
SGP10N60A
SGW10N60A
7 Rev. 2.4 Sep 08
E, SWITCHING ENERGY LOSSES
0A 5A 10A 15A 20A 25A
0,0mJ
0,2mJ
0,4mJ
0,6mJ
0,8mJ
1,0mJ
1,2mJ
1,4mJ
1,6mJ
Eon*
Eoff
Ets*
E, SWITCHING ENERGY LOSSES
0Ω20Ω40Ω60Ω80Ω
0,2mJ
0,4mJ
0,6mJ
0,8mJ
1,0mJ
Ets*
Eon*
Eoff
IC, COLLECTOR CURRENT RG, GATE RESISTOR
Figure 13. Typical switching energy losses
as a function of collector current
(inductive load, Tj = 150°C, VCE = 400V,
VGE = 0/+15V, RG = 25 Ω,
Dynamic test circuit in Figure E)
Figure 14. Typical switching energy losses
as a function of gate resistor
(inductive load, Tj = 150°C, VCE = 400V,
VGE = 0/+15V, IC = 10A,
Dynamic test circuit in Figure E)
E, SWITCHING ENERGY LOSSES
0°C 50°C 100°C 150°C
0,0mJ
0,2mJ
0,4mJ
0,6mJ
0,8mJ
Ets*
Eon*
Eoff
ZthJC, TRANSIENT THERMAL IMPEDANCE
1µs 10µs 100µs 1ms 10ms 100ms 1s
10-3K/W
10-2K/W
10-1K/W
100K/W
0.01
0.02
0.05
0.1
0.2
single pulse
D=0.5
Tj, JUNCTION TEMPERATURE tp, PULSE WIDTH
Figure 15. Typical switching energy losses
as a function of junction temperature
(inductive load, VCE = 400V, VGE = 0/+15V,
IC = 10A, RG = 25 Ω,
Dynamic test circuit in Figure E)
Figure 16. IGBT transient thermal
impedance as a function of pulse width
(D = tp / T)
*) Eon and Ets include losses
due to diode recovery.
*) Eon and Ets include losses
due to diode recovery.
*) Eon and Ets include losses
due to diode recovery.
C1=
1/R1
R1R2
C2=
2/R2
R,(K/W)
τ
, (s)
0.4287 0.0358
0.4830 4.3*10-3
0.4383 3.46*10-4
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