3.2x1.6mm SMD CHIP LED LAMP AP3216ID HIGH EFFICIENCY RED Features Description ! 3.2mm x 1.6mm SMT LED, 1.1mm THICKNESS. The High Efficiency Red source color devices are !LOW POWER CONSUMPTION. made with Gallium Arsenide Phosphide on Gallium !WIDE VIEWING ANGLE. Phosphide Orange Light Emitting Diode. ! IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. ! PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: DSAB2335 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE: MAY/09/2002 DRAWN: D. L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e AP3216ID Iv (m c d ) @ 20 m A L en s Ty p e HIGH EFFICIENCY RED(GaAsP/GaP) RED DIFFUSED V i ew i n g An g l e Min . Ty p . 21/2 5 12.5 60 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l Par am et er peak Peak Wavelength High Efficiency Red D Dominate Wavelength High Efficiency Red 1/2 D ev i c e Spectral Line Half-width High Efficiency Red Ty p . Un it s Tes t Co n d it io n s 6 27 nm I F =20mA 6 25 nm I F =20mA 45 nm I F =20mA pF VF=0V;f=1MHz 2.5 V I F =20mA 10 uA V R = 5V C Capacitance High Efficiency Red 15 VF Forward Voltage High Efficiency Red 2.0 IR Reverse Current High Efficiency Red Max . Absolute Maximum Ratings at T)=25C P ar am e t e r H i g h E f f i c i e n c y R ed Un it s Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 160 mA Reverse Voltage 5 V Operating/Storage Temperature -40C To +85C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB2335 APPROVED: J.Lu REV NO: V.1 CHECKED:Allen Liu DATE: MAY/09/2002 DRAWN: D. L. HUANG PAGE: 2 OF 4 High Efficiency Red AP3216ID SPEC NO: DSAB2335 APPROVED:J.Lu REV NO: V.1 CHECKED:Allen Liu DATE: MAY/09/2002 DRAWN: D. L.HUANG PAGE: 3 OF 4 AP3216ID SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB2335 APPROVED: J.Lu REV NO: V.1 CHECKED:Allen Liu DATE: MAY/09/2002 DRAWN: D. L. HUANG PAGE: 4 OF 4 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Kingbright: AP3216ID