June 2017
DocID030797 Rev 1
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www.st.com
BALF-NRG-02D3
50 ohm nominal input / conjugate match to BlueNRG tranceiver,
with integrated harmonic filter
Datasheet - production data
Features
50 Ω nominal input / conjugate match to
BlueNRG device
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Benefits
Small footprint
RF BOM reduction
High RF performance
Applications
Bluetooth low energy impedance matched
balun filter
Optimized for ST BlueNRG RFIC
Description
This device is an ultra-miniature balun which
integrates matching network and harmonics filter.
Matching impedance has been customized for
the BlueNRG ST transceiver.
The BALF-NRG-02D3 uses STMicroelectronics
IPD technology on non-conductive glass
substrate which optimizes RF performance.
Figure 1: Pin configuration (bump view)
Application schematic
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1 Application schematic
Figure 2: Application diagram example (refer to BlueNRG reference design)
BALF-NRG-02D3
Characteristics
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2 Characteristics
Table 1: Absolute maximum ratings (limiting values)
Symbol
Parameter
Value
Unit
Min.
Typ.
Max.
PIN
Input power RFIN
-
10
dBm
VESD
ESD ratings human body model, all I/O one at a time
while others connected to GND
2000
-
V
ESD ratings machine model
(MM: C = 200 pF, R = 25 Ω, L = 500 nH)
200
-
TOP
Operating temperature
-40
-
+105
°C
Table 2: Electrical characteristics (Tamb = 25 °C)
Symbol
Definition
Value
Unit
Min.
Typ.
Max.
Zdiff
Nominal differential impedance
Match to BlueNRG
Ω
ZANT
Nominal antenna impedance
50
Ω
f
Frequency range (bandwidth)
2400
2500
MHz
IL
Insertion loss in bandwidth
1.33
1.85
dB
RLSE
Single ended return loss in bandwidth
21
30
RLDIFF
Differential return loss in bandwidth
17
19
H2
Second harmonic attenuation (differential mode)
40
49
H3
Third harmonic attenuation (differential mode)
46
55
H4
Fourth harmonic attenuation (differential mode)
42
50
H5
Fifth harmonic attenuation (differential mode)
31
56
H6
Fifth harmonic attenuation (differential mode)
29
45
H7
Fifth harmonic attenuation (differential mode)
30
42
Φimb
Output phase imbalance
-3.5
0
3.5
°
Aimb
Output amplitude imbalance
-1
0
1
dB
Characteristics
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2.1 RF measurement
Figure 3: Differential transmission (dB)
Figure 4: Insertion loss (dB)
Figure 5: Return loss single ended (dB)
Figure 6: Return loss differential (dB)
Figure 7: H2 harmonic attenuation (dB)
Figure 8: H3 harmonic attenuation (dB)
BALF-NRG-02D3
Characteristics
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Figure 9: H4 harmonic attenuation (dB)
Figure 10: H5 harmonic attenuation (dB)
Figure 11: H6 harmonic attenuation (dB)
Figure 12: H7 harmonic attenuation (dB)
Figure 13: Amplitude imbalance in dB
Figure 14: Phase imbalance in deg
Application information
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3 Application information
3.1 BALF-NRG-02D3 with BlueNRG
Figure 15: Recommended balun land pattern
BALF-NRG-02D3
Package information
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4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.1 CSPG 0.4 package information
Figure 16: CSPG package outline (bump view)
Package information
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Figure 17: Footprint - 3 mils stencil -non solder
mask defined
Figure 18: Footprint - 3 mils stencil - solder mask
defined
Figure 19: Footprint - 5 mils stencil -non solder
mask defined
Figure 20: Footprint - 5 mils stencil - solder mask
defined
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
220 µm recommended
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
Solder stencil opening:
220 µm recommended
*depending on paste, it can go down to 270 µm
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
340 µm maximum
Solder stencil opening:
330 µm recommended*
*depending on paste, it can go down to 270 µm
Copper pad diameter:
220 µm recommended
180 µm minimum
260 µm maximum
Solder mask opening:
320 µm recommended
300 µm minimum
Solder stencil opening:
330 µm recommended*
BALF-NRG-02D3
Package information
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4.2 CSPG 0.4 packing information
Figure 21: Marking
Figure 22: Flip Chip tape and reel specifications
More packing information is available in the application note:
AN2348 Flip-Chip: “Package description and recommendations for use”
Ordering information
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5 Ordering information
Figure 23: Ordering information scheme
Table 4: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
BALF-NRG-02D3
TK
CSPG
1.37 mg
5000
Tape and reel
6 Revision history
Table 5: Document revision history
Date
Revision
Changes
23-Jun-2017
1
Initial release.
BAL F - NRG –02 D3
Balun
Integrated Harmonics
Filter
Custom impedance
NRG = BlueNRG from STMicroelectronics
Package type
D3=Flip Chip on Glass
250µm ball diameter
Design version
BALF-NRG-02D3
DocID030797 Rev 1
11/11
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