AP22815 / AP22615 SINGLE CHANNEL POWER DISTRIBUTION SWITCH WITH OUTPUT OVP Description Pin Assignments The AP22815/615 is a 3A single-channel current-limited high-side power switch with output OVP optimized for USB and other hot-swap applications, which must have overvoltage protection from output to protection the system. The AP22815/615 complies with USB standards and is available with both polarities of Enable input. AP22815 supports fixed current-limited feature, while AP22615 equips adjustable current-limited feature optimized for applications that require precision current limiting support. It supports USB PD3.0 fast role-swap function. The output voltage could recovery to USB valid voltage range within 110s during USB PD fast role-swap event. The device has fast short-circuit and output overvoltage response time for improved overall system robustness. Both TSOT25 and TSOT26 packages integrate discharge circuitry inside OUT pin. They provide a complete protection solution for applications subject to heavy capacitive loads and the prospect of short circuit, and offer output overvoltage protection, reverse-current protection, overcurrent, overtemperature and short-circuit protection, as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the open-drain flag output prevents false overcurrent, overvoltage, and overtemperature reporting and does not require any external components. The AP22815 is available in a standard green TSOT25 packages with RoHS compliant. The AP22615 is available in a standard Green TSOT26 packages with RoHS compliant. Features Applications * * * * * * * * * * * * * * * * * * * * * * Input Voltage Range: 3.0V ~ 5.5V 40m On-Resistance Built-in Soft-Start with 2.1ms Typical Rise Time Fault Report (FLG) with Blanking Time (7ms typ) Accurate Adjustable Current Limit, 0.4A ~ 4.0A (AP22615 Only) ESD Protection: 2KV HBM, 200V MM Active Low or Active High Enable Protection Output Overvoltage with Auto Recovery Overcurrent with Auto Recovery Short-Circuit with Auto Recovery Overtemperature with Auto Recovery Output Reverse Voltage/Current Protection Fast Role Swap Function Thermally Efficient Low Profile Package UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) Notes: Integrated Load Switches in Ultrabook PC Power Up/Down Sequencing in Ultrabook PC Notebook, Netbook, Tablet PC, Set-Top Box SSD (Solid State Drives) Consumer Electronics USB Charger Telecom Systems 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 1 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Typical Applications Circuit Active-High Enabled Example IN Power Supply 3.0V to 5.5V 0.1uF 1uF 10k Load OUT AP22815 100uF FLG ON EN OFF GND Active-High Enabled Example IN Power Supply 3.0V to 5.5V AP22615 1uF 10k FLG 0.1uF 100uF ISET RLIM 6K6.8K ON OFF Load OUT EN GND Note: Applying a 1F input capacitor leads to a large VIN spike, so it is recommended to use a 10F capacitor instead. AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 2 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Pin Descriptions AP22815 TSOT25 AP22615 TSOT26 Pin Name 1 1 OUT Voltage Output Pin 2 2 GND Ground Pin of the Circuitry 3 3 FLG Overcurrent and Overtemperature Fault Report; Open-Drain Flag is Active Low When Triggered. 4 4 EN Enable Input. Enable Input (Active Low or Active High). NC 5 ISET 5 6 IN Pin function AP22815 : NC pin AP22615 : Set OCP current by attaching resistor. The current limit: ILIM (A)=6800/RLIM() Voltage Input Pin Functional Block Diagram Current Sense Voltage Sense IN OUT UVLO OVP EN Driver Current Limit Discharge Control FLG Deglitch Thermal Sense ISET (AP22615) GND AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 3 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Absolute Maximum Ratings (@ TA = +25C, unless otherwise specified.) (Note 4) Symbol Ratings Units Human Body ESD Protection Machine Model ESD Protection Input Voltage 2000 200 -0.3 to 6.0 V V V VOUT Output Voltage (VOUT to GND, VOUT to VIN) -0.3 to 28 V VEN Enable Voltage -0.3 to (VIN +0.3) V VISET ISET Voltage -0.3 to (VIN +0.3) V IL Load Current Internal Limited A 150 C -65 to +150 C ESD HBM ESD MM VIN TJ(max) Parameter Maximum Junction Temperature TST Storage Temperature RJA Thermal Resistance, Junction to Ambient TSOT25 TSOT26 85 80 C/W RJC Thermal Resistance, Junction to Case TSOT25 TSOT26 32 30 C/W Note: 4. Stresses greater than the Absolute Maximum Ratings specified above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. 5. RJA and RJC are measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. Recommended Operating Conditions Symbol Note: (Note 5) Parameter VIN Input Voltage IOUT Output Current, 4.0V Vin 5.5V Output Current, 3.0V Vin < 4.0V Min Max Unit 3.0 5.5 V 0 0 3 1.5 A A VIL RLIM EN Input Logic Low Voltage VOUT Output Voltage VIH EN Input Logic High Voltage 1.2 VIN V TA Operating Ambient Temperature -40 +85 C Current-Limit Threshold Resistor Range (1% Initial Tolerance) 0 0.4 V 1.94 6.8 k 0 23 V 5. Refer to the typical application circuit. AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 4 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Electrical Characteristics (Vin = 5.0v @ TA = +25C, CIN = 1F, CL = 100nF, unless otherwise specified.) Symbol VUVLO Parameter Input UVLO VUVLO Input UVLO Hysteresis Min Typ Max Unit VIN Rising Test Conditions 2.1 2.5 2.9 V VIN Decreasing -- 180 -- mV ISHDN Input Shutdown Current Disabled, OUT = Open (Discharge Current Included) -- 0.1 10 A IQ Input Quiescent Current Enabled, OUT = Open -- 300 -- A ILEAK Input Leakage Current Disabled, OUT Grounded -- 0.1 1 A Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at OUT -- 0.5 15 IREV A Disabled, VIN = 0V, VOUT = 20V, IREV at OUT -- 0.5 30 A AP22815 -- 40 50 m (AP22815) VIN = 5V, VOUT = 4V 3.1 3.6 4.2 A (AP22615) VIN = 5V, VOUT = 4V, RLIM = 1.94K 3.1 3.6 4.2 A 0.75 1 -- A RDS(ON) Switch On-Resistance ILIMIT Overload Current Limit VIN = 5.0V, IOUT = 1A (AP22615) VIN = 5V, RLIM = 6.8K VOUT =4V Enabled, Output Short to Ground -- 1 -- A TSHORT Short-Circuit Response Time VIN = 5 V, No Load -- 5 -- s VIL EN Input Logic Low Voltage VIN = 5V -- -- 0.4 V VIH EN Input Logic High Voltage VIN = 5V 1.2 -- -- V VIN = 5V, VEN = 0V and 5.5V -- 1 2 A Disabled, VOUT = 0V -- 0.5 1 A ms ISHORT Short-Circuit Current Limit ILEAK-EN EN Input Leakage ILEAK-O Output Leakage Current TD(ON) Output Turn-On Delay Time CL = 10F, RLOAD = 10 @ VIN = 5V (Figure 1) -- 2.2 -- TR Output Turn-On Rise Time CL = 10F, RLOAD = 10 @ VIN = 5V (Figure 1) 1.0 1.9 3.5 ms CL = 10F, RLOAD = 10 @ VIN = 5V (Figure 1) -- 0.02 -- ms ms TD(OFF) Output Turn-Off Delay Time CL = 10F, RLOAD = 10 @ VIN = 5V (Figure 1) -- 0.2 -- RFLG FLG Output FET On-Resistance IFLG = 10mA -- 40 60 IFOH FLG Off Current VFLG = 5V -- 0.01 1 A FLG Blanking Time Assertion or Deassertion due to Overvoltage, Overcurrent, and Overtemperature Condition 2 7 20 ms TF TBlank Output Turn-Off Fall Time Discharge Resistance VIN = 5V, Disabled, VOUT = 1V -- 100 -- TSHDN Thermal Shutdown Threshold Enabled -- 140 -- C THYS Thermal Shutdown Hysteresis -- -- 35 -- C VOUT Rising Threshold 5.5 5.7 5.9 V VOUT Falling Threshold -- 5.6 -- V -- -- 0.1 -- V RDIS VOV_TRIP Output OVP Lockout OUTHYS Output OVP Hysteresis TOVP OVP Response Time IOUT=0.5A, CL =1F, VOUT from 5.5V to 6V -- 1 -- s VRVP Reverse-Voltage Comparator Trip Point VOUT - VIN -- 65 -- mV AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 5 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Typical Performance Characteristics VEN 50% TD(ON) 10% TD(ON) 90% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT TF 90% 10% 90% 10% Figure 1 Voltage Waveforms AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 6 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Typical Performance Characteristics (cont.) (TA = +25C, VIN = 5V, CIN = 1F, CL = 0.1F, unless otherwise specified.) Turn-on Time vs. Input Voltage Turn-off Time vs. Input Voltage 50 5 40 Turn-off Time(s) 4 Turn-on Time(ms) CL=10F RLOAD=10 CL=10F RLOAD=10 3 2 1 30 20 10 0 0 3.0 3.5 4.0 4.5 5.0 Input Voltage(V) 5.5 3.0 4.0 4.5 5.0 5.5 Input Voltage(V) Rise Time vs. Input Voltage Fall Time vs. Input Voltage 0.5 5 CL=10F RLOAD=10 CL=10F RLOAD=10 0.4 Fall Time(ms) 4 Rise Time(ms) 3.5 3 2 1 0.3 0.2 0.1 0 0.0 3.0 3.5 4.0 4.5 5.0 5.5 3.0 Input Voltage(V) AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 3.5 4.0 4.5 5.0 5.5 Input Voltage(V) 7 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Input Quiescent Current vs. Temperature Input Shutdown Current vs. Temperature 600 1.0 VIN=5V Enabled OUT=open 500 Input Shutdown Current (A) Input Quiescent Current (A) Typical Performance Characteristics (cont.) (TA = +25C, VIN = 5V, CIN = 1F, CL = 0.1F, unless otherwise specified.) 400 300 200 100 VIN=5V Disabled OUT=open 0.8 0.6 0.4 0.2 0.0 0 -40 -15 10 35 60 -40 85 Temperature(C) 10 35 60 85 Temperature(C) RDS(ON) vs. Output Current RDS(ON) vs. Temperature 80 80 VIN=5V 70 VIN=5V IOUT=1A 70 60 60 RDS(ON) (m) RDS(ON) (m) -15 50 40 30 50 40 30 20 20 10 10 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 Document number: DS41022 Rev. 4 - 2 10 35 60 85 Temperature(C) Output Current(A) AP22815 / AP22615 -15 8 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Typical Performance Characteristics (cont.) (TA = +25C, VIN = 5V, CIN = 1F, CL = 0.1F, unless otherwise specified.) Input Leakage Current vs. Temperature Under Voltage Lockout vs. Temperature 3.0 VIN=5V Disabled OUT grounded 0.8 Undervoltage Lockout(V) Input Leakage Current (A) 1.0 0.6 0.4 0.2 0.0 -40 -15 10 35 60 2.8 2.6 UVLO Rising 2.4 2.2 UVLO Falling 2.0 85 -40 -15 Short-Circuit Current Limit (A) 2.0 VIN=5V, Enabled Output short to ground 1.5 1.0 0.5 0.0 10 35 Document number: DS41022 Rev. 4 - 2 85 60 85 100 VOUT - VIN 80 60 40 20 0 -40 Temperature(C) AP22815 / AP22615 60 Reverse-Voltage Comparator Trip vs. Temperature Reverse-Voltage Comparator Trip (mV) Short-Circuit Output Current vs. Temperature -15 35 Temperature() Temperature(C) -40 10 -15 10 35 60 85 Temperature(C) 9 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Reverse Leakage Current vs. Temperature Reverse Leakage Current vs. Temperature 50 1.0 VIN=0V Disabled VOUT=5V IREV at OUT 40 Reverse Leakage Current (A) Reverse Leakage Current (nA) Typical Performance Characteristics (cont.) (TA = +25C, VIN = 5V, CIN = 1F, CL = 0.1F, unless otherwise specified.) 30 20 10 VIN=0V Disabled VOUT=20V IREV at OUT 0.8 0.6 0.4 0.2 0.0 0 -40 -15 10 35 60 -40 85 -15 35 60 85 Temperature(C) Temperature(C) RLIMIT vs. Over Load Current Limit Over Load Current Limit vs. Temperature 4.0 6 AP22615 VIN=5V, VOUT=4V 3.5 3.0 2.5 2.0 1.5 1.0 0.5 Over Load Current Limit (A) Over Load Current Limit (A) 10 AP22815 VIN=5V, VOUT=4V 5 4 3 2 1 0.0 0 2 4 6 -40 10 12 14 16 18 RLIMIT (k) AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 8 -15 10 35 60 85 Temperature() 10 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Typical Performance Characteristics (cont.) (TA = +25C, VIN = 5V, CIN = 1F, CL = 0.1F, unless otherwise specified.) Device Enabled Into Short-Circuit Inrush Current VIN=5V OUT grounded VIN=5V RLOAD=1.66 EN 5V/div EN 5V/div CL=220F CL=470F CL=100F IIN 1A/div IOUT 1A/div 1ms/div AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 CL=1F 1ms/div 11 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Application Information Input and Output Capacitors It is required to place a 1F X7R or X5R ceramic bypass capacitor between IN and GND--close to the device. It is recommended to place a highvalue capacitor (10F or 47F) close to input pin when the output transient load is heavy. This precaution reduces power-supply transients that can cause ringing on the input. Connecting a minimum 100F low ESR electrolytic or tantalum capacitor (or 22F MLCC) between OUT and GND is also required for hot-plug applications, which is required to bypass the output with a 0.1F ceramic capacitor that improves the immunity of the device to short-circuit transients. The bulky 100F or larger capacitors help reduce output droop voltage when a device is plugged in. When abnormal short-circuit condition happens, these capacitors can also reduce output negative voltage due to parasitic inductive effect and avoid device damage. Note that without the bypass capacitors, an output short can cause ringing on the input. If the voltage is over the maximum voltage rating, it will destroy the internal control circuitry even the duration is short. FLG Response When an overcurrent, overtemperature, or out overvoltage shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7ms deglitch timeout. The FLG output remains low until both overcurrent and overtemperature or out overvoltage conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary overcurrent condition, which does not trigger the FLG due to the 7ms deglitch timeout. The AP22815/AP22615 is designed to eliminate false overcurrent reporting without the requirement of external components to remove unwanted pulses. When Vin operates below 4V, the lower Vin voltage results in higher equivalent Ron and can potentially cause the FLG signal to be triggered at a higher output current. Overcurrent and Short-Circuit Protection An internal-sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP22815/AP22615 senses the short-circuit and immediately clamps output current to a certain safe level. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current can flow for a very short period of time before the current limit function can react. After the current limit function has tripped, the device switches into current limiting mode, and the current is clamped at ILIMIT or ISHORT. In the third condition, the load is gradually increased beyond the recommended operating current. The current is permitted to rise until the currentlimit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP22815/AP22615 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold is reached, the device switches into its current limiting mode and is set at ILIMIT. Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP22815/AP22615 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140C due to excessive power dissipation in an overcurrent or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +35C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an overtemperature shutdown or overcurrent occurs with 7ms deglitch. When Vin operates below 4V, the lower Vin voltage results in higher equivalent Ron and might potentially cause the chip to enter thermal cycling condition by higher output current. AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 12 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Application Information (continued) ON/OFF Input Operator The EN input allows the output current to be switched on and off using a GPIO compatible input. The high signal (switch on) must be at least 1.2V and the low signal (switch off) no higher than 0.4V. This pin should not be left floating. It is advisable to hold the EN signal low when applying or removing power. Undervoltage Lockout (UVLO) Undervoltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2.5V, even if the switch is enabled. Whenever the input voltage falls below approximately 2.3V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Discharge Function The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of the output voltage when either no external output resistance or load resistance is present at the output. Output Reverse-Voltage/Current Protection The output reverse-voltage protection turns off the MOSFET switch whenever the output voltage is higher than the input voltage by 65mV, and the MOSFET switch turns on when output reverse-voltage conditions is removed. When reverse-voltage is lower than 65mV, the reverse current is regulated at approximately 350mA. When the reverse current continuously increases and the reverse voltage is larger than 65mV, the reversevoltage protection is triggered. Fast Role-Swap Function The AP22615 & AP22815 integrate the fast role-swap function, which makes Vout recovery to 4.75V within 150s during Vout drops from high voltage to low. When EN is high, Vin is valid, and Vout is higher than Vin by 65 mV, the device works at reverse block mode, power FET is off and standby for FRS. Once Vout drops lower than Vin, power FET is turned on in 150s. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON) x I 2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: * * * TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Board Layout Instruction Placing input and output capacitors, 1F and 0.1F+100F respectively, close and next to the device pins must be implemented to minimize the effects of parasitic inductance. For best performance, all trace lengths must be kept as short as possible. The input and output PCB traces must be as wide as possible. Use a ground plane to enhance the power dissipation capability of the device. AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 13 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Ordering Information AP22815X XX-X AP22615X XX-X Package Enable A : Active High B : Active Low Packing -7 : Tape & Reel WT: TSOT25 WU: TSOT26 Part Number Package Code Packaging AP22815A AP22815B AP22615A AP22615B WT WT WU WU TSOT25 TSOT25 TSOT26 TSOT26 Quantity 7" Tape and Reel Part Number Suffix 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel -7 -7 -7 -7 Marking Information (1) TSOT25 ( Top View ) 4 7 5 XX Y W X 1 (2) 2 3 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Part Number Package Type Identification Code AP22815AWT-7 AP22815BWT-7 TSOT25 TSOT25 P5 P6 TSOT26 ( Top View ) 5 4 7 6 XX Y W X 1 AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 2 3 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Part Number Package Type Identification Code AP22615AWU-7 AP22615BWU-7 TSOT26 TSOT26 P7 P8 14 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 Package Outline Dimensions (All dimensions in mm.) Please see http://www.diodes.com/package-outlines.html for the latest version. (1) TSOT25 D e1 01( 4x) E1/2 E/2 E1 c E Gauge Plane 0 L L2 01( 4x) b e Seating Plane A2 A1 A Seating Plane (2) TSOT25 Dim Min Max Typ A -- 1.00 -- A1 0.01 0.10 -- A2 0.84 0.90 -- b 0.30 0.45 -- c 0.12 0.20 -- D -- -- 2.90 E -- -- 2.80 E1 -- -- 1.60 e 0.95 BSC e1 1.90 BSC L 0.30 0.50 -- L2 0.25 BSC 0 8 4 1 4 12 -- All Dimensions in mm TSOT26 D e1 01( 4x) E1/2 E/2 E1 c E Gauge Plane 0 L e L2 01( 4x) b A2 A A1 Seating Plane AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 15 of 17 www.diodes.com Seating Plane TSOT26 Dim Min Max Typ A -- 1.00 -- A1 0.010 0.100 -- A2 0.840 0.900 -- D 2.800 3.000 2.900 E 2.800 BSC E1 1.500 1.700 1.600 b 0.300 0.450 -- c 0.120 0.200 -- e 0.950 BSC e1 1.900 BSC L 0.30 0.50 -- L2 0.250 BSC 0 8 4 1 4 12 -- All Dimensions in mm December 2018 (c) Diodes Incorporated AP22815 / AP22615 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) TSOT25 C Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 Y1 Y X (2) TSOT26 C Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 Y1 Y X AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 16 of 17 www.diodes.com December 2018 (c) Diodes Incorporated AP22815 / AP22615 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2018, Diodes Incorporated www.diodes.com AP22815 / AP22615 Document number: DS41022 Rev. 4 - 2 17 of 17 www.diodes.com December 2018 (c) Diodes Incorporated