4-169
TELCOM SEMICONDUCTOR, INC.
7
6
5
4
3
1
2
8
TC426
TC427
TC428
PIN CONFIGURATIONS (DIP and SOIC)
TC426
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
V
DD
NC = NO INTERNAL CONNECTION
2, 4 7, 5
INVERTING
TC427
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
2, 4 7, 5
NONINVERTING
TC428
1
2
3
4
NC
5
6
7
8
OUT A
OUT B
NC
IN A
GND
IN B
27
45
V
DD
V
DD
COMPLEMENTARY
INPUT
V+
2.5mA
500µA
INVERTING
OUTPUT
NONINVERTING
OUTPUT
(TC426)(TC427)
TC426
TC427
TC428
1.5A DUAL HIGH-SPEED POWER MOSFET DRIVERS
FEATURES
■High-Speed Switching (CL = 1000pF)...........30nsec
■High Peak Output Current................................. 1.5A
■High Output Voltage Swing .................. V DD – 25mV
GND + 25mV
■Low Input Current (Logic "0" or "1") ................ 1µA
■TTL/CMOS Input Compatible
■Available in Inverting and Noninverting
Configurations
■Wide Operating Supply Voltage ............4.5V to 18V
■Current Consumption
— Inputs Low .................................................. 0.4mA
— Inputs High .................................................... 8mA
■Single Supply Operation
■Low Output Impedance ........................................ 6Ω
■Pinout Equivalent of DS0026 and MMH0026
■Latch-Up Resistant: Withstands > 500mA
Reverse Current
■ESD Protected......................................................2kV
FUNCTIONAL BLOCK DIAGRAM
Note: The TC428 has one inverting and one noninverting
driver. Ground any unused driver input.
TC426/7/8-7 10/11/96
GENERAL DESCRIPTION
The TC426/TC427/TC428 are dual CMOS high-speed
drivers. A TTL/CMOS input voltage level is translated into
a rail-to-rail output voltage level swing. The CMOS output
is within 25 mV of ground or positive supply.
The low impedance, high-current driver outputs swing
a 1000pF load 18V in 30nsec. The unique current and
voltage drive qualities make the TC426/TC427/TC428 ideal
power MOSFET drivers, line drivers, and DC-to-DC
converter building blocks.
Input logic signals may equal the power supply volt-
age. Input current is a low 1µA, making direct interface to
CMOS/bipolar switch-mode power supply control ICs pos-
sible, as well as open-collector analog comparators.
Quiescent power supply current is 8mA maximum. The
TC426 requires 1/5 the current of the pin-compatible bipo-
lar DS0026 device. This is important in DC-to-DC con-
verter applications with power efficiency constraints and
high-frequency switch-mode power supply applications. Qui-
escent current is typically 6mA when driving a 1000pF load
18V at 100kHz.
The inverting TC426 driver is pin-compatible with the
bipolar DS0026 and MMH0026 devices. The TC427 is
noninverting; the TC428 contains an inverting and non-
inverting driver.
Other pin compatible driver families are the TC1426/
27/28, TC4426/27/28, and TC4426A/27A/28A.
ORDERING INFORMATION
Temperature
Part No. Package Configuration Range
TC426COA 8-Pin SOIC Inverting 0°C to +70°C
TC426CPA 8-Pin PDIP Inverting 0°C to +70°C
TC426EOA 8-Pin SOIC Inverting –40°C to +85°C
TC426EPA 8-Pin SOIC Complementary –40°C to +85°C
TC426IJA 8-Pin CerDIP Inverting –25°C to +85°C
TC426MJA 8-Pin CerDIP Inverting –55°C to +125°C
TC427COA 8-Pin SOIC Noninverting 0°C to +70°C
TC427CPA 8-Pin PDIP Noninverting 0°C to +70°C
TC427EOA 8-Pin SOIC Noninverting –40°C to +85°C
TC427EPA 8-Pin SOIC Complementary –40°C to +85°C
TC427IJA 8-Pin CerDIP Noninverting –25°C to +85°C
TC427MJA 8-Pin CerDIP Noninverting –55°C to +125°C
TC428COA 8-Pin SOIC Complementary 0°C to +70°C
TC428CPA 8-Pin PDIP Complementary 0°C to +70°C
TC428EOA 8-Pin SOIC Complementary –40°C to +85°C
TC428EPA 8-Pin SOIC Complementary –40°C to +85°C
TC428IJA 8-Pin CerDIP Complementary –25°C to +85°C
TC428MJA 8-Pin CerDIP Complementary –55°C to +125°C
4-170 TELCOM SEMICONDUCTOR, INC.
TC426
TC427
TC428
1.5A DUAL HIGH-SPEED
POWER MOSFET DRIVERS
ELECTRICAL CHARACTERISTICS: TA = +25°C with 4.5V ≤ VDD ≤ 18V, unless otherwise specified.
Symbol Parameter Test Conditions Min Typ Max Unit
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current 0V ≤ VIN ≤ VDD –1 — 1 µA
Output
VOH High Output Voltage VDD – 0.025 — — V
VOL Low Output Voltage — — 0.025 V
ROH High Output Resistance IOUT = 10 mA, VDD = 18V — 10 15 Ω
ROL Low Output Resistance IOUT = 10 mA, VDD = 18V — 6 10 Ω
IPK Peak Output Current — 1.5 — A
Switching Time (Note 1)
tRRise Time Test Figure 1/2 — — 30 nsec
tFFall Time Test Figure 1/2 — — 30 nsec
tD1 Delay Time Test Figure 1/2 — — 50 nsec
tD2 Delay Time Test Figure 1/2 — — 75 nsec
Power Supply
ISPower Supply Current VIN = 3V (Both Inputs) — — 8 mA
VIN = 0V (Both Inputs) — — 0.4 mA
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage ......................................................... +20V
Input Voltage, Any Terminal.... VDD + 0.3V to GND – 0.3V
Power Dissipation (TA ≤ 70°C)
Plastic ...............................................................730mW
CerDIP ..............................................................800mW
SOIC .................................................................470mW
Derating Factor
Plastic ............................................................. 8mW/°C
CerDIP ......................................................... 6.4mW/°C
SOIC ............................................................... 4mW/°C
Operating Temperature Range
C Version .................................................0°C to +70°C
I Version..............................................– 25°C to +85°C
E Version ............................................– 40°C to +85°C
M Version..........................................– 55°C to +125°C
Maximum Chip Temperature.................................+150°C
Storage Temperature Range ................– 65°C to +150°C
Lead Temperature (Soldering, 10 sec) .................+300°C
NOTE: 1. Switching times guaranteed by design.
ELECTRICAL CHARACTERISTICS:
Over Operating Temperature Range with 4.5V ≤ V
DD
≤ 18V, unless otherwise specified.
Input
VIH Logic 1, High Input Voltage 2.4 — — V
VIL Logic 0, Low Input Voltage — — 0.8 V
IIN Input Current 0V ≤ VIN ≤ VDD –10 — 10 µA
Output
VOH High Output Voltage VDD – 0.025 — — V
VOL Low Output Voltage — — 0.025 V
ROH High Output Resistance IOUT = 10 mA, VDD = 18V — 13 20 Ω
ROL Low Output Resistance IOUT = 10 mA, VDD = 18V — 8 15 Ω
Switching Time (Note 1)
tRRise Time Test Figure 1/2 — — 60 nsec
tFFall Time Test Figure 1/2 — — 30 nsec
tD1 Delay Time Test Figure 1/2 — — 75 nsec
tD2 Delay Time Test Figure 1/2 — — 120 nsec
Power Supply
ISPower Supply Current VIN = 3V (Both Inputs) — — 12 mA
VIN = 0V (Both Inputs) — — 0.6 mA
4-171
TELCOM SEMICONDUCTOR, INC.
7
6
5
4
3
1
2
8
TC426
TC427
TC428
1.5A DUAL HIGH-SPEED
POWER MOSFET DRIVERS
*Static-sensitive device. Unused devices must be stored in conductive
material. Protect devices from static discharge and static fields. Stresses
above those listed under "Absolute Maximum Ratings" may cause perma-
nent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions above those
indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may
effect device reliability.
SUPPLY BYPASSING
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging a 1000-pF
load to18V in 25nsec requires an 0.72A current from the
device power supply.
To guarantee low supply impedance over a wide fre-
quency range, a parallel capacitor combination is recom-
mended for supply bypassing. Low-inductance ceramic
disk capacitors with short lead lengths (< 0.5 in.) should be
used. A 1 µF film capacitor in parallel with one or two
0.1 µF ceramic disk capacitors normally provides adequate
bypassing.
GROUNDING
The TC426 and TC428 contain inverting drivers. Ground
potential drops developed in common ground impedances
from input to output will appear as negative feedback and
degrade switching speed characteristics.
Individual ground returns for the input and output
circuits or a ground plane should be used.
INPUT STAGE
The input voltage level changes the no-load or quies-
cent supply current. The N-channel MOSFET input stage
transistor drives a 2.5mA current source load. With a logic
"1" input, the maximum quiescent supply current is 8 mA.
Logic "0" input level signals reduce quiescent current to
0.4 mA maximum. Minimum power dissipation occurs for
logic "0" inputs for the TC426/427/428. Unused driver
inputs must be connected to VDD or GND.
The drivers are designed with 100 mV of hysteresis.
This provides clean transitions and minimizes output stage
current spiking when changing states. Input voltage thresh-
olds are approximately 1.5V, making the device TTL com-
patible over the 4.5V to 18V supply operating range. Input
current is less than 1 µA over this range.
The TC426/427/428 may be directly driven by the
TL494, SG1526/1527, SG1524, SE5560, and similar switch-
mode power supply integrated circuits.
POWER DISSIPATION
The supply current vs frequency and supply current vs
capacitive load characteristic curves will aid in determining
power dissipation calculations.
The TC426/427/428 CMOS drivers have greatly re-
duced quiescent DC power consumption. Maximum quies-
cent current is 8 mA compared to the DS0026 40 mA
specification. For a 15V supply, power dissipation is typi-
cally 40 mW.
Two other power dissipation components are:
• Output stage AC and DC load power.
• Transition state power.
Output stage power is:
Po = PDC + PAC
= Vo (IDC) + f CL VS
Where:
Vo = DC output voltage
IDC = DC output load current
f = Switching frequency
Vs = Supply voltage
In power MOSFET drive applications the PDC term is
negligible. MOSFET power transistors are high imped-
ance, capacitive input devices. In applications where resis-
tive loads or relays are driven, the PDC component will
normally dominate.
The magnitude of PAC is readily estimated for several
cases:
A. B.
1. f = 20kHZ 1. f = 200kHz
2. CL=1000pf 2. CL=1000pf
3. Vs = 18V 3. VS =15V
4. PAC = 65mW 4. PAC = 45mW
During output level state changes, a current surge will
flow through the series connected N and P channel output
MOSFETS as one device is turning "ON" while the other is
turning "OFF". The current spike flows only during output
transitions. The input levels should not be maintained be-
tween the logic "0" and logic "1" levels. Unused driver
inputs must be tied to ground and not be allowed to
float. Average power dissipation will be reduced by mini-
mizing input rise times. As shown in the characteristic
curves, average supply current is frequency dependent.
4-172 TELCOM SEMICONDUCTOR, INC.
TC426
TC427
TC428
1.5A DUAL HIGH-SPEED
POWER MOSFET DRIVERS
TYPICAL CHARACTERISTICS
123456
20
15
10
5
0
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
Supply Voltage vs
Quiescent Supply Current
NO LOAD
BOTH INPUTS LOGIC "1"
T = +25°C
A
0
20
15
10
5
0
SUPPLY VOLTAGE (V)
50 100 150 200 250 300
SUPPLY CURRENT (µA)
Supply Voltage vs
Quiescent Supply Current
NO LOAD
BOTH INPUTS LOGIC "0"
T = +25°C
A
100
110 1000 10K
TIME (nsec)
CAPACITIVE LOAD (pF)
Rise and Fall Times vs
Capacitive Load
10
1K
100
30
20
10
0
–25 0 25 150
TIME (nsec)
Rise and Fall Times vs
Temperature
40
50 75 100 125
TEMPERATURE (°C)
35
25
15
R
t
F
t
80
70
60
50
30
0
DELAY TIME (nsec)
Delay Times vs Supply Voltage
40
90
SUPPLY VOLTAGE (V)
5101520
D1
t
D2
t
CL
TA
= 1000pF
= +25°C
90
80
70
60
40
30 0
–25 50 100 150
DELAY TIME (nsec)
TEMPERATURE (°C)
Delay Times vs Temperature
50
100
25 75 125
D1
t
CL
VDD
= 1000pF
= 18V D2
t70
60
50
40
20
010
SUPPLY CURRENT (mA)
Supply Current vs
Capacitive Load
30
80 400kHz
200kHz
20kHz
TA
VDD
= +25°C
= 18V
100 1000 10K
CAPACITIVE LOAD (pF)
10
0.96
0.72
0.48
0.24
010
OUTPUT VOLTAGE (V)
Low Output vs Voltage
1.20
TA= +25°C
20 30 40 50 60 70 80 90 100
CURRENT SUNK (mA)
VDD = 5V
10V
15V
1.76
1.32
0.88
0.44
010
High Output vs Voltage
2.20
TA= +25°C
20 30 40 50 60 70 80 90 100
CURRENT SOURCED (mA)
18V
VDD = 8V
V – V (V)
DD OUT
13V
20
10
01
SUPPLY CURRENT (mA)
Supply Current vs Frequency
30
10 100 1000
FREQUENCY (kHz)
CL
TA= 1000pF
= +25°CVDD= 18V
10V
5V
60
50
40
30
10
0510 15 20
TIME (nsec)
SUPPLY VOLTAGE (V)
70
R
t
F
t
CL
TA
= 1000pF
= +25°C
Rise and Fall Times vs
Supply Voltage
CL
VDD
= 1000 pF
= 18V
20
R
t
F
t
TA
VDD
= +25°C
= 18V
200
0
400
600
800
1000
1200
1400
1600
010 20 30 40 50 60 70 80 90 100 110 120
AMBIENT TEMPERATURE (°C)
MAX. POWER (mW)
8 Pin DIP
Thermal Derating Curves
8 Pin CerDIP
8 Pin SOIC
4-173
TELCOM SEMICONDUCTOR, INC.
7
6
5
4
3
1
2
8
TC426
TC427
TC428
1.5A DUAL HIGH-SPEED
POWER MOSFET DRIVERS
OUTPUT
INPUT
0.1µF
VDD
+5V
INPUT
10%
90%
10%
90%
10%
90%
18V
OUTPUT
tD1 tFt
tD2
C = 1000pF
L
1µF
= 18V
0V
0V
TC426
(1/2 TC428)
1
2
R
INPUT: 100kHz,
square wave,
tRISE = tFALL ≤ 10nsec
OUTPUT
INPUT
90%
10%
10% 10%
tD1 tRtD2 tF
90%
C = 1000pF
L
TC427
(1/2 TC428)
+5V
INPUT
18V
OUTPUT
0V
0V
90%
1
2
0.1µF
VDD
1µF
= 18V
INPUT: 100kHz,
square wave,
tRISE = tFALL ≤ 10nsec
VOLTAGE INVERTER
+ 15V
0.1µF 4.7µF
10µF47µF
+
–
+– 1N4001
1N4001
VOUT
f = 10kHz
IN
26
37
1/2
TC426
+– -6
-8
-10
-12
010 20 30 40 50 60 70 80 90
I (mA)
OUT
-7
-9
-11
-13
-5
-14 100
V (V)
OUT
+ 15V
0.1µF 4.7µF
10µF47µF
+
–
+
–
+
–1N4001
1N4001
VOUT
f = 10kHz
IN
26
37
29.
27.
25.
23.
0
10 20 30 40 50 60 70 80 90
I (mA)
OUT
28.
26.
24.
22.
30.
100
V (V)
OUT
1/2
TC426
Test Figure 1. Inverting Driver Switching Time Test Circuit Test Figure 2. Noninverting Driver Switching Time Test Circuit
VOLTAGE DOUBLER
