Datasheet LIN Transceiver BD41020FJ-C General Description BD41020FJ-C is the best transceiver that can be used for BMS (Battery Management System). It has a Master/Slave protocol communication of LIN (Local Interconnect Network). BD41020FJ-C is available in small SOP Package. It has a normal slope mode, very low Electro Magnetic Emission (EME) and low standby electricity consumption that is realized by sleep mode. Key Specifications 5 to 27(V) Supply Voltage 1 to 8(A) Supply Current 1 on pin BAT (sleep mode) 100 to 1000(A) Supply Current 2 on pin BAT (standby mode; recessive) 100 to 1000(A) Supply Current 3 on pin BAT (normal slope mode; recessive) Supply Current 4 on pin BAT 1.0 to 8.0(mA) (normal slope mode; dominant) Features LIN pin absolute maximum rating: -27 to +40V Max transmission rate: 20kbps Low Electro Magnetic Emission (EME) High Electro Magnetic Immunity (EMI) Low slope mode for an even further reduction of EME High impedance at power off BS Interface (RXD/TXD) with protocol layer corresponds to 3.3V/5.0V logic. Built in terminator for LIN slave Local/remote wake-up identification function Standby power consumption in sleep mode Transmit data (TXD) dominant time-out function Resistant to LIN-BAT/GND short Built in Thermal Shut Down (TSD) Package W (Typ.) x D (Typ.) x H (Max.) SOP-J8 4.90mm x 6.00mm x 1.65mm Applications LIN communication for Automotive networks Typical Application Circuits Example of circuit 1 VSAT LIN Bus Line +5V 100nF 100nF EN Only Master Node INH VDD Micro Controller GND VIN Regulator BAT RXD TXD BD41020FJ-C NWAKE 10k 33k LIN NSLP GND (1) Figure 1. Typical Application Circuits Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1k (1) Master: C = 1 nF; Slave: C = 220 pF. This product is not designed for protection against radioactive rays 1/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Pin Configuration Pin Description Pin No. Symbol Function 1 RXD Receive data output pin(Open Drain) "L" is output at standby mode. 2 NSLP Sleep control input pin ("L" Active mode) Prohibits Output, request from local/remote wake-up flag at TXD pin, and resets wake-up from RXD pin. 3 NWAKE Local wake-up input pin ("L" Active mode) Active at rising edge 4 TXD Transmission data input pin ("L" Active mode) Shift sleep mode to standby mode by NWAKE, output is "L". 5 GND Ground 6 LIN LIN BMS input and output pin 7 BAT Power supply pin 8 INH "Hi-Z" at sleep mode and "H" in other mode. TOP VIEW RXD 1 8 INH NSLP 2 7 BAT NWAKE 3 6 LIN TXD 4 5 GND Figure 2. Pin Configuration Block Diagram Figure 3. Block Diagram www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C State transition unpower state Power On SLEEP MODE t t (NSLP = 0; after 1 to 0) (NSLP = 0; after 1 to 0) t t > gotosleep t > gotosleep t (NSLP = 1; after 0 to 1) (NSLP = 1; after 0 to 1) t t > gotonorm while TXD = 1 > gotonorm while TXD = 0 NORMAL SLOPE MODE LOW SLOPE MODE t t (NWAKE = 0; after 1 to 0) > NWAKE or t t t (LIN = 0; after 1 to 0) > BUS t (NSLP = 1; after 0 to 1) t (NSLP = 1; after 0 to 1) t > gotonorm while TXD = 1 > gotonorm while TXD = 0 STANDBY MODE Figure 4. State transition chart Terminal operation table according to state STATE NSLP TXD RXD INH TRANSMIT and RECEIVE FUNCTION SLEEP 0 Weak pull-down Floating Floating OFF STANDBY 0 Remote wake up: Weak pull-down Local wake up: Strong pull-down Low HIGH OFF NORMAL SLOPE 1 Weak pull-down HIGH: recessive state LOW: dominant state HIGH ON LOW SLOPE 1 Weak pull-down HIGH: recessive state LOW: dominant state HIGH ON www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Absolute Maximum Rating (Ta=25) Parameter Symbol Rating Unit VBAT -0.3 to +40.0 V VTXD, VRXD, VNSLP -0.3 to +7.0 V VLIN -27 to +40 V DC voltage on pin NWAKE VNWAKE -1 to +40 V Current on pin NWAKE INWAKE -15 mA DC voltage on pin INH VINH -0.3 to VBAT + 0.3 V Output current at pin INH IINH -50 to +15 mA Power dissipation *2 Pd 674 mW Storage temperature range Tstg -55 to +150 Junction temperature Tjmax +150 Supply voltage on pin BAT *1 DC voltage on pins TXD, RXD, NSLP DC voltage on pin LIN *1 Pd, ASO should not be exceeded. *2 Pd decreased at 5.39mW/ for temperatures above Ta=25, mounted on 70x70x1.6mm Glass-epoxy PCB. NOTE: This product is not designed for protection against radioactive rays. Recommended Operating Rating(s) (Ta=25) Parameter Symbol Rating Unit Supply voltage VBAT 5.0 to 27.0 V Operating temperature range Topr -40 to +125 www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Electrical Characteristics (Ta= -40 to 125; VBAT=5 to 27V; RL(LIN-BAT)=500; typical values are given at Ta=25; VBAT=12V; unless otherwise specified) Symbol Limit Parameter Unit Condition Min Typ Max BAT Sleep mode. VLIN = VBAT VNWAKE = VBAT VTXD = 0V VNSLP = 0V Standby mode. (bus recessive) VLIN = VBAT VINH = VBAT VNWAKE = VBAT VTXD = 0V VNSLP = 0V Standby mode. (bus dominant) VBAT = 12V VLIN = 0V *1 VINH = VBAT VNWAKE = VBAT VTXD = 0V VNSLP = 0V Low slope mode. (bus recessive) VLIN = VBAT VINH = VBAT VNWAKE = VBAT VTXD = 5V VNSLP = 5V Normal slope mode. (bus recessive) VLIN = VBAT VINH = VBAT VNWAKE = VBAT VTXD = 5V VNSLP = 5V Low slope mode. (bus dominant) VBAT = 12V VINH = VBAT *1 VNWAKE = VBAT VTXD = 0V VNSLP = 5V Normal slope mode. (bus dominant) VBAT = 12V *1 VINH = VBAT VNWAKE = VBAT VTXD = 0V VNSLP = 5V Supply current 1 on pin BAT (Sleep mode) IBAT1 1 3 8 A Supply current 2 on pin BAT (Standby mode,Recessive) IBAT2 100 400 1000 A Supply current 3 on pin BAT (Standby mode,Dominant) IBAT3 300 900 2000 A Supply current 4 on pin BAT (Low slope mode, Recessive) IBAT4 100 400 1000 A Supply current 5 on pin BAT (Normal slope mode, Recessive) IBAT5 100 400 1000 A Supply current 6 on pin BAT (Low slope mode, Dominant) IBAT6 1.0 3.5 8.0 mA Supply current 7 on pin BAT (Normal slope mode, Dominant) IBAT7 1.0 3.5 8.0 mA HIGH-level input voltage VIH 2.0 - 7.0 V LOW-level input voltage VIL -0.3 - +0.8 V Hysteresis voltage Vhys 0.03 - 0.50 V Pull-down resistor RTXD 125 350 800 k VTXD = 5V IIL -5.0 0.0 +5.0 A VTXD = 0V mA Standby mode. Local wake-up. VNWAKE = 0V VLIN = VBAT VTXD = 0.4V TXD LOW-level input current LOW-level output current IOL www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1.5 3.0 5/17 - TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Electrical Characteristics (Ta= -40 to 125; VBAT=5 to 27V; RL(LIN-BAT)=500; typical values are given at Ta=25; VBAT=12V; unless otherwise specified) Limit Parameter Symbol Unit Condition Min Typ Max NSLP HIGH-level input voltage VIH 2.0 - 7.0 V LOW-level input voltage VIL -0.3 - +0.8 V Hysteresis voltage Vhys 0.03 - 0.50 V Pull-down resistor RNSLP 125 350 800 k VNSLP = 5V IIL -5.0 0.0 +5.0 A VNSLP = 0V LOW-level output current IOL 1.3 3.5 - mA HIGH-level leakage current IOZH -5.0 0.0 +5.0 A HIGH-level input voltage VIH VBAT - 1.0 - VBAT + 0.3 V LOW-level input voltage VIL -0.3 - VBAT - 3.3 V HIGH-level leakage current IIH -5.0 0.0 +5.0 A VNWAKE = 27V VBAT = 27V Pull-up current IIL -30 -10 -3 A VNWAKE = 0V Switch-on resistance between pins BAT and INH RINH - 30 50 HIGH-level leakage current IOZH -5.0 0.0 +5.0 A VO_rec VBAT 0.9 - VBAT V VTXD = 5V, ILIN = 0mA VO_dom1 - - 1.2 V VTXD = 0V, VBAT = 7.3V VO_dom2 0.6 - - V VTXD = 0V, VBAT = 7.3V RL(LIN-BAT) = 1k VO_dom3 - - 2.0 V VTXD = 0V, VBAT = 18V VO_dom4 0.8 - - V VTXD = 0V, VBAT = 18V RL(LIN-BAT) = 1k HIGH-level leakage current IIH -1.0 0.0 +1.0 A VLIN = VBAT LIN pull-up current IIL -10.0 -5.0 -2.0 A RSLAVE 20 30 47 k Sleep mode. VLIN = VNSLP = 0V Standby mode, low slope or normal slope mode. VLIN = 0V, VBAT = 12V CLIN - - 250 pF IO_SC0 40 - 100 mA VLIN = VBAT = 18V, VTXD = 0V t < tdom IO_SC1 27 40 60 mA VLIN = VBAT = 12V, VTXD = 0V t < tdom IO_SC2 60 90 125 mA VLIN = VBAT = 27V, VTXD = 0V t < tdom LOW-level input current RXD (open-drain) Normal slope mode. VLIN = 0V VRXD = 0.4V Normal slope mode. VLIN = VBAT VRXD = 5V NWAKE INH Standby mode, low slope or normal slope mode. IINH = -15mA, VBAT = 12V Sleep mode. VINH = VBAT = 27V LIN LIN recessive output voltage LIN dominant output voltage Slave termination resistance to pin BAT Capacitance on pin LIN Short-circuit output current www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Electrical Characteristics (Ta= -40 to 125; VBAT=5 to 27V; RL(LIN-BAT)=500; typical values are given at Ta=25; VBAT=12V; unless otherwise specified) Limit Parameter Symbol Unit Condition Min Typ Max VLIN = 0V Input leakage current at the Receiver -1 mA VBAT = 12V IBS_PAS_dom include pull-up resistor VTXD = 5V VLIN = 18V Receiver recessive I V 20 A BS_PAS_rec BAT = 8V Input leakage current VTXD = 5V VBAT = VGND = 12V Loss of ground IBS_NO_GND -1 1 mA leakage current VLIN = 0V to 18V VBAT = 0V Loss of battery IBS_NO_BAT 100 A leakage current VLIN = 18V Receiver threshold voltage Vth_rx Receiver center voltage Vcn_rx Receiver threshold hysteresis voltage Vth_hys VBAT x 0.4 - VBAT x 0.6 V VBAT = 7.3 to 27.0V VBAT x 0.475 VBAT x 0.500 VBAT x 0.525 V VBAT = 7.3 to 27.0V VBAT x 0.145 VBAT x 0.160 VBAT x 0.175 V VBAT = 7.3 to 27.0V AC characteristics td(TXD-BS)1 -2.0 0.0 +2.0 s td(TXD-BS)2 -5.0 0.0 +5.0 s td_(BS-RXD) - - 5.5 s td_(BS-RXD) -2.0 0.0 +2.0 s Fall time LIN tf_dom - 16 27 s Rise time LIN tr_rec - 16 27 s tslope_norm1 -5.0 0.0 +5.0 s TXD propagation delay failure RXD propagation delay RXD propagation delay failure Normal slope symmetry www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/17 Normal slope mode. CL(LIN-BAT) = 10nF RL(LIN-BAT) = 500 tPropTxDom-tPropTxRec Low slope mode. CL(LIN-BAT) = 10nF RL(LIN-BAT) = 500 tPropTxDom-tPropTxRec CRXD = 20pF RRXD = 2.4k Normal slope mode and low slope mode CL(LIN-BAT) = 0nF RL(LIN-BAT) = Voltage on LIN externally forced. LIN tf, tr < 500ns CRXD = 20pF RRXD = 2.4k tPropRxDom-tPropRxRec Normal slope mode CL(LIN-BAT) = 10nF RL(LIN-BAT) = 500 VBAT = 12V Transition from recessive to dominant. VLIN: 100 to 0% Normal slope mode CL(LIN-BAT) = 10nF RL(LIN-BAT) = 500 VBAT = 12V Transition from dominant to recessive. VLIN: 0 to 100% Normal slope mode CL(LIN-BAT) = 10nF RL(LIN-BAT) = 500 VBAT = 12V tf_dom - tr_rec Figure 6 Figure 6 Figure 6 *2 Figure 7 *3 Figure 7 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Electrical Characteristics (Ta= -40 to 125; VBAT=5 to 27V; RL(LIN-BAT)=500; typical values are given at Ta=25; VBAT=12V; unless otherwise specified) Limit Parameter Symbol Unit Condition Min Typ Max Normal slope mode CL(LIN-BAT) = 6.8nF RL(LIN-BAT) = 660 *2 Normal slope fall time LIN 12.0 22.5 s tf_norm_dom VBAT = 12V Figure 7 Transition from recessive to dominant. VLIN: 100 to 0% Normal slope mode CL(LIN-BAT) = 6.8nF RL(LIN-BAT) = 660 *3 Normal slope rise time LIN VBAT = 12V tr_norm_rec 12.0 22.5 s Figure 7 Transition from dominant to recessive. VLIN: 0 to 100% Normal slope mode CL(LIN-BAT) = 6.8nF Normal slope symmetry tslope_norm2 -4.0 0.0 +4.0 s RL(LIN-BAT) = 660 VBAT = 12V tf_norm_dom - tr_norm_rec Low slope mode CL(LIN-BAT) = 10nF RL(LIN-BAT) = 500 *2 Low slope fall time LIN 30 62 s tf_low_dom VBAT = 12V Figure 7 Transition from recessive to dominant. VLIN: 100 to 0% Low slope mode CL(LIN-BAT) = 10nF RL(LIN-BAT) = 500 *3 Low slope rise time LIN tr_low_rec VBAT = 12V 30 62 s Figure 7 Transition from dominant to recessive. VLIN: 0 to 100% Normal slope mode *4 THRec(max) = 0.744 x VBAT *5 Duty cycle 1 D1 0.396 THDom(max) = 0.581 x VBAT Figure 8 VBAT=7.0 to 18.0V tBit=50s Normal slope mode *4 THRec(min) = 0.422 x VBAT *6 THDom(min) = 0.284 x VBAT Duty cycle 2 D2 0.581 Figure 8 VBAT=7.6 to 18.0V tBit=50s THRec(max) = 0.778 x VBAT *4 THDom(max) = 0.616 x VBAT *5 Duty cycle 3 D3 0.417 VBAT=7.0 to 18.0V Figure 8 tBit=96s THRec(min) = 0.389 x VBAT *4 THDom(min) = 0.251 x VBAT *6 Duty cycle 4 D4 0.590 VBAT=7.6 to 18.0V Figure 8 tBit=96s Sleep mode Dominant time for Figure 8 tBS 30 70 150 s wake-up via bus (Remote wake-up) Sleep mode Dominant time for Figure 4 tNWAKE 7 20 50 s (Local wake-up) wake-up via pin NWAKE Time period for mode Shift from sleep/standby change from sleep or 2 5 10 s mode to normal/low slope Figure 5 t gotonorm standby mode into mode normal/low slope mode. Time period for mode Shift from normal/low slope Figure 6 change from normal/low tgotosleep 2 5 10 s mode to sleep mode slope mode into sleep mode. TXD dominant time out tdom www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6 12 8/17 20 ms VTXD = 0V TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C *1 When VBAT is more than 12V, add to the circuit current the value calculated by this expression because IBAT depends on pull-up resistor inside LIN Terminal. VBAT - 12V IBAT (increase) = (20k is the minimum value of pull-up resistor inside LIN terminal) 20k (tVLIN=40%) - (tVLIN=95%) *2 tf_dom = *3 0.55 (tVLIN=60%) - (tVLIN=5%) tr_rec = *4 0.55 Load condition at BS (CBS; RBS): 1nF; 1k / 6.8nF; 660 / 10nF; 500 *5 tBs_rec (min) D1, D3 = 2 x tBit *6 tBs_rec (max) D2, D4 = www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2 x tBit 9/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Timing Chart TXD 50% 50% tPropTXDom tPropTXRec 100% 95% LIN 0.5xVBAT 0.5xVBAT 5% 0% tPropRXDom tPropRXRec RXD 50% 50% Figure 5. AC characteristics Timing Chart 100% 95% 60% LIN 40% 5% 0% tf_dom tr_rec Figure 6. Slope Timing Chart tBit tBit TXD tBs_dom (max) LIN tBs_rec (min) THRec (max) THDom (max) VBAT THRec (min) THDom (min) tBs_dom (min) tBs_rec (max) Figure 7. BMS Timing Chart Figure 8. Rating Circuit of AC Characteristics www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Sleep mode This mode is the most power saving mode that stops the transmit/receive function. The following conditions will enter the sleep mode: After start-up of power supply (VBAT) Normal/Low slope mode switches when pin NSLP= "L". In this mode, one of the next wake-up event switches a state. Pin NWAKE "H""L" (Shift to Standby mode) Pin LIN "H""L""H" (Shift to Standby mode) Pin NSLP "L""H" (Shift to Normal slope mode at TXD="H", Shift to Low slope mode at TXD="L" All wake-up events must be maintained for a certain time period (tNWAKE, tBUS, tgotonorm) Standby mode Sleep mode will shift to standby mode if wake-up events occur at NWAKE terminal or LIN terminal. While the device is in standby mode, each PIN has the following conditions: INH PIN is "H"(VBAT voltage) RXD PIN is at "L" level (It indicates to microcontroller that the state is in standby mode.) TXD PIN is weak/strong pull-downIt indicates to microcontroller the remote wake-up or local wake-up Pin LIN Slave Resistance is ON If the state is in Standby mode, a shift to slope mode will happen when NSLP INPUT is changed to "H". At the time that TXD="H", the mode will shift to Normal slope mode, but If TXD="L", it will shift to Low slope mode. Normal slope mode The IC goes to Normal slope mode when NSLP changes to "H" at Sleep/Standby mode and TXD="H". In this mode, the transceiver is able to transmit and receive data via the LIN bus line. The receiver detects the data stream at the LIN bus input pin and transfers it via pin RXD to the microcontroller. The transmit data stream of the protocol controller at the TXD input is converted by the transmitter into a bus signal with optimized slew rate. The maximum operating frequency at normal slope mode is 10(kHz). BD41020FJ-C switches to sleep mode in case a LOW logiclevel on pin NSLP ismaintained within a fixed time( tgotosleep). Low slope mode The IC goes to Low slope mode when NSLP changes to "H" at Sleep/Standby mode and TXD="L". The difference between Low slope mode and Normal slope mode is in the rate of transmission at LIN output. This mode conducts LIN bus signal converted from TXD input signal to bus line when start and stop later than Normal slope mode. The maximum operating frequency at low slope mode is 5.2(kHz). BD41020FJ-C shifts to sleep mode when input on pin NSLP is changed to "L" and maintained within a fixed time (tgotosleep). TXD dominant time-out counter function A TXD dominant time-out counter prevents the bus line from being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. If the duration of the LOW-level on pin TXD exceeds the internal timer value (tdom), the transmitter is disabled, driving the bus line into a recessive state. The timer is reset by a positive edge on pin TXD. www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Fail-safe function Pin TXD provides a pull-down to GND in order to force a predefined level on input pin TXD in case the pin TXD is unsupplied. Pin NSLP provides a pull-down to GND in order to force the transceiver into sleep mode in case the pin NSLP is unsupplied. Pin RXD is set floating in case of lost power supply on pin VBAT. The output driver at pin LIN will be off when junction temperature exceeds TJ activating the TSD circuit without relation to input signal at pin TXD. However, when junction temperature drops below TJ, the output driver at pin LIN will depend again on the input signal at pin TXD. Figure 9. Timing Chart (at remote wake-up) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Floating Figure 10. Timing Chart (At local wake-up) Figure 11. Timing Chart (At shift to Normal slope mode) www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C I/O equivalent circuit RXD NSLP NWAKE TXD LIN INH BAT BAT INH LIN SHUNT www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes or open circuit modes. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is expected to be operated in a special mode exceeding the absolute maximum ratings 2) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (PcPd). Package Power dissipation : Pd (W)=(TjmaxTa)/ja Power dissipation : Pc (W)=(VccVo)xIo+VccxIb Tjmax : Maximum junction temperature=150, Ta : Peripheral temperature() , ja : Thermal resistance of package-ambience(/W), Pd : Package Power dissipation (W), Pc : Power dissipation (W), Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current 3) Operation understrong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 4) Thermal shutdown circuit(TSD) The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always be activated. 5) GND voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 7) GND wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 8) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 12 . Example of IC's basic structure www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Physical Dimension, Tape and Reel Information - continued Package Name SOP-J8 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 16/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet BD41020FJ-C Ordering Information B D 4 1 0 2 0 Part Number F J Package C E 2 Packaging and Forming Specification FJ: SOP-J8 E2: Embossed Tape and Reel Marking Diagram SOP-J8 (TOP VIEW) Part Number Marking 4 1 0 2 0 LOT Number 1PIN MARK Revision History Date Revision 2013.02.12 002 New Release 003 P.4 Item Name change "Operating Condition""Recommended Operating Rating(s)" P.16 Physical Dimension, Tape and Reel Information Format change 2013.03.25 www.rohm.com (c) 2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Changes 17/17 TSZ02201-0T1T0H500020-1-2 2013.03.25 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - SS (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - SS (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001