FOX
Electronics 5570 Enterprise Parkway Fort Myers, Florida 33905 USA +1.239.693.0099 FAX +1.239.693.1554 www.foxonline.com
FEATURES
• Miniature Packages
• Low Cost
• Cold Weld Design
• Long Term Stability
• Tight Tolerance
All specifications subject to change without notice.
Note: Can should not be soldered to the circuit board or grounded. If securing the can to the board
is desired, a rubber adhesive is recommended.
32.768 kHz
± 20 PPM
-0.04 PPM / (ƼC)2
+20ºC ~ +30ºC
-20ºC ~ +60ºC
-30ºC ~ +70ºC
50 kΩ
35 kΩ
12.5 pF (Standard)
6 pF (Optional)
500 MΩ Min
1.0 µW
±3 PPM
PARAMETERS
Frequency
Frequency Tolerance @ 25ºC
Frequency Stability
Temperature Coefficient
Temperature Range
Turnover (TO)
Operating (TOPR)
Storage (TSTG)
Equivalent Series Resistance (RS)
NC15 / NC26
NC38
Load Capacitance (Cl)
Insulation Resistance @ 100VDC
Drive Level
Aging per year
• STANDARD SPECIFICATIONS
MAX (unless otherwise noted)
All dimensions are in millimeters.
Frequency
Stability
-20 ºC~ +60 ºC
-20 ºC~ +60 ºC
-20 ºC~ +60 ºC
32.768 kHz
32.768 kHz
32.768 kHz
NC15LF
NC26LF
NC38LF
Model
Number
Part Number
298LF-Frequency-xxxxx
299LF-Frequency-xxxxx
300LF-Frequency-xxxxx
• PART NUMBER SELECTIONLearn More - Internet Required
Frequency
-0.04 PPM / (ƼC)2
-0.04 PPM / (ƼC)2
-0.04 PPM / (ƼC)2
Thru-Hole Tuning Fork Rev. 1/13/2012
RoHS Compliant / pB Freehttp://www.foxonline.com/need_a_sample.htm
Model: NC15LF/NC26LF/NC38LF
Operating
Temperature
Click to view mounting precautions
5.0 Max
1.5 Max
4.5 Min
0.45
6.0 Max
4.0 Min
0.7 ±0.15
2.0 Max
8.3 Max
9.0 Min
3.2 Max
0.8 ±0.1
0.22 ±0.05
0.2 ±0.07
0.38±0.05
NC38LF
NC26LF
NC15LF
1. Mounting Precautions
1.1 Lead Type Crystal Units
1.1.1. Structure
Tubular crystal units are hermetically sealed using glass (see Figures 1 and 2).
Case
Case
Hermetic
Glass
Lead
Figure
1
Lead
Figure 2
Hermetic
Glass
1.1.2 Unbending the lead
(1) DO NOT pull the lead excessively if unbending a lead or removing a cr ystal unit. The excessive force may
crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of the
characteristics and may also break the crystal chip see Figure 3).
(2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of
lead tightly. (see Figure 4).
Breakage
Pull out
Tweezers or
needle-nose pliers
Case
Lead
Figure 3 Figure 4
Page 1 of 2
7/7/2011
1.1.3 Bending the lead
(1) Bend the lead so that the lead will rem ain straight for more than 0.5mm from the case when solder ing a
crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6).
(2) Always leave a length greater than the case diameter when bending a lead after soldering (s ee Figure 7).
0.5mm
D
0.5mm
Solder
Printed circuit
board
Solder
Solder
L > D
L
Figure 7 Figure 6 Figure 5
Make the length from the
case to the printed circuit
board (L) longer than the
case diameter (D) so that
the lead wire will not be
pulled in case the crystal
unit falls over.
Solderi ng directly to the case will reduce the degree of vacuum and may result in
deterior ati on of th e cha ra cteris t i c s and ma
y
break the cr
y
stal chi
p
.
Page 2 of 2
7/7/2011
1.1.4 Soldering
When mounting or removing a quartz crystal unit, heat the lead part at 300°C or lower for 5 seconds or less (in the case of a
lead-type conventional product). A long period of time of heating may result in dete rioration of the characteristic s and may
break the crystal unit. Be sure to keep the case at or below 150°C.
