© Semiconductor Components Industries, LLC, 2009
October, 2009 Rev. 10
1Publication Order Number:
MC10EP11/D
MC10EP11, MC100EP11
3.3V / 5V ECL 1:2
Differential Fanout Buffer
Description
The MC10/100EP11 is a differential 1:2 fanout buffer. The device is
pin and functionally equivalent to the LVEL11 device. With AC
performance much faster than the LVEL11 device, the EP11 is ideal
for applications requiring the fastest AC performance available.
The 100 Series contains temperature compensation.
Features
220 ps Typical Propagation Delay
Maximum Clock Frequency > 3 GHz Typical
PECL Mode Operating Range: VCC = 3.0 V to 5.5 V
with VEE = 0 V
NECL Mode Operating Range: VCC = 0 V
with VEE = 3.0 V to 5.5 V
Open Input Default State
Safety Clamp on Inputs
Q Outputs Will Default LOW with Inputs Open or at VEE
PbFree Packages are Available
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= PbFree Package
H = MC10
K = MC100
5K = MC10
2Z = MC100
M= Date Code
SOIC8
D SUFFIX
CASE 751
MARKING DIAGRAMS*
TSSOP8
DT SUFFIX
CASE 948R
ALYWG
G
HP11
ALYWG
G
KP11
1
8
1
8
1
8
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
ORDERING INFORMATION
HEP11
ALYW
G
1
8
KEP11
ALYW
G
1
8
DFN8
MN SUFFIX
CASE 506AA
2Z MG
G
14
(Note: Microdot may be in either location)
1
8
MC10EP11, MC100EP11
http://onsemi.com
2
1
2
3
45
6
7
8
D
VEE
VCC
Figure 1. 8Lead Pinout (Top View) and Logic Diagram
Q0
D
Q1
Q1
Q0 Table 1. PIN DESCRIPTION
PIN
D*, D**
Q0, Q0, Q1, Q1 ECL Data Outputs
FUNCTION
ECL Data Inputs
VCC
VEE Negative Supply
Positive Supply
* Pins will default LOW when left open.
** Pins will default to high when left open.
R1
R2
R1
EP (DFN8 only) Thermal
exposed pad must be
connected to a sufficient
thermal conduit. Electrically
connect to the most negative
supply (GND) or leave
unconnected, floating open.
Table 2. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 75 kW
Internal Input Pullup Resistor 37.5 kW
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 4 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg PbFree Pkg
SOIC8
TSSOP8
DFN8
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 73 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
MC10EP11, MC100EP11
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3
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC PECL Mode Power Supply VEE = 0 V 6 V
VEE NECL Mode Power Supply VCC = 0 V 6 V
VIPECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6
6
V
V
Iout Output Current Continuous
Surge
50
100
mA
mA
TAOperating Temperature Range 40 to +85 °C
Tstg Storage Temperature Range 65 to +150 °C
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
SOIC8
SOIC8
190
130
°C/W
°C/W
qJC Thermal Resistance (JunctiontoCase) Standard Board SOIC841 to 44 °C/W
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
TSSOP8
TSSOP8
185
140
°C/W
°C/W
qJC Thermal Resistance (JunctiontoCase) Standard Board TSSOP841 to 44 °C/W
qJA Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol Wave Solder Pb
PbFree
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
qJC Thermal Resistance (JunctiontoCase) (Note 2) DFN8 35 to 40 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board 2S2P (2 signal, 2 power)
Table 4. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 3)
Symbol Characteristic
40°C 25°C 85°C
Min Typ Max Min Typ Max Min Typ Max Unit
IEE Negative Power Supply Current 20 29 37 20 30 39 22 31 40 mA
VOH Output HIGH Voltage (Note 4) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV
VOL Output LOW Voltage (Note 4) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV
VIH Input HIGH Voltage (SingleEnded) 2090 2415 2155 2480 2215 2540 mV
VIL Input LOW Voltage (SingleEnded) 1365 1690 1430 1755 1490 1815 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 5)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D
0.5
150
0.5
150
0.5
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to 2.2 V.
4. All loading with 50 W to VCC 2.0 V.
5. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP11, MC100EP11
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4
Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 6)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Negative Power Supply Current 20 29 37 20 30 39 22 31 40 mA
VOH Output HIGH Voltage (Note 7) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV
VOL Output LOW Voltage (Note 7) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV
VIH Input HIGH Voltage (SingleEnded) 3790 4115 3855 4180 3915 4240 mV
VIL Input LOW Voltage (SingleEnded) 3065 3390 3130 3455 3190 3515 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 8)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D
0.5
150
0.5
150
0.5
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Input and output parameters vary 1:1 with VCC.
7. All loading with 50 W to VCC 2.0 V.
8. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 6. 10EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = 5.5 V to 3.0 V (Note 9)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Negative Power Supply Current 20 29 37 20 30 39 22 31 40 mA
VOH Output HIGH Voltage (Note 10) 1135 1010 885 1070 945 820 1010 885 760 mV
VOL Output LOW Voltage (Note 10) 1935 1810 1685 1870 1745 1620 1810 1685 1560 mV
VIH Input HIGH Voltage (SingleEnded) 1210 885 1145 820 1085 760 mV
VIL Input LOW Voltage (SingleEnded) 1935 1610 1870 1545 1810 1485 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 11)
VEE + 2.0 0.0 VEE + 2.0 0.0 VEE + 2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D
0.5
150
0.5
150
0.5
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. Input and output parameters vary 1:1 with VCC.
10.All loading with 50 W to VCC 2.0 V.
11. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP11, MC100EP11
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5
Table 7. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 12)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Negative Power Supply Current 26 35 44 26 35 44 26 35 46 mA
VOH Output HIGH Voltage (Note 13) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV
VOL Output LOW Voltage (Note 13) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV
VIH Input HIGH Voltage (SingleEnded) 2075 2420 2075 2420 2075 2420 mV
VIL Input LOW Voltage (SingleEnded) 1355 1675 1355 1675 1355 1675 mV
VIHCMR Input HIGH Voltage Common Mode Range (Dif-
ferential Configuration) (Note 14)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D
0.5
150
0.5
150
0.5
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
12.Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to 2.2 V.
13.All loading with 50 W to VCC 2.0 V.
14.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 15)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Negative Power Supply Current 26 35 44 26 35 44 26 35 46 mA
VOH Output HIGH Voltage (Note 16) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV
VOL Output LOW Voltage (Note 16) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV
VIH Input HIGH Voltage (SingleEnded) 3775 4120 3775 4120 3775 4120 mV
VIL Input LOW Voltage (SingleEnded) 3055 3375 3055 3375 3055 3375 mV
VIHCMR Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 17)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D
0.5
150
0.5
150
0.5
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
15.Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to 0.5 V.
16.All loading with 50 W to VCC 2.0 V.
17.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP11, MC100EP11
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6
Table 9. 100EP DC CHARACTERISTICS, NECL VCC = 0 V; VEE = 5.5 V to 3.0 V (Note 18)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Negative Power Supply Current 26 35 44 26 35 44 26 35 46 mA
VOH Output HIGH Voltage (Note 19) 1145 1020 895 1145 1020 895 1145 1020 895 mV
VOL Output LOW Voltage (Note 19) 1945 1820 1695 1945 1820 1695 1945 1820 1695 mV
VIH Input HIGH Voltage (SingleEnded) 1225 880 1225 880 1225 880 mV
VIL Input LOW Voltage (SingleEnded) 1945 1625 1945 1625 1945 1625 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 20)
VEE + 2.0 0.0 VEE + 2.0 0.0 VEE + 2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current D
D
0.5
150
0.5
150
0.5
150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
18.Input and output parameters vary 1:1 with VCC.
19.All loading with 50 W to VCC 2.0 V.
20.VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 10. AC CHARACTERISTICS VCC = 0 V; VEE = 3.0 V to 5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 21)
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
fmax Maximum Frequency (Figure 2) > 3 > 3 > 3 GHz
tPLH,
tPHL
Propagation Delay to Output Differential
CLK to Q, Q 140 200 250 160 220 270 180 240 300
ps
tSKEW Within Device Skew Q0, Q1 (Note 22)
DevicetoDevice Skew
10 15
110
15 20
110
20 25
120
ps
tJITTER Random Clock Jitter (RMS) (Figure 2) 0.2 < 1 0.2 < 1 0.2 < 1 ps
VINPP Input Voltage Swing Sensitivity
(Differential Configuration)
150 800 1200 150 800 1200 150 800 1200 mV
tr
tf
Output Rise/Fall Times Q, Q
(20% 80%) @ 1.0 GHz
70 120 170 80 130 180 90 150 200 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
21.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC 2.0 V.
22.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.
MC10EP11, MC100EP11
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7
0
100
200
300
400
500
600
700
800
900
0 1000 2000 3000
1
2
3
4
5
6
7
8
9
Figure 2. Output Voltage Amplitude (VOUTPP) RMS Jitter vs. Input Clock Frequency at Ambient Temperature
INPUT FREQUENCY (MHz)
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
OUTPUT VOLTAGE AMPLITUDE (mV)
JITTEROUT ps (RMS)
ÉÉ
ÉÉ
tPHL
Figure 3. AC Reference Measurement
D
D
Q
Q
tPLH
VINPP = VIH(CLK) VIL(CLK)
VOUTPP = VOH(Q) VOL(Q)
MC10EP11, MC100EP11
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8
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Zo = 50 W
Zo = 50 W
50 W50 W
VTT
VTT = VCC 2.0 V
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
MC10EP11, MC100EP11
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9
ORDERING INFORMATION
Device Package Shipping
MC10EP11D SOIC898 Units / Rail
MC10EP11DG SOIC8
(PbFree)
98 Units / Rail
MC10EP11DR2 SOIC82500 / Tape & Reel
MC10EP11DR2G SOIC8
(PbFree)
2500 / Tape & Reel
MC10EP11DT TSSOP8100 Units / Rail
MC10EP11DTG TSSOP8
(PbFree)
100 Units / Rail
MC10EP11DTR2 TSSOP82500 / Tape & Reel
MC10EP11DTR2G TSSOP8
(PbFree)
2500 / Tape & Reel
MC10EP11MNR4 DFN8 1000 / Tape & Reel
MC10EP11MNR4G DFN8
(PbFree)
1000 / Tape & Reel
MC100EP11D SOIC898 Units / Rail
MC100EP11DG SOIC8
(PbFree)
98 Units / Rail
MC100EP11DR2 SOIC82500 / Tape & Reel
MC100EP11DR2G SOIC8
(PbFree)
2500 / Tape & Reel
MC100EP11DT TSSOP8100 Units / Rail
MC100EP11DTG TSSOP8
(PbFree)
100 Units / Rail
MC100EP11DGH SOIC8
(HalideFree, PbFree)
98 Units / Rail
MC100EP11DR2GH SOIC8
(HalideFree, PbFree)
2500 / Tape & Reel
MC100EP11DTR2 TSSOP82500 / Tape & Reel
MC100EP11DTR2G TSSOP8
(PbFree)
2500 / Tape & Reel
MC100EP11MNR4G DFN8
(PbFree)
1000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC10EP11, MC100EP11
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10
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC10EP11, MC100EP11
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11
PACKAGE DIMENSIONS
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C0.80 1.10 0.031 0.043
D0.05 0.15 0.002 0.006
F0.40 0.70 0.016 0.028
G0.65 BSC 0.026 BSC
L4.90 BSC 0.193 BSC
M0 6 0 6
____
SEATING
PLANE
PIN 1
14
85
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X L/2
U
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
T
V
W
0.25 (0.010)
8x REFK
IDENT
K0.25 0.40 0.010 0.016
TSSOP8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
MC10EP11, MC100EP11
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12
PACKAGE DIMENSIONS
DFN8
CASE 506AA01
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÇÇÇ
ÇÇÇ
ÇÇÇ
ÇÇÇ
A
D
E
B
C0.10
PIN ONE
2 X
REFERENCE
2 X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C0.10
C0.10
C0.08
8 X
A1
SEATING
PLANE
e/2 e
8 X
K
NOTE 3
b
8 X 0.10 C
0.05 C
ABB
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b0.20 0.30
D2.00 BSC
D2 1.10 1.30
E2.00 BSC
E2 0.70 0.90
e0.50 BSC
K0.20 −−−
L0.25 0.35
14
85
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.
Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury
or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an
Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
MC10EP11/D
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
l
Sales Representative