DATA SHEET
SVS SERIES
SOLID TANTALUM CAPACITOR
Document No. EC0062EJ6V0DS00 (6th edition)
Date Published February 1998 M
Printed in Japan
The SVS series is a line-up of high performance ultra miniaturized tantalum chip capacitors.
The case dimensions are 2.0 mm × 1.25 mm × 1.2 mm as shown below.
FEATURES
™The smallest molded chip tantalum capacitor (half size of the EIA standard A case)
™Available up to 10
µ
F with case dimension of 2.0 mm × 1.25 mm × 1.2 mm (case code P)
APPLICATIONS
™Portable stereos
™VCR cameras
™Hearing aids
DIMENSIONS
Sur face mount resin molded, Ultra miniaturized chip
©
1992(1996)
1.25±0.22.0±0.2
1.2 max.
(Unit : mm)
0.9±0.1
0.5±0.20.5±0.2
The information in this document is subject to change without notice.
2
SVS SERIES
PRODUCT LINE-UP AND MARKING CODE
2.5 4 6.3 10 16
0.33 CN
0.47 CS
0.68 AW CW
1JAAACA
1.5 GE JE AE
2.2 eJ GJ JJ AJ
3.3 eN GN JN AN
4.7 eS GS JS
6.8 eW GW JW
10 7eA 7GA 7JA
UR
(Vdc)
Capacitance
(
µ
F)
UR : Rated voltage
PART NUMBER SYSTEM
[BULK] [TAPE & REEL]
Marking detail
SVS P 0J 105 M TE SVSP0J105M 8 R
⊕
Polarity mark
⊕
Polarity mark
Feed direction
Tape
Tape
R : (Standard)
Orientation
L : (Non-Standard)
Orientation Feed direction
Capacitance tolerance ±20% Packing orientation
Tape and reel
Tape width 8 mm
Part number of bulk
(see left)
Capacitance code in pF
First two digits represent significant
figures. Third digit specifies number
of zeros to follow.
Rated voltage
0E : 2.5 V, 0G : 4 V, 0J : 6.3 V
1A : 10 V, 1C : 16 V
Case code
SVS series
J A
Production date code
(indicated by dots)
Marking code
(corresponding to rated
voltage and capacitance)
Polarity
Implement date code on trial.
+
up to 6.8 F
µ
10 F
µ
∗∗
∗∗
7 J A
3
SVS SERIES
RATINGS
Rated Voltage
(Vdc)
2.5
4
6.3
10
16
Capacitance
(
µ
F)
2.2
3.3
4.7
6.8
10
1.5
2.2
3.3
4.7
6.8
10
1
1.5
2.2
3.3
4.7
6.8
10
0.68
1
1.5
2.2
3.3
0.33
0.47
0.68
1
Tangent of loss angle
0.1
0.1
0.2
0.2
0.2
0.1
0.1
0.2
0.2
0.2
0.2
0.1
0.1
0.2
0.2
0.2
0.2
0.2
0.1
0.1
0.2
0.2
0.2
0.1
0.1
0.1
0.2
Leakage Current
(
µ
A)
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
Part Number
SVSP0E225M
SVSP0E335M
SVSP0E475M
SVSP0E685M
SVSP0E106M
SVSP0G155M
SVSP0G225M
SVSP0G335M
SVSP0G475M
SVSP0G685M
SVSP0G106M
SVSP0J105M
SVSP0J155M
SVSP0J225M
SVSP0J335M
SVSP0J475M
SVSP0J685M
SVSP0J106M
SVSP1A684M
SVSP1A105M
SVSP1A155M
SVSP0A225M
SVSP0A335M
SVSP1C334M
SVSP1C474M
SVSP1C684M
SVSP1C105M
4
SVS SERIES
SPECIFICATIONS
No. Items
1 Operating Temp. Range
2 Rated Voltage
3 Surge Voltage
4 Derated Voltage
5 Capacitance Range
6 Capacitance Tolerance
7 Leakage Current
8 Tangent of loss angle
9 Surge Voltage Resistance
Temp.
C/C
Tangent of
loss angle
Leakage
Current
11
Rapid change of temperature
12 Resistance to soldering
13 Damp Heat (Steady state)
14 Endurance
15 Failure Rate
Specifications
–55 to +125˚C
2.5 4 6.3 10 16 Vdc
3.3 5.2 8 13 20 Vdc
1.6 2.5 4 6.3 10 Vdc
0.33 to 10
µ
F
±20%
0.5
µ
A max.
0.1 max. / 0.2 max. (Refer to ratings)
C/C : ±20%
Tangent of loss angle : Initial requirement
Leakage Current : Initial requirement
–55˚C +85˚C +125˚C
%% %
150% of initial Initial 150%of initial
requirement requirement requirement
0.1 CV or 5
µ
A 0.125 CV or 6.25
µ
A
–– whichever is whichever is
greater greater
C/C : ±20%
Tangent of loss angle : Initial requirement
Leakage Current : Initial requirement
C/C : ±20%
Tangent of loss angle : Initial requirement
Leakage Current : Initial requirement
C/C : ±20%
Tangent of loss angle : 150% of Intial requirement
Leakage Current : Initial requirement
C/C : ±20%
Tangent of loss angle : Initial requirement
Leakage Current : 200% of Initial requirement
λ0 = 1%/1 000 h
Test Conditions
Over 85˚C, applied voltage shall be derated
on the basis of the Derated Voltage at
125˚C specified in this table item no.4.
up to 85˚C
up to 85˚C
at 125˚C
at 120 Hz
at 120 Hz
5 min. after rated voltage applied
at 25˚C, 120 Hz
at 85˚C
Surge voltage for 30 sec. (Rs = 1 kΩ)
Discharge for 5 min. 30 sec.
1 000 cycles
Step1 : +25˚C
Step2 : –55˚C
Step3 : +25˚C
Step4 : +85˚C
Step5 : +125˚C
Step6 : +25˚C
IEC68-2-14 Test N and IEC68-2-33
Guidance
–55 to +125˚C
5 cycles
IEC68-2-58 Test Td
Fully immersion to solder at 260˚C for
5 sec
IEC68-2-3 Test Ca
at 40˚C, 90 to 95% RH, for 500H
at 85˚C & 125˚C (Derated Voltage),
rated voltage applied for 2 000 H
at 85˚C & 125˚C (Derated Voltage),
rated voltage applied for 1 000 H
0
–20 +20
0 +20
0
10
C/C : Capacitance change ratio
∆
∆
∆
∆
∆
∆
∆
Characteris-
tics at high
and low
temperature
5
SVS SERIES
TAPE AND REEL SPECIFICATION
[Carrier Tape Specification and Packing Quantity]
A
0
B
0
D
0
Feed direction
sprocket hole embossed cavity
P
1
E
FW
t
K
P
2
P
0
A0±0.2
1.4
B0±0.2
2.2
W±0.3
8.0
F±0.05
3.5
E±0.1
1.75
P1±0.1
4.0
P2±0.05
2.0
P0±0.1
4.0
D0
φ
1.5
K±0.2
1.4
t
0.2
Q'ty/Reel
3000
(Unit : mm)
Tape width
8
(Unit : mm)
A
φ
178±2.0
N
φ
50 min.
C
φ
13±0.5
D
φ
21±0.5
B
2.0±0.5
W1
10.0±1.0
W2
14.5 max.
R
1
W
2
CNA
D
B
R
W
1
[Reel Specification]
+0.1
0
6
SVS SERIES
CHARACTERISTICS DATA
30
20
10
0
–10
–20
–30
C/C (%)
∆
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001 25˚C –55˚C 25˚C
2.5 V/2.2 F
µ
85˚C 125˚C 25˚C
Leakage current ( A)
µ
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001 25˚C –55˚C 25˚C
6.3 V/1 F
µ
85˚C 125˚C 25˚C
Leakage current ( A)
µ
30
20
10
0
–10
–20
–30
C/C (%)
∆
Characteristics at high and low temperature
7
SVS SERIES
15
10
5
0
–5
–10
–15
C/C (%)
∆
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001 Initial
2.5 V/2.2 F
µ
Final
Leakage current ( A)
µ
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001 Initial
6.3 V/1 F
µ
Final
Leakage current ( A)
µ
15
10
5
0
–5
–10
–15
C/C (%)
∆
Resistance to soldering (immersing for 10 sec. at 260˚C)
(reference data)
8
SVS SERIES
15
10
5
0
–5
–10
–15
C/C (%)
∆
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001 0 h
2.5 V/2.2 F
µ
500 h 1 000 h 0 h 500 h 1 000 h
Leakage current ( A)
µ
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001
6.3 V/1 F
µ
Leakage current ( A)
µ
15
10
5
0
–5
–10
–15
C/C (%)
∆
Damp heat, steady state (65˚C, 90 to 90% RH)
(reference data)
9
SVS SERIES
30
20
10
0
–10
–20
–30
C/C (%)
∆
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001 0 h
2.5 V/2.2 F
µ
500 h 1 000 h 0 h 500 h 1 000 h
Leakage current ( A)
µ
0.08
0.06
0.04
0.02
0
Tangent of loss angle (tan )
δ
0.1
0.01
0.001
6.3 V/1 F
µ
Leakage current ( A)
µ
30
20
10
0
–10
–20
–30
C/C (%)
∆
Endurance (85˚C, Rated voltage × 1.3 applied)
(reference data)
10
SVS SERIES
Impedance – Frequency characteristics (reference data)
10 k 100 k
Frequency (Hz)
1 M 10 M1 k
1
10
Z (Ω)
100
1 k
6.3 V/1 F
µ
11
SVS SERIES
GUIDE TO APPLICATIONS FOR TANTALUM CHIP CAPACITORS
The failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage
current mode. Refer to the following for reliable circuit design.
1. Expecting Reliability
SVS series tantalum chip capacitors are typically applied to decoupling, blocking, bypassing and filtering.
The SVS series has a very high reliability (low failure rate) in the field. For example, the maximum field failure
rate of an SVS series capacitor with a DC rated voltage of 16 V is 0.0004%/1000 hour (4 Fit) at an applied voltage
of 5 V, operating temperature of 25˚C and series resistance of 3 Ω.
The maximum failure rate in the field is estimated by the following expression :
λ: Maximum field failure rate
λ0: 1%/1000 hour (The failure rate of the SVS series at the full DC rated voltage at operating
temperature of 85˚C and series resistance of 3 Ω.)
V : Applied voltage in actual use
V0: DC Rated voltage
T : Operating temperature in actual use
T0: 85˚C
120
10
2
7
4
2
10
1
7
4
2
10
0
7
4
2
10
–1
7
0.2
0.1
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
4
2
10
–2
7
4
2
10
–3
7
4
2
10
–4
7
4
2
10
–5
110
100
90
Operating temperature T (˚C)
Failure rate multiplier F
Applied voltage ratio V/ V
0
80
70
60
50
40
30
20
The nomograph is provided for quick estimation of
maximum field failure rates.
Connect operating temperature T and applied
voltage ratio V/V
0
of interest with a straight line.
The failure rate multiplier F is given at the inter-
section of this line with the model scale. The failure
rate is obtained as λ = λ
0•
F.
Examples :
Given V/V
0
= 0.4 and T = 45˚C. read
F = 4 × 10
–3
Hence, λ = 0.004% / 1000 hour (40 Fit).
Given V/V
0
= 0.3 and T = 25˚C, read
F = 4 × 10
–4
Hence, λ = 0.0004%/1000 hour (4 Fit).
V
V0
λ = λ0
3
× 2
T-T
0
10
12
SVS SERIES
2. Series resistance
As shown in Figure 1, reliability is increased by inserting a series resistance of at least 3 Ω/V into circuits
where current flow is momentary (switching circuits, charge/discharge circuits, etc).
If the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to
1/3 of the DC rated voltage.
3. Ripple voltage
The sum of DC voltage and peak ripple voltage should not exceed the DC rated voltage of the capacitor.
Figure 2 is based on an ambient temperature of 25˚C. For higher temperature, permissible ripple voltage shall
be derated as follows.
Permissible voltage at 50˚C = 0.7 × permissible voltage at 25˚C
Permissible voltage at 85˚C = 0.5 × permissible voltage at 25˚C
Permissible voltage at 125˚C = 0.3 × permissible voltage at 25˚C
4. Reverse voltage
Because the capacitors are polarized, reverse voltage should not be applied.
If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very
short time and should not exceed the following.
10% of DC rated voltage at 25˚C
5% of DC rated voltage at 85˚C
1% of DC rated voltage at 125˚C
0.1 1
Frequency (kHz)
Figure 2 Permissible ripple voltage vs. frequency
10
0.1
1
10
Ripple voltage (Vrms)
100
100
16 V
Case : P @ 25˚C
10 V
6.3 V
4 V
2.5 V
10
1
Magnification of failure
0.1
0.1 1
Series Resistance (Ω/V)
Figure 1 Effects of series resistance
10 100
13
SVS SERIES
5. Mounting
(1) Direct soldering
Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering:
(a) Temporarily fixing resin
Because the SVS series solid tantalum capacitors are larger in size and subject to more force than the chip
multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum
capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board
may adversely affect the solderability.
(b) Pattern design
a
b
ca
Case a b c
P 2.2 1.4 0.7
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the
pattern is too small, the solderability may be degraded.
(e) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature ....... 260˚C max.
Time ....... 5 seconds max.
Whenever possible, perform preheating (at 150˚C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible.
(d) Component layout
If many types of chip components are mounted on a printed circuit board which is to be soldered by means
of jet soldering, solderability may not be uniform over the entire board depending on the layout and
density of the components on the board (also take into consideration generation of flux gas).
(e) Flux
Use resin-based flux. Do not use flux with strong acidity.
14
SVS SERIES
(2) Reflow soldering
Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate:
(a) Pattern design (In accordance with IEC1182)
The above dimensions are recommended. Note that if the pattern is too big, the component may not be
mounted in place.
(b) Temperature and time
Keep the peak temperature and time to within the following values:
Solder temperature …… 260˚C max.
Time : 10 seconds max.
Whenever possible, perform preheating (at 150˚C max.) for smooth temperature profile. To maintain the
reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak
temperature and time shown above are applicable when the capacitor is to be soldered in a soldering oven
or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal
temperature of the capacitor may rise beyond the surface temperature.
(3) Using soldering iron
When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron
is very difficult. However, it is recommended that the following temperature and time be observed to maintain
the reliability of the capacitor:
lron temperature …… 300˚C max.
Time……………………… 3 seconds max.
Iron power …………… 30 W max.
X
G
Z
Case G max. Z min. X min.
P 0.5 2.6 1.2
15
SVS SERIES
6. Cleaning
Generally, several organic solvents are used for flux cleaning of an electronic component after soldering.
Many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor
cleaning, and ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two
or more may be used in combination. The temperature of the organic solvent may vary from room temperature
to several 10˚C, depending on the desired effect. If cleaning is carried out with emphasis placed only on cleaning
effect, however, the marking on the electronic component cleaned may be erased, the appearance of the com-
ponent may be damaged, and in the worst case, the component may be functionally damaged. It is therefore
recommended that the SVS series solid tantalum capacitor be cleaned under the following conditions:
[Recommended conditions of flux cleaning]
(1) Cleaning solvent……… Chlorosen, isopropyl alcohol
(2) Cleaning method …… Shower cleaning, rinse cleaning, vapor cleaning
(3) Cleaning time ………… 5 minutes max.
∗ Ultrasonic cleaning
This cleaning method is extremely effective for eliminating dust that has been generated as a result of me-
chanical processes, but may pose a problem depending on the condition. As a result of an experiment conducted
by NEC, it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some
ultrasonic cleaning machines. The cause of this phenomenon is considered metal fatigue of the capacitor termi-
nals that occurred due to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output
power of the ultrasonic cleaning machine or shortening the cleaning time may be a possible solution. However,
it is difficult to specify the safe cleaning conditions because there are many factors involved such as the conver-
sion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath, difference in cleaning effect
depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned,
and the securing states of the components on the boards. It is therefore recommended that ultrasonic cleaning
be avoided as much as possible.
If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the
cleaning. For further information, consult NEC.
7. Others
(1) Do not apply excessive vibration and shock to the capacitor.
(2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at (–5 to +40˚C) room
temperature and (40 to 60% RH) humidity.
(3) Exercise care that no external force is applied to the tape packaged products (if the packaging material is
deformed, the capacitor may not be automatically mounted by a chip mounter).
SVS SERIES
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents. copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its Electronic Conponents,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC Electronic Conponents, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard”, “Special”, and “Specific”. The Specific quality grade applies only to devices developed based on
a customer designated “ quality assurance program” for a specific application. The recomm ended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, commu nications equipment, test and measurement equipment, audio and
visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life
support)
Specific: Aircrafis, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support
systems or medical equipment for life support, etc.
The quality grade of NEC devices is “Standard” unless otherwise specified in NEC's Data Sheets or Data
Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality
grade, they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
