1
0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
FX12 Series
2015.8e
Features
1. Dual shields
Built-in shield plates and metal fittings in the plugs
and receptacles prevent electromagnetic emission
and external interference on the entire 360°
periphery of mated connectors. (Fig.1, 2)
2. Low-Profile
A board-to-board distance of 1.5mm combined
with reduced mounting areas allow for use in
space-limited applications. (Fig.3)
3. Self alignment
Built-in self-alignment feature in the plug and
receptacle allows mating / un-mating in limited
spaces. (Fig.4)
4. Consistent mated retention force
Indents in the shield plates and contact configuration
assure consistent, mated retention forces regardless
of the number of contacts. A positive, tactile "click"
confirms the fully mated state.
5. Solder wicking prevention
Nickel plating barrier on the contacts prevents
solder compound intrusion (wicking) into the
contact engagement areas.
6.
High contact reliability
The narrow female contacts have a curved shape
that acts like a spring, producing a long wipe length
during mating and results in high contact reliability.
7.
Pick-and-Place automatic mounting friendly
The compact, double shielded structure still
provides enough area for vacuum pick-up machines
when used in automated mounting methods.
Receptacle: 0.8mm
Header: 0.8mm
8. RoHS Compliant
All materials and substances used to produce this
product comply with RoHS standards.
=ZVYZg"h^YZh]^ZaY
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Effective Shielding
Low-Profile, Space-Saving with Reduced Connector
Footprint
(Shown 24-Position – fully mated)
Self Alignment of 0.3 mm
Dual Shields (when mated)
[Patented Design]
Emitted Noise Level (dBm)
Frequency (GHz)
Without shield plates
With shield plates
Receptacle
Plug
Fig.1
Fig.2
Fig.3
Fig.4
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
Nov.1.2019Copyright2019HIROSEELECTRICCO.,LTD.AllRightsReserved.
2
FX12 Series0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
Series name : FX12
Configuration
B : Without guide post
Number of contacts : 24, 40, 60
Connector type
P : Header
S : Receptacle
Contact pitch : 0.4 mm
Mounting style
SV : SMT
Blank : Embossed tape packing (3,000 pcs/reel)
( 30 ) : Embossed tape packing (100 pcs/reel)
q
FX12 B - 24 P - 0.4 SV (**)
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u
Product Specifications
Rating Current rating 0.3A
Voltage rating 30V AC
Operating temperature range
-55ç to +85ç (Note 1)
Storage temperature range
-10ç to +60ç (Note 2)
Storage humidity range
Relative humidity 95% max. (No condensation)
Item Specification Conditions
1.Insulation resistance
50Mø min. 100V DC
2.Withstanding voltage
No flashover or insulation breakdown. 100V AC/one minute
3.Contact resistance 100mø max. 100mA
4.Vibration resistance No electrical discontinuity of 1µs or more.
No damage, cracks or parts dislocation.
Frequency: 10 to 55 Hz, single amplitude of
0.75mm, 3 axis, 10 cycles
5.Shock resistance No electrical discontinuity of 1µs or more.
No damage, cracks or parts dislocation.
Acceleration of 490m/s2, 11ms duration,
sine half-wave waveform, 3 cycles / each of
3 axis directions
6.Humidity resistance
Contact resistance: 120mø max.
Insulation resistance: 25Mø min.
No damage, cracks or parts dislocation.
96 hours at 40ç, 90% to 95% R.H.
7.Temperature cycle
Contact resistance: 120mø max.
Insulation resistance: 50Mø min.
No damage, cracks or parts dislocation.
Temperature: -55ç +15ç to 35ç
+85ç +15ç to +35ç
Time: 30 2 to 3 30 2 to 3 (Minutes)
5 cycles
8. Mating Cycles Contact resistance: 120mø max.
No damage, cracks or parts dislocation. 30 cycles
9. Resistance to
soldering heat
No deformation of components affecting
performance.
Reflow: At the recommended temperature profile
Manual soldering: 360ç for 5 seconds
Note 1 : Includes temperature rise caused by current flow.
Note 2 : The term “storage” refers to products stored for long periods of time prior to mounting and use. Operating
temperature range and humidity range includes non-conducting condition of installed connectors in storage,
shipment or during transportation.
Materials / Finish
Part Material Finish Remarks
Insulator Polyamide Color: Black UL94V-0
Contacts
Phosphor bronze
Header
Engagement Area: Gold Plated of 0.1µm
Termination Area: Flash Plated
-------
Receptacle
Ground plates Flash plated -------
Metal fittings Tin plated -------
Product Number Structure
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3
FX12 Series0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
(0.1)
1.34±0.3
0.3
4.9±0.2
(0.3)(0.15)
A±0.12
0.1
P=0.4±0.06
A±0.12
D
G
G0.04
B
0.4
1
0.23±0.02 (Land pattern )
0.2±0.02 (Metal mask)
0.4±0.02 (Land pattern)
0.35±0.02 (Metal mask)
1
(Land pattern)
3.4
+0.1
0
0
–0.1
E+0.1
0
0
–0.05
3.8 0
–0.05
5.2+0.05
0
0.9±0.02 (Metal mask)
Header
B Recommended PCB Layout and Metal Mask Dimensions
Recommended metal mask thickness: 0.12 mm
Notes:
Positions marked indicate a ground circuit connections.
The co-planarity of SMT terminations is 0.1 maximum.
No polarity orientation for board mounting.
Dimensions in parentheses ( ) are reference dimensions.
All dimensions in mm.
1
2
3
4
5
Part No. HRS No. No. of Contacts ABCDE
RoHS
FX12B-24P-0.4SV(**) 573-1005-0 ** 24 5.4 4.4 10.6 09.1 11.0
YesFX12B-40P-0.4SV(**) 573-1001-0 ** 40 8.6 7.6 13.8 12.3 14.2
FX12B-60P-0.4SV(**) 573-1007-6 ** 60 12.6 11.6 17.79 16.3 18.2
Blank : Embossed tape packing (3,000 pcs/reel)
( 30 ) : Embossed tape packing (100 pcs/reel)
A±0.12
D
4
5
4
0.4±0.02 (Land pattern)
0.35±0.02 (Metal mask)
1
(Land pattern)
2.76
+0.1
0
0
–0.1
E
F MIN.
+0.1
0
0
–0.05
0
–0.1
3.04 0
–0.05
4.6+0.05
0
0.9±0.02 (Metal mask)
2
5.3 MIN.
G
G0.04
B
0.4
1
0.23±0.02 (Land pattern)
0.2±0.02 (Metal mask)
A±0.12
C±0.3
(0.15)
(0.1)
(0.3)
B±0.1
4.2±0.21.2±0.3
P=0.4±0.06
Receptacle
B Recommended PCB Layout and Metal Mask Dimensions
Recommended metal mask thickness: 0.12 mm
Notes:
Positions marked indicate a ground circuit connections.
The co-planarity of SMT terminations is 0.1 maximum.
No polarity orientation for board mounting.
Do NOT place any components within area indicated by the broken line
.
Do NOT place conductive traces in areas indicated by .
Dimensions in parentheses ( ) are reference dimensions.
All dimensions in mm.
1
2
3
4
5
6
7
Part No. HRS No. No. of Contacts ABCDEF RoHS
FX12B-24S-0.4SV(**) 573-1006-3 ** 24 5.4 4.4 8.14 6.6 08.5 11.1
Yes
FX12B-40S-0.4SV(**) 573-1002-2 ** 40 8.6 7.6 11.34 9.8 11.7 14.3
FX12B-60S-0.4SV(**) 573-1008-9 ** 60 12.6 11.6 15.34 13.8 15.7 18.3
Blank : Embossed tape packing (3,000 pcs/reel)
( 30 ) : Embossed tape packing (100 pcs/reel)
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4
FX12 Series0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
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Embossed Carrier Tape and Reel Dimensions
Header Reel dimensions
Part No. ABC
FX12B-24P-0.4SV(**) 11.5 24.0 24.4
FX12B-40P-0.4SV(**)
FX12B-60P-0.4SV(**) 14.2 32.0 32.4
All dimensions in mm
Part No. ABC
FX12B-24S-0.4SV(**)
11.5 24.0 24.4FX12B-40S-0.4SV(**)
FX12B-60S-0.4SV(**)
All dimensions in mm
Embossed Carrier Tape and Reel Dimensions
Receptacle Reel dimensions
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5
FX12 Series0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
BRecommended solder temperature profile.
BWashing Conditions
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give
rise to the deterioration of electrical performance. In this regard it is important to check whether a thorough washing
has been performed.
Organic solvent Washing
Solvent type Room temperature washing Heated washing
IPA (Isoporopyl alcohol) Yes Yes
< HRS test conditions >
Solder method :Reflow
Environment :Room air
Solder paste :96.5%Sn/3.0%Ag/0.5%Cu
Test board : Glass epoxy
40mm∞30mm∞1mm thick
Metal mask :0.12mm thick
Reflow cycles :2cycles
Note 1 : The temperature profiles shown are
based on the above conditions.
Note 2 : In individual applications the actual
temperature may very, depending on
solder paste type, volume / thickness
and board size/ thickness.
Note 3 : Cosult your solder paste and equipment
manufacture for specific recommendations.
The temperature profile indicates the maximum temperature of the connector surfaces at the highest point from the PCB
mounting surface.
260
150ç
200ç
(MAX 60sec.)
(90~120sec.)
220ç
MAX 250ç
Time (Seconds)
240
220
200
180
160
140
0
Temperature (ç)
Preheating (150 to 200ç) Soldering
(220ç min)
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6
FX12 Series0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
(0.5mm)(0.5mm)
MAX 0.3 MAX 0.3
FX12*-**S-0.4SV
FX12*-**P-0.4SV
Fig.1
BHandling Precautions when mating mounted connectors.
Start the engagement of the connectors within the specified self-
alignment range of 0.3 mm, while keeping the boards parallel to
each other.
Do NOT start mating of the mounted connectors at an angle.
Correctly position the connectors over each other and assure that
both boards are parallel to each other.
When the connectors are correctly aligned (and both boards are
parallel to each other) apply even force until full mating is
confirmed by the “click” sensation.
BHandling Precautions when un-mating
Keep the boards (with mounted connectors) parallel to each
other.
If parallel disconnection is impossible, start un-mating at one end,
exercising extreme caution to apply force at the center of the
connector itself, away from the solder joint rows
(Ref. Fig A and Fig. B)
Do NOT start disconnection at the sides as the connector can be
damaged, voiding the warranty and making the re-engagement
impossible.
When the connectors are mounted on the FPC, care should taken to prevent the mated connectors from bending
or twisting on the FPC. The device case or cushioning material should be used to keep the connectors fully mated
and supported.
Caution
Fig. A Fig. B
Incorrect
Incorrect
Incorrect
Incorrect
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7
FX12 Series0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
125.00
122.50
120.00
117.50
115.00
112.50
110.00
107.50
105.00
102.50
100.00
[dB
A/m]
μ
BTechnical Documentation
Eye Pattern Output Waveform
60
50
40
30
20
10
0
0.1 0.15 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.5 2 3
Shielding Effect (dB)
Frequency (GHz)
Sample 1
Sample 2
Sample 3
Shielding Characteristics (1) (Measurement Results Using a 2-Chamber Shielded Room)
Without shielding With shielding
Explanatory Note
Measurement values of the unshielded connectors were set as the zero level of the vertical axis of the graph. The graph uses
unshielded connectors as the reference and indicates the noise leakage suppression (shielding) effect of the shielded
connectors as a relative comparison value.
In comparison to the unshielded connectors there was a noise suppression effect of 10 dB to 30 dB over the frequency range of
100 MHz to 3 GHz.
Explanatory Note
A signal of the 266 MHz operating frequency was transmitted through all contacts, over a frequency range of 10 MHz to 3 GHz.
The magnetic field leaking to the surroundings from the gap between the boards was measured with a magnetic probe to
provide the (mapping data) results.
Shielding Characteristics (2) (Board-to-Board Shielding Comparison Using a Magnetic Field
Probe Method: IEC 61967-6 Compliance)
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8
FX12 Series0.4mm Pitch, 1.5mm Board-to-Board Connectors with Dual Shielding
The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use.
The contents of this catalog are current as of date of 08/2015. Contents are subject to change without notice for the purpose of improvements.
2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN
TEL: +81-45-620-3526 Fax: +81-45-591-3726
http://www.hirose.com
http://www.hirose-connectors.com
®
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