Ericsson Internal
PRODUCT SPECIFICATION 1 (3)
Prepared (also subject responsible if other) No.
SEC/S David Xie 1/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 C
Key Features
• Industry standard MacroDensTM footprint
47.8 x 28.1 x Max height 8.0 mm (1.88 x 1.11 x 0.32
in.)
• High efficiency, typ. 82 %
• 500 Vdc input to output isolation
• More than 3.3 million hours MTBF
• Designed for a specific outdoor radio unit
General Characteristics
• Suited for narrow board pitch applications
(15 mm/0.6 in)
• Input under voltage shutdown
• Over temperature protection
• Over current protection
• Output short-circuit protection
• Soft start
• Synchronization function
• Highly automated manufacturing ensures quality
• ISO 9001/14001 certified supplier
Design for Environment
Meets requirements in high-
temperature lead-free soldering
processes.
Ericsson Internal
TABLE OF CONTENTS 1 (1)
Prepared (also subject responsible if other) No.
SEC/S David Xie 00152-EN/LZT146 37 2 Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 B
Contents
General Information .............................................................2
Safety Specification .............................................................3
Absolute Maximum Ratings .............................................................4
Product Program Ordering No.
5.5V, 2.0A / 3.3V/1.0A Electrical Specification BMR640 5002/1...................................5
EMC Specification .............................................................9
Operating Information ...........................................................10
Thermal Consideration ........................................................... 12
Connections ...........................................................13
Mechanical Information ...........................................................14
Soldering Information ...........................................................16
Delivery Information ...........................................................17
Product Qualification Specification ........................................................... 18
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
Ericsson Internal
PRODUCT SPECIFICATION 2 (3)
Prepared (also subject responsible if other) No.
SEC/S David Xie 1/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 C
General Information
Ordering Information
See Contents for individual product ordering numbers.
Reliability
The Mean Time Between Failure (MTBF) is calculated at
full output power and an operating ambient temperature
(TA) of +40°C, which is a typical condition in Information
and Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses one method Telcordia
SR332.
Predicted MTBF for the series is:
- BMR 640 5002: 3.34 million hours
According to Telcordia SR332, issue 1, Black box
technique.
The Ericsson failure rate data system is based on field
tracking data. The data corresponds to actual failure rates
of components used in Information Technology and
Telecom (IT&T) equipment in temperature controlled
environments (TA = -5...+65°C).
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in IT&T equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
- Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
- Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
Lead as an alloying element in copper alloy containing up to
4% lead by weight (used in connection pins made of Brass)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use
to boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose (including,
but not limited to, use in life support applications, where
malfunctions of product can cause injury to a person’s
health or life).
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
2
Ericsson Internal
PRODUCT SPECIFICATION 3 (3)
Prepared (also subject responsible if other) No.
SEC/S David Xie 1/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 C
Safety Specification
General information
Ericsson Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with safety
standards IEC/EN/UL60950, Safety of Information
Technology Equip m ent.
IEC/EN/UL60950 contains requirements to prevent injury
or damage due to the following hazards:
• Electrical shock
• Energy hazards
• Fire
• Mechanical and heat hazards
• Radiation hazards
• Chemical hazards
On-board DC-DC converters are defined as component
power supplies. As components they cannot fully comply
with the provisions of any Safety requirements without
“Conditions of Acceptability”. It is the responsibility of the
installer to ensure that the final product housing these
components complies with the requirements of all
applicable Safety standards and Directives for the final
product.
Component power supplies for general use should comply
with the requirements in IEC60950, EN60950 and
UL60950 “Safety of information technology equipment”.
There are other more product related standards, e.g.
IEEE802.3af “Ethernet LAN/MAN Data terminal equipment
power”, and ETS300132-2 “Power supply interface at the
input to telecommunications equipment; part 2: DC”, but all
of these standards are based on IEC/EN/UL60950 with
regards to safety.
The flammability rating for all construction parts of the
products meets requirements for V-0 class material
according to IEC 60695-11-10.
The products should be installed in the end-use equipment,
in accordance with the requirements of the ultimate
application. Normally the output of the DC/DC converter is
considered as SELV (Safety Extra Low Voltage) and the
input source must be isolated by minimum Double or
Reinforced Insulation from the primary circuit (AC mains) in
accordance with IEC/EN/UL60950.
Isolated DC/DC converters
It is recommended that a slow blow fuse with a rating twice
the maximum input current per selected product be used at
the input of each DC/DC converter. If an input filter is used
in the circuit the fuse should be placed in front of the input
filter.
In the rare event of a component problem in the input filter
or in the DC/DC converter that imposes a short circuit on
the input source, this fuse will provide the following
functions:
• Isolate the faulty DC/DC converter from the input
power source so as not to affect the operation of
other parts of the system.
• Protect the distribution wiring from excessive
current and power loss thus preventing hazardous
overheating.
The galvanic isolation is verified in an electric strength test.
The test voltage (Viso) between input and output is
500 Vdc for 60 seconds (refer to product specification).
Leakage current is less than 1 µA at nominal input voltage.
24 V DC systems
The input voltage to the DC/DC converter is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
48 and 60 V DC systems
If the input voltage to Ericsson Power Modules DC/DC
converter is 75 Vdc or less, then the output remains SELV
(Safety Extra Low Voltage) under normal and abnormal
operating conditions.
Single fault testing in the input power supply circuit should
be performed with the DC/DC converter connected to
demonstrate that the input voltage does not exceed
75 Vdc.
If the input power source circuit is a DC power system, the
source may be treated as a TNV2 circuit and testing has
demonstrated compliance with SELV limits and isolation
requirements equivalent to Basic Insulation in accordance
with IEC/EN/UL60950.
Non-isolated DC/DC regulators
The input voltage to the DC/DC regulator is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
3
Ericsson Internal
PRODUCT SPECIFICATION 1 (6)
Prepared (also subject responsible if other) No.
SEC/S David Xie 2/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 D
Absolute Maximum Ratings
Characteristics min typ max Unit
Tref Operating Temperature (see Thermal Consideration section) -45 +110 °C
TS Storage temperature -55 +125 °C
VI Input voltage -0.5 +70 V
Viso Isolation voltage (input to output test voltage) 500 Vdc
Vtr Input voltage transient (Tp 100 ms) 100 V
VRC Remote Control pin voltage (Option)
(see Operating Information section)
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits,
are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits,
function and performance may degrade in an unspecified manner.
Fundamental Circuit Diagram
Dual Outputs
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
4
Ericsson Internal
PRODUCT SPECIFICATION 2 (6)
Prepared (also subject responsible if other) No.
SEC/S David Xie 2/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 D
Dual 5.5 V / 2.0 A, 3.3 V / 1.0 A, Electrical Specification BMR 640 5002/1
Tref = -40 to +90ºC, VI = 44 to 60 V, unless otherwise specified under Conditions.
Typical values given at: Tref = +25°C, VI= 55 V, max IO , unless otherwise specified under Conditions.
Characteristics Conditions output min typ max Unit
VI Input voltage range 44 60 V
VIoff Turn-off input voltage Decreasing input voltage 35 38 40 V
VIon Turn-on input voltage Increasing input voltage 38 41 43 V
CI Internal input capacitance 2 μF
PO Output power Output voltage initial setting 0 14.3 W
SVR Supply voltage rejection (ac) f = 100 Hz sinewave, 1 Vp-p 40 dB
50 % of max IO 80
max IO 82.5
50 % of max IO , VI = 55 V 80
η Efficiency
max IO , VI = 55 V 82.5
%
Pd Power Dissipation max IO 3.1 W
Pli Input idling power IO = 0 A, VI = 55 V 0.4 W
fs Switching frequency 10-100 % of max IO
360 450 540 kHz
VOi Output voltage initial setting
and accuracy
Tref = +25°C, VI = 55 V, IO =
Inom
1
2 5.5
3.3 V
Output voltage tolerance
band
Io1 = 0.5 - 2A
Io2 = 0.2 - 1A
1
2
5.225
3.135 5.775
3.465 V
Idling voltage IO = 0 A 1
2
5.5
3.25 6.5
3.4 V
Line regulation max IO 1
2 15
2
30
10 mV
Load regulation VI = 55 V, 12.5-100 % of max IO
1
2 86
30
250
50 mV
VO
Load transient
voltage deviation
VI = 55 V, Load step 50-100-50
% of max IO, di/dt = 1 A/ms
1
2
+100
-100
mV
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
5
Ericsson Internal
PRODUCT SPECIFICATION 3 (6)
Prepared (also subject responsible if other) No.
SEC/S David Xie 2/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 D
Characteristics Conditions output min typ max Unit
tr Load transient recovery time 1
2 50
100 µs
tr Ramp-up time
(from 10−90 % of VOi)
1
2 0.5 s
ts Start-up time
(from VI connection to 90% of VOi)
IO as specified in Output current
below 1
2 1 s
max IO 1
2 0.1 ms
tf Vin shutdown fall time
(from VI off to 10% of VO) IO = 0 A 1
2 s
Output current 1
2
0.5
0.2 2.4
1.0 A
Vo1 = 4.8 V, Tref < max Tref
1
2.6
3.5
4.8
A
IO
Ilim
Isc Current limit threshold
Short circuit current
Tref = 25ºC 1
2 5.5
A
VOac Output ripple & noise See ripple & noise section,
max IO, VOi
1
2 30
30
50
50 mVp-p
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
6
Ericsson Internal
PRODUCT SPECIFICATION 4 (6)
Prepared (also subject responsible if other) No.
SEC/S David Xie 2/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 D
Dual 5.5 V / 2.0 A, 3.3 V / 1.0 A BMR 640 5002/1
Efficiency Power Dissipation
70
73
76
79
82
85
0.0 0.5 1.0 1.5 2.0 [A]
[% ]
44 V
55 V
60V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.0 0.5 1.0 1.5 2.0 [A]
[W]
44 V
55 V
60 V
Efficiency vs. load current IO1 , IO2 =1A and input voltage at Tref = +25°C Dissipated power vs. load current IO1 , IO2 =1A and input voltage at
Tref = +25°C
Output 1 Characteristics
5.0
5.2
5.4
5.6
5.8
6.0
0.0 0.5 1.0 1.5 2.0 [A]
[V]
44 V
55 V
60 V
Output voltage vs. load current IO1 , IO2 =1A at Tref = +25°C
Output Current Derating Thermal Resistance
5.0
7.0
9.0
11.0
13.0
15.0
20 30 40 50 60 70 80 90 100 [癈]
[W]
3.0 m/s
2.0 m/s
1.5 m/s
Nat. Conv.
0
5
10
15
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0[m/s]
[癈/W]
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Thermal resistance vs. airspeed measured at the converter. Tested in
wind tunnel with airflow and test conditions as per
the Thermal consideration section.
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
7
Ericsson Internal
PRODUCT SPECIFICATION 5 (6)
Prepared (also subject responsible if other) No.
SEC/S David Xie 2/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 D
Place your
graph here
Dual 5.5 V / 2.0 A, 3.3 V / 1.0 A BMR 640 5002/1
Start-up Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, VI = 55 V,
IO1 = 2 A, IO2 = 1 A resistive load.
Top trace: output voltage 2 (2 V/div.).
Mid trace: output voltage 1 (2 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (5 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25°C, VI = 55 V},
IO1 = 2 A, IO2 = 1 A resistive load.
Top trace: output voltage 1 (2 V/div.).
Mid trace: output voltage 2 (2 V/div.).
Bottom trace: input voltage (20 V/div.).
Time scale: (0.1 ms/div.).
Output Ripple & Noise Output Load Transient Response
Output voltage ripple at:
Tref = +25°C, VI = 55 V,
IO1 = 2 A, IO2 = 1 A resistive load.
Top trace: output voltage 1 (20mV/div.).
Bottom trace: output voltage 2 (20mV/div.).
Time scale: (2 µs/div.).
Output voltage response to load current step-
change, output 1 (1.2-2.4-1.2 A) at:
Tref =+25°C, VI = 55 V IO2 = 625 mA.
Top trace: output voltage 1 (50mV/div.).
Bottom trace: load current (1 A/div.).
Time scale: (2 ms/div.).
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
8
Limited Internal
PRODUCT SPECIFICATION 1 (6)
Prepared (also subject responsible if other) No.
SEC/S David 3/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 C
EMC Specification
Conducted EMI measured according to EN55022, CISPR 22
and FCC part 15J (see test set-up). The fundamental
switching frequency is 450 kHz on BMR 640 5002/1 @ VI = 55
V, max IO.
Conducted EMI Input terminal value (typ)
Test set-up
Layout recommendation
EMI without filter
External filter
(
class B
)
Required external input filter in order to meet class B in
EN 55022, CISPR 22 and FCC part 15J.
The radiated EMI performance of the DC/DC converter will
depend on the PCB layout and ground layer design.
It is also important to consider the stand-off of the DC/DC
converter.
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
Output ripple and noise
Output ripple and noise measured according to figure below.
C1, C3=47uF
C2, C5= 1uF 100V
C4= 2.2uF 100V
C6,C7= 3.9nF 500Vdc
L1= 5.6 uH
L2= 768 uH
Output ripple and noise test setup
EMI with filter
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
9
Limited Internal
PRODUCT SPECIFICATION 2 (6)
Prepared (also subject responsible if other) No.
SEC/S David 3/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 C
Operating information
Input Voltage
The input voltage range 44…60Vdc.
At input voltages exceeding 60 V, the power loss will be higher
than at normal input voltage and Tref must be limited to
absolute max +95°C. The absolute maximum continuous input
voltage is 70 Vdc.
Turn-off Input Voltage
The converters monitor the input voltage and will turn on and
turn off at predetermined levels. The minimum hysteresis
between turn on and turn off input voltage is 1V.
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
10
Limited Internal
PRODUCT SPECIFICATION 3 (6)
Prepared (also subject responsible if other) No.
SEC/S David 3/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 C
Operating information, cont.
Input And Output Impedance Temperature Shutdown
The DC/DC converters include an internal over temperature
shutdown circuit.
When the temperature exceeds 130°C - 150°C on the control
circuit the converter will shut down. The DC/DC converter will
make continuous attempts to start up (non-latching mode) and
resume normal operation automatically when the temperature
has dropped >15°C below the temperature threshold.
Synchronization (Sync)
The impedance of both the input source and the load will
interact with the impedance of the DC/DC converter. It is
important that the input source has low characteristic
impedance. The converters are designed for stable operation
without external capacitors connected to the input or output.
The performance in some applications can be enhanced by
addition of external capacitance as described under External
Decoupling Capacitors. If the input voltage source contains
significant inductance, the addition of a 10 µF capacitor across
the input of the converter will ensure stable operation. The
capacitor is not required when powering the DC/DC converter
from an input source with an inductance below 10 µH.
External Decoupling Capacitors
It is possible to synchronize the switching frequency on
BMR 640 5002/1 by connecting the synchronization pins (pin
7) together.
Over Current Protection (OCP)
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load can be
improved by addition of decoupling capacitors at the load.
The most effective technique is to locate low ESR ceramic
and electrolytic capacitors as close to the load as possible by
using several parallel capacitors to lower the effective ESR.
The ceramic capacitors will handle high-frequency dynamic
load changes while the electrolytic capacitors are used to
handle low frequency dynamic load changes. Ceramic
capacitors will also reduce any high frequency noise at the
load.
It is equally important to use low resistance and low
inductance PCB layouts and cabling.
External decoupling capacitors will become part of the control
loop of the DC/DC converter and may affect the stability
margins. As a “rule of thumb”, 100 µF/A of output current can
be added without any additional analysis.
The recommended absolute maximum value of output
capacitance is 5 000 µF. For further information please contact
your local Ericsson Power Modules representative.
The converters include current limiting circuitry for protection
at continuous overload.
The output voltage will decrease towards zero for output
currents in excess of max output current (max IO). The
converter will resume normal operation after removal of the
overload. The load distribution should be designed for the
maximum output short circuit current specified.
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
11
Limited Internal
PRODUCT SPECIFICATION 4 (6)
Prepared (also subject responsible if other) No.
SEC/S David 3/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
EERISUS 2009-05-27 C
Thermal Consideration
General Ambient Temperature Calculation
The converters are designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
Cooling is achieved mainly by conduction, from the pins to the
PCB board, and convection, which is dependant on the airflow
across the converter. Increased airflow enhances the cooling
of the converter.
The Output Current Derating graph found in the Output section
for each model provides the available output current vs.
ambient air temperature and air velocity at Vin = 53 V.
The converter is tested on a 254 x 254 mm,
35 µm (1 oz), 8-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
Proper cooling of the converter can be verified by measuring
the temperature at position P1. The temperature at these
positions should not exceed the max values provided in the
table below.
Note that the max value is the absolute maximum rating
(non destruction) and that the electrical Output data is
guaranteed up to Tref +95°C.
Position Device Designation max value
P1 Transformer Tref 110º C
By using the thermal resistance the maximum allowed ambient
temperature can be calculated.
1. The power loss is calculated by using the formula
((1/η) - 1) × output power = power losses (Pd).
η = efficiency of converter. E.g. 82.5 % = 0.825
2. Find the thermal resistance (Rth) in the Thermal Resistance
graph found in the Output section for each model.
Calculate the temperature increase (ΔT).
ΔT = Rth x Pd
3. Max allowed ambient temperature is:
Max Tref - ΔT.
E.g. BMR 640 5002/1 at 1m/s:
1. (( ) - 1) × 14.3 W = 3 W
2. 3 W × 9.2°C/W =27.9 °C
3. 110 °C – 27.9 °C = max ambient temperature is 82.1°C
The actual temperature will be dependent on several factors
such as the PCB size, number of layers and direction of
airflow.
P1
1
0.825
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
12
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PRODUCT SPECIFICATION 5 (6)
Prepared (also subject responsible if other) No.
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EERISUS 2009-05-27 C
Connections
1 9
2 3 4 5 6 7 8
18 17 16 15 14 13 12 11 10
Pin Designation Function
1 Out 1 Output 1
2 Rtn Output return
3 Out 2 Output 2
4 Rtn Output return
5 NC Do not connect
6 NC Do not connect
7 Sync Synchronization*
8 NC Do not connect
9 NC Do not connect
10 Rtn Not connected
11 Rtn Not connected
12 Rtn Not connected
13 Rtn Output return
14 Rtn Output return
15 Rtn Output return
16 Rtn Output return
17 - In Negative Input
18 +In Positive input
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
13
Ericsson Internal
PRODUCT SPEC. MECHANICAL 1 (3)
Prepared (also subject responsible if other) No.
MICKAOV 4/1301-BMR 640 5001 Uen
Approved Checked Date Rev Reference
MPM/BK/P (Margaretha Anderszén) See §1 2006-11-29 B
Mechanical Information - physical specifications
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
14
Ericsson Internal
PRODUCT SPEC. MECHANICAL 2 (3)
Prepared (also subject responsible if other) No.
MICKAOV 4/1301-BMR 640 5001 Uen
Approved Checked Date Rev Reference
MPM/BK/P (Margaretha Anderszén) See §1 2006-11-29 B
Mechanical Information – Assembly information
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
15
Limited Internal
PRODUCT SPECIFICATION 1 (4)
Prepared (also subject responsible if other) No.
MICJOHH 5/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
MPM/BK/P (tbd) See §1 2006-04-06 PA1
Soldering Information - Surface mounting
The product is intended for use in convection or vapor phase
reflow process. To achieve a good and reliable soldering
result, make sure to follow the recommendations from the
solder paste supplier, to use state-of-the-art reflow equipment
and reflow profiling techniques as well as the following
guidelines.
When using a Sn/Pb solder in the host board assembly
process, the composition of the mix of Pb- and Pb-free solder
results in a higher melting temperature compared to standard
Pb solder.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product. The cleaning
residues may affect long time reliability and isolation voltage.
Minimum pin temperature recommendations
Pin number 5 and 14 are chosen as reference locations for the
minimum pin temperature recommendations since these will
be the coolest solder joints during the reflow process.
1 9
2 3 4 5 6 7 8
18 17 16 15 14 13 12 11 10
Main transformer for measurement
of max product temperature, TP.
Pin 5 and 14
for measurement
of minimum
solder joint
temperature, TPIN
SnPb solder processes
For Pb solder processes, a pin temperature (TPIN) in excess of
the solder melting temperature, (TL, +183°C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of +210°C
is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, +217 to +221 °C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of minimum +235°C on all solder joints is
recommended to ensure a reliable solder joint.
Maximum converter temperature requirements
To avoid damage or performance degradation of the product,
the reflow profile should be optimized to avoid excessive
heating. The maximum product temperature shall be
monitored by attaching a thermocoupler to the top of the main
transformer.
A sufficiently extended preheat time is recommended to
ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
SnPb solder processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, TP must not exceed +225 °C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, TP must not exceed +245 °C at any time.
25 °C Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
TP
TL
Profile features Sn/Pb eutectic
assembly
Pb-free assembly
Average ramp-up rate 3 °C/s max 3 °C/s max
Solder melting
temperature (typical)
TL +183 °C +221 °C
Peak product temperature TP +225 °C +245 °C
Average ramp-down rate 6 °C/s max 6 °C/s max
Time 25 °C to peak
temperature
6 minutes max 8 minutes max
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
16
Limited Internal
PRODUCT SPECIFICATION 2 (4)
Prepared (also subject responsible if other) No.
MICJOHH 5/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
MPM/BK/P (tbd) See §1 2006-04-06 PA1
Delivery package information
The products are delivered in antistatic injection molded trays
(Jedec design guide 4.10D standard) or in antistatic carrier
tape (EIA 481 standard).
Carrier tape specifications
Material Polystyrene (PS), conductive
Surface resistance < 107 ohms//square
Bakability The tape is not bakable
Tape width 72 mm [2.835 inch]
Pocket pitch 36 mm [1.417 inch]
Pocket depth 9.2 mm [0.362 inch]
Reel diameter 330 mm [13 inch]
Reel capacity 150 products/reel
Box capacity 300 products (2 reels/box)
Tape feed direction Round holes
Elongated holes
Pin 1
Tray specifications
Material PPE, dissipative
Surface resistance 105 < ohms/square < 1012
Bake ability The trays can be baked at maximum
125 °C for 48 hours
Tray capacity 15 products/tray
Box capacity 150 products (10 full trays/box)
Tray weight 140 g empty, maximum 320 g full
Dry pack information
The product is delivered in trays or tape & reel. These inner
shipment containers are dry packed in standard moisture
barrier bags according to IPC/JEDEC standard J-STD-033
(Handling, packing, shipping and use of moisture/reflow
sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case the
products have been stored in an uncontrolled environment
and no longer can be considered dry, the modules must be
baked according to J-STD-033.
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
17
Limited Internal
PRODUCT SPECIFICATION 3 (4)
Prepared (also subject responsible if other) No.
MICJOHH 5/1301-BMR 640 5002+ Uen
Approved Checked Date Rev Reference
MPM/BK/P (tbd) See §1 2006-04-06 PA1
Product Qualification Specification
Characteristics
External visual inspection IPC-A-610
Operational life test MIL-STD-202G
method 108A
With power cycling
Tref
Load
Duration
According to Absolute maximum ratings
Maximum output power
500 h
Vibration, broad band random IEC 60068-2-64 Fh Frequency
Acceleration spectral density
Crest factor
Duration and directions
10 to 500 Hz
0.5 g2/Hz
3
10 min in each 3 perpendicular directions
Vibration, sinusoidal IEC 68-2-64 Fc Frequency
Amplitude
Acceleration
Sweep rate
Duration
10 to 500 Hz
0.75 mm
10 g
1 octave/min
2 h in each 3 perpendicular directions
Mechanical shock IEC 68-2-27 Ea Peak acceleration
Duration
Pulse shape
Directions
Number of pulses
100 g
6 ms
Half sine
6
18 (3 + 3 in each perpendicular direction)
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na Temperature range
Number of cycles
Dwell time
-40 to +100 °C
300
30 min
Robustness of terminations IEC 68-2-21 Ue1 Depth of bending
Time of remaining bent
3 mm
5 s
Solderability IEC 68-2-58 Td Temperature, SnPb Eutectic
Temperature, Pb free
Preconditioning
215 ±5 °C
245 ±5 °C
240 h in 85°C/85%RH
Damp heat IEC 60068-2-67 Cy
with bias
Temperature
Humidity
Duration
Preconditioning
+85 °C
85 % RH
500 hours
Reflowed 3X according to IPC/JEDEC
J-STD-020C MSL3 at 260°C
Moisture reflow sensitivity
classification
J-STD-020C SnPb Eutectic
Pb free
MSL 1, peak reflow at 225 °C
MSL 3, peak reflow at 245 °C
Immersion in cleaning solvents IEC 68-2-45 XA
Method 2
Water
Isopropyl alcohol
Glycol ether
+55 ±5 °C
+35 ±5 °C
+35 ±5 °C
Cold (in operation) IEC 68-2-1 Ad Temperature TA
Duration
-40 °C
72 h
E
BMR 640 5002 series Direct Converters
Input 44-60 V, Dual outputs up to 15 W
EN/LZT 146 372 R1B May 2009
© Ericsson AB
Technical Specification
18
