OSRAM OSTAR Observation (850nm) Lead (Pb) Free Product - RoHS Compliant SFH 4730, SFH 4740 SFH 4740 SFH 4740 SFH 4730 SFH 4730 SFH 4730 * Schwarzer Rahmen zur Streulichtminimierung * 3.6 W optische Leistung bei IF=1A * Black frame to minimize scattered light * 3.6 W optical power at IF=1A SFH 4740 SFH 4740 * Weier Rahmen fur hohe Lichtleistung * 4.3 W optische Leistung bei IF=1A * White frame to achieve high optical power * 4.3 W optical power at IF=1A Wesentliche Merkmale Features * * * * * * Aktive Chipflache 2.1 x 5.4 mm2 max. Gleichstrom 1 A niedriger Warmewiderstand (2.8 K/W) Emissionswellenlange 850 nm ESD-sicher bis 2 kV nach JESD22-A114-E Augensicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 mussen beachtet werden. * * * * * * Active chip area 2.1 x 5.4 mm2 max. DC-current 1 A Low thermal resistance (2.8 K/W) Spectral emission at 850 nm ESD safe up to 2 kV acc. to JESD22-A114-E Eye safety precautions given in IEC 60825-1 and IEC 62471 have to be followed. Anwendungen Applications * * * * * * * * Infrarotbeleuchtung fur Kameras Uberwachungssysteme IR-Datenubertragung Fahrer-Assistenz Systeme Infrared Illumination for cameras Surveillance systems IR Data Transmission Driver assistance systems Typ Type Bestellnummer Ordering Code Strahlstarke1) (IF = 1A, tp = 20 ms) Radiant intensity1) e (mW/sr) SFH 4730 Q65110A5452 800 (typ.1200) SFH 4740 Q65110A6190 1000 (typ.1400) 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr. 2010-12-15 1 SFH 4730, SFH 4740 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range TB, op , TB, stg - 40 ... + 125 C Sperrschichttemperatur Junction temperature TJ + 145 C Sperrspannung Reverse voltage VR 0.5 V Vorwartsgleichstrom, TB1) 90 C Forward current IF 1 A Stostrom, tp < 3 ms, D = 0 Surge current IFSM 5 A Leistungsaufnahme, TB 90 C Power consumption Ptot 19 W Thermische Verlustleistung, TB 90 C Thermal power-dissipation Pth 15.4 W Warmewiderstand Sperrschicht / Bodenplatte Thermal resistance Junction / Base plate RthJB 2.8 K/W 1) TB = Temperatur auf der Ruckseite der Metallkernplatine / Temperature at the backside of the base plate. 2010-12-15 2 SFH 4730, SFH 4740 Kennwerte (TB = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 1 A, tp = 10 ms peak 860 nm Schwerpunkts-Wellenlange der Strahlung Centroid wavelength IF = 1 A, tp = 10 ms centroid 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 1 A, tp = 10 ms 30 nm Abstrahlwinkel Half angle 60 Grad deg. Abmessungen der aktiven Chipflache1) Dimension of the active chip area LxB LxW 2.1 x 5.4 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, IF = 5 A, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 5 A, RL = 50 tr , tf 10, 10 ns Durchlassspannung Forward voltage IF = 1 A, tp = 100 s VF 15.5 ( 19) V e e 3.6 4.3 W W Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 1 A, tp = 10 ms TCI - 0.3 %/K Temperaturkoeffizient von VF Temperature coefficient of VF IF = 1 A, tp = 10 ms TCV - 10 mV/K Temperaturkoeffizient von Temperature coefficient of IF = 1 A, tp = 10 ms TC,centroid + 0.3 nm/K Gesamtstrahlungsfluss Total radiant flux IF = 1 A, tp = 100 s SFH 4730 SFH 4740 1) Die aktive Chipflache besteht aus 10 einzelnen Chips mit je 1 x 1 mm. The active chip area consists of 10 single chips with 1 x 1 mm each. 2010-12-15 3 SFH 4730, SFH 4740 Strahlstarke1) e Radiant Intensity1) e Bezeichnung Parameter Symbol Werte Values SFH 4730 -EB e min e max Strahlstarke Radiant Intensity IF = 1 A, tp = 20 ms 1) 800 1250 SFH 4730 -FA 1000 1600 Einheit Unit SFH 4740 -FA 1000 1600 SFH 4740 -FB 1250 2000 Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 1.6:1) Only one group in one packing unit (variation lower 1.6:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 2010-12-15 0.8 0.6 0.4 0 20 40 4 60 80 100 120 mW/sr mW/sr SFH 4730, SFH 4740 Relative spektrale Emission Relative Spectral Emission Irel = f (), TB = 25 C OHF04132 100 I rel Durchlassstrom Forward Current IF = f (VF), TB = 25 C, Single pulse, tp = 100 s % IF Relativer Gesamtstrahlungsfluss Relative Total Radiant Flux e/e(1A) = f (IF), TB = 25 C, Single pulse, tp = 100 s OHF04319 101 A OHF03848 101 e e (1 A) 80 100 10 60 0 5 5 10-1 5 40 10-1 10-2 5 20 5 0 700 750 800 850 nm 950 10-2 10 15 20 V 25 VF Max. zulassiger Durchlassstrom Max. Permissible Forward Current IF = f (TB), RthJB = 2.8 K/W OHF04318 1100 mA IF 900 4.5 800 4.0 700 3.5 600 3.0 500 2.5 400 2.0 300 1.5 200 1.0 100 0.5 0 0 20 40 60 80 100 C 140 OHF04317 t D = TP 2010-12-15 tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.33 0.5 1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp TB 5 5 10 -1 5 10 0 A 10 1 IF Zulassige Impulsbelastbarkeit Permissible Pulse Handling Capability IF = f (tp), TB = 85 C, Duty cycle D = parameter 5.5 IF A 10-3 -2 10 SFH 4730, SFH 4740 SMD NTC Thermistor mit Nickel Barrier Termination, Typ 0603 SMD NTC Thermistor with Nickel Barrier Termination, Type 0603 No. of R/T characteristics EPCOS 8502 / A01 R25 B25/50 B25/85 B25/100 [] [K] [K] [K] 10k 5% 3940 3980 4000 Typische Thermistor Kennlinie Typical Thermistor Graph R OHL02893 10 6 10 5 5 10 4 5 10 3 5 10 2 -60 -20 20 60 100 C 160 TNTC 2010-12-15 (www.epcos.com) 6 SFH 4730, SFH 4740 Mazeichnung und Ersatzschaltbild Package Outlines and equivalent circuit diagram Mae in mm (inch) / Dimensions in mm (inch). Verwendeter Stecker / Used male connector on board: ERNI male connector SMD 214012, 4-pins (www.erni.com) Empfohlene Gegenstecker / Recommended female connector for power supply: ERNI female connector SMD 214025, 4-pins (www.erni.com) Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2010-12-15 7