© Semiconductor Components Industries, LLC, 2014
August, 2017 − Rev. 12
1Publication Order Number:
MBRS360T3/D
MBRS360T3G,
MBRS360BT3G,
NRVBS360T3G,
NRVBS360BT3G
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Features
•Small Compact Surface Mountable Package with J−Bend Leads
•Rectangular Package for Automated Handling
•Highly Stable Oxide Passivated Junction
•Excellent Ability to Withstand Reverse Avalanche Energy Transients
•Guard−Ring for Stress Protection
•NRVBS Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
•Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
•Weight: 217 mg (Approximately), SMC
95 mg (Approximately), SMB
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Polarity: Polarity Band on Plastic Body Indicates Cathode Lead
•Device Meets MSL 1 Requirements
•ESD Ratings:
♦Machine Model, C
♦Human Body Model, 3B
Device Package Shipping†
ORDERING INFORMATION
SMB
CASE 403A−03
SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES, 60 VOLTS
www.onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
MBRS360T3G SMC
(Pb−Free)
2,500 /
Tape & Reel
B36 = Specific Device Code
A = Assembly Location**
Y = Year
WW = Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAMS
AYWW
B36G
G
MBRS360BT3G SMB
(Pb−Free)
2,500 /
Tape & Reel
NRVBS360T3G* SMC
(Pb−Free)
2,500 /
Tape & Reel
2,500 /
Tape & Reel
NRVBS360BT3G* SMB
(Pb−Free)
2,500 /
Tape & Reel
SBRS360BT3G SMB
(Pb−Free)
SMC 2−LEAD
CASE 403AC
**The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly code
may be blank.
2,500 /
Tape & Reel
NRVBS360BT3G
−VF01*
SMB
(Pb−Free)
AYWW
B36G
G
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60 V
Average Rectified Forward Current IF(AV) 3.0 @ TL = 137°C
4.0 @ TL = 127°C
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM 125
A
Storage Temperature Range Tstg −65 to +175 °C
Operating Junction Temperature (Note 1) TJ−65 to +175 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Lead (Note 2)
SMC Package
SMB Package
RqJL 11
15
°C/W
Thermal Resistance, Junction−to−Ambient (Note 2)
SMC Package
SMB Package
RqJA 136
145
°C/W
Thermal Resistance, Junction−to−Ambient (Note 3)
SMC Package
SMB Package (Note 4)
RqJA 71
73
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 5)
(iF = 3.0 A, TJ = 25°C)
VF0.63
V
Maximum Instantaneous Reverse Current (Note 5)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 100°C)
iR0.03
3.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Mounted with minimum recommended pad size, PC Board FR4.
3. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
4. Typical Value; 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
5. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
www.onsemi.com
3
TYPICAL ELECTRICAL CHARACTERISTICS
VF
, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
IF
, INSTANTANEOUS FORWARD
CURRENT (A)
TJ = 25°C
TJ = 150°C
TJ = 100°C
TJ = −40°C
VF
, INSTANTANEOUS FORWARD VOLTAGE (V)
TJ = 25°C
TJ = 150°C
TJ = 100°C
TJ = −40°C
0.01
0.1
1
10
0.0 0.2 0.4 0.6 0.8
TJ = 175°C
0.01
0.1
1
10
0.0 0.2 0.4 0.6 0.8
IF
, INSTANTANEOUS FORWARD
CURRENT (A)
TJ = 175°C
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
IR, INSTANTANEOUS REVERSE
CURRENT (A)
TJ = 25°C
TJ = 150°C
TJ = 100°C
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
IR, INSTANTANEOUS REVERSE
CURRENT (A)
TJ = 25°C
TJ = 150°C
TJ = 100°C
1.0E−07
1.0E−06
1.0E−05
1.0E−04
1.0E−03
1.0E−02
1.0E−01
1.0E+00
0 102030405060
TJ = 175°C
1.0E−06
1.0E−05
1.0E−04
1.0E−03
1.0E−02
1.0E−01
1.0E+00
0 102030405060
TJ = 175°C
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
www.onsemi.com
4
TL, LEAD TEMPERATURE (°C)
Figure 5. Current Derating Figure 6. Forward Power Dissipation
IF(AV), AVERAGE FORWARD CURRENT (A)
0
40123
IO, AVERAGE FORWARD CURRENT (A)
2.5
4.5 5
PFO, AVERAGE POWER DISSIPATION (W)
SQUARE WAVE
dc
0.5
1
1.5
2
3
4
RqJL = 15°C/W
3.52.51.50.5
SQUARE
WAVE
dc
Figure 7. Typical Capacitance
1000
10
600102030
VR, REVERSE VOLTAGE (V)
100
40 50 70
C, CAPACITANCE (pF)
TJ = 25°C
3.5
TJ = 175°C
0
1
2
3
4
5
0 20 40 60 80 100 120 140 160 180
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
www.onsemi.com
5
Test Type > min pad 1 oz
RqJC = min pad 1 oz C/W
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
t, TIME (s)
Figure 8. Thermal Response, Junction−to−Ambient, SMC Package
r
(
t
)
,
TRANSIENT
THERMAL
RESPONSE
100
1
0.1
0.2
D = 0.5
0.05
SINGLE PULSE
0.1
0.00001 0.0001 0.001 0.01 1 100 1000
0.01
10
0.1 10
Test Type > min pad 1 oz
RqJC = min pad 1 oz C/W
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
Figure 9. Typical Thermal Response, Junction−to−Ambient, SMB Package
PULSE TIME (s)
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
0.01
0.1
1
10
100
R(t) (°C/W)
Single Pulse
50% Duty Cycle
20%
10%
5%
2%
1%
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
www.onsemi.com
6
PACKAGE DIMENSIONS
J
SMC 2−LEAD
CASE 403AC
ISSUE B
J
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
E
b
D
c
L
A1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD
FLASH SHALL NOT EXCEED 0.254mm PER SIDE.
4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.
5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA
DETERMINED BY DIMENSION L.
TOP VIEW
SIDE VIEW END VIEW
H
DETAIL A
DETAIL A
SOLDERING FOOTPRINT*
8.750
0.344
3.790
0.149
2.250
0.089 ǒmm
inchesǓSCALE 4:1
DIM
A2
MIN MAX MIN
MILLIMETERS
1.90 2.41 0.075
INCHES
A1 0.05 0.20 0.002
b2.90 3.20 0.114
c0.15 0.41 0.006
D5.55 6.25 0.219
E6.60 7.15 0.260
L0.75 1.60 0.030
0.095
0.008
0.126
0.016
0.246
0.281
0.063
MAX
7.75 8.15 0.305 0.321
HE
2X
2X
E
A2
A1.95 2.61 0.077 0.103
MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G
www.onsemi.com
7
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
E
bD
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
2.261
0.089
2.743
0.108
2.159
0.085 ǒmm
inchesǓ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.95 2.30 2.47 0.077
INCHES
A1 0.05 0.10 0.20 0.002
b1.96 2.03 2.20 0.077
c0.15 0.23 0.31 0.006
D3.30 3.56 3.95 0.130
E4.06 4.32 4.60 0.160
L0.76 1.02 1.60 0.030
0.091 0.097
0.004 0.008
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205 0.214 0.220
HE
0.51 REF 0.020 REF
D
L1
HE
POLARITY INDICATOR
OPTIONAL AS NEEDED
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MBRS360T3/D
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