TLE4275D - Infineon Technologies

5-V Low Drop Fixed Voltage Regulator

TLE 4275

Data Sheet 1 Rev. 1.7, 2007-02-19

Type Package

TLE 4275 PG-TO220-5-11 (RoHS compliant)

TLE 4275 D PG-TO252-5-11 (RoHS compliant)

TLE 4275 G PG-TO263-5-1 (RoHS compliant)

TLE 4275 S PG-TO220-5-12 (RoHS compliant)

P-TO220-5-11

PG-TO220-5-11

P-TO252-5-11

PG-TO252-11

P-TO263-5-1

PG-TO263-5-1

-TO220-5-12

PG-TO220-5-12

Features

• Output voltage 5 V ± 2%

• Very low current consumption

• Power-on and undervoltage reset

• Reset low down to VQ = 1 V

• Very low-drop voltage

• Short-circuit-proof

• Reverse polarity proof

• Suitable for use in automotive electronics

• ESD protection > 4 kV

• Green Product (RoHS compliant) version of TLE 4275

•

AEC qualified

Functional Description

The TLE 4275 is a monolithic integrated low-drop

voltage regulator in a 5-pin TO-package. An input

voltage up to 45 V is regulated to VQ,nom = 5.0 V. The IC

is able to drive loads up to 450 mA and is short-circuit

proof. At overtemperature the TLE 4275 is turned off by

the incorporated temperature protection. A reset signal

is generated for an output voltage VQ,rt of typ. 4.65 V.

The delay time can be programmed by the external

delay capacitor.

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Data Sheet 2 Rev. 1.7, 2007-02-19

TLE 4275

Dimensioning Information on External Components

The input capacitor CI is necessary for compensation of line influences. Using a resistor

of approx. 1 Ω in series with CI, the oscillating of input inductivity and input capacitance

can be damped. The output capacitor CQ is necessary for the stability of the regulation

circuit. Stability is guaranteed at values CQ ≥ 22 µF and an ESR of ≤ 5 Ω within the

operating temperature range.

Circuit Description

The control amplifier compares a reference voltage to a voltage that is proportional to the

output voltage and drives the base of the series transistor via a buffer. Saturation control

as a function of the load current prevents any oversaturation of the power element. The

IC also incorporates a number of internal circuits for protection against:

• Overload

• Overtemperature

• Reverse polarity

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TLE 4275

Data Sheet 3 Rev. 1.7, 2007-02-19

Figure 1 Pin Configuration (top view)

Table 1 Pin Definitions and Functions

Pin No. Symbol Function

1IInput; block to ground directly at the IC by a ceramic capacitor.

2ROReset Output; open collector output

3GNDGround; Pin 3 internally connected to heatsink

4DReset Delay; connect capacitor to GND for setting delay time

5QOutput; block to ground with a ≥ 22 µF capacitor,

ESR < 5 Ω at 10 kHz.

AEP02580

ROΙDQ

GND

AEP02756

GNDΙRO Q

GND

IEP02528

PG-TO252-5-11

PG-TO263-5-1

PG-TO220-5-11

IEP02527

ΙRO

GNDDQ

PG-TO220-5-12

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Data Sheet 4 Rev. 1.7, 2007-02-19

TLE 4275

Figure 2 Block Diagram

AEB02425

Buffer

Reference

Bandgap

Protection

Circuit

Control and

Saturation

Temperature

Sensor

Reset

Generator

1 5

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TLE 4275

Data Sheet 5 Rev. 1.7, 2007-02-19

Note: Maximum ratings are absolute ratings; exceeding any one of these values may

cause irreversible damage to the integrated circuit.

Table 2 Absolute Maximum Ratings

Parameter Symbol Limit Values Unit Test Condition

Min. Max.

Input

Voltage VI-42 45 V –

Current II– – – Internally limited

Output

Voltage VQ-1.0 16 V –

Current IQ– – – Internally limited

Reset Output

Voltage VRO -0.3 25 V –

Current IRO – 5 5 mA –

Reset Delay

Voltage VD-0.3 7 V –

Current ID-2 2 mA –

Temperature

Junction temperature Tj-40 150 °C–

Storage temperature Tstg -50 150 °C–

Table 3 Operating Range

Parameter Symbol Limit Values Unit Remarks

Min. Max.

Input voltage VI5.5 42 V –

Junction temperature Tj-40 150 °C–

Thermal Resistance

Junction case Rthjc –4K/W–

Junction ambient Rthj-a –53K/WTO263

1) Worst case, regarding peak temperature; zero airflow; mounted on a PCB FR4, 80 × 80 × 1.5 mm3, heat sink

area 300 mm2

Junction ambient Rthj-a –78K/WTO252

Junction ambient Rthj-a –65K/WTO220

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Data Sheet 6 Rev. 1.7, 2007-02-19

TLE 4275

Table 4 Characteristics

VI = 13.5 V; -40 °C < Tj < 150 °C (unless otherwise specified)

Parameter Symbol Limit Values Unit Measuring

Condition

Min. Typ. Max.

Output

Output voltage VQ4.9 5.0 5.1 V 5 mA < IQ < 400 mA

6 V < VI < 28 V

Output voltage VQ4.9 5.0 5.1 V 5 mA < IQ < 200 mA

6 V < VI < 40 V

Output current

limitation1)

IQ450 700 – mA –

Current consumption;

Iq = II - IQ

Iq– 150 200 µAIQ = 1 mA;

Tj = 25 °C

Current consumption;

Iq = II - IQ

Iq– 150 220 µAIQ = 1 mA;

Tj ≤ 85 °C

Current consumption;

Iq = II - IQ

Iq–510mAIQ = 250 mA

Current consumption;

Iq = II - IQ

Iq–1222mAIQ = 400 mA

Drop voltage1) Vdr – 250 500 mV IQ = 300 mA;

Vdr = VI - VQ

Load regulation ∆VQ–1530mVIQ = 5 mA to 400 mA

Line regulation ∆VQ-15 5 15 mV ∆Vl = 8 V to 32 V

IQ = 5 mA

Power supply ripple

rejection

PSRR –60–dBfr = 100 Hz;

Vr = 0.5 Vpp

Temperature output

voltage drift

dVQ/dT–0.5–mV/K–

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TLE 4275

Data Sheet 7 Rev. 1.7, 2007-02-19

Reset Timing D and Output RO

Reset switching

threshold

VQ,rt 4.5 4.65 4.8 V –

Reset output low voltage VROL –0.20.4V Rext ≥ 5 kΩ;

VQ > 1 V

Reset output leakage

current

IROH –010µAVROH = 5 V

Reset charging current ID,c 3.0 5.5 9.0 µAVD = 1 V

Upper timing threshold VDU 1.5 1.8 2.2 V –

Lower timing threshold VDRL 0.2 0.4 0.7 V –

Reset delay time trd 10 16 22 ms CD = 47 nF

Reset reaction time trr –0.52µsCD = 47 nF

1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.

Table 4 Characteristics (cont’d)

VI = 13.5 V; -40 °C < Tj < 150 °C (unless otherwise specified)

Parameter Symbol Limit Values Unit Measuring

Condition

Min. Typ. Max.

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Data Sheet 8 Rev. 1.7, 2007-02-19

TLE 4275

Figure 3 Test Circuit

Figure 4 Reset Timing

AES02472

47 nF

GND

5 k

Ω

D, d

100 nF

1000 µF

22 µF

ext

I I

GND

D, c

AED03010

Thermal

trd

Power-on-Reset Voltage Dip Secondary Overload

at OutputSpike

VΙ

D,c

Q, rt

trr

at Input Undervoltage

Shutdown

VRO

VDU

VDRL

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Data Sheet 9 Rev. 1.7, 2007-02-19

TLE 4275

Output Voltage VQ versus

Temperature Tj

Output Voltage VQ versus

Temperature Tj

Output Current IQ versus Temperature

Output Voltage VQ versus

Input Voltage VI

AED03029

-40 04080120 ˚C 16

4.6

= 13.5 V

4.7

4.8

4.9

5.0

5.1

5.2

AED03029

-40 04080120 C 16

2.9

= 13.5 V

3.0

3.1

3.2

3.3

3.4

3.5

AED03034

-40 04080120 ˚C 16

200

400

600

800

1000

1200

VΙ

AED01929

= 25

Ω

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Data Sheet 10 Rev. 1.7, 2007-02-19

TLE 4275

Output Current IQ versus

Input Voltage VI

Current Consumption Iq

versus Output Current IQ

Current Consumption Iq

versus Output Current IQ

Drop Voltage Vdr versus

Output Current IQ

AED03030

0 10 20 30 40 V5

0.4

0.8

1.2

1.0

0.6

0.2

= 125 ˚C

25 ˚C

AED03084

= 13.5 V

20 40 60 80 120

AED03085

qmA

= 13.5 V

100 200 300 400 600

AED03031

100

200

300

400

500

600

700

800

= 125 ˚C

25 ˚C

200 400 600 100

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Data Sheet 11 Rev. 1.7, 2007-02-19

TLE 4275

Charge Current ID,c

versus Temperature Tj

Delay Switching Threshold VDU, VDRL

versus Temperature Tj

AED03086

-40

= 13.5 V

µA

04080

120 160˚C

= 1 V

D, c

-40

AED03083

VDU V

= 13.5 V

˚C

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

04080 120 160

VDU

VDRL

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Data Sheet 12 Rev. 1.7, 2007-02-19

TLE 4275

Package Outlines

Figure 5 PG-TO220-5-11 (Plastic Transistor Single Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products

and to be compliant with government regulations the device is available as a green

product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable

for Pb-free soldering according to IPC/JEDEC J-STD-020).

GPT09064

A0.25 M

Typical

9.8±0.15

2.8

15.65

±0.3

13.4

0...0.15

1.7 0.8±0.1

±0.11.27 4.4

9.25

±0.2

0.05

All metal surfaces tin plated, except area of cut.

±0.2

±0.3

8.51)

10±0.2

3.7-0.15

2.4 0.5±0.1

±0.3

8.6

10.2

±0.3

±0.43.9

±0.48.4

3.7

±0.3

ou can find all of our packages, sorts of packing and others in our

Infineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mm

SMD = Surface Mounted Device

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TLE 4275

Data Sheet 13 Rev. 1.7, 2007-02-19

Figure 6 PG-TO252-5-11 (Plastic Transistor Single Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products

and to be compliant with government regulations the device is available as a green

product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable

for Pb-free soldering according to IPC/JEDEC J-STD-020).

) Includes mold flashes on each side.

4.56 0.25

6.5

5.7 MAX.

±0.1

per side

0.15 MAX.

-0.2

6.22

±0.5

9.98

(4.24) 1

1.14

5 x 0.6

±0.15

0.8

±0.1

+0.15

-0.05

0.1

-0.04

+0.08

0...0.15

0.51 MIN.

0.5

2.3

-0.10

0.5

+0.05

-0.04

+0.08

(5)

-0.01

0.9

+0.20

All metal surfaces tin plated, except area of cut.

GPT09527

ou can find all of our packages, sorts of packing and others in our

Infineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mm

SMD = Surface Mounted Device

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Data Sheet 14 Rev. 1.7, 2007-02-19

TLE 4275

Figure 7 PG-TO263-5-1 (Plastic Transistor Single Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products

and to be compliant with government regulations the device is available as a green

product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable

for Pb-free soldering according to IPC/JEDEC J-STD-020).

BA0.25

±0.2

GPT0911

8.5

(15)

±0.2

9.25 ±0.3

0...0.15

5 x 0.8

±0.1

1.27

4.4

0.5

±0.1

±0.3

2.7

4.7±0.5

2.4

1.7

0...0.3 A

7.55

4 x

All metal surfaces tin plated, except area of cut.

Metal surface min. X = 7.25, Y = 6.9

Typical

0.1 B

0.1

0.05

8˚ MAX.

GPT09113

ou can find all of our packages, sorts of packing and others in our

Infineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mm

SMD = Surface Mounted Device

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TLE 4275

Data Sheet 15 Rev. 1.7, 2007-02-19

Figure 8 PG-TO220-5-12 (Plastic Transistor Single Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products

and to be compliant with government regulations the device is available as a green

product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable

for Pb-free soldering according to IPC/JEDEC J-STD-020).

GPT09065

BA0.25 M

Typical

9.8±0.15

2.8

15.65±0.3

13.4

0...0.15

1.7 0.8±0.1

±0.11.27 4.4

9.25±0.2

0.05

1) All metal surfaces tin plated, except area of cut.

±0.2

17±0.3

8.51)

10±0.2

3.7-0.15

2.4 0.5±0.1

13±0.5

±0.511

ou can find all of our packages, sorts of packing and others in our

Infineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mm

SMD = Surface Mounted Device

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Data Sheet 16 Rev. 1.7, 2007-02-19

TLE 4275

Revision History: 2007-02-19 Rev. 1.7

Previous Version: 1.6

Page Subjects (major changes since last revision)

general Removed all information related to the TLE4275v33 Product Proposal.

(See separate datasheet for the TLE4275v33)

general Updated Infineon logo

#1 Added “AEC” and “Green” logo

#1 Added “Green Product” and “AEC qualified” to the feature list

#1 Updated Package Names to “PG-xxx”

general Removed leadframe variant “P-TO-252-1”

#12 to #15 Added “Green Product” remark

#17 Disclaimer Update

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Edition 2007-02-19

Published by

Infineon Technologies AG

81726 München, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values

stated herein and/or any information regarding the application of the device, Infineon Technologies hereby

disclaims any and all warranties and liabilities of any kind, including without limitation warranties of

non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in

question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

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