100323
Low Power Hex Bus Driver
General Description
The 100323 is a monolithic device containing six bus drivers
capable of driving terminated lines with terminations as low
as 25. To reduce crosstalk, each output has its own re-
spective ground connection. Transition times were designed
to be longer than on other F100K devices. The driver itself
performs the positive logic AND of a data input (D
1
–D
6
) and
the OR of two select inputs (E and either DE
1
,DE
2
,orDE
3
).
Enabling of data is possible in multiples of two, i.e., 2, 4 or all
6 paths. All inputs have 50 kpull-down resistors.
The output voltage LOW level is designed to be more nega-
tive than normal ECL outputs (cut off state). This allows an
emitter-follower output transistor to turn off when the termi-
nation supply is −2.0V and thus present a high impedance to
the data bus.
Features
n50%power reduction of the 100123
n2000V ESD protection
n−4.2V to −5.7V operating range
nDrives 25load
Logic Symbol Pin Names Description
D
1
–D
6
Data Inputs
DE
1
–DE
3
Dual Enable Inputs
E Common Enable Input
O
1
–O
6
Data Outputs
DS100312-7
August 1998
100323 Low Power Hex Bus Driver
© 1998 National Semiconductor Corporation DS100312 www.national.com
Connection Diagrams
Logic Diagram
Truth Table
EDE
n
D
n
D
n+1
O
n
O
n+1
L L X X Cutoff Cutoff
X H L L Cutoff Cutoff
X H L H Cutoff H
X H H L H Cutoff
XH H H H H
H X L L Cutoff Cutoff
H X L H Cutoff H
H X H L H Cutoff
HX H H H H
H
=
High
Cutoff =Lower-than-LOW state
L=Low
X=Don’t Care
24-Pin DIP
DS100312-3
24-Pin Quad Cerpak
DS100312-4
DS100312-1
www.national.com 2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature −65˚C to +150˚C
Maximum Junction Temperature
Ceramic +175˚C
V
EE
Pin Potential to Ground Pin −7.0V to +0.5V
Input Voltage (DC) V
EE
to +0.5V
Output Current (DC Output High) −50 mA
ESD 2000V
Recommended Operating
Conditions
Case Temperature
Military −55˚C to +125˚C
Supply Voltage (V
EE
) −5.7V to −4.2V
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under these
conditions is not implied.
Note 2: ESD testing conforms to MIL-STD-883, Method 3015.
Military Version
DC Electrical Characteristics
V
EE
=−4.2V to −5.7V, V
CC
=V
CCA
=GND, T
C
=−55˚C to +125˚C
Symbol Parameter Min Max Units T
C
Conditions Notes
V
OH
Output HIGH −1025 −870 mV 0˚C to +125˚C V
IN
=V
IH (max)
Loading with (Notes 3, 4, 5)
Voltage −1085 −870 mV −55˚C or V
IL (min)
25to −2.0V
V
OHC
Output HIGH −1035 mV 0˚C to +125˚C V
IN
=V
IH (min)
or V
IL (max)
Loading with
25to −2.0V (Notes 3, 4, 5)
Voltage −1085 mV −55˚C
V
OLC
Output LOW −1610 mV 0˚C to +125˚C
Voltage −1555 MV −55˚C
V
OLZ
Cut-Off LOW −1950 mV 0˚C to +125˚C V
IN
=V
IH (min)
Loading with (Notes 3, 4, 5)
Voltage −1850 −55˚C or V
IL (max)
25to −2.0V
V
IH
Input HIGH −1165 −870 mV −55˚C to +125˚C Guaranteed HIGH Signal (Notes 3, 4, 5, 6)
Voltage for All Inputs
V
IL
Input LOW −1830 −1475 mV −55˚C to +125˚C Guaranteed LOW Signal (Notes 3, 4, 5, 6)
Voltage for All Inputs
I
IL
Input LOW
Current 0.50 µA −55˚C to +125˚C V
EE
=4.2V, V
IN
=V
IL (min)
(Notes 3, 4, 5)
I
IH
Input HIGH 240 µA 0˚C to +125˚C V
EE
=−5.7V, V
IN
=V
IH (max)
(Notes 3, 4, 5)
Current 340 µA −55˚C
I
EE
Power Supply Inputs Open
Current −155 −53 mA −55˚C to +125˚C V
EE
=−4.2V to −5.7V (Notes 3, 4, 5)
Note 3: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 4: Screen tested 100%on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 5: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7, and 8.
Note 6: Guaranteed by applying specified input condition and testing VOH/VOL.
www.national.com3
AC Electrical Characteristics
V
EE
=−4.2V to −5.7V, V
CC
=V
CCA
=GND
Symbol Parameter T
C
=−55˚C T
C
=+25˚C T
C
=+125˚C Units Conditions
Min Max Min Max Min Max
t
PZH
Propagation Delay 0.70 3.70 1.10 3.60 1.20 3.60 ns
Figures 1, 2
t
PHZ
Data to Output 0.50 3.60 1.10 3.10 1.20 3.50
t
PZH
Propagation Delay 0.60 3.60 1.10 3.60 1.30 3.80 ns
t
PHZ
Data Enable to Output 1.00 4.20 1.50 3.60 1.60 4.00
t
PZH
Propagation Delay 0.70 3.60 1.00 3.50 1.20 3.60 ns
t
PHZ
Common Enable to Output 0.90 4.00 1.40 3.40 1.40 3.80
t
TZH
Transition Time 0.20 2.00 0.20 2.00 0.20 2.00 ns
t
THZ
20%to 80%,80
%to 20%0.20 1.80 0.20 1.60 0.20 1.60
Note 7: The specified limits represent the “worst case” value for the parameter. Since these “worst case” values normally occur at the temperature extremes, ad-
ditional noise immunity and guard banding can be achieved by decreasing the allowable system operating ranges.
Note 8: Conditions for testing shown in the tables are chosen to guarantee operation under “worst case” conditions.
Test Circuitry
DS100312-5
Notes:
VCC,V
CCA =+2V, VEE =−2.5V
L1 and L2 =equal length 50impedance lines
RT=50terminator internal to scope
Decoupling 0.1 µF from GND to VCC and VEE
All unused outputs are loaded with 25to GND
CL=Fixture and stray capacitance 3pF
Pin numbers shown are for flatpak; for DIP see logic symbol
FIGURE 1. AC Test Circuit
www.national.com 4
Timing Waveform
DS100312-6
FIGURE 2. Propagation Delay and Transition Times
www.national.com5
6
Physical Dimensions inches (millimeters) unless otherwise noted
24 Lead Ceramic Dual-In-Line Package (0.400" Wide) (D)
NS Package Number J24E
24 Lead Quad Cerpak (F)
NS Package Number W24B
www.national.com7
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-
VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-
CONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or sys-
tems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose fail-
ure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: support@nsc.com
www.national.com
National Semiconductor
Europe Fax: +49 (0) 1 80-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 1 80-530 85 85
English Tel: +49 (0) 1 80-532 78 32
Français Tel: +49 (0) 1 80-532 93 58
Italiano Tel: +49 (0) 1 80-534 16 80
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: sea.support@nsc.com
National Semiconductor
Japan Ltd.
Tel: 81-3-5620-6175
Fax: 81-3-5620-6179
100323 Low Power Hex Bus Driver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.