ams Datasheet Page 1
[v1-00] 2016-May-20 Document Feedback
TSL2550
Ambient Light Sensor with SMBus
Interface
The TSL2550 is a digital-output light sensor with a two-wire,
SMBus serial interface. It combines two photodiodes and a
companding analog-to-digital converter (ADC) on a single
CMOS integrated circuit to provide light measurements over an
effective 12-bit dynamic range with a response similar to that
of the human eye.
The TSL2550 is designed for use with broad wavelength light
sources. One of the photodiodes (channel 0) is sensitive to
visible and infrared light, while the second photodiode
(channel 1) is sensitive primarily to infrared light. An integrating
ADC converts the photodiode currents to channel 0 and
channel 1 digital outputs. Channel 1 digital output is used to
compensate for the effect of the infrared component of
ambient light on channel 0 digital output. The ADC digital
outputs of the two channels are used to obtain a value that
approximates the human eye response in the commonly used
unit of Lux.
This device is intended primarily for use in applications in which
measurement of ambient light is used to control display
backlighting such as laptop computers, PDAs, camcorders, and
GPS systems. Other applications include contrast control in LED
signs and displays, camera exposure control, lighting controls,
etc. The integrating conversion technique used by the TSL2550
effectively eliminates the effect of flicker from AC-powered
lamps, increasing the stability of the measurement.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TSL2550, Ambient Light Sensor
with SMBus Interface are listed below:
Figure 1:
Added Value of Using TSL2550
Benefits Features
•Enables Operation in IR Light Environments • Patented Dual-Diode Architecture
• Digital Interface Is Less Susceptible to Noise •Two-Wire SMBus Digital Interface
•Enabling Low Active and Power-Down Modes
Reduces Average Power Consumption •1mW (typ) Active Power Mode
•Reduces Board Space Requirements while
Simplifying Designs
•Available in 2.6mm x 3.8mm TMB or 5mm x 6.2mm
SOIC (D) Packages
General Description
Page 2 ams Datasheet
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TSL2550 − General Description
•Converts Light Intensity to Digital Signal
•Infrared Compensation to Approximate Human Eye
Response
•Companding A/D for Wide Dynamic Range
•Rejects 50 Hz/60 Hz Lighting Ripple
•Single Supply Operation (2.7 V to 5.5 V)
•Power Down Mode
•Low-Profile Surface-Mount Packages
Functional Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL2550 Block Diagram
SMBCLK
Two-Wire Serial Interface
Integrating
A/D Converter
Control Logic Output Registers
SMBData
VDD = 2.7 V to 5.5 V
Channel 0
Photodiode
Channel 1
Photodiode
ams Datasheet Page 3
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Pin Assignments
Figure 3:
Package D 8-Lead SOIC (Top View)
Figure 4:
Package T 4-Lead SMD (Top View)
Figure 5:
Terminal Functions
Terminal
Type Description
Name D Pkg
No.
T Pkg
No.
GND 4 2 Power supply ground. All voltages are referenced to GND.
SMBCLK 5 3 I SMBus serial clock input terminal — clock signal for SMBus
serial data.
SMBData 8 4 I/O SMBus serial data I/O terminal — serial data I/O for SMBus.
V
DD
1 1 Supply voltage.
Pin Assignments
8 SMBData
7 NC
6 NC
5 SMBCLK
VDD 1
NC 2
NC 3
GND 4
VDD 1
GND 2
4 SMBData
3 SMBCLK
Page 4 ams Datasheet
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TSL2550 − Absolute Maximum R atings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure
to absolute-maximum-rated conditions for extended periods
may affect device reliability.
Figure 6:
Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted)
Note(s):
1. All voltages are with respect to GND.
2. Package D only: The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made
between the tip of the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds.
Symbol Parameter Min Max Units
V
DD
Supply voltage
(1)
6V
V
O
Digital output voltage range -0.3 +6 V
I
O
Digital output current ± 10 mA
I
(SMBIN)
SMBus input/output current -1 20 mA
T
A
Operating free-air temperature range -40 85 °C
T
STRG
Storage temperature range -40 85 °C
ESD
HBM
ESD tolerance, human body model ±2000 V
Solder conditions in accordance with JEDEC
J-STD-020A, maximum temperature
(2)
260 °C
Absolute Maximum Ratings
ams Datasheet Page 5
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TSL2550 − Electrical Characteristics
Figure 7:
Recommended Operating Conditions
Figure 8:
Electrical Characteristics over Recommended Operating Free-Air Temperature Range (unless
otherwise noted)
Symbol Parameter Min Max Units
V
DD
Supply voltage 2.7 5.5 V
T
A
Operating free-air temperature 0 70 °C
V
IL
SMBus input low voltage @ V
DD
= 3.3 V ± 5% 0.8 V
V
IH
SMBus input high voltage @ V
DD
= 3.3 V ± 5% 2.1 V
f
(SMBCLK)
SMBus operating frequency 10 100 kHz
Symbol Parameter Test Conditions Min Typ Max Unit
V
OL
SMBus output low voltage
I
O
= 50 μA0.01
V
I
O
= 4 μA0.4
I
DD
Supply current
Active, VSMBCLK and
VSMDATA = V
DD
,
V
DD
= 3.3 V ± 5%
0.35 0.6 mA
Power down, VSMBCLK
and VSMDATA = V
DD
,
V
DD
= 3.3 V ±5%
10 μA
I
IH
High level input current VI = V
DD
5μA
I
IL
Low level input current VI = 0 -5 μA
Electrical Characteristics
Page 6 ams Datasheet
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TSL2550 − Electrical Characteristics
Figure 9:
Operating Characteristics at V
DD
= 3.3 V, T
A
= 25°C (unless otherwise noted) (see Notes
(1)
,
(2)
,
(3)
)
Parameter Test Conditions Channel Min Typ Max Unit
ADC count value
standard mode
E
e
= 0
Ch0 1
counts
Ch1 1
λ
p
= 640 nm
E
e
= 72 μW/cm
2
Ch0 639 799 959
Ch1 85
λ
p
= 940 nm
E
e
= 140 μW/cm
2
Ch0 511 799 1039
Ch1 703
ADC count value
extended mode
E
e
= 0
Ch0 1
counts
Ch1 1
λ
p
= 640 nm
E
e
= 72 μW/cm
2
Ch0 155
Ch1 16
λ
p
= 940 nm
E
e
= 140 μW/cm
2
Ch0 155
Ch1 139
ADC count value ratio:
Ch1/Ch0, standard mode
λ
p
= 640 nm,
E
e
= 72 μW/cm
2
0.070 0.106 0.175
λ
p
= 940 nm,
E
e
= 140 μW/cm
2
0.70 0.88 1.20
R
e
Irradiance responsivity
standard mode
λ
p
= 640 nm
E
e
= 72 μW/cm
2
Ch0 11.1
counts/
(μW/ cm
2
)
Ch1 1.2
λ
p
= 940 nm
E
e
= 140 μW/cm
2
Ch0 5.7
Ch1 5
R
v
Illuminance responsivity
standard mode
Fluorescent light
source: 300 Lux
Ch0 2.8
counts/lux
Ch1 0.23
Incandescent light
source: 50 Lux
Ch0 19
Ch1 13
ams Datasheet Page 7
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Electrical Characteristics
Note(s):
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 640 nm LEDs
and infrared 940 nm LEDs are used for final product testing for compatibility with high volume production.
2. The 640 nm irradiance Ee is supplied by an AlInGaP light-emitting diode with the following characteristics: peak wavelength λp =
640 nm and spectral halfwidth Δλ½ = 17 nm.
3. The 940 nm irradiance Ee is supplied by a GaAs light-emitting diode with the following characteristics: peak wavelength λp = 940
nm and spectral halfwidth Δλ½ = 40 nm.
4. The sensor Lux is calculated using the empirical formula shown on p. 11 of this data sheet based on measured Ch0 and Ch1 ADC
count values for the light source specified. Actual Lux is obtained with a commercial luxmeter. The range of the (sensor Lux) / (actual
Lux) ratio is estimated based on the variation of the 640 nm and 940 nm optical parameters. Devices are not 100% tested with
fluorescent or incandescent light sources.
(Sensor Lux) / (actual
Lux), standard mode
(4)
Fluorescent light
source: 300 Lux 0.65 1 1.35
Incandescent light
source: 50 Lux 0.5 1 1.5
Parameter Test Conditions Channel Min Typ Max Unit
Page 8 ams Datasheet
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TSL2550 − Electrical Characteristics
Figure 10:
AC Electrical Characteristics, V
DD
= 3.3 V, T
A
= 25°C (unless otherwise noted)
Symbol Parameter Test Conditions Min Typ Max Unit
t
(CONV)
Conversion time, per channel,
standard mode 400 ms
t
(CONV)
Conversion time, per channel,
extended mode 80 ms
f
(SMBCLK)
Clock frequency 100 kHz
t
(BUF)
Bus free time between start
and stop condition 4.7 μs
t
(HDSTA)
Hold time after (repeated)
start condition. After this
period, the first clock is
generated.
4μs
t
(SUSTA)
Repeated start condition setup
time 4.7 μs
t
(SUSTO)
Stop condition setup time 4 μs
t
(HDDAT)
Data hold time 300 ns
t
(SUDAT)
Data setup time 250 ns
t
(LOW)
SMBCLK clock low period 4.7 μs
t
(HIGH)
SMBCLK clock high period 4 μs
t
(TIMEOUT)
Detect clock/data low timeout 25 35 ms
t
F
Clock/data fall time 300 ns
t
R
Clock/data rise time 1000 ns
C
i
Input pin capacitance 10 pF
ams Datasheet Page 9
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Parameter Measurement Information
Figure 11:
SMBus Timing Diagrams
Figure 12:
SMBus Timing Diagram for Send Byte Format
Parameter Measurement
Information
SMBDATA
SMBCLK
StopStart
SMBCLKACK
t(LOWMEXT) t(LOWMEXT)
t(LOWSEXT)
SMBCLKACK
t(LOWMEXT)
Start
Condition
Stop
Condition
P
SMBDATA
t(SUSTO)
t(SUDAT)
t(HDDAT)
t(BUF)
VIH
VIL
SMBCLK
t(SUSTA)
t(HIGH)
t(F)
t(R)
t(HDSTA)
t(LOW)
VIH
VIL
PSS
A0A1A2A3A4A5A6
SMBCLK
Start by
Master
SMBDATA
1919
D1D2D3D4D5D6D7 D0R/W
Frame 1 SMBus Slave Address Byte Frame 2 Command Byte
ACK by
TSL2550
Stop by
Master
ACK by
TSL2550
Page 10 ams Datasheet
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TSL2550 − Parameter Measurement Information
Figure 13:
SMBus Timing Diagram for Receive Byte Format
ams Datasheet Page 11
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Typical Operating Characteristics
Figure 14:
Spectral Responsivity
Figure 15:
Normalized ADC Output vs. Supply Voltage
Typical Operating
Characteristics
O Wavelength  nm
0
400
0.2
0.4
0.6
0.8
1
500 600 700 800 900 1000 1100
Relative Responsivity
Channel 1
Photodiode
Channel 0
Photodiode
VDD  Supply Voltage  V
Normalized ADC Output
2.5 3 3.5 4 4.5 5 5.5 6
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Page 12 ams Datasheet
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TSL2550 − Principles Of Operation
Analog-to-Digital Converter
The TSL2550 contains an integrating analog-to-digital
converter (ADC) that integrates a photodiode current. First it
integrates channel 0 photodiode current and then it integrates
channel 1 photodiode current. At the end of the conversion
cycle for each channel, the conversion result is transferred to
the appropriate channel 0 or channel 1 ADC register. The
transfer is double-buffered to ensure that invalid data is not
read during the transfer. After the data is transferred, the
TSL2550 automatically begins the next conversion cycle. A
VALID bit is used to indicate that data has been written to the
ADC register after ADC is enabled.
Interface to the ADC and control of other device functions is
accomplished using the standard 2-wire System Management
Bus (SMBus) interface. Both versions 1.1 and 2.0 of the SMBus
are supported.
The ADC has two operating modes: standard and extended. In
standard mode, the integration time is 400 mS for each channel
or 800 mS for both channel 0 and channel 1. Extended mode
shortens the integration time by a factor of five with a
corresponding decrease in responsivity of 5×. The extended
range allows the device to operate at higher light levels,
extending the overall dynamic range by a factor of five.
Digital Interface
The TSL2550 contains an 8-bit command register that can be
written and read via the SMBus. The command register controls
the overall operation of the device. There are two read-only
registers that contain the latest converted value of each of the
two ADC channels. The SMBus slave address is hardwired
internally as 0111001 (MSB to LSB, A6 to A0).
Both the send byte protocol and the receive byte protocol are
implemented in the TSL2550. The send byte protocol allows
single bytes of data to be written to the device (see Figure 16).
The written byte is called the COMMAND byte. The receive byte
protocol allows single bytes of data to be read from the device
(see Figure 17). The receive data can be either the previously
written COMMAND byte or the data from one of the ADC
channels. In Figure 16 and Figure 17, the clear area represents
data sent by the host and the shaded area represents data
returned by the ambient light sensor or slave device.
Principles Of Operation
ams Datasheet Page 13
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TSL2550 − Principles Of Operation
Figure 16:
Send Byte Protocol
Figure 17:
Receive Byte Protocol
WR
7
Data ByteSlave AddressS
1
APA
811 11
S = Start Condition P = Stop Condition Shaded = Slave Transmission
RD
7
Data ByteSlave AddressS
1
APA
811 11
S = Start Condition P = Stop Condition Shaded = Slave Transmission
Page 14 ams Datasheet
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TSL2550 − Principles Of Operation
Command Register
The command register is used primarily to:
•Select which ADC register will be read during a read cycle
•Switch the dynamic range of the device between standard
and extended range modes
•Power the device up for operation or power it down for
minimum power consumption
Figure 18 shows the six primary commands used to control the
TSL2550.
Figure 18:
Command Summary
The content of the command register defaults to 0x00h when
power is applied to the device, placing the device into the
power-down mode.
Once the TSL2550 is set to the standard range mode (0x18h) or
the extended range mode (0x1Dh), the device remains in that
mode until it is powered down or the mode is changed via the
command register.
The 0x03h command has two purposes: It is used to power up
the device and can also be used to check that the device is
communicating properly. The value returned during a read
cycle should be 0x03h.
Command Function
0x00h Power-down state
0x03h Power-up state/Read command register
0x1Dh Write command to assert extended range mode
0x18h Write command to reset or return to standard range mode
0x43h Read ADC channel 0
0x83h Read ADC channel 1
ams Datasheet Page 15
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Principles Of Operation
ADC Register
The TSL2550 contains two ADC registers (channel 0 and channel
1). Each ADC register contains two component fields that are
used to determine the logarithmic ADC count value: CHORD
bits and STEP bits. The CHORD bits correspond to the most
significant portion of the ADC value and specifies a segment of
the piece-wise linear approximation. The STEP bits correspond
to the least significant portion of the ADC count value and
specifies a linear value within a segment. CHORD and STEP bits
all equal to 0 corresponds to a condition in which the light level
is below the detection limit of the sensor. CHORD and STEP bits
all equal to 1 corresponds to an overflow condition.
Each of the two ADC value registers contain seven data bits and
a valid bit as described in Figure 19.
Figure 19:
ADC Register Data Format
The specific ADC value register read depends on the last read
command written to the command register, as described above
and in the Operation section, below.
The MSB of the ADC register (VALID bit B7) is used to indicate
that data has been written to the ADC register after the device
is powered up as described in Command Register section.
Bits 6 through 0 contain the 7-bit code representing the ADC
count value, which is proportional to a photodetector current.
In this code, the ADC count value is represented by a piece-wise
linear approximation to a log function. The transfer function is
broken into 8 chords of 16 steps each. (This code is very similar
to μ-law code used in audio compression — it differs in that it
does not have a sign bit and it is not inverted.) Figure 20 shows
the relationship between the CHORD and STEP bits and the
CHORD and STEP numbers and values. These are used to
calculate the ADC count value.
Valid Chord Bits Step Bits
B7 B6 B5 B4 B3 B2 B1 B0
VALID C2 C1 C0 S3 S2 S1 S0
Field Bits Description
VALID 7
ADC channel data is valid. One indicates that the ADC has written data into the
channel data register, since ADCEN was asserted in the COMMAND register.
CHORD 6 to 4 CHORD number.
STEP 3 to 0 STEP number.
Page 16 ams Datasheet
Document Feedback [v1-00] 2016-May-20
Figure 20:
CHORD and STEP Numbers and Values vs Register Bits
Note(s):
1. CHORD VALUE = INT (16.5 × ((2
C
) - 1))
2. STEP VALUE = 2
C
Chord Bits B6, B5, B4 C, Chord Number Chord Value (Note 1) Step Value (Note 2)
000 0 0 1
001 1 16 2
010 2 49 4
011 3 115 8
100 4 247 16
101 5 511 32
110 6 1039 64
111 7 2095 128
Step Bits B3, B2, B1, B0 S, Step Number
0000 0
0001 1
0010 2
0011 3
0100 4
0101 5
0110 6
0111 7
1000 8
1001 9
1010 10
1011 11
1100 12
1101 13
1110 14
1111 15
ams Datasheet Page 17
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Principles Of Operation
The ADC count value is obtained by adding the CHORD VALUE
and the product of the STEP NUMBER and STEP VALUE (which
depends on CHORD NUMBER).
The ADC count value can also be expressed as a formula:
where:
C is the CHORD NUMBER (0 to 7)
S is the STEP NUMBER (0 to 15)
as defined in Figure 20.
Operation
After applying VDD, the device will initially be in the power
down state. To operate the device, issue an SMBus Send Byte
protocol with the device address and the appropriate command
byte to read ADC channel 0 or ADC channel 1 (see Figure 18).
To obtain the conversion result, issue an SMBus Receive Byte
protocol with the device address. The data byte received will
correspond to the value in the ADC register (0 or 1) specified by
the previous command. If a conversion has not been completed
since power up (either through V
DD
or power up command), the
valid bit will be 0, and the data will not be valid. If there is a valid
conversion result available, the valid bit will be set (1), and the
remaining 7 bits will represent valid data from the previously
selected ADC register. Data may be read repeatedly from the
currently selected ADC register, and although it will remain
valid, the ADC register will not be updated until a new
conversion completes for that channel (800 ms total since there
are two serial 400 ms per channel conversion times in standard
mode). Note also that the command register itself may be read,
as a check to be sure that the device is communicating properly.
To power down the device for reduced power consumption,
issue an SMBus Send Byte protocol with the device address
followed by 0 as indicated in Figure 18.
(EQ1)
ADCCountValue ChordValue()StepValue()+ StepNumber()×()=
(EQ2)
ADCCountValue INT 16.25 2c1–()×()()S2
c
()×()+=
Page 18 ams Datasheet
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TSL2550 − Application Information
The TSL2550 is intended for use in ambient light detection
applications, such as display backlight control, where
adjustments are made to display brightness or contrast based
on the brightness of the ambient light, as perceived by the
human eye. Conventional silicon detectors respond strongly to
infrared light, which the human eye does not see. This can lead
to significant error when the infrared content of the ambient
light is high, such as with incandescent lighting, due to the
difference between the silicon detector response and the
brightness perceived by the human eye.
This problem is overcome in the TSL2550 through the use of
two photodiodes. One of the photodiodes (channel 0) is
sensitive to both visible and infrared light, while the second
photodiode (channel 1) is sensitive primarily to infrared light.
An integrating ADC converts the photodiode currents to
channel 0 and channel 1 digital outputs. Channel 1 digital
output is used to compensate for the effect of the infrared
component of light on the channel 0 digital output. The ADC
digital outputs from the two channels are used in a formula to
obtain a value that approximates the human eye response in
the commonly used Illuminance unit of Lux. For standard mod e:
where:
R = Ch1 Counts / (Ch0 Counts - Ch1 Counts)
The formula above was obtained by optical testing with
fluorescent and incandescent light sources. The light level
calculated from the formula will be slightly higher than the
actual light level for sunlight and will be slightly lower than the
actual light level for composite fluorescent and incandescent
light sources.
Note(s): Please see ams application notes for additional
information, including implementing a display brightness
control system with the TSL2550, and for a simple
implementation of the equation shown above suitable for use
in embedded microcontrollers.
Figure 21 contains a summary of the typical sensor outputs for
several common light sources.
Application Information
(EQ3)
LightLevel lux)()Ch0 Ch1–()0.39 e
0.181R–
2
()
××=
ams Datasheet Page 19
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Application Information
Figure 21:
Sensor Output Summary (Standard Mode)
Light from 50 or 60 Hz sources, and especially fluorescent
lighting, has a high harmonic content. Since the TSL2550
integrates the ambient light over an approximately 400
millisecond interval (per channel), this light ripple is typically
reduced to less than 1/4 LSB.
Power Supply Decoupling
The power supply lines must be decoupled with a 0.1 μF
capacitor placed as close to the device package as possible. The
bypass capacitor should have low effective series resistance
(ESR) and effective series inductance (ESI), such as the common
ceramic types, which provide a low impedance path to ground
at high frequencies to handle transient currents caused by
internal logic switching.
Light
Source
Illuminance
(LUX)
Channel 0
(Counts)
Channel 1
(Counts)
Ratio:
CH1/CH0
LUX Per
CH0 Count
Fluorescent 297 831 68 0.082 0.36
Daylight
(shade) 201 895 343 0.383 0.22
Incandescent 42 959 671 0.7 0.04
Page 20 ams Datasheet
Document Feedback [v1-00] 2016-May-20
TSL2550 − Application Information
PCB Pad Layout
Suggested PCB pad layout guidelines for the D package and T
package are shown in Figure 22 and Figure 23.
Figure 22:
Suggested D Package PCB Layout
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
Figure 23:
Suggested T Package PCB Layout
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
2.25
6.90
4.65
1.27
0.50
1.50
2.90
0.90
1.00
ams Datasheet Page 21
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Mechanical Data
Figure 24:
Package D — Plastic Small Outline IC Packaging Configuration
Note(s):
1. All linear dimensions are in millimeters.
2. The center of the 1234 μm by 282 μm photo-active area is typically located in the center of the package in the long dimension and
269 μm off center in the short dimension.
3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. This drawing is subject to change without notice.
Mechanical Data
PACKAGE D Plastic Small-Outline
PIN 1
6 1.27
0.510
0.330
8
2.8 TYP
CLEAR WINDOW
NOTE B
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
45
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41 0.25
0.10
0.25
0.19
DETAIL A
TOP VIEW
END VIEW
SIDE VIEW
PIN 1
BOTTOM VIEW
Pb
Green
RoHS
Page 22 ams Datasheet
Document Feedback [v1-00] 2016-May-20
TSL2550 − Mechanical Data
Figure 25:
Package T — Four-Lead Surface Mount Device Packaging Configuration
Note(s):
1. All linear dimensions are in millimeters.
2. Terminal finish is gold.
3. Dimension tolerance is ± 0.15 mm.
4. This drawing is subject to change without notice.
PACKAGE T Four-Lead Surface Mount Device
TOP VIEW
SIDE VIEW
BOTTOM VIEW
3.80
2.60
A
1.35
3.10 2 7
0.35
1.50
0.55
DETAIL A: TYPICAL PACKAGE TERMINAL
0.78
0.90
1.23
0.67
0.281.46
PHOTODIODE ACTIVE AREA LOCATION
0.50
0.10
0.78
R 0.25
PIN 4
PIN 1
PIN 4
PIN 1
Pb
Green
RoHS
ams Datasheet Page 23
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Mechanical Data
Figure 26:
Package D Carrier Tape
Note(s):
1. All linear dimensions are in millimeters [inches].
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
0.292 0.013
[0.0115 0.0005]
2.11 0.10 [0.083 0.004]
2 0.05
[0.079
0.002]
4 0.1
[0.157
0.004]
1.75 0.10
[0.069 0.004]
12 + 0.3 ï 0.1
[0.472 + 0.12 ï 0.004]
SIDE VIEW
TOP VIEW END VIEW
DETAIL B
5.50 0.05
[0.217 0.002]
8 0.1
[0.315
0.004]
1.50
B
B
AA
6.45 0.10
[0.254 0.004]
5.13 0.10
[0.202 0.004]
DETAIL A
AoBo
Ko
Page 24 ams Datasheet
Document Feedback [v1-00] 2016-May-20
TSL2550 − Mechanical Data
Figure 27:
Package T Carrier Tape
Note(s):
1. All linear dimensions are in millimeters.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
0.30 0.050 2.10
4 0.100
2 0.100
8 Typ
1.75 0.100
5.50
0.100
AA
B
B
12 0.100
R 0.20 TYP
1.50
1.50
SIDE VIEW
TOP VIEW
END VIEW
3.09 MAX
2.90 0.100 A
o
R 0.20 TYP
1.80 K
o
4.29 MAX
4.10 0.100 B
o
DETAIL B
DETAIL A
R 0.20 TYP
ams Datasheet Page 25
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Manufacturing Information
The D and T packages have been tested and have demonstrated
an ability to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 28:
TSL2550 Solder Reflow Profile
Figure 29:
TSL2550D/TSL2550T Solder Reflow Profile Graph
Parameter Reference TSL2550D/TSL2550T
Average temperature gradient in preheating 2.5°C/s
Soak time t
soak
2 to 3 minutes
Time above 217°C t
1
Max 60 s
Time above 230°C t
2
Max 50 s
Time above T
peak
−10°C t
3
Max 10 s
Peak temperature in reflow T
peak
260°C (−0°C/5°C)
Temperature gradient in cooling Max −5°C/s
Manufacturing Information
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (s)
Temperature (5C)
Page 26 ams Datasheet
Document Feedback [v1-00] 2016-May-20
TSL2550 − Manufactur ing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package
molding compound.
Package D
To ensure the package molding compound contains the
smallest amount of absorbed moisture possible, all devices
shipped in carrier tape have been pre-baked and shipped in a
sealed moisture-barrier bag. No further action is necessary if
these devices are processed through solder reflow within 24
hours of the seal being broken on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the
moisture barrier bag has been broken for 24 hours or longer, it
is recommended that the following procedures be used to
ensure the package molding compound contains the smallest
amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re-baked for 4 hours,
at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours
at 90°C).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through
solder reflow in 24 hours. Devices can be re-baked for 4 hours
in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4
hours at 90°C).
ams Datasheet Page 27
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Manufacturing Information
Package T
To ensure the package molding compound contains the
smallest amount of absorbed moisture possible, each device is
dry-baked prior to being packed for shipping. Devices are
packed in a sealed aluminized envelope with silica gel to
protect them from ambient moisture during shipping,
handling, and storage before use.
The T package has been assigned a moisture sensitivity level of
MSL 3 and the devices should be stored under the following
conditions:
•Temperature Range: 5°C to 50°C
•Relative Humidity: 60% maximum
•Total Time: 6 months from the date code on the
aluminized envelope—if unopened
•Opened Time: 168 hours or fewer
Rebaking will be required if the devices have been stored
unopened for more than 6 months or if the aluminized envelope
has been open for more than 168 hours. If rebaking is required,
it should be done at 90°C for 4 hours.
Page 28 ams Datasheet
Document Feedback [v1-00] 2016-May-20
TSL2550 − Ordering & Contact Information
Figure 30:
Ordering Information
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Ordering
Code
Package
− Leads Device TA Package
Designator
Delivery
Type
Delivery
Quantity
TSL2550D SOIC-8 TSL2550 -40°C to 85°C D Tape & Reel 1000 pcs/reel
TSL2550T T-4 TSL2550 -40°C to 85°C T Tape & Reel 1000 pcs/reel
Ordering & Contact Information
ams Datasheet Page 29
[v1-00] 2016-May-20 Document Feedback
TSL2550 − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
RoHS Compliant & ams Green
Statement
Page 30 ams Datasheet
Document Feedback [v1-00] 2016-May-20
TSL2550 − Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Copyrights & Disclaimer
ams Datasheet Page 31
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Document Status
Document Status Product Status Definition
Product Preview Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Preliminary Datasheet Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Datasheet Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Datasheet (discontinued) Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Document Status
Page 32 ams Datasheet
Document Feedback [v1-00] 2016-May-20
TSL2550 − Revision Information
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Changes from 029L (2007-Oct) to current revision 1-00 (2016-May-20) Page
Content of TAOS datasheet was updated to latest ams design
Updated Key Benefits & Features 1
Updated Ordering Information 28
Revision Information
ams Datasheet Page 33
[v1-00] 2016-May-20 Document Feedback
TSL2550 − Content Guide
1 General Description
1 Key Benefits & Features
2 Functional Block Diagram
3 Pin Assignments
4Absolute Maximum Ratings
5 Electrical Characteristics
9 Parameter Measurement Information
11 Typical Operation Characteristics
12 Principles Of Operation
12 Analog-to-Digital Converter
12 Digital Interface
14 Command Register
15 ADC Register
17 Operation
18 Application Information
19 Power Supply Decoupling
20 PCB Pad Layout
21 Mechanical Data
25 Manufacturing Information
26 Moisture Sensitivity
26 Package D
27 Package T
28 Ordering & Contact Information
29 RoHS Compliant & ams Green Statement
30 Copyrights & Disclaimer
31 Document Status
32 Revision Information
Content Guide