SPEC NO: DSAD1154 REV NO: V.1 DATE:MAR/25/2003 PAGE: 1 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:L.ZHANG
3.2X1.6mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
!3.2mmX1.6mm SMT LED, 1.1mm THICKNESS.
!LOW POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE :2000PCS / REEL.
Package Dimensions
APK3216MWC WHITE
Description
The source color devices are made with GaN on
SiC Light Emitting Diode.
Static electricity and surge damage the LEDS. It
is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded.
SPEC NO: DSAD1154 REV NO: V.1 DATE:MAR/25/2003 PAGE: 2 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:L.ZHANG
Selection Guide
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°°
°°
°C
Absolute Maximum Ratings at T)=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
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SPEC NO: DSAD1154 REV NO: V.1 DATE:MAR/25/2003 PAGE: 3 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:L.ZHANG
White APK3216MWC
APK3216MWC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
SPEC NO: DSAD1154 REV NO: V.1 DATE:MAR/25/2003 PAGE: 4 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:L.ZHANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
