Approval sheet Ultra Small Series (0201) MULTILAYER CERAMIC CAPACITORS Ultra-small Series (6.3V to 50V) 0201 Size NP0, X7R, X5R Dielectrics RoHS Compliance *Contents in this sheet are subject to change without prior notice. Page 1 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012 Approval sheet Ultra Small Series (0201) 1. INTRODUCTION MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. 0201 MLCC is performed by high precision technology achieve high capacitance in unit size and ensure the stability and reliability of products. 2. FEATURES 3. APPLICATIONS b. c. d. a. b. c. High capacitance in unit size. High precision dimensional tolerances. Suitable used in high-accuracy automatic mounting machine. Miniature microwave module. Portable equipments (ex. Mobile phone, PDA). High frequency circuits. 4. HOW TO ORDER 0201 B 102 K 250 C T Size Dielectric Capacitance Tolerance Rated voltage Termination Packaging Inch (mm) 0201 (0603) N=NP0 (C0G) B=X7R X=X5R Two significant digits followed by no. of zeros. And R is in place of decimal point. eg.: 0R5=0.5pF 1R0=1.0pF 102=10x102 =1000pF Page 2 of 9 B=0.1pF C=0.25pF D=0.5pF F=1% G=2% J=5% K=10% M=20% Z=-20/+80% Two significant digits followed by no. of zeros. And R is in place of decimal point. L=Ag/Ni/Sn (for NP0 T=7" reeled dielectric) C=Cu/Ni/Sn (for X7R, X5R dielectric) 6R3=6.3 VDC 100=10 VDC 160=16 VDC 250=25 VDC 500=50 VDC ASC_ Ultra Small_(0201)_007P_AS Oct. 2012 Approval sheet Ultra Small Series (0201) 5. EXTERNAL DIMENSIONS Size Inch (mm) L (mm) W (mm) 0201 (0603) 0.600.03 0.300.03 T (mm)/Symbol 0.300.03 MB (mm) L L 0.150.05 T * Reflow soldering only. W MB MB Fig. 1 The outline of MLCC 6. GENERAL ELECTRICAL DATA Size 0201 Dielectric Capacitance* Capacitance tolerance** NP0 X7R X5R 0.3pF to 100pF 100pF to 10nF 100pF to 0.47F Cap5pF: B (0.1pF), C (0.25pF) 5pF1000pF, 1.00.2Vrms, 1KHz10% Class II: X7R, X5R 1.00.2Vrms, 1kHz10%** **0.50.2Vrms, 1.0kHz10% : 0201 0.22 uF(6.3V) * Shall not exceed the limits given in the detailed spec. 4a. 5. Q/ D.F. (Dissipation Factor) NP0: Cap30pF, Q1000; Cap<30pF, Q400+20C X7R, X5R: Rated vol. D.F. Exception of D.F. 50V 3% 25V 3.5% 5% 02010.01uF 16V 3.5% 5% 02010.01uF 10V 5% 6.3V 10% --- 10% 02010.012uF 15% 02010.1uF 15% 02010.1uF Dielectric Strength * To apply voltage (100V) 250%. * Duration: 1 to 5 sec. * Charge and discharge current less than 50mA. * No evidence of damage or flash over during test. Insulation Resistance To apply rated voltage for max. 120 sec. 10G or RxC500-F whichever is smaller. Class II (X5R, X6S, X7R, Y5V) Rated voltage Insulation resistance 6.3V; 10V:020147nF 6. Temperature Coefficient 100 -F With no electrical load. T.C. Operating Temp T.C. NP0 (C0G) -55~125C at 25C NP0 (C0G) Capacitance Change Within 30ppm/C X7R -55~125C at 25C X7R Within 15% X5R -55~85C at 25C X5R Within 15% 7. Adhesive Strength of Termination * Pressurizing force2N * Test time: 101 sec. * No remarkable damage or removal of the terminations. 8. Vibration Resistance * Vibration frequency: 10~55 Hz/min. * Total amplitude: 1.5mm * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * Measurement to be made after keeping at room temp. for 242 hrs. * No remarkable damage. * Cap change and Q/D.F.: To meet initial spec. 9. Solderability * Solder temperature: 2355C * Dipping time: 20.5 sec. 95% min. coverage of all metalized area. 10. Bending Test * The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure shall be maintained for 51 sec. * Measurement to be made after keeping at room temp. for 242 hrs. * No remarkable damage. * Cap change: NP0: within 5.0% or 0.5pF whichever is larger. X7R, X5R: within 12.5% Y5V: within 30% (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) Page 5 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012 Approval sheet Ultra Small Series (0201) No. 11. Item Test Condition Requirements Resistance to * Solder temperature: 2605C Soldering Heat * Dipping time: 101 sec * Preheating: 120 to 150C for 1 minute before imme rse the capacitor in a eutectic solder. * Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for 242 hrs. 12. Temperature Cycle * Conduct the five cycles according to the temperatures and time. Step Temp. (C) Time (min.) 1 Min. operating temp. +0/-3 303 2 Room temp. 2~3 3 Max. operating temp. +3/-0 303 4 Room temp. 2~3 * No remarkable damage. * Cap change: NP0: within 2.5% or 0.25pF whichever is larger. X7R, X5R: within 7.5% Y5V: within 20% * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * 25% max. leaching on each edge. * No remarkable damage. * Cap change: NP0: within 2.5 or 0.25pF whichever is larger. X7R, X5R: within 7.5% Y5V: within 20% * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for 242 hrs. 13. Humidity (Steady State) * Test temp.: 402C * Humidity: 90~95% RH * Test time: 500+24/-0hrs. *Before initial measurement (Class II only): Perform 150+0/-10C for 1 hr and then set for 242 hrs at r oom temp. * Measurement to be made after keeping at room temp. for 242 hrs. * No remarkable damage. * Cap change: NP0: within 5.0% or 0.5pF whichever is larger. X7R, X5R: 10V, within 12.5%, 10V0.1F, within 25%; 6.3V, within 25% Y5V: 10V, within 30% 6.3V, within +30/-40% * Q/D.F. value: NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C Cap<10pF; Q200+10C X7R, X5R: Rated vol. D.F. Exception of D.F. 50V 6% --- 25V 5% 10% 02010.01uF 16V 5% 15% 02010.01uF 15% 02010.012uF 20% 02010.1uF 30% 02010.1uF 10V 7.5% 6.3V 15% * I.R.: 10V, 1G or RxC50-F whichever is smaller. 6.3V; 10V:020147nF, RxC10-F Page 6 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012 Approval sheet Ultra Small Series (0201) No. 14. Item Test Condition Requirements Humidity Load * Test temp.: 402C (Damp Heat) * Humidity: 90~95%RH * Test time: 500+24/-0 hrs. * To apply voltagerated voltage. * No remarkable damage. * Cap change: NP0: within 7.5% or 0.75pF whichever is larger. X7R, X5R: 10V, within 12.5%, 10V0.1F, within 25%; 6.3V, within 25% * Before initial measurement (Class II only): To apply test Y5V: 10V, within 30% voltage for 1hr at 40C and then set for 242 hrs a t room temp. 6.3V, within +30/-40% * Measurement to be made after keeping at room temp. for * Q/D.F. value: 242 hrs. NP0: Cap30pF, Q200; Cap<30pF, Q100+10/3C X7R, X5R: Rated vol. D.F. Exception of D.F. 50V 6% --- 25V 5% 10% 02010.01uF 16V 5% 15% 02010.01uF 15% 02010.012uF 20% 02010.1uF 30% 02010.1uF 10V 7.5% 6.3V 15% * I.R.: 10V,500M or RxC25-F whichever is smaller. 6.3V; 10V:020147nF, RxC5-F 15. High Temperature Load (Endurance) * Test temp.: NP0, X7R: 1253C X5R,Y5V: 853C * To apply voltage: (1) Cap.0.1uF : 100% of rated voltage (2) 6.3V: 150% of rated voltage. (3) >6.3V: 200% of rated voltage. * Test time: 1000+24/-0 hrs. * No remarkable damage. * Cap change: NP0: within 3.0% or 0.3pF whichever is larger. X7R, X5R: 10V, within 12.5%, 10V0.1F, within 25%; 6.3V, within 25% Y5V: 10V, within 30% 6.3V, within +30/-40% * Q/D.F. value: NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C *Before initial measurement (Class II only): To apply test Cap<10pF; Q200+10C voltage for 1hr at test temp. and then set for 242 hrs at room X7R, X5R: temp. Rated vol. D.F. Exception of D.F. *Measurement to be made after keeping at room temp. for 50V 6% --242 hrs 25V 5% 10% 02010.01uF 16V 5% 15% 02010.01uF 10V 7.5% 20% 02010.1uF 6.3V 15% 30% 02010.1uF * I.R.: 10V, 1G or RxC50-F whichever is smaller. 6.3V; 10V:020147nF, RxC10-F Page 7 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012 Approval sheet Ultra Small Series (0201) 10. APPENDIXES Tape & reel dimensions Fig. 2 The dimension of paper tape Size Thickness A0 B0 T K0 W P0 10xP0 P1 P2 D0 D1 E F Size Reel size C W1 A N 0201 L 0.380.05 0.680.05 0.420.05 8.000.10 4.000.10 40.00.10 2.000.05 2.000.05 1.550.05 1.750.05 3.500.05 0201 7" 13.0+0.5/-0.2 8.4+1.5/-0 178.00.10 60.0+1.0/-0 13" 13.0+0.5/-0.2 8.4+1.5/-0 330.01.0 1001.0 Fig. 3 The dimension of reel Description of customer label a. Customer name b. WTC order series and item number c. Customer P/O d. Customer P/N e. Description of product f. Quantity g. Bar code including quantity & WTC P/N or customer h. WTC P/N i. Shipping date j. Order bar code including series and item numbers k. Serial number of label Page 8 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012 Approval sheet Ultra Small Series (0201) Constructions No. Name 1 Ceramic material 2 Inner electrode 3 4 NP0 BaTiO3 based AgPd alloy Ni Ag Cu Inner layer Termination 5 X7R, X5R Middle layer Ni Outer layer Sn (Matt) Fig. 4 The construction of MLCC Storage and handling conditions (1) To store products at 5 to 40C ambient temperature and 20 to 70%. related humidity conditions. (2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life extension is needed. Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability. Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low reliability. c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture. . Recommended soldering conditions The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2 within oven are recommended. 4 / sec max Over 60sec at least by natural cooling Fig. 5 Recommended reflow soldering profile for SMT process with SnAgCu series solder paste. Page 9 of 9 Fig. 6 Recommended wave soldering profile for SMT process with SnAgCu series solder. ASC_ Ultra Small_(0201)_007P_AS Oct. 2012