August 1994 2
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
FEATURES
•Wide temperature range
•No switch ON/OFF clicks
•Excellent power supply ripple rejection
•Low power consumption
•Short-circuit resistant
•High performance
– high signal-to-noise ratio
– high slew rate
– low distortion
•Large output voltage swing.
GENERAL DESCRIPTION
The TDA1308 is an integrated class AB stereo headphone
driver contained in an SO8 or a DIP8 plastic package. The
device is fabricated in a 1 mm CMOS process and has
been primarily developed for portable digital audio
applications.
QUICK REFERENCE DATA
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi= 1 kHz; RL= 32 Ω; unless otherwise specified.
Note
1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB).
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VDD supply voltage
single 3.0 5.0 7.0 V
dual 1.5 2.5 3.5 V
VSS negative supply voltage −1.5 −2.5 −3.5 V
IDD supply current no load −3 5 mA
Ptot total power dissipation no load −15 25 mW
Pomaximum output power THD < 0.1%; note 1 −60 −mW
(THD + N)/S total harmonic distortion plus
noise-to-signal ratio note 1 −0.03 0.06 %
− −70 −65 dB
RL= 5 kΩ − −101 −dB
S/N signal-to-noise ratio 100 110 −dB
αcs channel separation −70 −dB
RL = 5 kΩ − 105 −dB
PSRR power supply ripple rejection fi= 100 Hz; Vripple(p-p) = 100 mV −90 −dB
Tamb operating ambient
temperature −40 −+85 °C
TYPE NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA1308 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TDA1308T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
August 1994 3
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
BLOCK DIAGRAM
Fig.1 Block diagram.
PINNING
SYMBOL PIN DESCRIPTION
OUTA 1 output A
INA(neg) 2 inverting input A
INA(pos) 3 non-inverting input A
VSS 4 negative supply
INB(pos) 5 non-inverting input B
INB(neg) 6 inverting input B
OUTB 7 output B
VDD 8 positive supply
Fig.2 Pin configuration.
August 1994 4
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
Fig.3 Equivalent schematic diagram.
August 1994 5
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
Notes
1. Human body model: C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 Ω; 3 pulses positive plus 3 pulses negative.
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
“UZW-BO/FQ-0601”
. The numbers of the quality specification can be found in the
“Quality Reference
Handbook”
. The handbook can be ordered using the code 9398 510 63011.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDD supply voltage 0 8.0 V
tSC(O) output short-circuit duration Tamb = 25 °C; Ptot = 1 W 20 −s
Tstg storage temperature −65 +150 °C
Tamb operating ambient temperature −40 +85 °C
Vesd electrostatic discharge note 1 −2000 +2000 V
note 2 −200 +200 V
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air
DIP8 109 K/W
SO8 210 K/W
August 1994 6
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
CHARACTERISTICS
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi= 1 kHz; RL= 32 Ω; unless otherwise specified.
Notes
1. Values are proportional to VDD; (THD + N)/S < 0.1%.
2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB).
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
VDD supply voltage
single 3.0 5.0 7.0 V
dual 1.5 2.5 3.5 V
VSS negative supply voltage −1.5 −2.5 −3.5 V
IDD supply current no load −3 5 mA
Ptot total power dissipation no load −15 25 mW
DC characteristics
VI(os) input offset voltage −10 −mV
Ibias input bias current −10 −pA
VCM common mode voltage 0 −3.5 V
Gvopen-loop voltage gain RL= 5 kΩ − 70 −dB
IOmaximum output current (THD + N)/S < 0.1% −60 −mA
ROoutput resistance −0.25 − Ω
VOoutput voltage swing note 1 0.75 −4.25 V
RL= 16 Ω; note 1 1.5 −3.5 V
RL= 5 kΩ; note 1 0.1 −4.9 V
PSRR power supply rejection ratio fi= 100 Hz;
Vripple(p-p) = 100 mV −90 −dB
αcs channel separation −70 −dB
RL= 5 kΩ − 105 −dB
CLload capacitance − − 200 pF
AC characteristics
(THD + N)/S total harmonic distortion plus
noise-to-signal ratio note 2 − −70 −65 dB
−0.03 0.06 %
note 2; RL= 5 kΩ − −101 −dB
−0.0009 −%
S/N signal-to-noise ratio 100 110 −dB
fGunity gain frequency open-loop; RL= 5 kΩ − 5.5 −MHz
Pomaximum output power (THD + N)/S < 0.1% −60 −mW
Ciinput capacitance −3−pF
SR slew rate unity gain inverting −5−V/µs
B power bandwidth unity gain inverting −20 −kHz
August 1994 7
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
TEST AND APPLICATION INFORMATION
Fig.4 Measurement circuit for inverting application.
Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC).
August 1994 8
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
Fig.6 Open-loop gain as a function of input
frequency.
Fig.7 Crosstalk as a function of input
frequency.
Fig.8 Output power as a function of supply
voltage.
August 1994 9
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency.
Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level.
August 1994 10
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
PACKAGE OUTLINES
Fig.11 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1.
Dimensions in mm.
handbook, full pagewidth
8.25
7.80
0.38 max
10.0
8.3
7.62
MSA252 - 1
6.48
6.20
1.73 max
5
8
41
1.15
max 0.53
max
0.254 M
3.2
max 4.2
max
3.60
3.05
9.8
9.2
2.54
(3x)
0.51
min
seating plane
August 1994 11
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
handbook, full pagewidth
pin 1
index
0.7
0.3
0.49
0.36
1.27 0.25 M
(8x)
14
5
0.1 SS
5.0
4.8
4.0
3.8
6.2
5.8
A
8
MBC180 - 1
0.25
0.19
0.7
0.6 1.75
1.35
1.45
1.25
detail A
1.0
0.5
0.25
0.10 0 to 8o
Fig.12 Plastic small outline package; 8 leads; body width 3.9 mm. (SO8; SOT96-1).
Dimensions in mm.
August 1994 12
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
SOLDERING
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
Plastic small outline packages
BY WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
August 1994 13
Philips Semiconductors Product specification
Class AB stereo headphone driver TDA1308
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
04/00 v
V. PRODUCT LISTING EXPLANATION
Table 1 FAMI L Y PREFIX AND DEVICE TEMPE RATURE Table 2 PACKAGE DESCRIPTIONS
Prefix A/WP = Leaded Chip Carrier (PLCC)
ADC
AM =
=Alternat e to National part number
Alternat e to AMD part number B/BB/BC/BE/BG = Plast ic Quad Flat Package(PQFP)
- Dry Pack handl i ng required
AU = Automotive -40° to +125°C BD = Low Profile quad Flat Pac kage(LQFP)
DAC = Alternate to P.M.I. part number BF/BH/BK = Shri nk quad Fl at Package(S QFP )
FB = Futurebus+, 0°C to +70°C D=
Plast i c Smal l Outline (SO/SOL)
ICM = Alternat e to lntersil part number DB/DK/DL = Shri nk Smal l Outline Package (SSOP)
LF = Alternat e to National part number F=
Ceramic Dual In-Line
LM = A l t ernate to National part number FE = Hermet i c CERDIP - 8 lead
MB = MULTIBYTE™, -40' C to +85'C GW = Pcio Gate
MC = Alternate t o Motorol a part number M=
Module
N, NE = O°C to +70°C (O° to +75° C for 9300) MSC = Miscellaneous
P=
Philips N/P = Plastic Dual In-Line (DIL)
PL = Programmable Logic PW/DH/DG/DGG = Thi n Shrink Small Outl i ne P ackage (TSSOP)
PZ = Programm able Logic/Philips Zero Power NB = 42 Pin Shrink Dual In-Line (DI L)
S/SC = MCO Microcontroller SC/SD = Microprocessor Support
SA = -40°C to +85° C U=
Plast i c Single In-Li ne (SIL)
SE = -55°C to +125°C ** The DH on PW and G on some DGG Part
SG = Alternate to Silicon General part number Package Codes have been removed due to
µA = Alternate to National part number Space constraints i n this pric e book.
Table 3 - PRODUCT FAMILY
ABBR PRODUCT FAMILY
BIC
CLI BiCMOS Logic
CMOS Logic (CLI C)
CON
DC
DSG
IND
Consum er Mult i media
Digital/Linear Data Com m/FB+
Discrete
Identif i cation Contac t
LIC
LOG
LV
Linear Indust ri al
Bipolar Logic
Low Voltage
MCO Microproc es sor, Microcontrollers,
CRT (Sunnyvale)
MM
MOS Multimedia
MOS Microcont rol l ers /Hamburg
MST
PDI
PLD
PRM
RF
TEL
Mass St orage/ Mot or Cont rol
Philips Digital Interface
Program mable Logic Devi ces
Proms
Wireless/RF Product s
Telecom
Table 4 - COLUMN HEADING EXPLANATIONS
PART
NUMBER CROSS REF. PRD
FAM PRODUCT
DESCRIPTION SPQ P/C
N74F244D LOG Octal Buff er 3 S tate 1520 20
N74F244D-T LOG Octal Buff er 3 S tate 1000
N74F244N Product Family-
See Table 3 Pin Count
Descript i on of Product Quantity per
tube/reel/ box
Indust ry Standard Part Number
-Complexity of LOG Parts
-Product Di scontinuation Notic e (DN-##)
-Dry Pack Indicator
Special P ackaging Alternatives - s ee following page
Package Code - See Table 2
Device Number
Famil y P ref i x and Device Temperature - See Tabl e 1
04/00vi
VII. COMMERCIAL PRODUCT SPECIAL PROCESSING
SPECIAL PACKAGING ALTERNATIVES
SPECIFICATIONS
Tape and Reel specifications conform to Electronic Industries Association (EIA) standard EIA-481-1, EIA-481-2,
EIA-481-3, and EIA-468-B.
DEVICE AVAILABILITY
Plastic Leaded Chip Carrier (PLCC) and Plastic Small Outline (SO/SOL/SSOP/TSSOP) parts are available in tape
and reel pack aging. Produc ts available in tape and reel ar e identified in the Pr ice Book with a "-T " (13”) or "-G" (7”)
added to the end of basic part num ber (e.g. N74F379AD- T or T DA1543T D-G). Return of product M UST be in full
reels with unbroken quality seals.
Plastic Quad Flat Pack (PQFP) parts are available in single tray packaging. Products available in single tray are
identified in the Price Book with a "-S" added to the end of basic part number (e.g. SAB9075HB-S). Return of
product MUST be in original container with unbroken quality seals.
VII. DRY PACK HANDLING
Philips Semiconductors is providing moisture barrier protection for plastic Surface Mount Technology (SMT) lCs
prior to shipping/storage. This protection is designed to minim ize the absorption of water into the body of the pack -
age in high humidity environments and later causing damage to itself when exposed to the rapid thermal heating
associated with surface m ount printed circuit board assem bly. As the package is heated, m oisture inside the pac k-
age rapidly heats and vaporizes, generating pressure within the package, which can result in package cracking.
Philips Semiconductors has conducted susceptibility testing on its entire line of SMT packages and has found that
certain combinations of package outlines and lead frames are sensitive to this accelerated test. These packages
include specif ic, but not all varieties of Sm all Outline SO/SSOP-16/24/28 lead, Plas tic Leaded Chip Carrier (PLCC)-
32/52/68/84 lead, and all Plastic Quad Flat Pack (PQFP).
Philips Sem iconductors pr oducts that are dry packed ar e indicated in the price book with "DRY PACK" entered next
to the device in the "Cross Ref column.
The dry packing process begins with a 24-hour bake at 125°C after electrical test to rem ove any moisture build-up
within the package. Product is then packed under a partial vacuum in a moisture barrier bag containing desiccant
and a humidity indicator card. The bag interior is maintained at a relative humidity (RH) level of less than 30%.
Once outside the bag (in a typical factory environment of 20°C to 30°C and 50% to 70% RH), product should be
used within 48 hours. If this time is exceeded, or upon opening the bag, the humidity indicator card register s pink on
the 20% level, the product should be baked at 125°C for 24 hours. Product m ust be baked in metal tubes, not the
plastic tubes or reels in which it was shipped. PQFP products packed in trays can be baked at 125°C.
Philips Semiconductors complies with the recommendations of the NEDA Semiconductor Packing and Handling
Committee for Moisture Sensitive Plastic Surface Mount Components that is incorporated in NIGP 103.00. Our in-
ternal specif ications are available upon r equest from Ron Deetz, 408-991-3892: 1) 874-0086, General Operator Dry
Packing Requirements; and 2) 874-0083, General Operator Dry Packing.
Dry packed products m ust be order ed in full tube or full tray increm ents and m ust also m eet the order m inim um s as
determined by each device's Price Book inventory code (I/C).
Only factory Q.A. sealed containers, undamaged, with all labels intact are eligible for stock rotation. Philips Semi-
conductors recommends that the minimum quantity be imposed as a minimum buy to distributor's end customer.
04/00 vii
VIII. PACKING QUANTITY INFORMATION
CERAMIC DUAL IN-LINE (CERDIP) QUANTITIES
PACKAGE CODE PIN COUNT DEVICES
PER TUBE DEVICES
PER BOX
FE 8-pin (300 mil) 48 1920
F 14-pin (300 mil) 25 1000
F 16-pin (300 mil) 25 1000
F 18-pin (300 mil) 21 840
F/FA 20-pin (300 mil) 20 800
F 22-pin (400 mil) 17 544
F/FA/F24 24-pin (300 mil) 15 600
F 24-pin (400 mil) 15 480
F 24-pin (600 mil) 15 360
F/FA/F28 28-pin (600 mil) 13 312
F/FA/F40 40-pin (600 mil) 9 216
CERQUAD QUANTITIES
PACKAGE CODE PIN COUNT DEVICES
PER TRAY DEVICES
PER BOX
K/KA/K44 44-pin 66
K/KA/K68 68-pin 44
KA 84-pin 42 210
QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF
THAT QUANTITY.
04/00viii
VIII. PACKING QUANTITY INFORMATION
PLASTIC DUAL IN-LINE QUANTITIES
PACKAGE CODE PIN COUNT DEVICES
PER TUBE DEVICES
PER BOX
N/N8 8-pin (300 mil) 50 * 2000
N/N14 14-/16-pin (300 mil) 25 * 1000
N 14-/16-pin (300 mil long tube) 28 * 1120
N 18-pin (300 mil) 20 800
N 18-pin (standard tube) 22 880
N 18-pin (long tube) 25 1000
N 20-pin (300 mil) 18 * 720
N 20-pin (long tube) 20 * 800
N 22-pin (400 mil) 17 544
N/N3/N24 24-pin (300 mil) 15 600
N/N24 24-pin (400 mil) 15 480
N 24-pin (600 mil) 15 360
N 24-pin (600 mil long tube) 17 510
N 24-pin (600 mil long tube) 25 1000
N/N3 28-pin (300 mil) 13 520
N/N28 28-pin (600 mil) 13 312
N 28-pin (600 mil long tube) 15 450
N 32-pin (600 mil) 11 264
N 28-pin (600 mil shrink) 19 760
N/N40 40-pin (600 mil) 9 216
N 40-pin (600 mil long tube) 10 300
NB (Shrink) 42-pin (600 mil) 12 288
N/NB 42-pin (600 mil long tube) 14 420
N/N48 48-pin (600 mil) 7 168
N 50-pin (900 mil) 7 112
N 52-pin (600 mil) 10 240
N/N64 64-pin (900 mil) 580
* Selected part t ypes in these pac kages may be subject t o full box multi pl es. Refer to specific part “PQ” for minimum purc has e amount.
PLASTIC LEADED CHIP CARRIER (PLCC) QUANTITIES
PACKAGE CODE PIN COUNT DEVICES
PER TUBE DEVICES
PER BOX DEVICES
PER REEL
A 20-pin 46 3680 1000
A/A28 28-pin 37 2368 750
A 28-pin 34 2176 750
A 32-pin 31 2232 750
A/A44 44-pin 26 1248 500
A/A44 44-pin 26 1300 500
A/A52 52-pin 23 1012 500
A/A68 68-pin 18 648 250
A/A84 84-pin 15 420 250
QUANTITIES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULTIPLES OF
THAT QUANTITY. VIII. PACKING QUANTITY INFORMATION
04/00 ix
PLASTIC QUAD FLAT PACK (PQFP) QUANTITIES
PACKAGE CODE PIN COUNT DEVICES
PER 5 TRAY DEVICES PER
SINGLE TRAY DEVICES
PER REEL
B/BD 32-pin LQFP ( 7x7) 1250 250 2000
B 32-Pin LQFP (5x5) 1800 360 2000
B 44-pin QFP (14x14) 420 84 500
B/B44 44-pin QFP (10x10) 480 96 1500
BC/BD 44-pin LFQP (10x10) 800 160 1500
B/BE 48-pin LQFP (7x7) 1250 250 2000
BB 52-pin QFP (10x10) 480 96 500
B/BD 64-pin LQFP (10x10) 800 160 -
BG 64-pin QPF (14x14) 420 84 600
B/BA/BB1 64/80-pin QFP (14x20) 330 66 500
BE 80-pin LQFP (12x12) 595 119 1000
BE/BP 100-pin TQFP (14x14) 450 90 1000
B/BB1 100-pin QFP (14x20) 330 66 -
B 120-pin QFP (28x28) 120 24 -
BE 128-pin LQFP (14x20) 360 72 -
BH 128-pin SQFP (14x20) 330 66 -
B/BB 128/160-pin QFP (28x28) 120 24 -
BF 208-pin SQFP (28x28) 120 24 -
QUANTIT IES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULT IPLES OF
THAT QUANTITY.
04/00
x
VIII. PACKING QUANTITY INFORMATION
PLA S TIC SMALL OUTLINE (SO/SOL/SSOP/TSSOP) QUANTITIES
PACKAGE CODE PIN COUNT DEVICES
PER TUBE DEVICES
PER BOX DEVICES
PER REEL
D/D8 8-pin (Small) 100 * 2000 2500
D 8-pin (Large) 64 * 2560 1000
D/D14 14-pin (Small) 57 * 1140 2500
DB (SSOP) 14-pin (Medium) 78 1092 2000
PW/DH (TSSOP) 14-pin 96 2400 2500
D 16-pin (Small) 50 * 1000 2500
DB (SSOP) 16-pin (Medium) 78 1092 2000
D 16-pin (Large) 48 * 1920 1000
PW/DH (TSSOP) 16-pin 96 2400 2500
DK (SSOP) 16-pin 93 1674 2500
DK (SSOP) 20-pin (Small) 75 1350 2500
DB (SSOP) 20-pin (Medium) 66 924 1000
PW/DH (TSSOP) 20-pin 75 1875 2500
D 20-pin (Large) 38 * 1520 2000
DB (SSOP) 24-pin (Medium) 59 826 1000
PW/DH (TSSOP) 24-pin 63 1575 2500
D 24-pin (Large) 30 1200 1000
DB (SSOP) 28-pin (Medium) 47 658 1000
D 28-pin (Large) 27 1080 1000
D 32-pin (Large) 24 960 1000
D 40-pin (VSO-40) 31 1240 500
DG/DGG (TSSOP) 48-pin 39 975 2000
DL (SSOP) 48-pin (Large) 31 1581 1000
DG/DGG (TSSOP) 56-pin 35 875 2000
DL (SSOP) 56-pin (Large) 26 1326 1000
D 56-pin (VSO-56) 22 616 500
* Selected part t ypes in these pac kages may be subject t o full box multi pl es. Refer to specific part “PQ” for minimum purc has e amount.
QUANTIT IES SHOWN IN GRAY REQUIRE PURCHASE OF PRODUCT TO BE MADE IN EXACT MULT IPLES OF
THAT QUANTITY.
04/00 x
i
IX. PRODUCT IDENTIFICATION
4000 CMOS PRODUCTS
Example: H E F 4 X X X X X X Philips North America Package Code:
D = Plastic SO
N = Plast i c Dual In-Line
DB = Shrink Small Outline (SSOP)
Philips Pac kage Code on part:
P = Plas tic Dual In-Li ne
T = Plastic SO
S = Shrink Small Outline (SSOP)
B = JEDEC “B” series CMOS specification
4XXX = Devic e number up to 5 digi ts
F = Limited
Family I dentificat i on
BiCMOS PRODUCTS - ABT
Example 74 ABT XXX X
Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
D = Plastic SO
DB = Shrink Small Outline (SSOP)
N = Plast i c Dual In-Line
PW = Thin Shrink Small Outline (TSSOP)
Device Number
Designates Advanced Bi CMOS TTL P rocess
74 = Commercial Operat i ng Temperature Range:
-40°C to +85°C
BiCMOS PRODUCTS - ABT16
Example 74 ABT 16 XXX X
Package Code:
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
Device Number
16 Bit
Designates Advanced Bi CMOS TTL P rocess
74 = Commercial Operat i ng Temperature Range:
-40°C to +85°C
BiCMOS PRODUCTS - 3.3V LVT
Example 74 LVT XXX D
Package Code:
D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
Device Number
3.3V Devic e Family
74 = Commercial Operat i ng Temperature Range:
-40°C to +85°C
04/00xi
i
IX. PRODUCT IDENTIFICATION
BiCMOS PRODUCTS - 3.3V LVT16
Example 74 LVT 16 XXX DL
Package Code:
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
Device Number
16 Bit
3.3V Bi CMOS
74 = Commercial Operat i ng Temperature Range:
-40°C to +85°C
CONSUMER & INDUSTRIAL PRODUCTS
PREFIXES PC, SA, TD, TE, TS, UA, UM
Example: TD A XXXX P N
Device Family:
PCx
SAx
TDx
TEx
TSx
UAx
UMx
=
=
=
=
=
=
=
CMOS Circuit
Digital Ci rcuit
Linear Circui t
Linear Circui t
Analog Circ ui t
Digital Ci rcuit
Digital Ci rcuit
Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
B = Quad Flat Pac k (QFP )
N = Plast i c Dual In-Line
D = Plastic SO
DK = Shrink Small Outline Package (SSOP)
F = Cerami c Dual In-Line
U = Plast i c Single In-Li ne
Package Code on Part:
GP = Quad Flat Pac k (QFP )
P = Plas tic Dual In-Li ne
T = Plastic SO
D = Ceramic Dual In-Line
M = Shrink Small Outl i ne Package (SS O P )
WP = Plastic Leaded Chip Carri er (PLCC)
Device Number
Operating Temperatures:
A = Temperature range no specified (see
data sheet)
B = 0°C to 70° C
C = -55°C to +125°C
D = -25°C to +70°C
E = -25°C to +85° C
F = -40°C to +85°C
04/00 xii
i
IX. PRODUCT IDENTIFICATION
DATA COMMUNICATIONS, LOCAL AREA NETWORK, FUTUREBUS+
Example 1: SCNXXXXXCN48
Philips Desi gnat or Pin Count:
14, 16, 20, 24, 28, 40, 48, etc.
Process:
N = N - Channel Package Code:
C = C - Channel A = Plas tic Leaded Chip Carrier (P LCC)
N = Plast i c Dual In-Line
Device Number
See individual dat a sheets F = Cerami c Dual In-Line
Temperature:
C = 0°C to +70°C (Comm ercial)
A = -40°C to +85° C (I ndustrial)
M = -55°C to +125°C (Military)
E = -40°C to +85° C (I ndustrial)
Example 2: S C X X C X X X C 1 A
Philips Desi gnat or Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
Device Number
See individual dat a sheets N = Plast i c Dual In-Line
Timing Variation:
Process/Power Variati on: 1 = Normal
C = CMOS 5V
L = CMOS 3V Temperat ure:
C = 0°C to +70°C (Comm ercial)
A = -40°C to +85° C (I ndustrial)
Example 3: N E 8 3 X 9 2 A
Philips Desi gnat or Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
Device Number
See individual dat a sheets N = Plast i c Dual In-Line
F = Cerami c Dual In-Line
D = Plastic Small Outline
Applic at i ons Designator
(See Data Sheets)
Example 4: FB XXXX BB
Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
BB = Quad Flat P ac k (QFP)
Device Number
Designates Futurebus+ Produc t
Temperat ure Range: 0° C to +70°C
For Industri al -- Contact Factory
04/00xi
IX. PRODUCT IDENTIFICATION
FIBER OPTIC, LINE DRIVERS/RECEIVERS, MODEMS
Example 1: NE XXXX N
Package Code:
D = Plastic SO
N = Plast i c Dual In-Line
Device Number
Device Family and Temperature Range Prefix:
NE = 0°C to +70° C
SE = -55°C t o +125° C
SA = -40°C t o +85° C
Example 2: AM XX LS XX C N
Generic Industry Prefix Package Code:
D = Plastic SO
Device Number N = Plast i c Dual In-Line
See individual dat a
sheets Device Family and Temperature Range Prefix:
Generic Industry ID C = 0°C to +70°C
M = -55°C to +125°C
I = -40°C to +85°C
HIGH-SPEED CMOS PRODUCTS
Example: 74 HC XXXXX N
Package Code:
D = Plastic SO
N = Plast i c Dual In-Line
Device Number
HC = CMOS input switching le vel s,
supply volt age range 2V to 6V,
fully buffered.
HCT = TTL input s witching levels,
supply volt age range 4. 5V to 5.5V,
fully buffered
74 = Standard Temperature Range:
-40°C to +125°C
LOGIC PRODUCTS - ALS/FAST
Example: N 74FXXX N
Package Code
Device Number
Temperat ure Range
TEMPERATURE
RANGE DEVICE
NUMBER PACKAGE CODE
N = Commercial Range
0°C to 70°C 74ALSXXX
74FXX A = Plastic Leaded Chip Carrier (PLCC)
D = Plastic SO
F = Ceramic Dual In-Line
N = Plastic Dual In-Line
04/00 x
v
IX. PRODUCT IDENTIFICATION
LINEAR AND RF PRODUCTS
Example: NE XXXX N
Package Code:
A = Plas tic Leaded Chip Carriers (PLCC)
D = Plastic SO
DK = Shrink Small Outline (SSOP)
F = Cerami c Dual In-Line
FE = Hermetic Cerdip (8 Lead)
N = Plast i c Dual In-Line
Device Number
Device Family and Temperature Range Prefix:
AU = -40°C to +125°C
NE = 0°C to +70° C
SE = -55°C t o +125° C
SA = -40°C t o +85° C
LOW VOLTAGE (3.3V CMOS) LOGIC - ALVC16
Example: 74ALVC16XXX DPackage Code
Device Number
TEMPERATURE
RANGE DEVICE
NUMBER PACKAGE CODE
Tamb = -40°C to +85°C 74ALVC16XXX D = Plastic S O
DL = Shrink Small Outline (SSOP)
DG = Thin Shrink Small Outline (TSSOP)
LOW VOLTAGE (3.3V CMOS) LOGIC - HLL
Example: 74HL33XXX DPackage Code
Device Number
TEMPERATURE
RANGE DEVICE
NUMBER PACKAGE CODE
Tamb = -40°C to +85°C 74HL33XXX D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
LOW VOLTAGE (3.3V CMOS) LOGIC - LV
Example: 74LVXXX DPackage Code
Device Number
TEMPERATURE
RANGE DEVICE
NUMBER PACKAGE CODE
Tamb = -40°C to +85°C 74LVXXX D = Pl as tic SO
DB = Shrink Small Outline (SSOP)
N = Plastic Dual In-Line
LOW VOLTAGE (3.3V CMOS) LOGIC - LVC
Example: 74LVCXXX DPackage Code
Device Number
TEMPERATURE
RANGE DEVICE
NUMBER PACKAGE CODE
Tamb = -40°C to +85°C 74LVC16XXX D = Plastic SO
DB = Shrink Small Outline (SSOP)
PW = Thin Shrink Small Outline (TSSOP)
04/00xv
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IX. PRODUCT IDENTIFICATION
MICROCONTROLLER PRODUCTS
Example: P 8 X C XXX E B P N
Memory Options:
0 = ROMLESS
3 = ROM
7 = OTP-EPROM
9 = FEEPROM (FLASH)
Device Number
Speed:
C = 3.5MHz to 12MHz
D = 0MHz to 20MHz
E = 3.5MHz to 16mhz
F = 1.2Mhz to 16MHz
G = 3.5MHz to 20MHz
H = 32KHz to 12MHz
I = 3.5MHz to 24MHz
N = 3.5MHz to 33MHz
P = 3.5MHz to 40MHz
S = 0MHz to 16MHz
T = 0MHz to 24MHz
U = 0MHz to 33MHz
Philips North A merica Pac kage Code:
A = Plas tic Leaded Chip Carrier (P LCC)
B = Quad Flat Pac k (QFP )
N = Plast i c Dual In-Line
Philips Pac kage Code:
A = Plas tic Leaded Chip Carrier (P LCC)
B = Quad Flat Pac k (QFP )
F = Hermet i c Cerdi p (window)
L = Cerdip (Window))
P = Plastic Dual In-Line
Q = Ceramic Quad Fl at Pack (Window)
T = Small Out line (S O)
Temperature:
B = 0°C to 70° C
F = -40°C to +85°C
H = -40°C to +125°C
Example: P 8 X C 51 XXX X X
Memory Options:
0 = ROMLESS
3 = ROM
7 = OTP-EPROM
9 = FEEPROM (FLASH)
Device Number
FX-
FX+
FX2
Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
B = Quad Flat Pac k (QFP )
N = Plast i c Dual In-Line
Temperat ure / Speed:
B = 0ºC to 70ºC / 16 MHz
F = -40ºC to 85ºC / 16 MHz
I = 0ºC to 70ºC / 33 MHz
J = -40ºC to 85ºC / 33 MHz
04/00 xvi
i
IX. PRODUCT IDENTIFICATION
MICROCONTROLLER PRODUCTS (Continued)
Example: S 8 X C XXX -1 N 24
S = Standard
P = Static Design
Memory Options:
0 = ROMLESS
3 = ROM
7 = EPROM/OTP
9 = FLASH
Device Number
Pin Count (opt i onal )
Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
B = Quad Flat Pac k (QFP )
N = Plast i c Dual In-Line
Speed / Temperature Range:
1 = 12MHz, 0oC to 70oC
2 = 12MHz, -40oC to +85oC
3 = 0.5 to 12 MHz, 0oC to +70oC
4 = 16MHz, 0oC to 70oC
5 = 16MHz, -40oC to +85oC
6 = 12 or 16MHz, -55oC to +125oC
7 = 20MHz, 0oC to 70oC
8 = 20MHz, -40oC to +85oC
A = 24MHz, 0oC to 70oC
B = 24MHz, -40oC to +85oC
I = 33MHz, 0oC to 70oC
J = 33MHz, -40oC to +85oC
- = Other / + = Rx Family
MICROCONTROLLER PRODUCTS - XA
Example: P51XA G3 7 K B A
Philips 80C51 eXtended Architec ture
P51XAG3 or PXAG3 or S3 or SCC
Derivative Name
Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
B = Quad Flat Pac k (QFP )
BD = Thin Quad Flat Pack (TQFP)
N = Plast i c Dual In-Line
Temperature:
B = 0°C to 70° C
F = -40°C to +85°C
Speed:
E = 16MHz
G = 20Mhz
K = 30MHz
J = 25MHz
Memory Options:
0 = ROMLESS
3 = ROM
5 = Bondout
7 = EPROM/OTP
9 = FLASH
MICROCONTROLLER PRODUCTS - PXA
Example: PXA SCC K F XX
Philips XA extended Architecture
Derivative Name
C = CAN
G = Generic
S = Generic with ADC
Package Code:
A = Plas tic Leaded Chip Carrier (P LCC)
BD = Leaded Quad Flat Pac k (LQFP)
BE = Plastic Quad Flat Pack (PQFP)
Temperature:
A = 0°C to 70°C
F = -40°C to +85°C
Speed:
K = 30MHz
IX. PRODUCT IDENTIFICATION
MICROCONTROLLER PRODUCTS - LPC
04/00xvii
i
Example: P 8 X LPC XXX B N
80C51 Famil y
Derivative Name
Memory Options
7 = OTP
Package Code:
DIP, SO
Temperature:
B = 0°C to 70° C
F = -40°C to +85°C
Derivative Name
Low Pin Count:
MICROCONTROLLER PRODUCTS – PERIPHERALS
Example: P82B XXX X X
Philips North A merica Pac k age Code:
Philips Pac k age Code
Device Number
MULTIBYTE™ PRODUCTS
Example: MB 2 XXX BB
Package Code:
BB = QuadFlat Pack (QFP)
Device Number
Byte-width (2 or 4)
Designates MULTIBYTE™ P roduct.
Temperat ure Range: -40° C to +85°C
MULTIBYTE is a registered tradem ark of Philips Semiconduc t ors.