10 The Important Information/Disclaimer is incorporated in the catalog where these specications came from or
available online at www.avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
Transmission Line MIM Capacitor
(Metal-Insulator-Metal)
052219
BENEFITS
GENERAL DESCRIPTION
• HFSS Design Unique for every device
• Gold Wirebondable
• Copper Conductor Design for improved Circuit Conductivity
• Designs Optimized for RF/Performance
• ROHS Compliant
• Alumina (Al2O3)
• Quartz
AVX Thin Film Technologies is pleased to introduce a novel MIM (Metal-Insulator-Metal) capacitor using a
transmission line wire bond pad structure with backside ground.
The TL MIM can be supplied on quartz, alumina, glass and other substrates to minimize losses. Copper traces
are used for optimal conductivity. Front and backside gold metalization make this device suitable epoxy, gold
wire bond/ribbon bond attachments.
APPLICATIONS
• DC Blocking at UHF
• High Frequency Link
• RF Microwave applications
SUBSTRATE MATERIALS CAPACITOR MATERIALS
*Actual maximum capacitance values depend on transmission line dimensions
L
W
Length is determined by transmission line
TEST METHODS
MECHANICAL DIMENSIONS
Based on Transmission Line Design Request
Rated Voltage Specic Capacitance Dissipation Factor TCC (ppm/°C)
<100 50 - 100 * pf/mm2 <0.1% ±60
Specication Limit
MIL-STD-883-2011.10 BOND STRENGTH > 3 gm min. w/0.001” Au Wire
MIL-STD-883-2019.10 SHEAR STRENGTH Size Dependent See Procedure
MIL-STD-202-108 LIFE 1000 hrs @ 125°C