DATA SHEET
ANTI-SULFURATED CHIP RESISTORS
AF122 (4Pin/2R) / AF124 (8Pin/4R) /
AF162 (4Pin/ 2R)/ AF164 (8Pin/ 4R)
5%, 1%
sizes 2 × 0402, 4 x 0402, 2 x 0603, 4 x 0603
RoHS compliant
Product specification –March 20, 2017 V.5
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
2
8
www.yageo.com
Mar. 20, 2017 V.5
Y
YA
AG
GE
EO
O
B
BR
RA
AN
ND
D
o
or
rd
de
er
ri
in
ng
g
c
co
od
de
e
GLOBAL PART NUMBER (PREFERRED)
AF XX X - X X X XX XXXX L
(1) (2) (3) (4) (5) (6) (7)
(1) SIZE
12 = 0402 x 2 (0404)
12 = 0402 x 4 (0408)
16 = 0603 x 2 (0606)
16 = 0603 x 4 (0612)
(2) NUMBER OF RESISTORS
2 = 2 resistors
4 = 4 resistors
(3) TOLERANCE
F = ± 1%
J = ± 5% (for Jumper ordering, use code of J)
(4) PACKAGING TYPE
R = Paper taping reel
(5) TEMPERATURE COEFFICIENT OF RESISTANCE
– = Base on spec
(6) TAPING REEL
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
(7) RESISTANCE VALUE
There are 2~4 digits indicated the resistor value. Letter R/K/M is decimal point, no need
to mention the last zero after R/K/M, e.g.1K2, not 1K20.
Detailed resistance rules show in table of “Resistance rule of global part number”.
(8) DEFAULT CODE
Letter L is the system default code for ordering only. (Note)
ORDERING INFORMATION - GLOBAL PART NUMBER & 12NC
Both part numbers are identified by the series, size, tolerance, packing
type, temperature coefficient, taping reel and resistance value.
SCOPE
This specification describes
AF122/AF124/AF162/AF164
(convex)series chip resistor arrays
with lead-free terminations made
by thick film process.
APPLICATIONS
Terminal for SDRAM and
DDRAM
High-end Computer &
Multimedia Electronics in high
sulfur environment
Consume electronic
equipments: PDAs, PNDs
Mobile phone, telecom…
FEATURES
AEC-Q200 qualified
RoHS compliant
Reducing environmentally
hazardous wastes
High component and equipment
reliability
Saving of PCB space
None forbidden-materials used
in products/production
Halogen Free Epoxy
Moisture sensitivity level: MSL 1
ORDERING EXAMPLE
The ordering code of a AF122
convex chip resistor array, value
1,000Ω with ±5% tolerance,
supplied in 7-inch tape reel is:
AF122-JR-071KL.
NOTE
1. All our R-Chip products meet RoHS
compliant. "LFP" of the internal 2D reel
label mentions "Lead Free Process"
2. On customized label, "LFP" or specific
symbol printed and the optional "L" at
the end of GLOBAL PART NUMBER
Resistance rule of global part
number
Resistance code rule
Example
0R
0R = Jumper
XRXX
(1 to 9.76 Ω)
1R = 1 Ω
1R5 = 1.5 Ω
9R76 = 9.76 Ω
XXRX
(10 to 97.6 Ω)
10R = 10 Ω
97R6 = 97.6 Ω
XXXR
(100 to 976 Ω)
100R = 100 Ω
XKXX
(1 to 9.76 KΩ)
1K = 1,000 Ω
9K76 = 9760 Ω
XM
(1 MΩ)
1M = 1,000,000 Ω
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
3
8
www.yageo.com
Mar. 20, 2017 V.5
MARKING
AF122 / 162
No marking
AF124 / 164
I-Digit marking
1% E-24/E-96: R≧100Ω 4digits
First three digits for significant figure and 4th digit for number of zeros
5% E-24: R≧10Ω
First two digits for significant figure and 3rd digit for number of zeros
For further marking information, please refer to data sheet “Chip resistors marking”.
CONSTRUCTION
The resistor is constructed on top
of a high-grade ceramic body.
Internal metal electrodes are added
on each end to make the contacts to
the thick film resistive element. The
composition of the resistive element
is a noble metal embedded into a
glass and covered by a glass. The
resistor is laser trimmed to the
rated resistance value. The resistor
is covered with a protective epoxy
coat, finally the external
terminations (matte tin on Ni-
barrier) are added as shown in Fig.4.
Fig. 1
O
OU
UT
TL
LI
IN
NE
ES
S
Fig. 4 Chip resistor outlines
DIMENSIONS
TYPE
AF122
AF124
AF162
AF164
B (mm)
0.24± 0.10
0.25± 0.15
0.35±0.10
0.35± 0.15
H (mm)
0.30+0.10/-0.05
0.45± 0.05
0.30±0.10
0.65± 0.05
H1 (mm)
---
0.30± 0.05
--
0.50± 0.15
P (mm)
0.67± 0.05
0.50± 0.05
0.80±0.05
0.80± 0.05
L (mm)
1.00± 0.10
2.00± 0.10
1.60±0.10
3.20± 0.15
T (mm)
0.30± 0.10
0.45± 0.10
0.40±0.10
0.60± 0.10
W1 (mm)
0.25± 0.10
0.30± 0.15
0.30±0.10
0.30± 0.15
W2 (mm)
1.00± 0.10
1.00± 0.10
1.60±0.10
1.60± 0.15
Table 1
0
Fig. 2 Value = 0Ω
Fig. 3 Value = 240KΩ
360
Fig. 3 Value = 316KΩ
AF122 / 162
AF124 / 164
For dimension, please refer to Table 1
Fig. 5 AF122/124/162/164 series chip resistors dimension
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
4
8
www.yageo.com
Mar. 20, 2017 V.5
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles, please refer to data sheet
“Chip resistors mounting”.
ELECTRICAL CHARACTERISTICS
CHARACTERISTICS
AF122
AF124
AF162
AF164
Operating Temperature
Range
–55 °C to +155 °C
–55 °C to +155 °C
–55 °C to +155 °C
–55 °C to +155 °C
Rated Power
1/16 W
1/16 W
1/16W
1/16W
Maximum Working Voltage
50 V
25 V
50V
50V
Maximum Overload Voltage
100 V
50 V
100V
100V
Dielectric Withstanding
Voltage
100 V
100 V
100V
100V
Resistance Range
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 10 Ω to 1 MΩ
Jumper < 50 mΩ
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 1 Ω to 1 MΩ
Jumper < 50 mΩ
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 1 Ω to 1 MΩ
Jumper < 50 mΩ
5% (E24) 1 Ω to 1 MΩ
1% (E24/E96) 1 Ω to 1 MΩ
Jumper < 50 mΩ
Temperature Coefficient
1 Ω ≤ R ≤ 10 Ω ±250 ppm/°C
10 Ω ≤ R ≤ 1 MΩ ±200 ppm/°C
±250 ppm/°C
Jumper Criteria
Rated Current
0.5 A
Rated Current
1.0 A
Rated Current
1.0 A
Rated Current
1.0A
Maximum Current
1.0 A
Maximum Current
2.0 A
Maximum Current
2.0 A
Maximum Current
2.0A
Table 2
PACKING STYLE AND PACKAGING QUANTITY
PACKING STYLE
REEL DIMENSION
AF122
AF124
AF162
AF164
Paper Taping Reel (R)
7" (178 mm)
10,000 units
10,000 units
5,000 units
5,000 units
13" (330 mm)
50,000 units
40,000 units
---
20,000 units
NOTE
1. For paper tape and reel specification/dimensions, please refer to data sheet “Chip resistors packing”.
Table 3 Packing style and packaging quantity
SCHEMATIC
Fig. 6 Equivalent circuit diagram
For dimension, please refer to Fig. 5 and Table 1
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
5
8
www.yageo.com
Mar. 20, 2017 V.5
Fig. 7 Maximum dissipation (P) in percentage of rated power as a
function of the operating ambient temperature (Tamb)
FUNCTIONAL DESCRIPTION
P
PO
OW
WE
ER
R
R
RA
AT
TI
IN
NG
G
AF122 / AF124 / AF162 / AF164 rated power at
70 °C is 1/16 W
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V=
R) X (P
or max. working voltage whichever is less
Where
V=Continuous rated DC or
AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (Ω)
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
6
8
www.yageo.com
Mar. 20, 2017 V.5
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Life/
Endurance
MIL-STD-202-method 108
IEC 60115-1 4.25
1,000 hours at 70± 2 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
± (2%+0.05 Ω)
<100 mΩ for Jumper
High Temperature
Exposure
MIL-STD-202-method 108
1,000 hours at maximum operating
temperature depending on specification,
unpowered
Tolerances: 155± 3 °C
± (1%+0.05 Ω)
<50 mΩ for Jumper
Moisture
Resistance
MIL-STD-202-method 106
Each temperature / humidity cycle is defined at
8 hours (method 106G), 3 cycles / 24 hours
for 10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24± 2 hours after
test conclusion
± (2%+0.05 Ω)
<100 mΩ for Jumper
Thermal Shock
MIL-STD-202-method 107
-55/+125 °C
Note: Number of cycles required is 300.
Devices mounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
± (1%+0.05 Ω)
<50 mΩ for Jumper
Short Time
Overload
IEC60115-1 4.13
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
temperature
± (2%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as
described, only 1 board bending required
3 mm bending
Bending time: 60± 5 seconds
Ohmic value checked during bending
± (1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Table 4 Test condition, procedure and requirements
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
7
8
www.yageo.com
Mar. 20, 2017 V.5
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Solderability
- Wetting
J-STD-002 test B
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245± 3 °C
Dipping time: 3± 0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching
J-STD-002 test D
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
IEC 60115-1 4.18
MIL-STD-202 Method 215
Condition B, no pre-heat of samples
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (1%+0.05Ω)
<50 mΩ for Jumper
No visible damage
FOS
ASTM-B-809-95*
*Modified
Sulfur 750 hours, 105℃, unpowered
± (4.0%+0.05Ω)
<100mΩ for Jumper
SERIES
AF
122/124/162/164 (RoHS Compliant)
Chip Resistor Surface Mount
Product specification
8
8
www.yageo.com
Mar. 20, 2017 V.5
REVISION HISTORY
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products itself are unchanged. Any
product change will be announced by PCN.”
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 5
Mar. 20, 2017
-
- Modify AF124/164 Equivalent Circuit Diagram
Version 4
Jun. 23, 2016
-
- AEC-Q200 qualified
Version 3
Nov. 17, 2015
-
- Add in AF162
Version 2
May 29,2015
-
- Add in AF164
Version 1
Aug. 15, 2014
-
- Update AF124 dimensions
Version 0
Oct. 02, 2013
-
- First issue of this specification
