MIL SPECS TCM co0012es do03b08 b & MIL-S-19500/279C(NAVY) AMENDMENT 3 23 January 1973 SUPERSEDING 1/7 AMENDMENT 2 16 October 1972 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, TYPES 1N3644, 1N3645, 1N3646, AND 1N3647 This amendment forms a part of Military Specification MIL-S-19500/279C(NAVY), dated 5 March 1971. Page 1 TITLE, line 1: Delete TYPES" and substitute "TX AND NON-TX TYPES". Page 2 FIGURE 1: Delete and substitute new figure printed on page 4 of this amendment. Page 3 Add the following new paragraph: "3.3.1 Process-conditioning, testing, and screening for 'TX' types. The procedure for process-conditioning, testing, and screening the 'TX' types shall be as specified in 4.6 through 4.6.8." 3.4 and 3.4.1: Melete and substitute the following 3.4, 3.4.1 and 3.4.2: "3.4 Marking. The marking shall be as specified in MIL-S~19500, with the following exceptions: (a) The manufacturer's identification, country of origin, and inspection lot identification code may be omitted, at the option of the manufacturer. (b) The type designation may be abbreviated byusing the "J" prefix in lieu of the "JAN" On non-TX devices, the "X" prefix in lieu of the "TX" on TX devices, and by omitting the component designation (1M). "3.4.1 It is permissible to have the type designation on more than one line. Examples of acceptable marking are as follows: J3 IX3 644 OR 644 DBV DBV "3.4.2 Polarity. The polarity shall be indicated by a contrasting color band or dot to indicate the cathode end." TABLE I: Delete "LTPD" column and substitute the following: woece for Subgroup 1 " w-t-- for Subgroup 2 1/ CHANGES FROM PREVIOUS ISSUE. THE OUTSIDE MARGINS OF THIS NOCUMENT HAVE BEEN MARKED "#" TO INDICATE WHERE CHANGES (DELETIONS, ADDITIONS, ETC.) FPOM THE PREVIGUS ISSUE HAVE PFEN MADE. THIS HAS BEEN DONE AS A CONVENIENCE ONLY AND THE GOVERTIMENT ASSUMES NO LIABILITY WHATSOEVER FOR ANY INACCURACIES IM THESE NOTATIONS. SIDDERS AND CONTRACTORS ARE CAUTIONED TO EVALUATE THE REQUIREMENTS OF THIS DOCUMENT BASED ON THE ENTIRE CONTENT AS WRITTEN IRRESPECTIVE OF THE MARGINAL NOTATIONS AND RELATIONSHIP TO THE LAST PREVIOUS ISSUE. FSC 5961MIL SPECS MIL-S-19500/279C(NAVY) ICMP oood12s co03409 6 g Page 4 for Subgroup 1 for Subgroup 2 for Subgroup 3 for Subgroup 4 for Subgroup 5 AMENDMENT 3 TABLE II: Delete 'LTPD" column and substitute the following: Non TX ; TX 5 i 5 10 - 10 10 10 10 10 10 ~ 10 | 1019" for Subgroup 6 Page 5 TABLE Wi: Delet 'LTPD" column and substitute the following: ww LTPD Non ! TX . TX A=10 A=7 A=10 | A=7 for Subgroup 7 for Subgroup 8 Page 6 TABLE I: Delete "LTPD" column and substitute the following: tt LTPD Non TX ; TX 10 10 Add the following new paragraphs: "4.6 Process-conditioning, testing, and screening for 'TX' types. and screening the 'TX' types shall be in accordance with 4.6.1 process-conditioning, te through 4.6.7. Process-conditioning shall be conducte sting, for Subgroup 1 The procedure for d on 100 percent of the lot prior to submission of the lot to the tests specified in tables I, U, and Ii. "4.6.1 High-temperature stor e. All devices shall be stored for at least 48 hours ata minimum temperature (TA) of +175C. 4.6.2 Thermal shock (temperature cycling). All d shock (temperature cycling) in accordance with MIL-STD except that T high = + 175C an time at temperature extremes s All devices shall be subjected to the 4.6.3 Acceleration. with MIL-STO-750, method 2006, with the fo orientation only, har not apply. "4.6.4 Hermetic seal tests. A followed by gross leak) with test conditions as specifie time in the Y requirement s d cycling hall be 15 minutes (minimum). at a peak level ll devices shall be subjected to hermetic seal tests evices shall be subjected to thermal ~750, method 1051, test condition Cc, duration shall be 10 continuous cycles and exposure acceleration test in accordance The test shall be performed one lowing exceptions: n The one-minute hold-time of 15,000 G minimum. fine leak din 4.6.4.1 and 4.6.4.2 and 4.6.4.3. "4.6.4.1 Fine leak test. All devices shall be fine leak tested in accordance with MIL-STD-750, method 1071, test condition Gor H. oss leak test (bubble). "4.6.4.2 Gr ( ) with MIL-STD-750, meth non-corrosive liquid at a minimum od 1071, test condition D, exce temperature of 100C. gross leaks in accordance All devices shall be tested for any suitable pt that the solution may be Page 2 of 4MIL SPECS tcf ooo0125 oon3410 4 &j MIL-S-19500/279C (NAVY) AMENDMENT 3 "4.6.4.3 Grogs leak lest (penctrant dye). AM devices shall be tested for gross leaks in accordance with MIL-STD~-750, method 1071, lest condilion E. After the aleohol rinse and drying cycle, non-lransparent devices shall be examined by placing them on a clean white blotter and observing for evidence of any dyc. "4.6.' Pre burn-in tests, The paramelcers Vp and Ig of table IV shall be measured and the dala recorded for all devices in the lot. All devices shall be handled or identified such that the della end points can be determined afler the burn-in test. All devices which fail to meet these requirements shall be removed from the lot and the quantity removed shall be noted on the lot hislory. TABLE [V. Burn-in test measurements, i MIL-STD-750 Limits ! Examination or test Method Details Symbol Min. Max. Unit ro on . ' . . t Forward voltae | 4011 Ip 25011A VF seo 5.0 Vde ' Reverse current 4016 DC method IR ) (at TA room | | ambient) I 1N3644 , Vr 150 Vde --- 5.0 pAde 1N3645 VR - 2000 Vde --- 5.0 Adc 1N3646 VR - 2500 Vde --- 5.0 pAde 1N3647 VR - 3000 Vde ane 5,9 pAdc "4.6.0 Burn-in lost (Method 1938. conditicn Stal All devices shall he anerated for 164 hours (minimum) under the fal}esinn cordttion: : TA- 25C Vrmiwky) = full rated (see 1.2) Ip - 100 mAde {= 60 Hz "4.6.7 Post burn-in tests. The parameters VF and Ip of table IV shall be retested (within 24 hours) after burn-in and the data recorded for all devices in the lot. The parameters measured shall not have changed during the birn-in test from the initial value by more than the specified amount as follows: AVF AIR "4,6,8 Burn-in test failure (screening). All devices that exceed the delta (A) limits of 4.6. or the limits of those tests performed oun table IV, shall be removed from the inspection lot and the quantity removed shall be noted on the lot history. Where the quantity removed after burn-in exceeds 10 percent of the total inspection lot on burn-in test, the entire lot shall be unacceptable as 'TX' types." 10 percent maximum +250 nanoamyeres or 100 ner ent maximyr User activities: . Preparing activity: Navy - AS, OS, MC, CG, SH Navy - EC Agent: DSA - ES (Project 5961-N492) Neve 3 of 4MIL SPECS cP oooo12s coos. 6 MIL -S-19500/279C(NAVY) AMENDMENT 3 B E E oo SI. S|} D C - tele A ee 6 DIMENSIONS N TR INCHES MILLIMETERS t L MIN MAX | MIN | MAX [| 5 A .190| .215}| 4.83] 5.46/2,4 B .065} .110] 1.65[ 2.79] 2 c {1.00 [1.25 | 25.40] 31. 75/2, 3 D .029} .033 744) -.84[2,3 E --- .030{ --- . 76] 2,5 NOTES: 1. Dimensions are in inches. Metric equivalents (to the nearest .01 mm) are given for general information only and are based upon 1 inch = 25.4 mm. 3. Both leads shall be within the specified limits. 4. See paragraph 3,4 for marking requirements. 5. The lead diameter is uncontrolled in this area. FIGURE 1. Outline and dimensions of diode types 1N3644, 1N3645, 1N3646 and 1N3647, TX and Non-TX types. YU, &. GOVERNMENT PRINTING OFFICE: 973-714-542 3718 Page 4 of 4 on TS MIL-S-19500/279C(NAVY) 5 March 1971 MIL SPECS ICMf Oo001eS O0osb12 & & SUPERSEDING MIL~S-19500/279B(NAVY) 14 May 1968 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, TYPES 1N3644, 1N3645, 1N3646 AND 1N3647 . 1. SCOPE : 1.1 Scope. This specification covers the detail requirements for 0.1 ampere silicon rectifiers and is in accordance with MIL~S-19500, except as otherwise specified herein. 1.2 Maximum ratings. I j . VR I, T.\ = 100C i(Surge) T tg Altitude Type | Vde mAde mAde A C Ft. i 1N3644 1500 250 100 14 -65 to +175 40,000 , 1N3645 2000 250 100 14 -65 to +175 40,000 1N3646 2500 250 100 14 -65 to +175 40,000 1N3647 3000 250 100 14 65 to +175 40,000 : 2. APPLICABLE DOCUMENTS 2.1 The following documents of the issue in effect on date of invitation for bids, or request for proposal, form a part of this specification to the extent specified herein: SPECIFICATION MILITARY MIL-S~-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Copies of specifications, standards, drawings, and publications required by suppliers in connection with specific procurement functions should be obtained from the procuring activity or as directed by the contract- ing officer.) 3. REQUIREMENTS 3.1 General. Diodes shall be in accordance with MIL-S-19500 and as specified herein. 3.2 Design, construction and physical dimensions. Diodes shall be of the design, constructio1, and physical dimensions shown on Figure 1. 3.2.1 Encapsulating material(s). Encapsulating material(s) used shall be at the device manuacturers option. Information concerning the material(s) shall be included with the qualification device desizn data. FSC 5961MIL SPECS tcf oooo12s oo03u13 T & MIL-$~-19500/279C(NAVY) wae eh. oF - NL OPTIONAL \e1.0 e} 222 Ja_ 1.0 Min. 0315 Min... i _ 2025, Le , 035 > Both Leads FIGURE 1. Design, construction and physical dimensions of diode, types 1N3644, 1N3645, 1N3646 and 1N3647.MIL SPECS Tcffoooo1es oo035b14 1 & MIL-S~19500/279C(NAVY) 3.3 Performance characteristics. Performance characteristics shall be as specified in 4.3, 4.4 and 4.5. 3.4 Marking. The following marking specified in MIL-S-19500 may be omitted at the option of the manu- facturer: (a) Manufacturer's identification {(b) Country of origin 3.4.1 Polarity. The polarity shall be indicated by a contrasting color band or dot to indicate the cathode end. f i 4. QUALITY ASSURANCE PROVISIONS 4.1 Quality conformance inspection. Quality conformance inspection shall consist of the examinations and tests specified in tables 1, Il, and I. Group A inspection shall be performed on a sublot basis. Group B inspection, with the exception of subgroups 7 and 8, shall be performed on a lot basis. Group B subgroups 7 and 8 shall be performed on sublots of the highest and lowest voltage types present in the lot. Group C inspection shall be performed on sublots of the highest voltage type for each altitude rating for which qualifi- cation applies. TABLE I. Group A inspection. Conditions Examination MIL-STD-750 Specific Limits : or Test ; Method Conditions LTPD Symbol Min Max Unit Subgroup 1 . 5 : Visual and mechanical examination 2071 Subgroup 2 5 o Forward voltage 4011 Ip = 250mA Ve wen 5 Vdc Reverse current 4016 1N 3644 . VR = 1500Vdc IR --- 5 uAdc 1N 3645 VRe= 2000Vdc Ip = 5 uAde 1N 3646 VR = 2500Vdc Ip --- 5 uAdc 1N3647 VR 3000Vdc Ip mee 5 uAdc Breakdown voltage 4021 1N 3644 BV = 1800Vdc Ip --- 50 uAdc 1N3645 BV = 2400Vdc Ip --- 50 uAde 1N 3646 BV = 3000Vdc IR ae 50 uAdec 1N3647 BV = 3600Vdc In wen 50 uAdc Reverse current average 4046 Ta = +100C Tg = 100mA . 1N3644 VR= 1050Vac Tro -- 100 uAdc 1N3645 VR = 1490Vac Iro --- k 100 uAdc 1N 3646 . VR = 1750Vac Iro --- 100 uAdc 1N3647 VR = 2100Vac IrRo --- 100 uAdcMIL SPECS MIL-S-19500/279C(NAVY) rc Jfoooco12s 0003615 3 & TABLE Il. Group B inspection. Conditions Examination ss MIL-STD-750 Specific Limits . or Test " Method Conditions LTPD Symbol Min Max Unit Subgroup 1 Physical dimensions 2066 5 Subgroup 2 10 Solderability 2026 Thermal shock 1051 Cond. C except (Temperature cy- T High = +175C cling) Thermal shock 1056 Cond. A except (glass strain) T = -40C T = +120C Moisture resistance 1021 Subgroup 3 10 Shock 2016 1 000G 5 Blows X1, Y1, Y2 Vibration fatigue 2046 Non-Operating 20 G 55 Hz Vibration, variable frequency 2056 Constant acceleration 2006 15,000G X1, X2, 1 Subgroup 4 10 Lead fatigue 2036 Cond. E Subgroup 5 10 Salt atmosphere 1041 48 Hrs. Subgroup 6 10 Surge current 4066 Ta = +25C i (Surge) = 144A Ten 8 msec surges; 1 surge/min Ig = 250mAMIL SPECS Tc) cooo12s ooosnin s & MIL~S-19500/279C(NAVY) Table II. Group B inspection (Continued). Conditions Examination aos ws MIL-STD-750 Specific Limits . TPD Symbol . Unit or Test Method Conditions LTP yme Min Max Subgroup 7 = 10 High temperature life (non-operating) - 1031 T, = 175C Subgroup 8 n= 10 Steady State op- . eration life 1026 T, = 100C Iy = 100mAdc 1N3644 V = 1050Vac 1N3645 V = 1400Vac 1N3646 V = 1750Vac 1N3647 V = 2100Vac End points for sub- groups 2 through 8 Forward voltage 4011 Ip = 250mA Vp --- 5 | Vde Reverse current 4016 ~ 1N3644 Vr = 1500Vdc Irn wen 5 uAdc 1N3645 VR = 2000Vdc Ip -- 5 uAdc I1N3646 VR = 2500Vdc IR wae 5 uAde 1N3647 VR = 3000Vdc Ip --- 5 uAdc Breakdown voltage 4021 1N3644 By = 1800Vdc Ir --- 50 uAdc 1N3645 By = 2400Vdc Ip --- 50 uAde 1N 3646 By = 3000Vdc Ip --~ 50 uAdc 1N3647 By = 3600Vdc Ip --- 50 uAdce Reverse current average 4046 Ta = 100C Ig = 100mA 1N3644 Vr = 1050Vac Iro --- 100 uAdc 1N3645 VR = 1400Vac IRO ~e- 100 | uAde 1N3646 VR = 1750Vac IRO wee 100 | uAde 1N3647 VR = 2100Vac Ino --- 100 uAdcMIL SPECS 1Cf cooo12s oooan17 7 MIL-S-19500/279C(NAVY) TABLE Ifl. Group C inspection. Conditions Examination Tae Limits MIL-STD-750 Specific bol . Unit or Test Method Conditions LTPD Symbo Min Max Subgroup 1 10 Barometric 1001 40,000 ft. --- --- --- ~-- pressure, reduced (altitude operation) (See 4.5.1) Measurement during test Reverse current 4016 1N3644 VR = 1500V 1N3645 VR = 2000V 1N3646 VR = 2500V 1N3647 VrRe 3000V 4.2 Qualification tests. Qualification tests shall be conducted at a laboratory satisfactory to the Naval Electronic Systems Command. Qualification tests shall consist of the tests specified in 4.2.1. (Application for Qualification tests shall be made in accordance with Provisions Governing Qualification SD-6 (See 6.1).) 4.2.1 Qualification inspection shall consist of the examinations and tests specified in tables I, II, and II. Group A inspection shall be performed on a sublot basis. Group B subgroups 7 and 8 shali be performed on sublots of the highest and lowest voltage types submitted to qualify those voltage types and all intermediate voltage types. Group C inspection shall be performed on sublots of the highest voltage type for each altitude rating for which qualification is pursued. . 4.2.2 Qualification inspection information. When specified in the contract or order, one copy of the ; qualification inspection data pertinent to the inspection lot shall accompany the shipments. (See 6.3). 4.3 Group A inspection. Group A inspection shall consist of the examinations and tests shown in table I. 4.4 Group B inspection. Group B inspection shall consist of the examinations and tests shown in table Il. 4.5 Group C inspection. Group C inspection shall consist of the examinations and tests shown in table I. 4.5.1 Barometric pressure, reduced. The devices shall be suitably mounted in the vacuum chamber and the specified reverse voltage applied (see 1.2). Reverse current shall be monitored. Pressure shall be reduced to the value specified herein and maintained for 30 seconds. Evidence of arcing, corona, or reverse current in excess of 100 microamperes shdll be considered a defect. 5. PREPARATION FOR DELIVERY 5.1 Preparation for delivery shall be in accordance with MIL-S-19500. 6. NOTES . 6.1 The activity responsible for the qualified products list is the NAVAL ELECTRONIC SYSTEMS COMMAND, ELEX 0517, Department of the Navy, Washington, D.C. 20360. Information pertaining toMIL SPECS ICff oo0012e5 0003418 4 & MIL~S-19500/279C(NAVY) qualification of products may be obtained from either the NAVAL ELECTRONIC SYSTEMS COMMAND or the Defense Electronics Supply Center (DESC), Dayton, Ohio 45401, agent for administration of the Quali- fied Products List. Application for qualification tests shall be made in accordance with Provisions Govern- ing Qualification SD-6". (Copies of Provisions Governing Qualification SD-6" may be obtained upon ap- plication to yommanding Officer, Naval Publications and Forms Center, 5801 Tabor Avenue, Philadelphia, Pennsy1~ vania 19120. 6.2 Substitution data. Types 13643 and 1N3992 have been deleted from this specification. Type 1N3957 Of MIL-S-19500/228 may be substituted for type 1N3643. There is no direct replacement for type 1N3992. 6.3 Ordering data. (a) Qualification inspection information, if required (See 4.2.2). User activities: Preparing activity: Navy - AS, OS, MC, CG. SH Navy - EC (Project 5961-N342)