67-22/R6BHC-B07/2T - Everlight International Corp.

EVERLIGHT ELECTRONICS CO.,LTD.

Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 1 of 11

Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

Technical Data Sheet

Bi-Color (Multi-color) Top Views LEDs

67-22/R6BHC-B07/2T

Features

․P-LCC-4 package.

․White package.

․Optical indicator.

․Colorless clear window.

․Ideal for backlight and light pipe application.

․Inter reflector.

․Wide viewing angle.

․Suitable for vapor-phase reflow, Infrared reflow and

wave solder processes.

․Computable with automatic placement equipment.

․Available on tape and reel (8mm Tape).

․Pb-free.

․The product itself will remain within RoHS compliant version

Descriptions

․The 67-22 series is available in soft orange, green,blue

and yellow. Due to the package design, the LED has

wide viewing angle and optimized light coupling by

inter reflector. This feature makes ideal for light pipe

application. The low current requirement makes this

device ideal for portable equipment or any other

application where power is at a premium.

Applications

․Telecommunication: indicator and backlighting in

telephone and fax.

․Flat backlight for LCD’s, switches and symbols.

․Light pipe application.

․General use.

Device Selection Guide

Chip

Type Material Emitted Color Lens Color

R6 AlGaInP Brilliant Red

BH InGaN Blue

Water Clear

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Package Dimensions

For reflow soldering(propose)

0.8±0.1

0.15±0.05

0.7

2.4±0.1

3.2±0.2

3.5±0.2

0.8±0.1

1.9±0.2

0.5±0.1

2.7±0.2

1.8 1.6 1.8

2.8±0.2

2.2

Red

Blue

4

3

L

C

L

C

2.8±0.2

2.2±0.1

0.7±0.1

1

2

4

3

1

2

Note: The tolerances unless mentioned is ±0.1mm;Unit = mm

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Rating Unit

Reverse Voltage VR 5 V

R6 50

Forward Current IF BH 25 mA

Operating Temperature Topr -40 ~ +85 ℃

Storage Temperature Tstg -40~ +100 ℃

R6 2000 V Electrostatic

Discharge(HBM) ESD BH 150 V

R6 120

Power Dissipation Pd BH 110 mW

R6 100

Peak Forward Current(Duty

1/10 @ 1KHz) IFP BH 100 mA

Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

Electro-Optical Characteristics (Ta=25℃)

Parameter Symbol Min. Typ. Max. Unit Condition

R6 90 ----- 225

Luminous Intensity IV BH 90 ----- 225 mcd

Viewing Angle 2θ1/2 ----- 120 ----- deg

R6 ----- 632 -----

Peak Wavelength λp BH ----- 468 ----- nm

R6 621 ----- 631

Dominant Wavelength λd BH 466.5 ----- 471.5 nm

R6 ----- 20 -----

Spectrum Radiation

Bandwidth △λ BH ----- 35 ----- nm

R6 1.75 ----- 2.35

Forward Voltage VF BH 2.9 ----- 3.7 V

IF=20mA

Reverse Current IR ----- ----- 10 μA VR=5V

Notes: 1.Tolerance of Luminous Intensity ±10%

2.Tolerance of Dominant Wavelength ±1nm

3.Tolerance of Forward Voltage ±0.1V

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Bin Range Of Luminous Intensity

Chip Bin Code Min. Max. Unit Condition

Q2 90.0 112

R1 112 140

R2 140 180

R6

S1 180 225

Q2 90.0 112

R1 112 140

R2 140 180

BH

S1 180 225

mcd IF =20mA

Bin Range Of Dominant Wavelength

Chip Bin Code Min. Max. Unit Condition

FF1 621 626

R6 FF2 626 631

nm IF =20mA

Bin Range Of Forward Voltage

Chip Bin Code Min. Max. Unit Condition

0 1.75 1.95

1 1.95 2.15

R6 2 2.15 2.35

11 2.90 3.10

12 3.10 3.30

13 3.30 3.50

BH

14 3.50 3.70

V IF =20mA

Notes:

1.Tolerance of Luminous Intensity ±10%

2.Tolerance of Dominant Wavelength ±1nm

3.Tolerance of Forward Voltage ±0.1V

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Typical Electro-Optical Characteristics Curves(R6)

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

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Typical Electro-Optical Characteristics Curves(BH)

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Label explanation

CAT: Luminous Intensity Rank

HUE: Dom. Wavelength Rank

REF: Forward Voltage Rank

Reel Dimensions

Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel.

NOTE :TOLERANCES UNLESS DIMENSION ±0.1 mm

UNIT: mm

Moisture Resistant Packaging

Label Desiccant Label

Aluminum moisture-proof bag

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Reliability Test Items And Conditions

The reliability of products shall be satisfied with items listed below.

Confidence level：90%

LTPD：10%

No. Items Test Condition

Test

Hours/Cycles Sample

Size Ac/Re

1 Reflow Soldering

Temp. : 260℃±5℃

Min. 5sec. 6 min 22 PCS. 0/1

2 Temperature Cycle

H : +100℃ 15min

∫ 5 min

L : -40℃ 15min

300 Cycles 22 PCS. 0/1

3 Thermal Shock

H : +100℃ 5min

∫ 10 sec

L : -10℃ 5min

300 Cycles 22 PCS. 0/1

4 High Temperature

Storage Temp. : 100℃ 1000 Hrs. 22 PCS. 0/1

5 Low Temperature

Storage Temp. : -40℃ 1000 Hrs. 22 PCS. 0/1

6 DC Operating Life IF = 20 mA/ 25℃ 1000 Hrs. 22 PCS. 0/1

7 High Temperature /

High Humidity 85℃/ 85%RH 1000 Hrs. 22 PCS. 0/1

EVERLIGHT ELECTRONICS CO.,LTD.

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

Precautions For Use

1. Over-current-proof

Customer must apply resistors for protection , otherwise slight voltage shift will cause big

current change ( Burn out will happen ).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the

storage time, baking treatment should be performed using the following conditions.

Baking treatment : 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

4.Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3

seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more

intervals, and do soldering of each terminal. Be careful because the damage of the product is often

started at the time of the hand solder.

120 Sec. M ax.

1~5 °C / Sec. Pre-heating

180~200°C 60 Sec. M ax.

A bove 220°C

260°C. M ax.

10 Sec. M ax.

1~5 °C / Sec.

EVERLIGHT ELECTRONICS CO.,LTD.

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Device No. :DSE-672-085 Prepared date: 27.Jan.2006 Prepared by: Venis Wu

67-22/R6BHC-B07/2T

5.Repairing

Repair should not be done after the LEDs have been soldered. When repairing is

unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed

beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

EVERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936

Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306

Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com