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Product Data Sheet
Industrial
MICRO SD Memory Card
S-300u Series
SPI, SD and SDHC compliant
BU: Flash Products
Date : March 29, 20 1 2
Revisi o
n: 1.00
File:
factsheet
-
titel_rz4.
docx
Prod
uct
fact
shee
t
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S-300u Series
MICRO SD Memory Card
1 Feature summary
Highly-integrated memory controller
o Fully compliant with SD Memory Card specification SD1.01, SD1.1, SD2.0
and SD3.01 and MICRO SD Memory Card Addendum 4.00
Standard MICRO SD Memory Card form factor
o 15.0mm x 11.0mm x 0.7mm
Operating voltage 2.7…3.6V
Low-power CMOS technology
High reliability
o MTBF: > 3,000,000 hours
o Number of insertions: > 10,000
o Extended Temperature range -25° up to 85°C
o Industrial Temperature range -40° up to 85°C
Hot swappable
High performance
o Speed class
2GB Card class 6
4GB to 8GB class 10
o SD burst up to 25MB/s
o SD Low speed 0…25MHz clock rate
o SD High speed 25…50MHz clock rate
o Flash burst up to 40MB/s
o Flash Bus interleave
Operating bus modes: SD 1 & 4bit and SPI
Error Correction up to 24bit/1KB BCH ECC
Wear Leveling: equal wear leveling of static and dynamic data
The wear leveling assures that dynamic data as well as static data is balanced evenly across the memory.
With that the maximum write endurance of the device is guaranteed.
Write Endurance: Due to advanced wear leveling an even use of the entire flash is guaranteed, regardless
how much “static” (OS) data is stored. Example: If the average file size is 10MByte and the total capacity is
8GByte, 48Mio write cycles can be performed.
Available densities
o 2, 4 and 8GBytes (SLC NAND Flash)
Controlled BOM
Life Cycle Management
2 Order Information
2.1 Standard product list
Table 1: Standard Product List
Density
Part Number
2GB
SFSD2048NgBW1MT-t-ME-1x1-STD
4GB
SFSD4096NgBW1MT-t-DF-1x1-STD
8GB
SFSD8192NgBW1MT-t-QG-1x1-STD
g defines the product generation
x defines the FW
t defines the temperature range (E=-25°C to +85°C, I=-40°C to +85°C)
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2.2 Current product generation
Table 2: Standard Product List
Density
Part Number
2GB
SFSD2048N1BW1MT-E-ME-111-STD
4GB
SFSD4096N1BW1MT-E-DF-111-STD
8GB
SFSD8192N1BW1MT-E-QG-111-STD
2GB
SFSD2048N1BW1MT-I-ME-111-STD
4GB
SFSD4096N1BW1MT-I-DF-111-STD
8GB
SFSD8192N1BW1MT-I-QG-111-STD
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3 Contents
1 FEATURE SUMMARY ..................................................................................................................................................................... 2
2 ORDER INFORMATION .................................................................................................................................................................. 2
2.1 STANDARD PRODUCT LIST .......................................................................................................................................................... 2
2.2 CURRENT PRODUCT GENERATION ................................................................................................................................................ 3
3 CONTENTS .................................................................................................................................................................................... 4
4 PRODUCT SPECIFICATION ............................................................................................................................................................. 5
4.1 SYSTEM PERFORMANCE ............................................................................................................................................................ 5
4.2 ENVIRONMENTAL SPECIFICATIONS .............................................................................................................................................. 6
4.2.1 Recommended Operating Conditions ............................................................................................................... 6
4.2.2 Recommended Storage Conditions ................................................................................................................... 6
4.2.3 Humidity & ESD .................................................................................................................................................... 6
4.2.4 Environmental Conditions ................................................................................................................................. 6
4.3 PHYSICAL DIMENSIONS ............................................................................................................................................................ 6
4.4 RELIABILITY .......................................................................................................................................................................... 6
5 CAPACITY SPECIFICATION ............................................................................................................................................................. 6
6 CARD PHYSICAL ........................................................................................................................................................................... 7
6.1 PHYSICAL DESCRIPTION ............................................................................................................................................................ 7
7 ELECTRICAL INTERFACE ................................................................................................................................................................ 8
7.1 ELECTRICAL DESCRIPTION ........................................................................................................................................................... 8
7.2 DC CHARACTERISTICS ............................................................................................................................................................... 9
7.3 SIGNAL LOADING .................................................................................................................................................................... 9
7.4 AC CHARACTERISTICS ..............................................................................................................................................................10
8 HOST ACCESS SPECIFICATION ......................................................................................................................................................12
8.1 SD AND SPI BUS MODES .......................................................................................................................................................12
8.1.1 SD Bus Mode Protocol .........................................................................................................................................12
8.1.2 SPI Bus Mode Protocol ........................................................................................................................................13
8.1.3 Mode Selection ....................................................................................................................................................13
8.2 CARD REGISTERS...................................................................................................................................................................14
9 DECLARATION OF CONFORMITY ..................................................................................................................................................17
10 ROHS AND WEEE UPDATE FROM SWISSBIT ...............................................................................................................................18
11 PART NUMBER DECODER ...........................................................................................................................................................20
11.1 MANUFACTURER ...................................................................................................................................................................20
11.2 MEMORY TYPE .....................................................................................................................................................................20
11.3 PRODUCT TYPE .....................................................................................................................................................................20
11.4 CAPACITY ............................................................................................................................................................................20
11.5 PLATFORM ..........................................................................................................................................................................20
11.6 GENERATION .......................................................................................................................................................................20
11.7 MEMORY ORGANIZATION ........................................................................................................................................................20
11.8 TECHNOLOGY .......................................................................................................................................................................20
11.9 CHANNELS ..........................................................................................................................................................................20
11.10 FLASH CODE ......................................................................................................................................................................20
11.11 TEMP. OPTION ....................................................................................................................................................................21
11.12 DIE CLASSIFICATION ............................................................................................................................................................21
11.13 PIN MODE ........................................................................................................................................................................21
11.14 CONFIGURATION XYZ ...........................................................................................................................................................21
11.15 OPTION .............................................................................................................................................................................21
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12 SWISSBIT LABEL SPECIFICATION ................................................................................................................................................22
12.1 FRONT SIDE MARKING............................................................................................................................................................22
12.2 BACK SIDE MARKING.............................................................................................................................................................22
13 REVISION HISTORY.....................................................................................................................................................................23
4 Product Specification
The MICRO SD Memory Card is a small form factor non-volatile memory card which provides high capacity data
storage. Its aim is to capture, retain and transport data, audio and images, facilitating the transfer of all types of
digital information between a large variety of digital systems.
The card operates in two basic modes:
SD/SDHC card mode
SPI mode
The MICRO SD Memory Card also supports SD High Speed mode with up to 50MHz clock frequency.
The cards are compliant with
SD Memory card Specification Part 1, Physical layer Specification V3.01
SD Memory card Specification Part 2, File System Specification V3.00
SD Memory card Specification Part 3, Security Specification V3.00
MICRO SD Memory Card Addendum V4.00
Simplified specifications are available at https://www.sdcard.org/downloads/pls/simplified_specs/
The Card has an internal intelligent controller which manages interface protocols, data storage and retrieval as
well as hardware BCH Error Correction Code (ECC), defect handling, diagnostics and clock control.
The advanced wear leveling mechanism assures an equal usage of the Flash memory cells to extend the life time.
The hardware BCH-code ECC allows to detect and correct up to 24 defect bits per 1kByte.
The card has a power-loss management feature to prevent data corruption after power-down. The power
consumption is very low.
The cards are RoHS compliant and lead-free.
4.1 System Performance
Table 3: Performance
System Performance
typ
max
Unit
Burst Data transfer Rate (max SD clock 50MHz)
25
MB/s
Sustained Sequential Read
2GB
19 (1)(2)
24(1)(3)
4…8GB
19(1)(2)
24(1)(3)
Sustained Sequential Write
2GB
11 (1)(2)
12(1)(3)
4…8GB
17(1)(2)
22(1)(3)
1. All values refer to Micron Flash 8Gb MICRO SD Memory Card in SD mode 50MHz, cycle time 20ns,
2. Sustained Speed measured with USB-SD Memory Card reader. It depends on burst speed, flash number, and file size.
3. Maximum values were measured with Testmetrix tester.
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4.2 Environmental Specifications
4.2.1 Recommended Operating Conditions
Table 4: MICRO SD Memory Card Recommended Operating Conditions
Parameter
min
typ
max
unit
Extended Operating Temperature
-25
25
85
°C
Industrial Operating Temperature
-40
25
85
°C
4.2.2 Recommended Storage Conditions
Table 5: MICRO SD Memory Card Recommended Storage Conditions
Parameter
min
typ
max
unit
Extended Storage Temperature
-25
25
85
°C
Industrial Operating Temperature
-40
25
100
°C
4.2.3 Humidity & ESD
Table 6: Humidity & ESD
Parameter
Operating
Non Operating
Humidity (non-condensing)
operation: 95% RH @25°C
storage: 93% RH @40°C, 500h
EMC / EMI
Non Contact Pads area:
±8 kV (air discharge)
Human body model according
to IEC61000-4-2
Contact Pads:
±4 kV, Human body model
according to IEC61000-4-2
4.2.4 Environmental Conditions
Table 7: Environmental Conditions
Parameter
Operating
Non Operating
UV light exposure
UV: 254nm, 15Ws/cm2 according to ISO7816-1
Durability
10,000 mating cycles
Drop test
1.5m free fall
Bending / Torque
10N / 0.10Nm ±2.5° max
Mechanical Schock
1500G, 0,5ms, half sine wave ±xyz-axis, five pulses each
Non operating, JESD22B110 Condition B
Vibration
50G, 1.5mm p-p, 20..2000Hz, sweep xyz-axis,
five pulses each, Non operating
MIL-STD-883 M2007.3 Condition B
4.3 Physical Dimensions
Table 8: Physical Dimensions
Outer Physical Dimensions
Value
Unit
Length
15.0±0.1
mm
Width
11.0±0.1
Thickness
0.7 (1.0)±0.1
Weight (typ.)
0.4
g
4.4 Reliability
Table 9: Reliability
Parameter
Value
Data Retention @ 25°C
10 years (JEDEC47G)
5 Capacity specification
Table 10: MICRO SD Memory Card capacity specification
Capacity
Sectors
Total addressable capacity (Byte)
2GB
4’016’128
2’056’257’536
4GB
8’042’496
4’117’757’952
8GB
16’136’192
8’261’730’304
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6 Card physical
6.1 Physical description
The MICRO SD Memory Card contains a single chip controller and Flash memory module(s). The controller interfaces
with a host system allowing data to be written to and read from the Flash memory module(s).
Figure 1 and Figure 2 show card dimensions.
Figure 1: Mechanical Dimensions MICRO SD
Memory Card (side and top, simplified)
Figure 2: Mechanical Dimensions MICRO SD
Memory Card (bottom side with connector)
Gold pads thickness: 0.8µm / 30µinch
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7 Electrical interface
7.1 Electrical description
Figure 3: MICRO SD Memory Card Block Diagram
Figure 4: MICRO SD Memory Card Shape and
Interface (Bottom View)
Table 11: MICRO SD Memory Card Pad Assignment
Pin #
SD Mode
SPI Mode
Name
Type1
Description
Name
Type1
Description
1
DAT25
I/O/PP
Data Line [Bit 2]
RSV
2
CD/DAT32
I/O/PP3
Card Detect/ Data Line [Bit 3]
CS
I3
Chip Select (negative true)
3
CMD
PP
Command/Response
DI
I
Data In
4
VDD
S
Supply voltage
VDD
S
Supply voltage
5
CLK
I
Clock
SCLK
I
Clock
6
VSS
S
Supply voltage ground
VSS
S
Supply voltage ground
7
DAT0
I/O/PP
Data Line [Bit 0]
DO
O/PP
Data Out
8
DAT14
I/O/PP
Data Line [Bit 1]
RSV
Notes:
1)
S: power supply; I: input; O: output using push-pull drivers; PP: I/O using push-pull drivers;
2)
The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after
SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode, as well, while they
are not used.
3)
At power up this line has a 50kOhm pull up enabled in the card. This resistor serves two functions Card
detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high
to select SD mode. If the host wants to select SPI mode it should drive the line low. For Card detection,
the host detects that the line is pulled high. This
pull-up should be disconnected by the user, during
regular data transfer, with SET_CLR_CARD_DETECT (ACMD42) command
4)
DAT1 line may be used as Interrupt Output (from the Card) in SDIO mode during all the times that it is not
in use for data transfer operations (refer to "SDIO Card Specification" for further details).
5)
DAT2 line may be used as Read Wait signal in SDIO mode (refer to "SDIO Card Specification" for further
details).
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7.2 DC characteristics
Measurements are at Recommended Operating Conditions unless otherwise specified.
Table 12: DC Characteristics
Symbol
Parameter
min
typ
max
unit
notes
Peak Voltage on all Lines
-0.3
VDD+0.3
V
VIL
Input LOW Voltage
-0.3
0.25*VDD
V
VIH
Input HIGH Voltage
0.625*VDD
VDD+0.3
V
VOL
Output LOW Voltage
0.125*VDD
V
@ 100µA
VOH
Output HIGH Voltage
0.75*VDD
V
@ 100µA
IDD
Operating Current Read
50
60
mA
@ 25°C
Operating Current Write
60
70
mA
@ 25°C
Pre-initialization Standby Current
150
200
µA
@ 25°C
Post-initialization Standby Current
130
150
µA
@ 25°C
400
600
µA
@ 85°C
ILI
Input Leakage Current
-10
10
µA
without
pull up R
ILO
Output Leakage Current
-10
10
µA
Table 13: MICRO SD Memory Card Recommended Operating Conditions
Symbol
Parameter
min
typ
max
unit
VDD
Supply Voltage
Normal Operating Status
2.7
3.6
V
Basic Communication
(CMD0, CMD15, CMD55, ACMD41)
2.0
3.3
3.6
V
-
Power Up Time (from 0V to VDD min)
250
ms
7.3 Signal Loading
The total capacitance CL is the sum of the bus master capacitance CHOST, the bus capacitance CBUS, and the
capacitance CCARD of the card connected to the line:
CL = CHOST + CBUS + CCARD
To allow the sum of the host and bus capacitances to be up to 20pF for the card, the following conditions in the
table below are met by the card.
Table 14: Signal loading
Parameter
Symbol
Min
Max
Unit
Notes
Pull up resistance
RCMD
10
100
kOhm
To prevent bus floating
Pull up resistance
RDAT
10
100
kOhm
To prevent bus floating
Bus signal line capacitance
CL
40
pF
Single card
Signal card capacitance
Ccard
10
pF
Single card
Signal line inductance
16
nH
f≤20MHz
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Figure 5: Signal Loading (MICRO SD Memory Card has no WP slider)
7.4 AC characteristics
Table 15: AC Characteristics Low Speed Mode
Parameter
Symbol
Min
Max
Unit
Notes
Clock frequency in data transfer mode
fPP
0
25
MHz
CL≤100pF
Clock frequency in card id mode
fOD
0
400
KHz
CL≤250pF
Clock low time
tWL
10/50
ns
CL≤100/250pF
Clock high time
tWH
10/50
ns
Clock rise time
tTLH
10/50
ns
Clock fall time
tTHL
10/50
ns
CMD, DAT input setup time
tISU
5
ns
CL≤25pF
CMD, DAT input hold time
tIH
5
ns
CMD, DAT output delay time
tODLY
0
14
ns
CL≤25pF, data transfer
CMD, DAT output delay time
tODLY
0
50
ns
CL≤25pF, identification
Notes
1. Rise and fall times are measured from 10% to 90% of voltage level.
2. CLK referenced to VIH min and VIL max.
3. CMD and DAT inputs and outputs referenced to CLK.
4. 0Hz means to stop the clock. The given minimum frequency range is for cases where a continuous clock is
required
5. Specified for one card
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Figure 6: AC Characteristics Low Speed Mode
Table 16: AC Characteristics High Speed Mode
Parameter
Symbol
Min
Max
Unit
Notes
Clock frequency in data transfer mode
fPP
0
50
MHz
CL≤10pF
Clock low time
tWL
7.0
ns
Clock high time
tWH
7.0
ns
Clock rise time
tTLH
3
ns
Clock fall time
tTHL
3
ns
CMD, DAT input setup time
tISU
6
ns
CMD, DAT input hold time
tIH
2
ns
CMD, DAT output delay time during data
transfer mode
tODLY
14
ns
CMD, DAT output hold time
tOH
2.5
ns
Notes
1. Rise and fall times are measured from 10% to 90% of voltage level.
2. CLK referenced to VIH min and VIL max.
3. CMD and DAT inputs and outputs referenced to CLK.
4. In order to satisfy severe timing, the host shall drive only one card with max 40pF total at each line.
Figure 7: AC Characteristics High Speed Mode
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8 Host access Specification
The following chapters summarize how the host accesses the card:
Chapter 8.1 summarizes the SD and SPI buses.
Chapter 8.2 summarizes the registers.
8.1 SD and SPI Bus Modes
The card supports SD and the SPI Bus modes. Application can chose either one of the modes. Mode selection is
transparent to the host. The card automatically detects the mode of the reset command and will expect all further
communication to be in the same communication mode. The SD mode uses a 4-bit high performance data
transfer, and the SPI mode provides compatible interface to MMC host systems with little redesign, but with a
lower performance.
8.1.1 SD Bus Mode Protocol
The SD Bus mode has a single master (host) and multiple slaves (cards) synchronous topology. Clock, power, and
ground signals are common to all cards. After power up, the SD Bus mode uses DAT0 only; after initialization, the
host can change the cards’ bus width from 1 bit (DAT0) to 4 bits (DAT0-DAT3). In high speed mode, only one card
can be connected to the bus.
Communication over the SD bus is based on command and data bit streams which are initiated by a start bit and
terminated by a stop bit.
Command: a command is a token which starts an operation. A command is sent from the host either to a
single card (addressed command) or to all connected cards (broadcast command). A command is
transferred serially on the CMD line.
Response: a response is a token which is sent from an addressed card, or (synchronously) from all
connected cards, to the host as an answer to a previously received command. A response is transferred
serially on the CMD line.
Data: data can be transferred from the card to the host or vice versa. Data is transferred via the data
lines.
The SD bus signals are listed in Table 17, and the SD bus topology is illustrated in Figure 8: SD Bus Topology.
Table 17: SD Bus Signals
Signal
Description
CLK
Host to card clock signal
CMD
Bidirectional Command/Response signal
DAT0-DAT3
4 Bidirectional data signals
Vdd, Vss
Power and Ground
Figure 8: SD Bus Topology
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8.1.2 SPI Bus Mode Protocol
The Serial Parallel Interface (SPI) Bus is a general purpose synchronous serial interface. The SPI mode consists of a
secondary communication protocol. The interface is selected during the first reset command after power up
(CMD0) and it cannot be changed once the card is powered on.
While the SD channel is based on command and data bit streams which are initiated by a start bit and
terminated by a stop bit, the SPI channel is byte oriented. Every command or data block is built of 8-bit bytes
and is byte aligned to the CS signal.
The card identification and addressing methods are replaced by a hardware Chip Select (CS) signal. There are no
broadcast commands. For every command, a card (slave) is selected by asserting (active low) the CS signal.
The CS signal must be continuously active for the duration of the SPI transaction (command, response and data).
The only exception occurs during card programming, when the host can de-assert the CS signal without affecting
the programming process.
The bidirectional CMD and DAT lines are replaced by unidirectional
dataIn
and
dataOut
signals.
The SPI bus signals are listed Table 18 and the SPI bus topology is illustrated in Figure 9.
Table 18: SPI Bus Signals
Signal
Description
/CS
Host to card chip select
CLK
Host to card clock signal
Data In
Host to card data signal
Data Out
Card to host data signal
Vdd, Vss
Power and ground
Figure 9: SPI bus topology
8.1.3 Mode Selection
The SD Memory Card wakes up in the SD mode. It will enter SPI mode if the CS signal is asserted (negative) during
the reception of the reset command (CMD0) and the card is in
idle_state
. If the card recognizes that the SD mode
is required it will not respond to the command and remain in the SD mode.
If SPI mode is required the card will switch to SPI and respond with the SPI mode R1 response.
The only way to return to the SD mode is by entering the power cycle. In SPI mode the SD Memory Card protocol
state machine is not observed. All the SD Memory Card commands supported in SPI mode are always available.
During the initialization sequence, if the host gets Illegal Command indication for ACMD41 sent to the card, it may
assume that the card is Multimedia Card. In that case it should re-start the card as Multimedia Card using CMD0
and CMD1.
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8.2 Card Registers
The MICRO SD Memory Card has five registers. Refer to Table 19 to Table 24 for detail.
Table 19: MICRO SD Memory Card registers
Register
Name
Bit
Width
Description
Function
CID
128
Card Identification
information
This register contains the card identification information used during the
Card Identification phase.
OCR
32
Operation
Conditions Registers
This register describes the operating voltage range and contains the status
bit in the power supply.
CSD
128
Card specific
information
This register provides information on how to access the card content. Some
fields of this register are writeable by PROGRAM_CSD (CMD27).
SCR
64
SD Memory Card’s
Special features
This register provides information on special features.
RCA
16
Relative Card
Address
This register carries the card address is SD Card mode.
Table 20: CID register
Register Name
Bit Width
Description
typ. value
MID
8
Manufacture ID
TBD (0x5d)
OID
16
OEM/Application ID
TBD (0x5342)
PNM
40
Product Name
TBD (“NgBWc”)
g=generation
c=number of channels
PRV
8
Product Revision
0xgg
PSN
32
Product Serial Number
xxxxxxxx
—
4
Reserved
0x0
MDT
12
Manufacture Date
0xyym
CRC
7
Check sum of CID contents
chksum
—
1
Not used; always=1
1
Table 21: OCR register
OCR bit position
VDD voltage
window
typ. value
OCR bit position
VDD voltage
window
typ. value
0-3
Reserved
0
15
2.7-2.8
1
4
1.6-1.7
0
16
2.8-2.9
1
5
1.7-1.8
0
17
2.9-3.0
1
6
1.8-1.9
0
18
3.0-3.1
1
7
1.9-2.0
0
19
3.1-3.2
1
8
2.0-2.1
0
20
3.2-3.3
1
9
2.1-2.2
0
21
3.3-3.4
1
10
2.2-2.3
0
22
3.4-3.5
1
11
2.3-2.4
0
23
3.5-3.6
1
12
2.4-2.5
0
24-30
Reserved
13
2.5-2.6
0
30
Card Capacity
Status (CCS)
*1)
14
2.6-2.7
0
31
0=busy; 1=ready
*2)
Notes
1. This bit is valid only when the card power up status bit is set.
2. This bit is set to LOW if the card has not finished the power up routine.
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Table 22: CSD register
Register Name
Bits
Bit Width
Description
typ. Value
2GB
typ. Value
4GB, 8GB
CSD_STRUCTURE
127:126
2
CSD structure
00
01
—
125:120
6
Reserved
000000
00000
TAAC
119:112
8
Data read access time 1
01011110
00001110
NSAC
111:104
8
Data read access time 2 (CLK cycle)
00000000
00000000
TRAN_SPEED
103:96
8
Data transfer rate
00110010
00110010
CCC
95:84
12
Card command classes
010110110101
010110110101
READ_BL_LEN
83:80
4
Read data block length
1010
1001
READ_BL_PARTIAL
79
1
Partial blocks for read allowed
1
0
WRITE_BLK_MISALIGN
78
1
Write block misalignment
0
0
READ_BLK_MISALIGN
77
1
Read block misalignment
0
0
DSR_IMP
76
1
DSR implemented
0
0
—
75:74
2
Reserved
00
-
C_SIZE
73:62
12
Device size
xxx*)
-
VDD_R_CURR_MIN
61:59
3
VDD min read current
101
-
VDD_R_CURR_MAX
58:56
3
VDD max read current
101
-
VDD_W_CURR_MIN
55:53
3
VDD min write current
101
-
VDD_W_CURR_MAX
52:50
3
VDD max write current
101
-
C_SIZE_MULT
49:47
3
Device size multiplier
111*)
-
—
75:70
6
Reserved
-
000000
C_SIZE
69:48
22
Device size
-
xxx*)
—
47
1
Reserved
-
0
ERASE_BLK_EN
46
1
Erase single block enable
1
1
SECTOR_SIZE
45:39
7
Erase sector size
1111111
1111111
WP_GRP_SIZE
38:32
7
Write protect group size
0111111*)
0000000
WP_GRP_ENABLE
31
1
Write protect group enable
0
0
—
30:29
2
Reserved
00
00
R2W_FACTOR
28:26
3
Write speed factor
101
010
WRITE_BL_LEN
25:22
4
Write data block length
1010*)
1001*)
WRITE_BL_PARTIAL
21
1
Partial blocks for write allowed
0
0
—
20:16
5
Reserved
00000
00000
FILE_FORMAT_GRP
15
1
File format group
0 W(1)
0 W(1)
COPY
14
1
Copy flag
0 W(1)
0 W(1)
PERM_WRITE_PROTECT
13
1
Permanent write protection
0 W(1)
0 W(1)
TMP_WRITE_PROTECT
12
1
Temporary write protection
0 W
0 W
FILE_FORMAT
11:10
2
File format
00 W(1)
00 W(1)
—
9:8
2
Reserved
00 W
00 W
CRC
7:1
7
Checksum of CSD contents
xxxxxxx W
xxxxxxx W
—
0
1
Always=1
1
1
*) Drive Size and block sizes vary with card capacity
≤2Gb
memory capacity = BLOCKNR * BLOCK_LEN
Where
BLOCKNR = (C_SIZE+1) * MULT
MULT = 2C_SIZE_MULT+2 (C_SIZE_MULT < 8)
BLOCK_LEN = 2READ_BL_LEN, (READ_BL_LEN < 12)
>2Gb
memory capacity = (C_SIZE+1) * 512kByte
W value can be changed with CMD27 (PROGRAM_CSD)
W(1) value can be changed ONCE with CMD27 (PROGRAM_CSD)
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Table 23: SCR register
Field
Bit Width
typ Value
remark
SCR_STRUCTURE
4
0000
SCR 1.01…2.00
SD_SPEC
4
0010
SD 2.0 or 3.0
DATA_STAT_AFTER_ERASE
1
0
0
SD_SECURITY
3
010 or
011
Version 1.01 (SD) or
2.00 (SDHC)
SD_BUS_WIDTHS
4
0101
1 or 4 bit
Reserved
16
0
0
Reserved
32
0
0
Table 24: RCA register
Field
Bit Width
typ Value
RCA
16
0x0000*)
*) After Initialization the card can change the RCA register.
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9 Declaration of Conformity
We
Manufacturer: Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
declare under our sole responsibility that the product
Product Type: MICRO SD Memory Card
Brand Name: SWISSMEMORY™ MICRO SD Memory Card
Product Series: S-300u
Part Number: SFSDxxxxNxBWxxx-x-xx-xxx-xxx
to which this declaration relates is in conformity with the following directives:
EN55022:2006 +A1:r B
FCC47 Part 15 Subpart B §15.111
EN 61000-4-2:1995 +A1:1998 + A2:2001
EN 61000-4-3:2006+A1:2008
2002/96/EC Category 3 (WEEE)
following the provisions of Directive
Electromagnetic compatibility 2004/108/EC
Restriction of the use of certain hazardous substances 2011/65/EU
Swissbit AG, February 2013
Manuela Kögel
Head of Quality Management
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10 RoHS and WEEE update from Swissbit
Dear Valued Customer,
We at Swissbit place great value on the environment and thus pay close attention to the diverse aspects of
manufacturing environmentally and health friendly products. The European Parliament and the Council of
the European Union have published two Directives defining a European standard for environmental
protection. This states that CompactFlash Cards must comply with both Directives in order for them to be
sold on the European market:
RoHS – Restriction of Hazardous Substances
WEEE – Waste Electrical and Electronic Equipment
Swissbit would like to take this opportunity to inform our customers about the measures we have
implemented to adapt all our products to the European norms.
What is the WEEE Directive (2002/96/EC)?
The Directive covers the following points:
Prevention of WEEE
Recovery, recycling and other measures leading to a minimization of wastage of electronic
and electrical equipment
Improvement in the quality of environmental performance of all operators involved in the
EEE life cycle, as well as measures to incorporate those involved at the EEE waste disposal
points
What are the key elements?
The WEEE Directive covers the following responsibilities on the part of producers:
Producers must draft a disposal or recovery scheme to dispose of EEE correctly.
Producers must be registered as producers in the country in which they distribute the goods.
They must also supply and publish information about the EEE categories.
Producers are obliged to finance the collection, treatment and disposal of WEEE.
Inclusion of WEEE logos on devices
In reference to the Directive, the WEEE logo must be printed directly on all devices that have sufficient
space. «In exceptional cases where this is necessary because of the size of the product, the symbol of the
WEEE Directive shall be printed on the packaging, on the instructions of use and on the warranty»
(WEEE Directive 2002/96/EC)
When does the WEEE Directive take effect?
The Directive came into effect internationally on 13 August, 2005.
What is RoHS (2002/95/EC)?
The goals of the Directive are to:
Place less of a burden on human health and to protect the environment by restricting the
use of hazardous substances in new electrical and electronic devices
To support the WEEE Directive (see above)
RoHS enforces the restriction of the following 6 hazardous substances in electronic and electrical devices:
Lead (Pb) – no more than 0.1% by weight in homogeneous materials
Mercury (Hg) – no more than 0.1% by weight in homogeneous materials
Cadmium (Cd) – no more than 0.01% by weight in homogeneous materials
Chromium (Cr6+) – no more than 0.1% by weight in homogeneous materials
PBB, PBDE – no more than 0.1% by weight in homogeneous materials
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Swissbit is obliged to minimize the hazardous substances in the products.
According to part of the Directive, manufacturers are obliged to make a self-declaration for all devices with
RoHS. Swissbit carried out intensive tests to comply with the self-declaration. We have also already taken
steps to have the analyses of the individual components guaranteed by third-party companies.
Swissbit carried out the following steps during the year with the goal of offering our customers products
that are fully compliant with the RoHS Directive.
Preparing all far-reaching directives, logistical enhancements and alternatives regarding
the full understanding and introduction of the RoHS Directive’s standards
Checking the components and raw materials:
o Replacing non-RoHS-compliant components and raw materials in the supply chain
o Cooperating closely with suppliers regarding the certification of all components and
raw materials used by Swissbit
Modifying the manufacturing processes and procedures
o Successfully adapting and optimizing the new management-free integration process
in the supply chain
o Updating existing production procedures and introducing the new procedures to
support the integration process and the sorting of materials
Carrying out the quality process
o Performing detailed function and safety tests to ensure the continuous high quality
of the Swissbit product line
When does the RoHS Directive take effect?
As of 1 July, 2006, only new electrical and electronic devices with approved quantities of RoHS will be put
on the market.
When will Swissbit be offering RoHS-approved products?
Swissbit’s RoHS-approved products are available now. Please contact your Swissbit contact person to find
out more about exchanging your existing products for RoHS-compliant devices.
For your attention
We understand that packaging and accessories are not EEE material and are therefore not subject to the
WEEE or RoHS Directives.
Contact details:
Swissbit AG
Industriestrasse 4
CH 9552 Bronschhofen
Tel: +41 71 913 03 03 – Fax: +41 71 913 03 15
E-mail: info@swissbit.com – Website: www.swissbit.com
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11 Part Number Decoder
S
F
SD
2048
N
1
B
W
1
MT
-
E
-
M
E
-
111
-
STD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Manuf.
Option
Memory Type.
Configuration
Product Type
Manuf. Code: Flash Mode
Capacity
Manuf. Code: Flash Package
Platform
Temp. Option
Generation
Flash vendor Code
Memory Organization
Number of flash chips/channels
Technology
11.1 Manufacturer
Swissbit code
S
11.2 Memory Type
Flash
F
11.3 Product Type
SD Memory Card
SD
11.4 Capacity
2 GByte
2048
4 GByte
4096
8 GByte
8192
11.5 Platform
MICRO SD Memory Card
N
11.6 Generation
Generation
1
11.7 Memory Organization
x8
B
11.8 Technology
SD Memory Card controller
S-3x0 series
W
11.9 Channels
1 Flash Channel
1
11.10 Flash Code
Micron
MT
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11.11 Temp. Option
Extended Temp. Range
-25°C to 85°C
E
Industrial Temp. Range
-40°C to 85°C
I
11.12 DIE Classification
SLC MONO
(single die package)
M
SLC DDP
(dual die package)
D
SLC QDP
(dual die package)
Q
MLC MONO
(single die package)
G
MLC DDP
(dual die package)
L
11.13 PIN Mode
Single nCE & R/nB
E
Dual nCE & Dual R/nB
F
Quad nCE & Quad R/nB
G
11.14 Configuration XYZ
X Configuration
Configuration
X
default
1
Y FW Revision
FW Revision
Y
Version 1
1
Z
optional
Optional
Z
optional
1
11.15 Option
Swissbit / Standard
STD
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12 Swissbit Label specification
12.1 Front side marking
Swissbit
Density
SD Memory Card logo
12.2 Back side marking
Part Number
Calendar week and year
Lot code
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13 Revision History
Table 25: Document Revision History
Date
Revision
Revision Details
April 19, 2012
1.00
Initial release
February 01, 2013
1.01
Electrical characteristic update, added I-grade material, added CE Declaration and gold pads
thickness
Disclaimer:
No part of this document may be copied or reproduced in any form or by any means, or transferred to any
third party, without the prior written consent of an authorized representative of Swissbit AG (“SWISSBIT”).
The information in this document is subject to change without notice. SWISSBIT assumes no responsibility
for any errors or omissions that may appear in this document, and disclaims responsibility for any
consequences resulting from the use of the information set forth herein. SWISSBIT makes no commitments
to update or to keep current information contained in this document. The products listed in this document
are not suitable for use in applications such as, but not limited to, aircraft control systems, aerospace
equipment, submarine cables, nuclear reactor control systems and life support systems. Moreover, SWISSBIT
does not recommend or approve the use of any of its products in life support devices or systems or in any
application where failure could result in injury or death. If a customer wishes to use SWISSBIT products in
applications not intended by SWISSBIT, said customer must contact an authorized SWISSBIT representative to
determine SWISSBIT willingness to support a given application. The information set forth in this document
does not convey any license under the copyrights, patent rights, trademarks or other intellectual property
rights claimed and owned by SWISSBIT. The information set forth in this document is considered to be
“Proprietary” and “Confidential” property owned by SWISSBIT.
ALL PRODUCTS SOLD BY SWISSBIT ARE COVERED BY THE PROVISIONS APPEARING IN SWISSBIT’S TERMS AND
CONDITIONS OF SALE ONLY, INCLUDING THE LIMITATIONS OF LIABILITY, WARRANTY AND INFRINGEMENT PROVISIONS.
SWISSBIT MAKES NO WARRANTIES OF ANY KIND, EXPRESS, STATUTORY, IMPLIED OR OTHERWISE, REGARDING
INFORMATION SET FORTH HEREIN OR REGARDING THE FREEDOM OF THE DESCRIBED PRODUCTS FROM INTELLECTUAL
PROPERTY INFRINGEMENT, AND EXPRESSLY DISCLAIMS ANY SUCH WARRANTIES INCLUDING WITHOUT LIMITATION ANY
EXPRESS, STATUTORY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
©2012 SWISSBIT AG All rights reserved.
