Approval sheet
Ultra Small Series (0201)
Page 1 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
*Contents in this sheet are subject to change without prior notice.
MULTILAYER CERAMIC CAPACITORS
Ultra-small Series (6.3V to 50V)
0201 Size
NP0, X7R, X5R Dielectrics
RoHS Compliance
Approval sheet
Ultra Small Series (0201)
Page 2 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
1. INTRODUCTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used.
0201 MLCC is performed by high precision technology achieve high capacitance in unit size and ensure the
stability and reliability of products.
4. HOW TO ORDER
0201 B 102 K 250 C T
Size
Inch (mm)
0201 (0603)
Dielectric
N=NP0
(C0G)
B=X7R
X=X5R
Capacitance
Two significant digits
followed by no. of zeros.
And R is in place of
decimal point.
eg.:
0R5=0.5pF
1R0=1.0pF
102=10x10
2
=1000pF
Tolerance
B0.1pF
C0.25pF
D0.5pF
F1%
G2%
J5%
K10%
M20%
Z=-20/+80%
Rated voltage
Two significant digits
followed by no. of
zeros. And R is in
place of decimal point.
6R3=6.3 VDC
100=10 VDC
160=16 VDC
250=25 VDC
500=50 VDC
Termination
L=Ag/Ni/Sn (for NP0
dielectric)
C=Cu/Ni/Sn (for X7R,
X5R dielectric)
Packaging
T=7” reeled
2. FEATURES
b. High capacitance in unit size.
c. High precision dimensional tolerances.
d. Suitable used in high-accuracy automatic mounting
machine.
3. APPLICATIONS
a. Miniature microwave module.
b. Portable equipments (ex. Mobile phone, PDA).
c. High frequency circuits.
Approval sheet
Ultra Small Series (0201)
Page 3 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
5. EXTERNAL DIMENSIONS
6. GENERAL ELECTRICAL DATA
Size 0201
Dielectric NP0 X7R X5R
Capacitance* 0.3pF to 100pF 100pF to 10nF 100pF to 0.47µF
Capacitance tolerance**
Cap5pF: B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: C (±0.25pF),D(±0.5pF)
Cap10pF: F (±1%), G (±2%), J (±5%),
K (±10%)
J (±5%), K (±10%), M (±20%) J (±5%),K (±10%), M (±20%)
Rated voltage (WVDC) 16V, 25V, 50V 6.3V, 10V, 16V, 25V, 50V 6.3V, 10V, 16V, 25V, 50V
Tan δ / Q* Cap<30pF, Q400+20C
Cap30pF, Q1000 Note 1
Insulation resistance at Ur
10G 10G or RxC500xF whichever is less
Operating temperature -55 to +125°C -55 to +85°C
Capacitance change ±30ppm ±15%
Termination Ni/Sn (lead-free termination)
* Measured at 30~70% related humidity.
NP0: Apply 1.0±0.2Vrms, 1.0MHz±10% at the condition of 25°C ambient temperature.
X7R, X5R: Apply 1.0±0.2Vrms, 1.0kHz±10%(0201/6.3V,Cap224 : 0.5±0.2Vrms, 1.0kHz±10%) at the condition of 25°C ambient
temperature.
** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10°C for 1 hour, then leave in ambient condition for 24±2 hours
before measurement.
Note 1:
X7R/X5R
Rated vol.
D.F. Exception of D.F.
50V 3% ---
25V 3.5% 5% 02010.01uF
16V 3.5% 5% 02010.01uF
10%
02010.012uF
10V 5% 15%
02010.1uF
6.3V 10% 15%
02010.1uF
T
W
L
M
B
M
B
Fig. 1 The outline of MLCC
Size
Inch (mm) L (mm) W (mm) T (mm)/Symbol M
B
(mm)
0201 (0603) 0.60±0.03
0.30±0.03 0.30±0.03
L 0.15±0.05
* Reflow soldering only.
Approval sheet
Ultra Small Series (0201)
Page 4 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
7. CAPACITANCE RANGE
1. The letter in cell is expressed the symbol of product thickness.
2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.
8. PACKAGING DIMENSION AND QUANTITY
Paper tape
Size Thickness (mm)/Symbol 7” reel 13” reel
0201 (0603) 0.30±0.03 L 15K 70k
Unit: pieces
SIZE 0201
DIELECTRIC NP0
RATED VOLTAGE (VDC)
16
25
50
0.3pF (0R3)
L^
L^
0.4pF (0R4)
L^
L^
0.5pF (0R5)
L^
L^
1.0pF (1R0)
L^
L^
1.2pF (1R2)
L^
L^
1.5pF (1R5)
L^
L^
1.8pF (1R8)
L^
L^
2.2pF (2R2)
L^
L^
2.7pF (2R7)
L^
L^
3.0pF (3R0)
L^
L^
3.3pF (3R3)
L^
L^
3.9pF (3R9)
L^
L^
4.0pF(4R0)
L^
L^
4.7pF (4R7)
L^
L^
5.6pF (5R6)
L^
L^
6.8pF (6R8)
L^
L^
8.2pF (8R2)
L^
L^
10pF (100)
L^
L^
12pF (120)
L^
L^
15pF (150)
L^
L^
18pF (180)
L^
L^
22pF (220)
L^
L^
27pF (270)
L^
L^
33pF (330)
L^
L^
39pF (390)
L^
L^
47pF (470)
L^
L^
56pF (560)
L^
L^
68pF (680)
L^
L^
82pF (820)
L^
L^
Capacitance
100pF (101)
L^
L^
SIZE 0201
DIELECTRIC X7R X5R
RATED VOLTAGE 6.3
10
16
25
50
6.3
10
16
25
50
100pF (101)
L L L L L L
120pF (121)
L L L L L L
150pF (151)
L L L L L L
180pF (181)
L L L L L L
220pF (221)
L L L L L L
270pF (271)
L L L L L L
330pF (331)
L L L L L L
390pF (391)
L L L L L L
470pF (471)
L L L L L L
560pF (561)
L L L L L L
680pF (681)
L L L L L L
820pF (821)
L L L L L L
1,000pF (102)
L L L L L L L L L
1,500pF (152)
L L L L L
2,200pF (222)
L L L L L
3,300pF (332)
L L L L L
4,700pF (472)
L L L L L
6,800pF (682)
L L L
8,200pF (822)
L L L
0.010µF (103)
L L L L L
0.015µF (153)
L L
0.022µF (223)
L L
0.033µF (333)
L L
0.047µF (473)
L L
0.068µF (683)
L L
0.082µF (823)
L L
0.10µF (104)
L L
0.22µF (224)
L
Capacitance
0.47µF (474)
L
Approval sheet
Ultra Small Series (0201)
Page 5 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
9. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Condition Requirements
1.
Visual and
Mechanical --- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
Class I: NP0
Cap1000pF, 1.0±0.2Vrms, 1MH10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
Class II: X7R, X5R
1.0±0.2Vrms, 1kHz±10%**
**0.5±0.2Vrms, 1.0kHz±10% : 0201 0.22 uF(6.3V)
NP0: Cap30pF, Q1000; Cap<30pF, Q400+20C
X7R, X5R:
Rated vol.
D.F. Exception of D.F.
50V 3% ---
25V 3.5% 5% 02010.01uF
16V 3.5% 5% 02010.01uF
10%
02010.012uF
10V 5% 15%
02010.1uF
6.3V 10% 15%
02010.1uF
4a.
Dielectric
Strength * To apply voltage (100V) 250%.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
10G or RxC500-F whichever is smaller.
Class II (X5R, X6S, X7R, Y5V)
Rated voltage Insulation resistance
6.3V; 10V:020147nF 100 -F
5.
Insulation
Resistance To apply rated voltage for max. 120 sec.
6.
Temperature
Coefficient With no electrical load.
T.C. Operating Temp
NP0 (C0G)
-55~125°C at 25°C
X7R -55~125°C at 25°C
X5R -55~85°C at 2C
T.C. Capacitance Change
NP0 (C0G)
Within ±30ppm/°C
X7R Within ±15%
X5R Within ±15%
7.
Adhesive
Strength of
Termination
* Pressurizing force2N
* Test time: 10±1 sec. * No remarkable damage or removal of the terminations.
8.
Vibration
Resistance * Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time:0.5 sec. 95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of ab
out 1 mm per second until
the deflection becomes 1 mm and then the pressure shall be
maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change:
NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R, X5R: within ±12.5%
Y5V: within ±30%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before
the test.)
Approval sheet
Ultra Small Series (0201)
Page 6 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
No.
Item Test Condition Requirements
11.
Resistance to
Soldering Heat
* Solder temperature: 260±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at r oom temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change:
NP0: within ±2.5% or ±0.25pF whichever is larger.
X7R, X5R: within ±7.5%
Y5V: within ±20%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
12.
Temperature
Cycle * Conduct the five cycles according to the temperatures and
time.
Step Temp. (°C) Time (min.)
1 Min. operating temp. +0/-3 30±3
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at r oom temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change:
NP0: within ±2.5 or ±0.25pF whichever is larger.
X7R, X5R: within ±7.5%
Y5V: within ±20%
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
13.
Humidity
(Steady State)
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
*Before initial measurement (Class II only): Perform
150+0/-10°C for 1 hr and then set for 24±2 hrs at r oom temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R, X5R: 10V, within ±12.5%,
10V
0.1µF, within ±25%;
6.3V, within ±25%
Y5V: 10V, within ±30%
6.3V, within +30/-40%
* Q/D.F. value:
NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C
Cap<10pF; Q200+10C
X7R, X5R:
Rated vol.
D.F. Exception of D.F.
50V 6% ---
25V 5% 10%
02010.01uF
16V 5% 15%
02010.01uF
15%
02010.012uF
10V 7.5%
20%
02010.1uF
6.3V 15%
30%
02010.1uF
* I.R.: 10V, 1G or RxC50-F whichever is smaller.
6.3V; 10V:020147nF, RxC10-F
Approval sheet
Ultra Small Series (0201)
Page 7 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
No.
Item Test Condition Requirements
14.
Humidity Load
(Damp Heat)
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltagerated voltage.
* Before initial measurement (Class II only): To apply test
voltage for 1hr at 4C and then set for 24±2 hrs at room temp.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: NP0: within ±7.5% or ±0.75pF whichever is larger.
X7R, X5R: 10V, within ±12.5%,
10V
0.1µF, within ±25%;
6.3V, within ±25%
Y5V: 10V, within ±30%
6.3V, within +30/-40%
* Q/D.F. value:
NP0: Cap30pF, Q200; Cap<30pF, Q100+10/3C
X7R, X5R:
Rated vol.
D.F. Exception of D.F.
50V 6% ---
25V 5% 10%
02010.01uF
16V 5% 15%
02010.01uF
15%
02010.012uF
10V 7.5%
20%
02010.1uF
6.3V 15%
30%
02010.1uF
* I.R.: 10V,500M or RxC25-F whichever is smaller.
6.3V; 10V:020147nF, RxC5-F
15.
High
Temperature
Load
(Endurance)
* Test temp.:
NP0, X7R: 125±3°C
X5R,Y5V: 85±3°C
* To apply voltage:
(1) Cap.0.1uF : 100% of rated voltage
(2) 6.3V: 150% of rated voltage.
(3) >6.3V: 200% of rated voltage.
* Test time: 1000+24/-0 hrs.
*Before initial measurement (Class II only): To apply test
voltage for 1hr at test temp. and then set for 24±2 hrs at room
temp.
*Measurement to be made after keeping at room temp. for
24±2 hrs
* No remarkable damage.
* Cap change: NP0: within ±3.0% or ±0.3pF whichever is larger.
X7R, X5R: 10V, within ±12.5%,
10V
0.1µF, within ±25%;
6.3V, within ±25%
Y5V: 10V, within ±30%
6.3V, within +30/-40%
* Q/D.F. value:
NP0: Cap30pF, Q350; 10pFCap<30pF, Q275+2.5C
Cap<10pF; Q200+10C
X7R, X5R:
Rated vol.
D.F. Exception of D.F.
50V 6% ---
25V 5% 10%
02010.01uF
16V 5% 15%
02010.01uF
10V 7.5%
20%
02010.1uF
6.3V 15%
30%
02010.1uF
* I.R.: 10V, 1G or RxC50-F whichever is smaller.
6.3V; 10V:020147nF, RxC10-F
Approval sheet
Ultra Small Series (0201)
Page 8 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
10. APPENDIXES
Tape & reel dimensions
Description of customer label
Fig. 3 The dimension of reel
Fig. 2 The dimension of paper tape
Size 0201
Reel size
7” 13”
C 13.0+0.5/-0.2 13.0+0.5/-0.2
W
1
8.4+1.5/-0 8.4+1.5/-0
A 178.0±0.10 330.0±1.0
N 60.0+1.0/-0 100±1.0
a. Customer name
b. WTC order series and item number
c. Customer P/O
d. Customer P/N
e. Description of product
f. Quantity
g. Bar code including quantity & WTC P/N or customer
h. WTC P/N
i. Shipping date
j. Order bar code including series and item numbers
k. Serial number of label
Size 0201
Thickness L
A
0
0.38±0.05
B
0
0.68±0.05
T 0.42±0.05
K
0
-
W 8.00±0.10
P
0
4.00±0.10
10xP
0
40.0±0.10
P
1
2.00±0.05
P
2
2.00±0.05
D
0
1.55±0.05
D
1
-
E 1.75±0.05
F 3.50±0.05
Approval sheet
Ultra Small Series (0201)
Page 9 of 9 ASC_ Ultra Small_(0201)_007P_AS Oct. 2012
Constructions
Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions: a. The corrosive gas reacts on the terminal electrodes of capacitors, and results in the poor solderability.
Do not store the capacitors in the ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver migration might occur to cause low
reliability.
c. Due to the dewing by rapid humidity change, or the photochemical change of the terminal electrode by
direct sunlight,the solderability and electrical performance may deteriorate. Do not store capacitors under
direct sunlight or dewing condition. To store products on the shelf and avoid exposure to moisture.
.
Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and
concentration of N
2
within oven are recommended.
Fig. 4 The construction of MLCC
No.
Name NP0 X7R, X5R
1
Ceramic material BaTiO
3
based
2
Inner electrode AgPd alloy Ni
3
Inner layer Ag Cu
4
Middle layer Ni
5
Termination
Outer layer Sn (Matt)
Fig. 5 Recommended reflow soldering profile for SMT process
with SnAgCu series solder paste.
4
/ sec max
Over 60sec at least by
natural cooling
4
/ sec max
Over 60sec at least by
natural cooling
Fig. 6 Recommended wave soldering profile for SMT process
with SnAgCu series solder.