MA4E2501L-1290 SURMOUNT Low Barrier 0201 Silicon Schottky Diode Rev. V3 Features Extremely Low Parasitic Capacitance and Inductance. Extremely Small 0201 (600x300um) Footprint Surface Mountable in Microwave Circuits. No Wire bonds Required. Rugged HMIC Construction with Polyimide Scratch Protection Reliable, Multilayer Metalization with a Diffusion Barrier, 100% Stabilization Bake (300C, 16 hours) Available in Pocket Tape and Reel The MA4E2501L-1290 SURMOUNT Low Barrier Schottky diode is recommended for use in microwave circuits through Ku band frequencies for lower power applications such as mixers, sub-harmonic mixers, detectors and limiters A B Description and Applications The MA4E2501L-1290 SURMOUNT Diodes are Silicon Low Barrier Schottky Devices fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of Silicon pedestals which form diodes or via conductors embedded in a glass dielectric, which acts as the low dispersion, microstrip transmission medium. The combination of silicon and glass allows HMIC devices to have excellent loss and power dissipation characteristics in a low profile, reliable device. The Surmount Schottky devices are excellent choices for circuits requiring the small parasitics of a beam lead device coupled with the superior mechanical performance of a chip. The SURMOUNT structure employs very low resistance silicon vias to connect the Schottky contacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. The multi-layer metalization employed in the fabrication of the Surmount Schottky junctions includes a platinum diffusion barrier, which permits all devices to be subjected to a 16-hour non-operating stabilization bake at 300C. The extremely small " 0201 " outline allows for Surface Mount placement and multi-functional polarity orientations. C D E F G Cathode Anode Chip Dimensions dim. A B C D E F G in min. 0.023 0.011 0.004 0.006 0.007 0.006 0.009 max. 0.025 0.013 0.008 0.008 0.009 0.008 0.011 mm min. max. 0.575 0.625 0.275 0.325 0.102 0.203 0.150 0.200 0.175 0.225 0.150 0.200 0.220 0.270 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4E2501L-1290 SURMOUNT Low Barrier 0201 Silicon Schottky Diode Rev. V3 Electrical Specifications @ + 25 C Parameters and Test Conditions Symbol Units Min. Typ. Max. Total Capacitance at 0V at 1 MHz Ct pF 0.10 0.12 Dynamic Resistance at 9.5 - 10.5mA Rd Ohms 10 14 Forward Voltage at +1mA Vf Volts .300 .330 Reverse Breakdown Voltage at -10uA Vb Volts 3.0 5 Absolute Maximum Ratings 1 Parameter Absolute Maximum Operating Temperature -40 C to +150 C Storage Temperature -40 C to +150 C Forward Current 20 mA Reverse Voltage 5 volts. RF CW Incident Power + 20 dBm RF+DC Dissipated Power 50 mW Electrostatic Discharge ( ESD ) Classification 2 Class 0 1. Operation of this device above any one of these parameters may cause permanent damage. 2. Human Body Model Ordering Information Part Number Package Standard Quantity MA4E2501L-1290 Die in Carrier 100 MADS-002501-1290LP Pocket Tape and Reel 3000 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4E2501L-1290 SURMOUNT Low Barrier 0201 Silicon Schottky Diode Rev. V3 Die Bonding Die attach for these devices is made simple through the use of surface mount die attach technology. Mounting pads are conveniently located on the bottom surface of these devices, and are opposite the active junction. The devices are well suited for high temperature solder attachment onto hard substrates. 80Au/20Sn and Sn63/Pb37 solders are acceptable for usage. Die attach with electrically conductive silver epoxy is not recommended. For hard substrates, we recommend using a vacuum tip and a force of 60 to100 grams applied uniformly to the top surface of the device using a hot gas bonder with equal heat applied across the bottom mounting pads of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads. Reflow the paste by applying equal heat to the circuit at both die mounting pads. The solder joint must not be made one at a time creating unequal heat flow and thermal stress. Solder reflow should not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after die attach is completed. Reference M/A-Com application note M538 which can be found @ www.macomtech.com for additional surface mounting information. Handling Procedures The following precautions should be observed to avoid damaging these chips: Cleanliness: The chips should be handled in a clean environment. Do not attempt to clean die after installation. Static Sensitivity: Schottky barrier diodes are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices. General Handling: The protective polymer coating on the active areas of these die provides scratch protection, particularly for the metal air bridge which contacts the anode. The use of plastic tipped tweezers or vacuum pickups is strongly recommended. These die are also suitable for automatic pick and place equipment. 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MA4E2501L-1290 SURMOUNT Low Barrier 0201 Silicon Schottky Diode Rev. V3 M/A-COM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM assumes no responsibility for errors or omissions in these materials. MACOM may make changes to specifications and product descriptions at any time, without notice. MACOM makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS. MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale. 4 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support