IPS161H Single high-side switch Datasheet - production data Description The IPS161H is a monolithic device which can drive capacitive, resistive or inductive loads with one side connected to ground; it is specifically designed to match safety integrity level (SIL) applications. PowerSSO12 Features RDS(on) = 0.060 , IOUT = 0.7 A, VCC = 65 V 8 V to 60 V operating voltage range Minimum output current limitation: 0.7 A Non-dissipative short-circuit protection (cutoff) Programmable cut-off delay time using external capacitor Cut-off delay time can be programmed by an external capacitor. Table 1. Device summary Diagnostic signalization for: open load in offstate, cut-off and junction thermal shutdown Fast demagnetization of inductive load Built-in thermal shutdown protects the chip against overtemperature and short-circuit. In order to minimize the power dissipation when the output is shorted, a non-dissipative short-circuit protection (cut-off) is implemented, it limits both the output average current value and, consequently, the device overheating. The DIAG common diagnostic pin reports the thermal shutdown, open load in off-state and cut-off. Order code IPS161H IPS161HTR Package PowerSSO12 Packing Tube Tape and reel Ground disconnection protection VCC disconnection protection Undervoltage lock-out Designed to meet IEC 61131-2 PSSO12 package Applications Programmable logic control Industrial PC peripheral input/output Numerical control machines SIL applications December 2018 This is information on a product in full production. DocID029436 Rev 4 1/25 www.st.com Contents IPS161H Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 DIAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 CoD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.5 GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.6 VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Output logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1 Undervoltage lock-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 Overtemperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 Cut-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.4 Open load in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 6.5 VCC disconnection protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6.6 GND disconnection protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 Active clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8.1 9 2/25 PowerSSO12 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 DocID029436 Rev 4 IPS161H List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC = 24 V; 125 C > TJ > -40 C, RLOAD = 48 ) . . . . . . . . . . . . . . . . . . . . . . . 9 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Output stage truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Minimum cut-off delay for TAMB less than -20 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PowerSSO12 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 DocID029436 Rev 4 3/25 25 List of figures IPS161H List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. 4/25 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 trise and tfall . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 tPD(L-H) and tPD(H-L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current limitation and cut-off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Open load off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 VCC disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 GND disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Active clamp equivalent principle schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Fast demag waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Typical demagnetization energy (single pulse) at VCC = 24 V and TAMB = 125 C . . . . . . 20 PowerSSO12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 PowerSSO12 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DocID029436 Rev 4 IPS161H Block diagram Figure 1. Block diagram 6OEFSWPMUBHF EFUFDUJPO */ %*"( -PHJD JOUFSGBDF 1 Block diagram 7DD 7DD DMBNQ 0VUQVUDMBNQ 065 $VSSFOU MJNJUBUJPO DVU PGG 0QFO MPBEJOPGGTUBUF $P% +VODUJPO 0WFSUFNQFSBUVSF (/% (*1(-. DocID029436 Rev 4 5/25 25 Pin description 2 IPS161H Pin description Figure 2. Pin connection (top view) 7$$ 7$$ */ %*"( $P% 065 /$ 065 /$ (/% 5"# 7DD 065 065 (*1(-. Table 2. Pin configuration 2.1 Number Name Function Type 1, 12, TAB VCC 2 IN 3 DIAG Common diagnostic pin both for thermal shutdown, cut-off and open load 4 CoD Cut-off delay pin, cannot be left floating. Connected to GND by 1 k resistor to disable the cut-off function. Connect to a CCoD capacitor to set the cut-off delay see Table 9: Protection and diagnostic on page 10. 5, 6 NC Not connected 7 GND Device ground Ground 8, 9, 10, 11 OUT Channel power stage output Output Device supply voltage Supply Channel input Input Output open drain Input IN This pin drives the output stage to pin OUT. IN pin has internal weak pull-down resistors, see Table 8: Logic inputs on page 10. 2.2 OUT Output power transistor is in high-side configuration, with active clamp for fast demagnetization. 6/25 DocID029436 Rev 4 IPS161H 2.3 Pin description DIAG This pin is used for diagnostic purpose and it is internally wired to an open drain transistor. The open drain transistor is turned on in case of junction thermal shutdown, cut-off, or open load in off-state. 2.4 CoD This pin cannot be left floating and can be used to program the cut-off delay time tcoff, see Table 9: Protection and diagnostic on page 10 through an external capacitor (CCoD). The cut-off function can be completely disabled connecting the CoD pin to GND through 1 k resistor: in this condition the output channel remains on in limitation condition, supplying the current to the load until the input is forced LOW or the thermal shutdown threshold is triggered or tcoff time elapses. 2.5 GND IC ground. 2.6 VCC IC supply voltage. DocID029436 Rev 4 7/25 25 Absolute maximum ratings 3 IPS161H Absolute maximum ratings Table 3. Absolute maximum ratings Symbol Parameter VCC Supply voltage VOUT Output channel voltage Value Unit -0.3 to 65 V VCC - Vclamp to VCC +0.3 V -10 to +10 mA IIN Input current VIN IN voltage VCC V VCOD Output cut-off voltage pin 5.5 V ICOD Input current on cut-off pin -1 to +10 mA VDIAG Fault voltage VCC V IDIAG Fault current -5 to +10 mA ICC(1) Maximum DC reverse current flowing through the IC from GND to VCC -250 mA IOUT Output stage current Internally limited -IOUT(1) Maximum DC reverse current flowing through the IC from OUT to VCC EAS(1) Single pulse avalanche energy (TAMB = 125 C, VCC = 24 V, load = 48 ) PTOT Power dissipation at TC = 25 C(2) TSTG TJ A 5 3000 mJ Internally limited W Storage temperature range -55 to 150 C Junction temperature -40 to 150 1. Verified on application board with Rth(ja) = 49 C/W 2. [TJSD(MAX) - TC]/ Rth(JA). Note: Absolute maximum ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. All voltages are referenced to GND. Table 4. Thermal data Symbol Note: 8/25 Parameter Value Rth(JC) Thermal resistance junction-case 1 Rth(JA) Thermal resistance junction-ambient 49 Package mounted on a 2-layer application board with Cu thickness = 35 m, total dissipation area = 1.5 cm2 connected by 6 vias. DocID029436 Rev 4 Unit C/W IPS161H 4 Electrical characteristics Electrical characteristics 8 V < VCC < 60 V; -40 C < TJ < 125 C, unless otherwise specified. Table 5. Supply Symbol VCC Parameter Test conditions Min. Typ. Max. Unit Supply voltage - VUVON - 60 - VUVON Undervoltage on threshold - 6.9 - 8 - VUVOFF Undervoltage off threshold - 6.5 - 7.8 - Undervoltage hysteresis - 0.15 0.5 VCC = 24 V - 300 500 VCC = 60 V - 350 600 VCC = 24 V - 1 1.4 VCC = 60 V - 1.4 1.8 VGND = VIN = VCC VOUT = 0 V - - 1 mA Unit VUVH Supply current in off-state IS Supply current in on-state ILGND GND disconnection output current A mA Table 6. Output stage Symbol RDS(on) VOUT(OFF) IOUT(OFF) Parameter On-state resistance Off-state output voltage Off-state output current IOUT(OFF-min) Off-state output current Test conditions Min. Typ. Max. VCC = 24 V, IOUT = 0.5 A at TJ = 25 C - 60 - VCC = 24 V, IOUT = 0.5 A at TJ = 125 C - - 120 VIN = 0 V and IOUT = 0 A - - 2 VCC = 24 V, VIN = 0 V, VOUT = 0 V - - 3 VCC = 60 V, VIN = 0 V, VOUT = 0 V - - 10 VIN = 0 V, VOUT = 4 V -35 - 0 m V A Table 7. Switching (VCC = 24 V; 125 C > TJ > -40 C, RLOAD = 48 ) Symbol Parameter tr Rise time tf Fall time tPD(H-L) Propagation delay time off tPD(L-H) Propagation delay time on Test conditions IOUT = 0.5 A Figure 3 DocID029436 Rev 4 Min. Typ. Max. - 10 - - 10 - - 20 - - 30 - Unit s 9/25 25 Electrical characteristics IPS161H Figure 3. Timing in normal operation Table 8. Logic inputs Symbol Parameter Test conditions Min. Typ. Max. VIL Input low level voltage - - - 0.8 VIH Input high level voltage - 2.2 - - VI(HYST) Input hysteresis voltage - - 0.4 - VCC = VIN = 36 V - - 200 VCC = VIN = 60 V - - 550 IIN Input current Unit V A Table 9. Protection and diagnostic Symbol Vclamp Parameter VCC active clamp Vdemag Demagnetization voltage Test conditions ICC = 10 mA IOUT = 0.5 A; load = 1 mH Min. Typ. Max. 65.5 68.5 71.5 VCC - 71.5 VCC - 71.5 VCC - 71.5 Unit V VOLoff Open load (off- state) or short to VCC detection threshold - 2 - 4 tBKT Open load blanking time - - - 200 s VDIAG Voltage drop on DIAG IDIAG = 4 mA - - 1 V IDIAG DIAG pin leakage current VCC 36 V - - 110 A 36 V VCC 60 V - - 180 0.7 - 1.7 ILIM 10/25 Output current limitation VCC 32 V, RLOAD 10 m DocID029436 Rev 4 A IPS161H Electrical characteristics Table 9. Protection and diagnostic Symbol tcoff Parameter Cut-off current delay time Test conditions Programmable by the external capacitor on CoD pin. Cut-off is disabled when CoD pin is connected to GND through 1 k resistor. TJ TJSD Output stage restart delay time TJ TJSD Junction temperature shutdown - Junction temperature TJHYST thermal hysteresis - tres TJSD Min. Typ. Max. Unit 50 x CCOD [nf] 35%(1) s 32 x tcoff [s] 40% 150 170 190 C - 15 - 1. The formula is guaranteed in the range 10 nF CCOD 100 nF. DocID029436 Rev 4 11/25 25 Output logic 5 IPS161H Output logic Table 10. Output stage truth table 12/25 Operation IN OUT DIAG Normal L H L H H H Cut-off L H L L L L Overtemperature L H L L L L Open load L H H (external pull-up resistor is used) H L (external pull-up resistor is used) H UVLO X X L L X X DocID029436 Rev 4 IPS161H 6 Protection and diagnostic Protection and diagnostic The IC integrates several protections to ease the design of a robust application. 6.1 Undervoltage lock-out The device turns off if the supply voltage falls below the turn-off threshold [VUV(off)]. Normal operation restarts after VCC exceeds the turn-on threshold [VUV(on)]. Turn-on and turn-off thresholds are defined in Table 5: Supply on page 9. 6.2 Overtemperature The output stage turns off when its internal junction temperature (TJ) exceeds the shutdown threshold TJSD. Normal operation restarts when TJ comes back below the reset threshold (TJSD - TJHYST), see Table 9: Protection and diagnostic. The internal fault signal is set when the channel is off due to thermal protection and it is reset when the junction triggers the reset threshold. This same behavior is reported on DIAG pin. 6.3 Cut-off The IC can limit the output current at the power stage by its embedded output current limitation circuit. This circuit continuously monitors the output current and, when load is increasing, at the triggering of its activation threshold (1.8ATYP) it starts limiting to ILIM limitation level (see Table 8): while current limitation is active the IC enters a high dissipation status. The IPS161H implements the cut-off feature which limits the duration of the current limitation condition. The duration of the current limitation condition (Tcoff) can be set by a capacitor (CCoD) placed between CoD and GND pins. The design rule for CCoD is: tcoff[s] 35% = 50 x Ccod[nF] The drift of +/-35% is guaranteed in the range of 10 nF < Ccod < 100 nF; lower capacitance than 10 nF can be used. If ILIM threshold is triggered, the output stage remains in the current limitation condition (IOUT = ILIM) no longer than tcoff. If tcoff elapses, the output stage turns off and restarts after the tres restart time. Thermal shutdown protection has higher priority than cut-off: IC is forced off if TJSD is triggered before tcoff elapses If TJSD is triggered, IC is maintained off even after the tres has elapsed and until the TJ decreases below TJSD - TJHYST DocID029436 Rev 4 13/25 25 Protection and diagnostic IPS161H Figure 4. Current limitation and cut-off ". The fault condition is reported on the DIAG pin. The internal cut-off flag signal is latched at output switch-off and released after the time tres, the same behavior is reported on DIAG pin. The status of the DIAG is independent on the IN pin status. If CoD pin is connected to GND through 1 k resistor (cut-off feature disabled), when the output channel triggers the limitation threshold, it remains on, in current limitation condition, until the input becomes LOW or the thermal protection threshold is triggered. In case of low ambient temperature conditions (TAMB < -20 C) and high supply voltage (VCC > 36 V) the cut-off function needs activating in order to avoid IC permanent damages. The following table reports the suggested cut-off delay for the different operating voltage. Table 11. Minimum cut-off delay for TAMB less than -20 C 14/25 VCC [V] Cut-off delay [s] Cut-off capacitance [nF] 36-48 100 2.2 48-60 50 1 DocID029436 Rev 4 IPS161H 6.4 Protection and diagnostic Open load in off-state The IPS161H provides the open load detection feature which detects if the load is disconnected from the OUT pin. This feature can be activated by a resistor (RPU) between OUT and VCC pins. Figure 5. Open load off-state ". In case of wire break and during the OFF state (IN = low), the output voltage VOUT rises according to the partitioning between the external pull-up resistor and the internal resistance of the IC (RI = 115 k). The effect of the LED (if any) on the output pin has to be considered as well. In case of wire break and during the ON state (IN = high), the output voltage VOUT is pulled up to VCC by the low resistive integrated switch. If the load is not connected, in order to guarantee the correct open load signalization it must result: Equation 1 VOUT > VOLoff(max) Referring to the circuit in Figure 5: Equation 2 VOUT = VCC - RPU x IPU = VCC - RPU x (IRI + ILED + IRL) DocID029436 Rev 4 15/25 25 Protection and diagnostic IPS161H therefore: Equation 3 V CC min - V OLoff max R PU --------------------------------------------------------------------------------------------V OLoff max V OLoff max - V LED -----------------------------+ ------------------------------------------------- R R I LED If the load is connected, in order to avoid any false signalization of the open load, it must result as follows: Equation 4 VOUT < VOLoff(min) By taking into account the circuit in Figure 5: Equation 5 V OUT V OUT - V LED V OUT + ---------------------------------- + -------------V OUT = V CC - R PU I PU = V CC - R PU ------------- R R LED RL I so: Equation 6 V CC max - V OLoff min R PU ------------------------------------------------------------------------------------------------------------------------------V OLoff min V OLoff min - V LED V OLoff min ---------------------------- + ------------------------------------------------- + ---------------------------- R LED RI RL The fault condition is reported on the DIAG pin and the fault reset occurs when load is reconnected. If the channel is switched on by IN pin, the fault condition is no longer detected. When inductive load is driven, some ringing of the output voltage may be observed at the end of the demagnetization. In fact, the load is completely demagnetized when ILOAD = 0 A and the OUT pin remains floating until next turn-on. In order to avoid a fake signalization of the open load event driving inductive loads, the open load signal is masked for tBKT. So, the open load is reported on the DIAG pin with a delay of tBKT and if the open load event is triggered for more than tBKT. 16/25 DocID029436 Rev 4 IPS161H 6.5 Protection and diagnostic VCC disconnection protection The IC is protected despite the VCC disconnection event. This event is intended as the disconnection of the VCC wire from the application board, see Figure 6. When this condition happens, the IC continues working normally until the voltage on the VCC pin is VUV(OFF). Once the VUVOFF is triggered, the output channel is turned off independently on the input status. In case of inductive load, if the VCC is disconnected while the output channel is still active, the IC allows the discharge of the energy still stored in the inductor through the integrated power switch. Figure 6. VCC disconnection ". DocID029436 Rev 4 17/25 25 Protection and diagnostic 6.6 IPS161H GND disconnection protection GND disconnection is intended as the disconnection event of the application ground, see Figure 7. When this event happens, the IC continues working normally until the voltage between VCC and GND pins of the IC results VUVOFF. The voltage on GND pin of the IC rises up to the supply rail voltage level. In case of GND disconnection event, a current (ILGND) flows through OUT pin. Table 8: Logic inputs on page 10 reports IOUT = ILGND for the worst case of GND disconnection event in case of output shorted to ground. Figure 7. GND disconnection ". 18/25 DocID029436 Rev 4 IPS161H 7 Active clamp Active clamp Active clamp is also known as fast demagnetization of inductive loads or fast current decay. When a high-side driver turns off an inductance, an undervoltage is detected on output. The OUT pin is pulled down to Vdemag. The conduction state is modulated by an internal circuitry in order to keep the OUT pin voltage at about Vdemag until the load energy has been dissipated. The energy is dissipated both in IC internal switch and in load resistance. Figure 8. Active clamp equivalent principle schematic Figure 9. Fast demag waveforms *065 U0/ _ *-0"% U%&."( U 7065 _ 7$$ U 7$$7%&."( _ 7*/ U ". DocID029436 Rev 4 19/25 25 Active clamp IPS161H The demagnetization of inductive load causes a huge electrical and thermal stress to the IC. The curve plotted below shows the maximum demagnetization energy that the IC can support in a single demagnetization pulse with VCC = 24 V and TAMB = 125 C. If higher demagnetization energy is required then an external free-wheeling Schottky diode has to be connected between OUT (cathode) and GND (anode) pins. Note that in this case the fast demagnetization is inhibited. Figure 10. Typical demagnetization energy (single pulse) at VCC = 24 V and TAMB = 125 C ". 20/25 DocID029436 Rev 4 IPS161H 8 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 8.1 PowerSSO12 package information Figure 11. PowerSSO12 package outline DocID029436 Rev 4 21/25 25 Package information IPS161H Table 12. PowerSSO12 package mechanical data Dimensions (mm) Symbol Min. Typ. Max. A 1.250 - 1.700 A1 0.000 - 0.100 A2 1.100 - 1.600 B 0.230 - 0.410 C 0.190 - 0.250 D(1) 4.800 - 5.000 E 3.800 - 4.000 e - 0.800 - H 5.800 - 6.200 h 0.250 - 0.55 L 0.400 - 1.270 k 0d - 8d X 1.900 - 2.500 Y 3.600 - 4.200 - 0.100 ddd 1. Dimension D doesn't include mold flash protrusions or gate burrs. Mold flash protrusions or gate burrs don't exceed 0.15 mm in total both side. Figure 12. PowerSSO12 recommended footprint 22/25 DocID029436 Rev 4 IPS161H Package information Figure 13. PowerSSO12 tape packing information [mm] Figure 14. PowerSSO12 reel packing information [mm] DocID029436 Rev 4 23/25 25 Revision history 9 IPS161H Revision history Table 13. Document revision history 24/25 Date Revision Changes 10-Jun-2016 1 Initial release. 04-Oct-2016 2 Datasheet promoted from preliminary to production data. 22-Mar-2018 3 Updated Table 3: Absolute maximum ratings on page 8 (updated EAS parameter and value). Minor modifications throughout document. 13-Dec-2018 4 Added Figure 13 and 14, amended Table 12, updated Section 4 and Section 6.3. Changed Package image on cover page. DocID029436 Rev 4 IPS161H IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved DocID029436 Rev 4 25/25 25