SFH 4730, SFH 4740
OSRAM OSTAR Observation (850nm)
Lead (Pb) Free Product - RoHS Compliant
SFH 4730
SFH 4740
2010-12-15 1
SFH 4740
SFH 4730
• Schwarzer Rahmen zur Streulichtminimierung
•3.6 W optische Leistung bei IF=1A
SFH 4740
• Weißer Rahmen für hohe Lichtleistung
•4.3 W optische Leistung bei IF=1A
Wesentliche Merkmale
• Aktive Chipfläche 2.1 x 5.4 mm2
• max. Gleichstrom 1 A
• niedriger Wärmewiderstand (2.8 K/W)
• Emissionswellenlänge 850 nm
•ESD-sicher bis 2 kV nach JESD22-A114-E
• Augensicherheitsrichtlinien der IEC-Normen
60825-1 und 62471 müssen beachtet werden.
Anwendungen
• Infrarotbeleuchtung für Kameras
• Überwachungssysteme
• IR-Datenübertragung
• Fahrer-Assistenz Systeme
Typ
Type
Bestellnummer
Ordering Code
Strahlstärke1) (IF = 1A, tp = 20 ms)
Radiant intensity1) Ιe (mW/sr)
1) gemessen bei einem Raumwinkel Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr.
SFH 4730 Q65110A5452 ≥ 800 (typ.1200)
SFH 4740 Q65110A6190 ≥ 1000 (typ.1400)
SFH 4730
• Black frame to minimize scattered light
•3.6 W optical power at IF=1A
SFH 4740
• White frame to achieve high optical power
•4.3 W optical power at IF=1A
Features
• Active chip area 2.1 x 5.4 mm2
• max. DC-current 1 A
• Low thermal resistance (2.8 K/W)
• Spectral emission at 850 nm
• ESD safe up to 2 kV acc. to JESD22-A114-E
• Eye safety precautions given in IEC 60825-1
and IEC 62471 have to be followed.
Applications
• Infrared Illumination for cameras
• Surveillance systems
• IR Data Transmission
• Driver assistance systems
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SFH 4730, SFH 4740
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
TB, op , TB, stg – 40 … + 125 °C
Sperrschichttemperatur
Junction temperature
TJ+ 145 °C
Sperrspannung
Reverse voltage
VR0.5 V
Vorwärtsgleichstrom, TB1) ≤ 90 °C
Forward current
IF1 A
Stoßstrom, tp < 3 ms, D = 0
Surge current
IFSM 5 A
Leistungsaufnahme, TB ≤ 90 °C
Power consumption
Ptot 19 W
Thermische Verlustleistung, TB ≤ 90 °C
Thermal power-dissipation
Pth 15.4 W
Wärmewiderstand Sperrschicht / Bodenplatte
Thermal resistance Junction / Base plate
RthJB 2.8 K/W
1) TB = Temperatur auf der Rückseite der Metallkernplatine / Temperature at the backside of the base plate.
SFH 4730, SFH 4740
2010-12-15 3
Kennwerte (TB = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 1 A, tp = 10 ms
λpeak 860 nm
Schwerpunkts-Wellenlänge der Strahlung
Centroid wavelength
IF = 1 A, tp = 10 ms
λcentroid 850 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 1 A, tp = 10 ms
Δλ 30 nm
Abstrahlwinkel
Half angle
ϕ± 60 Grad
deg.
Abmessungen der aktiven Chipfläche1)
Dimension of the active chip area
L × B
L × W
2.1 × 5.4 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, IF = 5 A, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 5 A, RL = 50 Ω
tr, tf10, 10 ns
Durchlassspannung
Forward voltage
IF = 1 A, tp = 100 µs
VF15.5 (≤ 19) V
Gesamtstrahlungsfluss
Total radiant flux
IF = 1 A, tp = 100 μs
SFH 4730
SFH 4740
Φe
Φe
3.6
4.3
W
W
Temperaturkoeffizient von Ie bzw. Φe
Temperature coefficient of Ie or Φe
IF = 1 A, tp = 10 ms
TCI– 0.3 %/K
Temperaturkoeffizient von VF
Temperature coefficient of VF
IF = 1 A, tp = 10 ms
TCV– 10 mV/K
Temperaturkoeffizient von λ
Temperature coefficient of λ
IF = 1 A, tp = 10 ms
TCλ,centroid + 0.3 nm/K
1) Die aktive Chipfläche besteht aus 10 einzelnen Chips mit je 1 x 1 mm².
The active chip area consists of 10 single chips with 1 x 1 mm² each.
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SFH 4730, SFH 4740
Strahlstärke1) Ιe
Radiant Intensity1) Ιe
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 1.6:1)
Only one group in one packing unit (variation lower 1.6:1)
Bezeichnung
Parameter
Symbol Werte
Values
Einheit
Unit
SFH 4730
-EB
SFH 4730
-FA
SFH 4740
-FA
SFH 4740
-FB
Strahlstärke
Radiant Intensity
IF = 1 A, tp = 20 ms
Ιe min
Ιe max
800
1250
1000
1600
1000
1600
1250
2000
mW/sr
mW/sr
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
0˚10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
SFH 4730, SFH 4740
2010-12-15 5
Relative spektrale Emission
Relative Spectral Emission
Irel = f (λ), TB = 25 °C
Max. zulässiger Durchlassstrom
Max. Permissible Forward Current
IF = f (TB), RthJB = 2.8 K/W
700
0nm
%
OHF04132
20
40
60
80
100
950750 800 850
I
rel
λ
14010080604020 ˚C0
T
B
100
0
200
400
300
500
700
600
800
F
I
900
mA
1100
OHF04318
Durchlassstrom
Forward Current
IF = f (VF), TB = 25 °C,
Single pulse, tp = 100 μs
Zulässige Impulsbelastbarkeit
Permissible Pulse Handling
Capability IF = f (tp), TB = 85 °C,
Duty cycle D = parameter
OHF04319
F
I
V
A
10
F
V
10-1
5
100
5
101
10-2
15 20 25
1010
0
-2-3-4-5
1010 10
F
I
A
P
t
=
DT
210-1
10
t
p
10 s 10
OHF04317
T
t
P
I
F
0.5
0.33
0.1
0.2
0.05
0.005
0.01
0.02
D
=
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.5
1
Relativer Gesamtstrahlungsfluss
Relative Total Radiant Flux
Φe/Φe(1A) = f (IF), TB = 25 °C,
Single pulse, tp = 100 μs
OHF03848
10-3
A
101
0
10
5
5
10-1
-2
5
10
I
F
10 10 0
10 1
1055
-2 -1
Φ(1 A)
Φe
e
2010-12-15 6
SFH 4730, SFH 4740
SMD NTC Thermistor mit Nickel Barrier Termination, Typ 0603
SMD NTC Thermistor with Nickel Barrier Termination, Type 0603
No. of R/T
characteristics
R25
[Ω]
B25/50
[K]
B25/85
[K]
B25/100
[K]
EPCOS 8502 / A01 10k ± 5% 3940 3980 4000
Typische Thermistor Kennlinie
Typical Thermistor Graph
(www.epcos.com)
SFH 4730, SFH 4740
2010-12-15 7
Maßzeichnung und Ersatzschaltbild
Package Outlines and equivalent circuit diagram
Maße in mm (inch) / Dimensions in mm (inch).
Verwendeter Stecker / Used male connector on board:
ERNI male connector SMD 214012, 4-pins (www.erni.com)
Empfohlene Gegenstecker / Recommended female connector for power supply:
ERNI female connector SMD 214025, 4-pins (www.erni.com)
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com
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The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
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By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.