March 2009 Rev 6 1/20
1
M48Z08
M48Z18
5 V 64 Kbit (8 Kb x 8) ZEROPOWER® SRAM
Features
Integrated, ultralow power SRAM and power-
fail control circuit
Unlimited WRITE cycles
READ cycle time equals WRITE cycle time
Automatic power-fail chip deselect and WRITE
protection
WRITE protect voltages
(VPFD = power-fail deselect voltage):
–M48Z08: V
CC = 4.75 to 5.5 V
4.5 V VPFD 4.75 V
–M48Z18: V
CC = 4.5 to 5.5 V
4.2 V VPFD 4.5 V
Self-contained battery in the CAPHAT™ DIP
package
Pin and function compatible with JEDEC
standard 8 K x 8 SRAMs
RoHS compliance
Lead-free components are compliant with the
RoHS directive.
28
1
PCDIP28 (PC)
Battery CAPHAT™
www.st.com
Contents M48Z08, M48Z18
2/20
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Operation modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 READ mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 WRITE mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.4 VCC noise and negative going transients . . . . . . . . . . . . . . . . . . . . . . . . . 11
3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7 Environmental information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
M48Z08, M48Z18 List of tables
3/20
List of tables
Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 2. Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3. READ mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. WRITE mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 6. Operating and AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 8. DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 11. PCDIP28 – 28-pin plastic DIP, battery CAPHAT™, package mech. data . . . . . . . . . . . . . 16
Table 12. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 13. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
List of figures M48Z08, M48Z18
4/20
List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. READ mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. WRITE enable controlled, WRITE mode AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 6. Chip enable controlled, WRITE mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 7. Supply voltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. AC testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 9. Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10. PCDIP28 – 28-pin plastic DIP, battery CAPHAT™, package outline . . . . . . . . . . . . . . . . . 16
Figure 11. Recycling symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
M48Z08, M48Z18 Description
5/20
1 Description
The M48Z08/18 ZEROPOWER® RAM is a 8 K x 8 non-volatile static RAM which is pin and
functional compatible with the DS1225.
The monolithic chip is available in two special packages to provide a highly integrated
battery backed-up memory solution.
The M48Z08/18 is a non-volatile pin and function equivalent to any JEDEC standard 8 K x 8
SRAM. It also easily fits into many ROM, EPROM, and EEPROM sockets, providing the
non-volatility of PROMs without any requirement for special write timing or limitations on the
number of writes that can be performed.
The 28-pin, 600 mil DIP CAPHAT™ houses the M48Z08/18 silicon with a long life lithium
button cell in a single package.
Figure 1. Logic diagram
Table 1. Signal names
A0-A12 Address inputs
DQ0-DQ7 Data inputs / outputs
EChip enable
GOutput enable
WWRITE enable
VCC Supply voltage
VSS Ground
NC Not connected internally
AI01022
13
A0-A12
W
DQ0-DQ7
VCC
M48Z08
M48Z18
G
VSS
8
E
Description M48Z08, M48Z18
6/20
Figure 2. DIP connections
Figure 3. Block diagram
A1
A0
DQ0
A7
A4
A3
A2
A6
A5
NC
A10
A8
A9
DQ7
W
A11
G
E
DQ5DQ1
DQ2
DQ3VSS
DQ4
DQ6
A12
NC VCC
AI01183
M48Z08
M48Z18
8
1
2
3
4
5
6
7
9
10
11
12
13
14
16
15
28
27
26
25
24
23
22
21
20
19
18
17
AI01394
LITHIUM
CELL
VPFD
VCC VSS
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
8K x 8
SRAM ARRAY
A0-A12
DQ0-DQ7
E
W
G
POWER
M48Z08, M48Z18 Operation modes
7/20
2 Operation modes
The M48Z08/18 also has its own power-fail detect circuit. The control circuitry constantly
monitors the single 5 V supply for an out of tolerance condition. When VCC is out of
tolerance, the circuit write protects the SRAM, providing a high degree of data security in the
midst of unpredictable system operation brought on by low VCC. As VCC falls below
approximately 3 V, the control circuitry connects the battery which maintains data until valid
power returns.
Table 2. Operating modes
Note: X = VIH or VIL; VSO = Battery backup switchover voltage.
2.1 READ mode
The M48Z08/18 is in the READ mode whenever W (WRITE enable) is high and E (chip
enable) is low. The device architecture allows ripple-through access of data from eight of
65,536 locations in the static storage array. Thus, the unique address specified by the 13
address inputs defines which one of the 8,192 bytes of data is to be accessed. Valid data
will be available at the data I/O pins within address access time (tAVQV) after the last
address input signal is stable, providing that the E and G access times are also satisfied. If
the E and G access times are not met, valid data will be available after the latter of the chip
enable access time (tELQV) or output enable access time (tGLQV).
The state of the eight three-state data I/O signals is controlled by E and G. If the outputs are
activated before tAVQV, the data lines will be driven to an indeterminate state until tAVQV. If
the address inputs are changed while E and G remain active, output data will remain valid
for output data hold time (tAXQX) but will go indeterminate until the next address access.
Mode VCC E G W DQ0-DQ7 Power
Deselect
4.75 to 5.5 V
or
4.5 to 5.5 V
VIH X X High Z Standby
WRITE VIL XV
IL DIN Active
READ VIL VIL VIH DOUT Active
READ VIL VIH VIH High Z Active
Deselect VSO to VPFD(min)(1)
1. See Table 10 on page 15 for details.
X X X High Z CMOS standby
Deselect VSO(1) X X X High Z Battery backup mode
Operation modes M48Z08, M48Z18
8/20
Figure 4. READ mode AC waveforms
Note: WRITE enable (W) = high.
Table 3. READ mode AC characteristics
2.2 WRITE mode
The M48Z08/18 is in the WRITE mode whenever W and E are active. The start of a WRITE
is referenced from the latter occurring falling edge of W or E.
A WRITE is terminated by the earlier rising edge of W or E. The addresses must be held
valid throughout the cycle. E or W must return high for a minimum of tEHAX from chip enable
or tWHAX from WRITE Enable prior to the initiation of another READ or WRITE cycle. Data-
in must be valid tDVWH prior to the end of WRITE and remain valid for tWHDX afterward. G
should be kept high during WRITE cycles to avoid bus contention; although, if the output bus
has been activated by a low on E and G, a low on W will disable the outputs tWLQZ after W
falls.
Symbol Parameter(1)
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where noted).
M48Z08/M48Z18
Unit
Min Max
tAVAV READ cycle time 100 ns
tAVQV Address valid to output valid 100 ns
tELQV Chip enable low to output valid 100 ns
tGLQV Output enable low to output valid 50 ns
tELQX(2)
2. CL = 30 pF.
Chip enable low to output transition 10 ns
tGLQX(2) Output enable low to output transition 5 ns
tEHQZ(2) Chip enable high to output Hi-Z 50 ns
tGHQZ(2) Output enable high to output Hi-Z 40 ns
tAXQX Address transition to output transition 5 ns
AI01385
tAVAV
tAVQV tAXQX
tELQV
tELQX
tEHQZ
tGLQV
tGLQX
tGHQZ
VALID
A0-A12
E
G
DQ0-DQ7
VALID
M48Z08, M48Z18 Operation modes
9/20
Figure 5. WRITE enable controlled, WRITE mode AC waveform
Figure 6. Chip enable controlled, WRITE mode AC waveforms
AI01386
tAVAV
tWHAX
tDVWH
DATA INPUT
A0-A12
E
W
DQ0-DQ7
VALID
tAVWH
tAVEL
tWLWH
tAVWL
tWLQZ
tWHDX
tWHQX
AI01387B
tAVAV
tEHAX
tDVEH
A0-A12
E
W
DQ0-DQ7
VALID
tAVEH
tAVEL
tAVWL
tELEH
tEHDX
DATA INPUT
Operation modes M48Z08, M48Z18
10/20
Table 4. WRITE mode AC characteristics
2.3 Data retention mode
With valid VCC applied, the M48Z08/18 operates as a conventional BYTEWIDE™ static
RAM. Should the supply voltage decay, the RAM will automatically power-fail deselect, write
protecting itself when VCC falls within the VPFD (max), VPFD (min) window. All outputs
become high impedance, and all inputs are treated as “Don't care.
Note: A power failure during a WRITE cycle may corrupt data at the currently addressed location,
but does not jeopardize the rest of the RAM's content. At voltages below VPFD (min), the
user can be assured the memory will be in a write protected state, provided the VCC fall time
is not less than tF
. The M48Z08/18 may respond to transient noise spikes on VCC that reach
into the deselect window during the time the device is sampling VCC. Therefore, decoupling
of the power supply lines is recommended.
When VCC drops below VSO, the control circuit switches power to the internal battery which
preserves data. The internal button cell will maintain data in the M48Z08/18 for an
accumulated period of at least 11 years when VCC is less than VSO.
As system power returns and VCC rises above VSO, the battery is disconnected, and the
power supply is switched to external VCC. Write protection continues until VCC reaches VPFD
(min) plus trec (min). E should be kept high as VCC rises past VPFD (min) to prevent
inadvertent write cycles prior to system stabilization. Normal RAM operation can resume trec
after VCC exceeds VPFD (max). For more information on battery storage life refer to the
application note AN1012.
Symbol Parameter(1)
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where
noted).
M48Z08/M48Z18
Unit
Min Max
tAVAV WRITE cycle time 100 ns
tAVWL Address valid to WRITE enable low 0 ns
tAVEL Address valid to chip enable 1 low 0 ns
tWLWH WRITE enable pulse width 80 ns
tELEH Chip enable low to chip enable 1 high 80 ns
tWHAX WRITE enable high to address transition 10 ns
tEHAX Chip enable high to address transition 10 ns
tDVWH Input valid to WRITE enable high 50 ns
tDVEH Input valid to chip enable 1 high 30 ns
tWHDX WRITE enable high to input transition 5 ns
tEHDX Chip enable high to input transition 5 ns
tWLQZ(2)(3)
2. CL = 30 pF.
3. If E goes low simultaneously with W going low, the outputs remain in the high impedance state.
WRITE enable low to output Hi-Z 50 ns
tAVWH Address valid to WRITE enable high 80 ns
tAVEH Address valid to chip enable high 80 ns
tWHQX(2)(3) WRITE enable high to output transition 10 ns
M48Z08, M48Z18 Operation modes
11/20
2.4 VCC noise and negative going transients
ICC transients, including those produced by output switching, can produce voltage
fluctuations, resulting in spikes on the VCC bus. These transients can be reduced if
capacitors are used to store energy which stabilizes the VCC bus. The energy stored in the
bypass capacitors will be released as low going spikes are generated or energy will be
absorbed when overshoots occur. A ceramic bypass capacitor value of 0.1 µF (as shown in
Figure 7) is recommended in order to provide the needed filtering.
In addition to transients that are caused by normal SRAM operation, power cycling can
generate negative voltage spikes on VCC that drive it to values below VSS by as much as
one volt. These negative spikes can cause data corruption in the SRAM while in battery
backup mode. To protect from these voltage spikes, STMicroelectronics recommends
connecting a schottky diode from VCC to VSS (cathode connected to VCC, anode to VSS).
Schottky diode 1N5817 is recommended for through hole and MBRS120T3 is
recommended for surface mount.
Figure 7. Supply voltage protection
AI02169
VCC
0.1μF DEVICE
VCC
VSS
Maximum ratings M48Z08, M48Z18
12/20
3 Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 5. Absolute maximum ratings
Note: For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal
budget not to exceed 150°C for longer than 30 seconds).
Caution: Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Symbol Parameter Value Unit
TAAmbient operating temperature 0 to 70 °C
TSTG Storage temperature (VCC off, oscillator off) –40 to 85 °C
TSLD(1) Lead solder temperature for 10 seconds 260 °C
VIO Input or output voltages –0.3 to 7 V
VCC Supply voltage –0.3 to 7 V
IOOutput current 20 mA
PDPower dissipation 1 W
M48Z08, M48Z18 DC and AC parameters
13/20
4 DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the DC and
AC characteristics of the device. The parameters in the following DC and AC characteristic
tables are derived from tests performed under the measurement conditions listed in the
relevant tables. Designers should check that the operating conditions in their projects match
the measurement conditions when using the quoted parameters.
Table 6. Operating and AC measurement conditions
Note: Output Hi-Z is defined as the point where data is no longer driven.
Figure 8. AC testing load circuit
Table 7. Capacitance
Parameter M48Z08 M48Z18 Unit
Supply voltage (VCC) 4.75 to 5.5 4.5 to 5.5 V
Ambient operating temperature (TA) 0 to 70 0 to 70 °C
Load capacitance (CL) 100 100 pF
Input rise and fall times 5 5ns
Input pulse voltages 0 to 3 0 to 3 V
Input and output timing ref. voltages 1.5 1.5 V
Symbol Parameter(1)(2)
1. Effective capacitance measured with power supply at 5 V; sampled only, not 100% tested.
2. At 25°C, f = 1 MHz.
Min Max Unit
CIN Input capacitance 10 pF
CIO(3)
3. Outputs deselected.
Input / output capacitance 10 pF
AI01398
5V
OUT
CL = 100pF or 30pF
CL includes JIG capacitance
1.8kΩ
DEVICE
UNDER
TEST
1kΩ
DC and AC parameters M48Z08, M48Z18
14/20
Table 8. DC characteristics
Figure 9. Power down/up mode AC waveforms
Note: Inputs may or may not be recognized at this time. Caution should be taken to keep E high as
VCC rises past VPFD (min). Some systems may perform inadvertent WRITE cycles after VCC
rises above VPFD (min) but before normal system operations begin. Even though a power on
reset is being applied to the processor, a reset condition may not occur until after the system
is running.
Symbol Parameter Test condition(1)
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where noted
Min Max Unit
ILI Input leakage current 0V VIN VCC ±1 µA
ILO(2)
2. Outputs deselected.
Output leakage current 0V VOUT VCC ±1 µA
ICC Supply current Outputs open 80 mA
ICC1 Supply current (standby) TTL E = VIH 3mA
ICC2 Supply current (standby) CMOS E = VCC – 0.2 V 3 mA
VIL Input low voltage –0.3 0.8 V
VIH Input high voltage 2.2 VCC + 0.3 V
VOL Output low voltage IOL = 2.1 mA 0.4 V
VOH Output high voltage IOH = –1 mA 2.4 V
AI00606
VCC
INPUTS
(PER CONTROL INPUT)
OUTPUTS
DON'T CARE
HIGH-Z
tF
tFB
tR
tRECtPD tRB
tDR
VALID VALID
NOTE
(PER CONTROL INPUT)
RECOGNIZEDRECOGNIZED
VPFD (max)
VPFD (min)
VSO
M48Z08, M48Z18 DC and AC parameters
15/20
Table 9. Power down/up AC characteristics
Table 10. Power down/up trip points DC characteristics
Symbol Parameter(1)
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where
noted).
Min Max Unit
tPD E or W at VIH before power down 0 µs
tF(2)
2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring
until 200 µs after VCC passes VPFD (min).
VPFD (max) to VPFD (min) VCC fall time 300 µs
tFB(3)
3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.
VPFD (min) to VSS VCC fall time 10 µs
tRVPFD (min) to VPFD (max) VCC rise time 0 µs
tRB VSS to VPFD (min) VCC rise time 1 µs
trec E or W at VIH before power-up 2 ms
Symbol Parameter(1)(2)
1. All voltages referenced to VSS.
2. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where
noted).
Min Typ Max Unit
VPFD Power-fail deselect voltage M48Z08 4.5 4.6 4.75 V
M48Z18 4.2 4.3 4.5 V
VSO Battery backup switchover voltage 3.0 V
tDR(3)
3. At 25°C, VCC = 0 V.
Expected data retention time 11 Years
Package mechanical data M48Z08, M48Z18
16/20
5 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 10. PCDIP28 – 28-pin plastic DIP, battery CAPHAT™, package outline
Note: Drawing is not to scale.
Table 11. PCDIP28 – 28-pin plastic DIP, battery CAPHAT™, package mech. data
PCDIP
A2
A1
A
L
B1 B e1
D
E
N
1
C
eA
e3
Symb
mm inches
Typ Min Max Typ Min Max
A 8.89 9.65 0.350 0.380
A1 0.38 0.76 0.015 0.030
A2 8.38 8.89 0.330 0.350
B 0.38 0.53 0.015 0.021
B1 1.14 1.78 0.045 0.070
C 0.20 0.31 0.008 0.012
D 39.37 39.88 1.550 1.570
E 17.83 18.34 0.702 0.722
e1 2.29 2.79 0.090 0.110
e3 29.72 36.32 1.170 1.430
eA 15.24 16.00 0.600 0.630
L 3.05 3.81 0.120 0.150
N28 28
M48Z08, M48Z18 Part numbering
17/20
6 Part numbering
Table 12. Ordering information scheme
For other options, or for more information on any aspect of this device, please contact the
ST sales office nearest you.
Example: M48Z 08 –100 PC 1 TR
Device Type
M48Z
Supply voltage and write protect voltage
08 = VCC = 4.75 to 5.5 V; VPFD = 4.5 to 4.75 V
18 = VCC = 4.5 to 5.5 V; VPFD = 4.2 to 4.5 V
Speed
–100 = 100 ns
Package
PC = PCDIP28
Temperature range
1 = 0 to 70°C
Shipping method
blank = ECOPACK® package, tubes
TR = ECOPACK® package, tape & reel
Environmental information M48Z08, M48Z18
18/20
7 Environmental information
Figure 11. Recycling symbols
This product contains a non-rechargeable lithium (lithium carbon monofluoride chemistry)
button cell battery fully encapsulated in the final product.
Recycle or dispose of batteries in accordance with the battery manufacturer's instructions
and local/national disposal and recycling regulations.
Please refer to the following web site address for additional information regarding
compliance statements and waste recycling.
Go to www.st.com/nvram, then select "Lithium Battery Recycling" from "Related Topics".
M48Z08, M48Z18 Revision history
19/20
8 Revision history
Table 13. Document revision history
Date Revision Changes
Mar-1999 1 First issue
19-Jul-2001 2 2-socket SOH and 2-pin SH packages removed; reformatted;
temperature information added to tables (Ta bl e 7 , 8, 3, 4, 9, 10)
19-Dec-2001 2.1 Remove all references to “clock”
21-Dec-2001 2.2 Changes to text to reflect addition of M48Z08Y option
20-May-2002 2.3 Modify reflow time and temperature footnotes (Ta bl e 5)
10-Sep-2002 2.4 Remove all references to “SNAPHAT” and M48Z08Y part (Figure 1;
Tab le 5 , 6, 3, 4, 10, 12)
01-Apr-2003 3 v2.2 template applied; updated test condition (Ta b l e 1 0 )
28-Aug-2004 4 Reformatted; removed references to ‘crystal’ (Figure 1)
14-Dec-2005 5 Updated template, Lead-free text, removed footnote (Ta b le 8 , 12)
24-Mar-2009 6 Reformatted document; added text to Section 5: Package mechanical
data; added Section 7: Environmental information.
M48Z08, M48Z18
20/20
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2009 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com