(1,00 mm) .0394"
MEC1-RA, MEC1-EM SERIES
MEC1–120–02–L–D–RA1–SL
MEC1–130–02–L–D–EM2
MEC1–120–02–F–D–EM2
WWW.SAMTEC.COM
(No. of Positions + 2) x
(1,00) .03937 + (2,54) .100
(No. of Positions + 2)
x (1,00) .03937
(0,36) .014
(1,00)
.03937
(8,89)
.350
(0,64)
.025
(3,12) .123
(1,27)
.050
(11,68)
.460 (11,94)
.470
(1,78)
.070
DIA
(1,24)
.049
01
02
(8,13)
.320
(2,51)
.099
(6,81)
.268
MEC1 POSITIONS
PER ROW
PLATING
OPTION D
1
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.5A per contact @ 80°C
(See website for details)
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
RoHS Compliant: Ye s
Processing:
Lead–Free Solderable: Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (05-40)
(0,15 mm) .006" max (50-70)
05, 08, 20, 30,
40, 50, 60, 70
–F
= Gold fl ash on contact,
Matte Tin on tail
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
CARD
SLOT
–02
= (1,60 mm)
.062"
thick card
F-213
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SL
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
POLARIZED
POSITIONS
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
Mates with:
(1,60 mm)
.062" card
Mates with:
(1,60 mm)
.062" card
APPLICATION
SPECIFIC OPTION
• Elevated body height
• Non-polarized
Call Samtec.
RA1
(No. of Positions + 2) x
(1,00) .03937 + (12,45) .490
02
(1,19)
.047
(0,38)
.015
(No. of Positions + 2)
x (1,00) .03937
(0,36)
.014
(8,89)
.350
(4,70)
.185
(1,00)
.03937
(4,57)
.180
(3,15)
.124
(6,81)
.268
±
01
(8,13)
.320
(5,21)
.205
MEC1 POSITIONS
PER ROW
PLATING
OPTION D
1
05, 08, 20, 30,
40, 50, 60, 70
02 EM2
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?MEC1-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84 mm) .230" to
(8,13 mm) .320"
RoHS Compliant:
Ye s
Lead–Free Solderable:
Ye s
APPLICATION
SPECIFIC
OPTION
• Edge mount leads for
(0,80 mm) .031"
thick board
• Non-polarized
Call Samtec.
–F
= Gold fl ash on contact,
Matte Tin on tail
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
POLARIZED
POSITIONS
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
Note: Some sizes, styles and
options are non-standard,
non-returnable.
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
SPECIFICATIONS
SPECIFICATIONS
Note: Other Gold plating
options available.
Contact Samtec.
Note: Other Gold plating options
available. Contact Samtec.
RIGHT ANGLE/EDGE MOUNT SOCKETS
MEC1-RA
6,81 mm Stack Height Rated @ 3dB Insertion Loss*
Single-Ended Signaling 4.5 GHz / 9 Gbps
Differential Pair Signaling 5.5 GHz / 11 Gbps
*Performance data includes effects of a non-optimized PCB.
Complete test data available at www.samtec.com?MEC1-RA
or contact sig@samtec.com
Note: While optimized for
50Ω applications, this
connector with alternative
signal/ground patterns may
also perform well in certain
75Ω applications. Contact
Samtec for further information.
Note: While optimized for 50Ω
applications, this connector with
alternative signal/ground patterns
may also perform well in certain
75Ω applications. Contact Samtec
for further information.
