Data Sheet
V1.5 2013-02
Microcontrollers
16/32-Bit
Architecture
XC2232N, XC2234N,
XC2236N, XC2238N
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family / Value Line
Edition 2013-02
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Data Sheet
V1.5 2013-02
Microcontrollers
16/32-Bit
Architecture
XC2232N, XC2234N,
XC2236N, XC2238N
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family / Value Line
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Data Sheet 4 V1.5, 2013-02
Trademarks
C166™, TriCore™ and DAVE™ are trademarks of Infineon Technologies AG.
XC223xN Data Sheet
Revision History: V1.5 2013-02
Previous Versions:
V1.4, 2011-07
V1.3, 2010-04
V1.2, 2009-12
V1.1, 2009-07
V1.0, 2009-03 Preliminary
Page Subjects (major changes since last revision)
27 Added AB step marking.
79 Errata SWD_X.P002 implemented: VSWD tolerance boundaries for
5.5 V are changed.
81 Clarified “Coding of bit fields LEVxV” descriptions. Matched with Operating
Conditions: marked some coding values “out of valid operation range”.
82 Errata FLASH_X.P001 implemented: Test Condition for Flash parameter
NER corrected
We Listen to Your Comments
Is there any information in this document that you feel is wrong, unclear or missing?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Table of Contents
Data Sheet 5 V1.5, 2013-02
1 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1 Basic Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Special Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.3 Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.2 Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.1 Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.2 Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
3.3 Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.4 Memory Checker Module (MCHK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
3.5 Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
3.6 On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.7 Capture/Compare Unit (CC2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.8 Capture/Compare Units CCU6x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3.9 General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
3.10 Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.11 A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.12 Universal Serial Interface Channel Modules (USIC) . . . . . . . . . . . . . . . . . 50
3.13 MultiCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
3.14 System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.15 Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
3.16 Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
3.17 Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
3.18 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
3.19 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.1 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.1.1 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.2 Voltage Range definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.2.1 Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.3 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
4.3.1 DC Parameters for Upper Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 66
4.3.2 DC Parameters for Lower Voltage Area . . . . . . . . . . . . . . . . . . . . . . . . 68
4.3.3 Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.4 Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
4.5 System Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
4.6 Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table of Contents
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Table of Contents
Data Sheet 6 V1.5, 2013-02
4.7 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
4.7.1 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
4.7.2 Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
4.7.2.1 Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
4.7.2.2 Wakeup Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
4.7.2.3 Selecting and Changing the Operating Frequency . . . . . . . . . . . . . . 89
4.7.3 External Clock Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
4.7.4 Pad Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
4.7.5 Synchronous Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
4.7.6 Debug Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
5.1 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
5.2 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
5.3 Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Summary of Features
Data Sheet 7 V1.5, 2013-02
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC223xN (XC2000 Family)
1 Summary of Features
For a quick overview and easy reference, the features of the XC223xN are summarized
here.
• High-performance CPU with five-stage pipeline and MPU
– 12.5 ns instruction cycle @ 80 MHz CPU clock (single-cycle execution)
– One-cycle 32-bit addition and subtraction with 40-bit result
– One-cycle multiplication (16 × 16 bit)
– Background division (32 / 16 bit) in 21 cycles
– One-cycle multiply-and-accumulate (MAC) instructions
– Enhanced Boolean bit manipulation facilities
– Zero-cycle jump execution
– Additional instructions to support HLL and operating systems
– Register-based design with multiple variable register banks
– Fast context switching support with two additional local register banks
– 16 Mbytes total linear address space for code and data
– 1,024 Bytes on-chip special function register area (C166 Family compatible)
– Integrated Memory Protection Unit (MPU)
• Interrupt system with 16 priority levels providing 96 interrupt nodes
– Selectable external inputs for interrupt generation and wake-up
– Fastest sample-rate 12.5 ns
• Eight-channel interrupt-driven single-cycle data transfer with
Peripheral Event Controller (PEC), 24-bit pointers cover total address space
• Clock generation from internal or external clock sources,
using on-chip PLL or prescaler
• Hardware CRC-Checker with Programmable Polynomial to Supervise On-Chip
Memory Areas
• On-chip memory modules
– 8 Kbytes on-chip stand-by RAM (SBRAM)
– 2 Kbytes on-chip dual-port RAM (DPRAM)
– Up to 16 Kbytes on-chip data SRAM (DSRAM)
– Up to 16 Kbytes on-chip program/data SRAM (PSRAM)
– Up to 320 Kbytes on-chip program memory (Flash memory)
– Memory content protection through Error Correction Code (ECC)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Summary of Features
Data Sheet 8 V1.5, 2013-02
• On-Chip Peripheral Modules
– Two synchronizable A/D Converters with up to 9 channels, 10-bit resolution,
conversion time below 1 μs, optional data preprocessing (data reduction, range
check), broken wire detection
– 16-channel general purpose capture/compare unit (CC2)
– Two capture/compare units for flexible PWM signal generation (CCU6x)
– Multi-functional general purpose timer unit with 5 timers
– Up to 6 serial interface channels to be used as UART, LIN, high-speed
synchronous channel (SPI/QSPI), IIC bus interface (10-bit addressing, 400 kbit/s),
IIS interface
– On-chip MultiCAN interface (Rev. 2.0B active) with up to 256 message objects
(Full CAN/Basic CAN) on 6 CAN node
– On-chip system timer and on-chip real time clock
• Single power supply from 3.0 V to 5.5 V
• Power reduction and wake-up modes with flexible power management
• Programmable watchdog timer and oscillator watchdog
• Up to 40 general purpose I/O lines
• On-chip bootstrap loaders
• Supported by a full range of development tools including C compilers, macro-
assembler packages, emulators, evaluation boards, HLL debuggers, simulators,
logic analyzer disassemblers, programming boards
• On-chip debug support via Device Access Port (DAP) or JTAG interface
• 64-pin Green LQFP package, 0.5 mm (19.7 mil) pitch
Ordering Information
The ordering code for an Infineon microcontroller provides an exact reference to a
specific product. This ordering code identifies:
• the derivative itself, i.e. its function set, the temperature range, and the supply voltage
• the temperature range:
– SAF-…: -40°C to 85°C
– SAH-…: -40°C to 110°C
– SAK-…: -40°C to 125°C
• the package and the type of delivery.
For ordering codes for the XC223xN please contact your sales representative or local
distributor.
This document describes several derivatives of the XC223xN group:
Basic Device Types are readily available and
Special Device Types are only available on request.
As this document refers to all of these derivatives, some descriptions may not apply to a
specific product, in particular to the special device types.
For simplicity the term XC223xN is used for all derivatives throughout this document.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Summary of Features
Data Sheet 9 V1.5, 2013-02
1.1 Basic Device Types
Basic device types are available and can be ordered through Infineon’s direct and/or
distribution channels.
Table 1 Synopsis of XC223xN Basic Device Types
Derivative1)
1) The 80 MHz type is marked ...80L. The 40 MHz type is marked ...40L.
Flash
Memory2)
2) Specific information about the on-chip Flash memory in Table 3.
PSRAM
DSRAM3)
3) All derivatives additionally provide 8 Kbytes SBRAM and 2 Kbytes DPRAM.
Capt./Comp.
Modules4)
4) Due to bonding limitations in the XC223xN devices only a subset of the CCU61 features can be used. The
module has the T12 and T13 timer inputs and no outputs connected. Therefore only CCU61 timers can be
triggered from external. This can typically be used for periodic triggering of ADCs.
ADC5)
Chan.
5) Specific information about the available channels in Table 5.
Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1).
Interfaces5)
XC2236N-24F40L 192 Kbytes 8 Kbytes
8 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
4 Serial Chan.
XC2236N-40F80L 320 Kbytes 16 Kbytes
16 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
4 Serial Chan.
XC2238N-40F80L 320 Kbytes 16 Kbytes
16 Kbytes
CC2
CCU60/1
7 + 2 6 CAN Node,
6 Serial Chan.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Summary of Features
Data Sheet 10 V1.5, 2013-02
1.2 Special Device Types
Special device types are only available for high-volume applications on request.
Table 2 Synopsis of XC223xN Special Device Types
Derivative1)
1) x is a placeholder for available speed grade in MHz. Can be 20, 40, 66 or 80.
Flash
Memory2)
2) Specific information about the on-chip Flash memory in Table 3.
PSRAM
DSRAM3)
3) All derivatives additionally provide 8 Kbytes SBRAM and 2 Kbytes DPRAM.
Capt./Comp.
Modules4)
4) Due to bonding limitations in the XC223xN devices only a subset of the CCU61 features can be used. The
module has the T12 and T13 timer inputs and no outputs connected. Therefore only CCU61 timers can be
triggered from external. This can typically be used for periodic triggering of ADCs.
ADC5)
Chan.
5) Specific information about the available channels in Table 5.
Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1).
Interfaces5)
XC2232N-40FxL 320 Kbytes 16 Kbytes
16 Kbytes
CC2
CCU60/1
7 + 2 3 CAN Nodes,
6 Serial Chan.
XC2232N-24FxL 192 Kbytes 8 Kbytes
8 Kbytes
CC2
CCU60/1
7 + 2 3 CAN Nodes,
6 Serial Chan.
XC2232N-8FxL 64 Kbytes 4 Kbytes
4 Kbytes
CC2
CCU60/1
7 + 2 3 CAN Nodes,
6 Serial Chan.
XC2234N-40FxL 320 Kbytes 16 Kbytes
16 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
2 Serial Chan.
XC2234N-24FxL 192 Kbytes 8 Kbytes
8 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
2 Serial Chan.
XC2234N-16FxL 128 Kbytes 4 Kbytes
4 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
2 Serial Chan.
XC2236N-40FxL 320 Kbytes 16 Kbytes
16 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
4 Serial Chan.
XC2236N-24FxL 192 Kbytes 8 Kbytes
8 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
4 Serial Chan.
XC2236N-16FxL 128 Kbytes 4 Kbytes
4 Kbytes
CC2
CCU60/1
7 + 2 1 CAN Node,
4 Serial Chan.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Summary of Features
Data Sheet 11 V1.5, 2013-02
1.3 Definition of Feature Variants
The XC223xN types are offered with several Flash memory sizes. Table 3 and Table 4
describe the location of the available Flash memory.
The XC223xN types are offered with different interface options. Table 5 lists the
available channels for each option.
Table 3 Continuous Flash Memory Ranges
Total Flash Size 1st Range1)
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
2nd Range 3rd Range
320 Kbytes C0’0000H …
C0’EFFFH
C1’0000H …
C4’FFFFH
n.a.
192 Kbytes C0’0000H …
C0’EFFFH
C1’0000H …
C1’FFFFH
C4’0000H …
C4’FFFFH
128 Kbytes C0’0000H …
C0’EFFFH
C4’0000H …
C4’FFFFH
n.a.
64 Kbytes C0’0000H …
C0’EFFFH
n.a. n.a.
Table 4 Flash Memory Module Allocation (in Kbytes)
Total Flash Size Flash 01)
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
Flash 1
320 256 64
192 128 64
128 64 64
64 64 -
Table 5 Interface Channel Association
Total Number Available Channels / Message Objects
7 ADC0 channels CH0, CH2, CH4, CH8, CH10, CH13, CH15
2 ADC1 channels CH0, CH4
1 CAN node CAN0
64 message objects
2 CAN nodes CAN0, CAN1
64 message objects
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Summary of Features
Data Sheet 12 V1.5, 2013-02
The XC223xN types are offered with several SRAM memory sizes. Figure 1 shows the
allocation rules for PSRAM and DSRAM. Note that the rules differ:
• PSRAM allocation starts from the lower address
• DSRAM allocation starts from the higher address
For example 8 Kbytes of PSRAM will be allocated at E0’0000h-E0’1FFFh and 8 Kbytes
of DSRAM will be at 00’C000h-00’DFFFh.
Figure 1 SRAM Allocation
3 CAN nodes CAN0, CAN1, CAN2
64 message objects
6 CAN nodes CAN0, CAN1, CAN2, CAN3, CAN4, CAN5
256 message objects
2 serial channels U0C0, U0C1
4 serial channels U0C0, U0C1, U1C0, U1C1
6 serial channels U0C0, U0C1, U1C0, U1C1, U2C0, U2C1
Table 5 Interface Channel Association (cont’d)
Total Number Available Channels / Message Objects
MC_XC_SRAM_ALLOCATION
Available
PSRAM
Reserved for
PSRAM
E0'0000h
(E8'0000h)
Available
DSRAM
Reserved for
DSRAM
E7'FFFFh
(EF'FFFFh)
00'8000h
00'DFFFh
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 13 V1.5, 2013-02
2 General Device Information
The XC223xN series (16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance) is a part of the Infineon XC2000 Family of full-feature single-
chip CMOS microcontrollers. These devices extend the functionality and performance of
the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They
combine high CPU performance (up to 80 million instructions per second) with extended
peripheral functionality and enhanced IO capabilities. Optimized peripherals can be
adapted flexibly to meet the application requirements. These derivatives utilize clock
generation via PLL and internal or external clock sources. On-chip memory modules
include program Flash, program RAM, and data RAM.
Figure 2 XC223xN Logic Symbol
MC_XY _LOGSYMB64
Port 2
11 bit
Port 6
2 bit
Port 7
1 bit
V
AGND
(1)
V
AREF
(1)
V
DDP
(9)
V
SS
(4)
V
DDI1
(3)
XTAL1
XTAL2
ESR0
Port 10
16 bit
Port 15
2 bit
Port 5
7 bit
via Port Pins
DAP/JTAG
2 / 4 bit
TRST Debug
2 bit
TESTM
PORST
V
DDIM
(1)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 14 V1.5, 2013-02
2.1 Pin Configuration and Definition
The pins of the XC223xN are described in detail in Table 6, which includes all alternate
functions. For further explanations please refer to the footnotes at the end of the table.
The following figure summarizes all pins, showing their locations on the four sides of the
package.
Figure 3 XC223xN Pin Configuration (top view)
MC_XY_PIN64
V
DDPA
16
P15.0
15
14
13
P6.1
12
P6.0
11
V
DDIM
10
9
8
7
6
5
TRST 4
TESTM 3
V
DDPB
2
V
SS
1
P7.0
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
V
DDPB
ESR0
PORST
XTAL1
XTAL2
P10.15
P 10.1 4
V
DDI1
P10.13
P10.12
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
V
SS
V
DDPB
P5.8
P5.10
P5.13
P5.15
V
DDI1
P2.0
P2.1
P2.2
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P10.2
V
DDI1
P2.10
P10.3
P10.4
P10.5
P10.6
P10.7
V
DDPB
LQFP64
P15.4
P5.4
V
AR EF
V
AGN D
P5.0
P5.2
V
DDPB
V
SS
V
DDPB
P10.0
P10.1
P2.9
P2.7
P2.8
P1 0.1 1
P1 0.1 0
P1 0.9
P1 0.8
V
DDPB
V
SS
V
DD PB
P2.3
P2.4
P2.5
P2.6
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 15 V1.5, 2013-02
Key to Pin Definitions
•Ctrl.: The output signal for a port pin is selected by bit field PC in the associated
register Px_IOCRy. Output O0 is selected by setting the respective bit field PC to
1x00B, output O1 is selected by 1x01B, etc.
Output signal OH is controlled by hardware.
•Type: Indicates the pad type and its power supply domain (A, B, M, 1).
– St: Standard pad
– Sp: Special pad e.g. XTALx
– DP: Double pad - can be used as standard or high speed pad
– In: Input only pad
– PS: Power supply pad
Table 6 Pin Definitions and Functions
Pin Symbol Ctrl. Type Function
3 TESTM IIn/BTestmode Enable
Enables factory test modes, must be held HIGH for
normal operation (connect to VDDPB).
An internal pull-up device will hold this pin high
when nothing is driving it.
4TRST IIn/BTest-System Reset Input
For normal system operation, pin TRST should be
held low. A high level at this pin at the rising edge
of PORST activates the XC223xN’s debug
system. In this case, pin TRST must be driven low
once to reset the debug system.
An internal pull-down device will hold this pin low
when nothing is driving it.
5 P7.0 O0 / I St/B Bit 0 of Port 7, General Purpose Input/Output
T3OUT O1 St/B GPT12E Timer T3 Toggle Latch Output
T6OUT O2 St/B GPT12E Timer T6 Toggle Latch Output
TDO_A OH /
IH
St/B JTAG Test Data Output / DAP1 Input/Output
If DAP pos. 0 or 2 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
ESR2_1 I St/B ESR2 Trigger Input 1
RxDC4B I St/B CAN Node 4 Receive Data Input
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 16 V1.5, 2013-02
7 P6.0 O0 / I DA/A Bit 0 of Port 6, General Purpose Input/Output
EMUX0 O1 DA/A External Analog MUX Control Output 0 (ADC0)
TxDC2 O2 DA/A CAN Node 2 Transmit Data Output
BRKOUT O3 DA/A OCDS Break Signal Output
ADCx_REQG
TyG
IDA/AExternal Request Gate Input for ADC0/1
U1C1_DX0E I DA/A USIC1 Channel 1 Shift Data Input
8 P6.1 O0 / I DA/A Bit 1 of Port 6, General Purpose Input/Output
EMUX1 O1 DA/A External Analog MUX Control Output 1 (ADC0)
T3OUT O2 DA/A GPT12E Timer T3 Toggle Latch Output
U1C1_DOUT O3 DA/A USIC1 Channel 1 Shift Data Output
ADCx_REQT
RyE
IDA/AExternal Request Trigger Input for ADC0/1
RxDC2E I DA/A CAN Node 2 Receive Data Input
ESR1_6 I DA/A ESR1 Trigger Input 6
10 P15.0 I In/A Bit 0 of Port 15, General Purpose Input
ADC1_CH0 I In/A Analog Input Channel 0 for ADC1
11 P15.4 I In/A Bit 4 of Port 15, General Purpose Input
ADC1_CH4 I In/A Analog Input Channel 4 for ADC1
T6INA I In/A GPT12E Timer T6 Count/Gate Input
12 VAREF - PS/A Reference Voltage for A/D Converters ADC0/1
13 VAGND - PS/A Reference Ground for A/D Converters ADC0/1
14 P5.0 I In/A Bit 0 of Port 5, General Purpose Input
ADC0_CH0 I In/A Analog Input Channel 0 for ADC0
15 P5.2 I In/A Bit 2 of Port 5, General Purpose Input
ADC0_CH2 I In/A Analog Input Channel 2 for ADC0
TDI_A I In/A JTAG Test Data Input
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 17 V1.5, 2013-02
19 P5.4 I In/A Bit 4 of Port 5, General Purpose Input
ADC0_CH4 I In/A Analog Input Channel 4 for ADC0
T3EUDA I In/A GPT12E Timer T3 External Up/Down Control
Input
TMS_A I In/A JTAG Test Mode Selection Input
20 P5.8 I In/A Bit 8 of Port 5, General Purpose Input
ADC0_CH8 I In/A Analog Input Channel 8 for ADC0
ADC1_CH8 I In/A Analog Input Channel 8 for ADC1
CCU6x_T12H
RC
IIn/AExternal Run Control Input for T12 of CCU60/1
CCU6x_T13H
RC
IIn/AExternal Run Control Input for T13 of CCU60/1
U2C0_DX0F I In/A USIC2 Channel 0 Shift Data Input
21 P5.10 I In/A Bit 10 of Port 5, General Purpose Input
ADC0_CH10 I In/A Analog Input Channel 10 for ADC0
ADC1_CH10 I In/A Analog Input Channel 10 for ADC1
BRKIN_A IIn/AOCDS Break Signal Input
U2C1_DX0F I In/A USIC2 Channel 1 Shift Data Input
CCU61_T13
HRA
IIn/AExternal Run Control Input for T13 of CCU61
22 P5.13 I In/A Bit 13 of Port 5, General Purpose Input
ADC0_CH13 I In/A Analog Input Channel 13 for ADC0
23 P5.15 I In/A Bit 15 of Port 5, General Purpose Input
ADC0_CH15 I In/A Analog Input Channel 15 for ADC0
RxDC2F I In/A CAN Node 2 Receive Data Input
25 P2.0 O0 / I St/B Bit 0 of Port 2, General Purpose Input/Output
TxDC5 O1 St/B CAN Node 5 Transmit Data Output
RxDC0C I St/B CAN Node 0 Receive Data Input
T5INB I St/B GPT12E Timer T5 Count/Gate Input
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 18 V1.5, 2013-02
26 P2.1 O0 / I St/B Bit 1 of Port 2, General Purpose Input/Output
TxDC0 O1 St/B CAN Node 0 Transmit Data Output
RxDC5C I St/B CAN Node 5 Receive Data Input
T5EUDB I St/B GPT12E Timer T5 External Up/Down Control
Input
ESR1_5 I St/B ESR1 Trigger Input 5
27 P2.2 O0 / I St/B Bit 2 of Port 2, General Purpose Input/Output
TxDC1 O1 St/B CAN Node 1 Transmit Data Output
ESR2_5 I St/B ESR2 Trigger Input 5
28 P2.3 O0 / I St/B Bit 3 of Port 2, General Purpose Input/Output
U0C0_DOUT O1 St/B USIC0 Channel 0 Shift Data Output
CC2_CC16 O3 / I St/B CAPCOM2 CC16IO Capture Inp./ Compare Out.
ESR2_0 I St/B ESR2 Trigger Input 0
U0C0_DX0E I St/B USIC0 Channel 0 Shift Data Input
U0C1_DX0D I St/B USIC0 Channel 1 Shift Data Input
RxDC0A I St/B CAN Node 0 Receive Data Input
29 P2.4 O0 / I St/B Bit 4 of Port 2, General Purpose Input/Output
U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output
TxDC0 O2 St/B CAN Node 0 Transmit Data Output
CC2_CC17 O3 / I St/B CAPCOM2 CC17IO Capture Inp./ Compare Out.
ESR1_0 I St/B ESR1 Trigger Input 0
U0C0_DX0F I St/B USIC0 Channel 0 Shift Data Input
RxDC1A I St/B CAN Node 1 Receive Data Input
30 P2.5 O0 / I St/B Bit 5 of Port 2, General Purpose Input/Output
U0C0_SCLK
OUT
O1 St/B USIC0 Channel 0 Shift Clock Output
TxDC0 O2 St/B CAN Node 0 Transmit Data Output
CC2_CC18 O3 / I St/B CAPCOM2 CC18IO Capture Inp./ Compare Out.
U0C0_DX1D I St/B USIC0 Channel 0 Shift Clock Input
ESR1_10 I St/B ESR1 Trigger Input 10
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 19 V1.5, 2013-02
31 P2.6 O0 / I St/B Bit 6 of Port 2, General Purpose Input/Output
U0C0_SELO
0
O1 St/B USIC0 Channel 0 Select/Control 0 Output
U0C1_SELO
1
O2 St/B USIC0 Channel 1 Select/Control 1 Output
CC2_CC19 O3 / I St/B CAPCOM2 CC19IO Capture Inp./ Compare Out.
U0C0_DX2D I St/B USIC0 Channel 0 Shift Control Input
RxDC0D I St/B CAN Node 0 Receive Data Input
ESR2_6 I St/B ESR2 Trigger Input 6
35 P2.7 O0 / I St/B Bit 7 of Port 2, General Purpose Input/Output
U0C1_SELO
0
O1 St/B USIC0 Channel 1 Select/Control 0 Output
U0C0_SELO
1
O2 St/B USIC0 Channel 0 Select/Control 1 Output
CC2_CC20 O3 / I St/B CAPCOM2 CC20IO Capture Inp./ Compare Out.
U0C1_DX2C I St/B USIC0 Channel 1 Shift Control Input
RxDC1C I St/B CAN Node 1 Receive Data Input
ESR2_7 I St/B ESR2 Trigger Input 7
36 P2.8 O0 / I DP/B Bit 8 of Port 2, General Purpose Input/Output
U0C1_SCLK
OUT
O1 DP/B USIC0 Channel 1 Shift Clock Output
EXTCLK O2 DP/B Programmable Clock Signal Output
CC2_CC21 O3 / I DP/B CAPCOM2 CC21IO Capture Inp./ Compare Out.
U0C1_DX1D I DP/B USIC0 Channel 1 Shift Clock Input
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 20 V1.5, 2013-02
37 P2.9 O0 / I St/B Bit 9 of Port 2, General Purpose Input/Output
U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output
TxDC1 O2 St/B CAN Node 1 Transmit Data Output
CC2_CC22 O3 / I St/B CAPCOM2 CC22IO Capture Inp./ Compare Out.
CLKIN1 I St/B Clock Signal Input 1
TCK_A IH St/B DAP0/JTAG Clock Input
If JTAG pos. A is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
If DAP pos. 0 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
38 P10.0 O0 / I St/B Bit 0 of Port 10, General Purpose Input/Output
U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output
CCU60_CC6
0
O2 St/B CCU60 Channel 0 Output
CCU60_CC6
0INA
ISt/BCCU60 Channel 0 Input
ESR1_2 I St/B ESR1 Trigger Input 2
U0C0_DX0A I St/B USIC0 Channel 0 Shift Data Input
U0C1_DX0A I St/B USIC0 Channel 1 Shift Data Input
39 P10.1 O0 / I St/B Bit 1 of Port 10, General Purpose Input/Output
U0C0_DOUT O1 St/B USIC0 Channel 0 Shift Data Output
CCU60_CC6
1
O2 St/B CCU60 Channel 1 Output
CCU60_CC6
1INA
ISt/BCCU60 Channel 1 Input
U0C0_DX1A I St/B USIC0 Channel 0 Shift Clock Input
U0C0_DX0B I St/B USIC0 Channel 0 Shift Data Input
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 21 V1.5, 2013-02
40 P10.2 O0 / I St/B Bit 2 of Port 10, General Purpose Input/Output
U0C0_SCLK
OUT
O1 St/B USIC0 Channel 0 Shift Clock Output
CCU60_CC6
2
O2 St/B CCU60 Channel 2 Output
CCU60_CC6
2INA
ISt/BCCU60 Channel 2 Input
U0C0_DX1B I St/B USIC0 Channel 0 Shift Clock Input
42 P2.10 O0 / I St/B Bit 10 of Port 2, General Purpose Input/Output
U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output
U0C0_SELO
3
O2 St/B USIC0 Channel 0 Select/Control 3 Output
CC2_CC23 O3 / I St/B CAPCOM2 CC23IO Capture Inp./ Compare Out.
U0C1_DX0E I St/B USIC0 Channel 1 Shift Data Input
CAPINA I St/B GPT12E Register CAPREL Capture Input
43 P10.3 O0 / I St/B Bit 3 of Port 10, General Purpose Input/Output
CCU60_COU
T60
O2 St/B CCU60 Channel 0 Output
U0C0_DX2A I St/B USIC0 Channel 0 Shift Control Input
U0C1_DX2A I St/B USIC0 Channel 1 Shift Control Input
44 P10.4 O0 / I St/B Bit 4 of Port 10, General Purpose Input/Output
U0C0_SELO
3
O1 St/B USIC0 Channel 0 Select/Control 3 Output
CCU60_COU
T61
O2 St/B CCU60 Channel 1 Output
U0C0_DX2B I St/B USIC0 Channel 0 Shift Control Input
U0C1_DX2B I St/B USIC0 Channel 1 Shift Control Input
ESR1_9 I St/B ESR1 Trigger Input 9
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 22 V1.5, 2013-02
45 P10.5 O0 / I St/B Bit 5 of Port 10, General Purpose Input/Output
U0C1_SCLK
OUT
O1 St/B USIC0 Channel 1 Shift Clock Output
CCU60_COU
T62
O2 St/B CCU60 Channel 2 Output
U2C0_DOUT O3 St/B USIC2 Channel 0 Shift Data Output
U0C1_DX1B I St/B USIC0 Channel 1 Shift Clock Input
46 P10.6 O0 / I St/B Bit 6 of Port 10, General Purpose Input/Output
U0C0_DOUT O1 St/B USIC0 Channel 0 Shift Data Output
TxDC4 O2 St/B CAN Node 4 Transmit Data Output
U1C0_SELO
0
O3 St/B USIC1 Channel 0 Select/Control 0 Output
U0C0_DX0C I St/B USIC0 Channel 0 Shift Data Input
U1C0_DX2D I St/B USIC1 Channel 0 Shift Control Input
CCU60_CTR
APA
ISt/BCCU60 Emergency Trap Input
47 P10.7 O0 / I St/B Bit 7 of Port 10, General Purpose Input/Output
U0C1_DOUT O1 St/B USIC0 Channel 1 Shift Data Output
CCU60_COU
T63
O2 St/B CCU60 Channel 3 Output
U0C1_DX0B I St/B USIC0 Channel 1 Shift Data Input
CCU60_CCP
OS0A
ISt/BCCU60 Position Input 0
RxDC4C I St/B CAN Node 4 Receive Data Input
T4INB I St/B GPT12E Timer T4 Count/Gate Input
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 23 V1.5, 2013-02
51 P10.8 O0 / I St/B Bit 8 of Port 10, General Purpose Input/Output
U0C0_MCLK
OUT
O1 St/B USIC0 Channel 0 Master Clock Output
U0C1_SELO
0
O2 St/B USIC0 Channel 1 Select/Control 0 Output
U2C1_DOUT O3 St/B USIC2 Channel 1 Shift Data Output
CCU60_CCP
OS1A
ISt/BCCU60 Position Input 1
U0C0_DX1C I St/B USIC0 Channel 0 Shift Clock Input
BRKIN_B ISt/BOCDS Break Signal Input
T3EUDB I St/B GPT12E Timer T3 External Up/Down Control
Input
52 P10.9 O0 / I St/B Bit 9 of Port 10, General Purpose Input/Output
U0C0_SELO
4
O1 St/B USIC0 Channel 0 Select/Control 4 Output
U0C1_MCLK
OUT
O2 St/B USIC0 Channel 1 Master Clock Output
CCU60_CCP
OS2A
ISt/BCCU60 Position Input 2
TCK_B IH St/B DAP0/JTAG Clock Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
If DAP pos. 1 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
T3INB I St/B GPT12E Timer T3 Count/Gate Input
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 24 V1.5, 2013-02
53 P10.10 O0 / I St/B Bit 10 of Port 10, General Purpose Input/Output
U0C0_SELO
0
O1 St/B USIC0 Channel 0 Select/Control 0 Output
CCU60_COU
T63
O2 St/B CCU60 Channel 3 Output
U0C0_DX2C I St/B USIC0 Channel 0 Shift Control Input
U0C1_DX1A I St/B USIC0 Channel 1 Shift Clock Input
TDI_B IH St/B JTAG Test Data Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
54 P10.11 O0 / I St/B Bit 11 of Port 10, General Purpose Input/Output
U1C0_SCLK
OUT
O1 St/B USIC1 Channel 0 Shift Clock Output
BRKOUT O2 St/B OCDS Break Signal Output
U1C0_DX1D I St/B USIC1 Channel 0 Shift Clock Input
RxDC2B I St/B CAN Node 2 Receive Data Input
TMS_B IH St/B JTAG Test Mode Selection Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
55 P10.12 O0 / I St/B Bit 12 of Port 10, General Purpose Input/Output
U1C0_DOUT O1 St/B USIC1 Channel 0 Shift Data Output
TxDC2 O2 St/B CAN Node 2 Transmit Data Output
TDO_B OH /
IH
St/B JTAG Test Data Output / DAP1 Input/Output
If DAP pos. 1 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
U1C0_DX0C I St/B USIC1 Channel 0 Shift Data Input
U1C0_DX1E I St/B USIC1 Channel 0 Shift Clock Input
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 25 V1.5, 2013-02
56 P10.13 O0 / I St/B Bit 13 of Port 10, General Purpose Input/Output
U1C0_DOUT O1 St/B USIC1 Channel 0 Shift Data Output
TxDC3 O2 St/B CAN Node 3 Transmit Data Output
U1C0_SELO
3
O3 St/B USIC1 Channel 0 Select/Control 3 Output
U1C0_DX0D I St/B USIC1 Channel 0 Shift Data Input
58 P10.14 O0 / I St/B Bit 14 of Port 10, General Purpose Input/Output
U1C0_SELO
1
O1 St/B USIC1 Channel 0 Select/Control 1 Output
U0C1_DOUT O2 St/B USIC0 Channel 1 Shift Data Output
ESR2_2 I St/B ESR2 Trigger Input 2
U0C1_DX0C I St/B USIC0 Channel 1 Shift Data Input
RxDC3C I St/B CAN Node 3 Receive Data Input
59 P10.15 O0 / I St/B Bit 15 of Port 10, General Purpose Input/Output
U1C0_SELO
2
O1 St/B USIC1 Channel 0 Select/Control 2 Output
U0C1_DOUT O2 St/B USIC0 Channel 1 Shift Data Output
U1C0_DOUT O3 St/B USIC1 Channel 0 Shift Data Output
U0C1_DX1C I St/B USIC0 Channel 1 Shift Clock Input
60 XTAL2 O Sp/M Crystal Oscillator Amplifier Output
61 XTAL1 I Sp/M Crystal Oscillator Amplifier Input
To clock the device from an external source, drive
XTAL1, while leaving XTAL2 unconnected.
Voltages on XTAL1 must comply to the core
supply voltage VDDIM.
ESR2_9 I St/B ESR2 Trigger Input 9
62 PORST IIn/BPower On Reset Input
A low level at this pin resets the XC223xN
completely. A spike filter suppresses input pulses
<10 ns. Input pulses >100 ns safely pass the filter.
The minimum duration for a safe recognition
should be 120 ns.
An internal pull-up device will hold this pin high
when nothing is driving it.
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 26 V1.5, 2013-02
63 ESR0 O0 / I St/B External Service Request 0
After power-up, ESR0 operates as open-drain
bidirectional reset with a weak pull-up.
U1C0_DX0E I St/B USIC1 Channel 0 Shift Data Input
U1C0_DX2B I St/B USIC1 Channel 0 Shift Control Input
6VDDIM - PS/M Digital Core Supply Voltage for Domain M
Decouple with a ceramic capacitor, see Data
Sheet for details.
24,
41,
57
VDDI1 - PS/1 Digital Core Supply Voltage for Domain 1
Decouple with a ceramic capacitor, see Data
Sheet for details.
All VDDI1 pins must be connected to each other.
9VDDPA - PS/A Digital Pad Supply Voltage for Domain A
Connect decoupling capacitors to adjacent
VDDP/VSS pin pairs as close as possible to the pins.
Note: The A/D_Converters and ports P5, P6 and
P15 are fed from supply voltage VDDPA.
2,
16,
18,
32,
34,
48,
50,
64
VDDPB - PS/B Digital Pad Supply Voltage for Domain B
Connect decoupling capacitors to adjacent
VDDP/VSS pin pairs as close as possible to the pins.
Note: The on-chip voltage regulators and all ports
except P5, P6 and P15 are fed from supply
voltage VDDPB.
1,
17,
33,
49
VSS - PS/-- Digital Ground
All VSS pins must be connected to the ground-line
or ground-plane.
Note: Also the exposed pad is connected
internally to VSS. To improve the EMC
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to the
Data Sheet. Board layout examples are
given in an application note.
Table 6 Pin Definitions and Functions (cont’d)
Pin Symbol Ctrl. Type Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
General Device Information
Data Sheet 27 V1.5, 2013-02
2.2 Identification Registers
The identification registers describe the current version of the XC223xN and of its
modules.
Table 7 XC223xN Identification Registers
Short Name Value Address Notes
SCU_IDMANUF 1820H00’F07EH
SCU_IDCHIP 3001H00’F07CHmarking EES-AA or ES-AA
3002H00’F07CHmarking AA, AB
SCU_IDMEM 304FH00’F07AH
SCU_IDPROG 1313H00’F078H
JTAG_ID 0018’B083H--- marking EES-AA or ES-AA
1018’B083H--- marking AA, AB
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 28 V1.5, 2013-02
3 Functional Description
The architecture of the XC223xN combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a well-balanced design. On-chip
memory blocks allow the design of compact systems-on-silicon with maximum
performance suited for computing, control, and communication.
The on-chip memory blocks (program code memory and SRAM, dual-port RAM, data
SRAM) and the generic peripherals are connected to the CPU by separate high-speed
buses. Another bus, the LXBus, connects additional on-chip resources and external
resources. This bus structure enhances overall system performance by enabling the
concurrent operation of several subsystems of the XC223xN.
The block diagram gives an overview of the on-chip components and the advanced
internal bus structure of the XC223xN.
Figure 4 Block Diagram
DPRAM
CPU
PMU
DMU
ADC0
Module
8-/10-
Bit
RTC
MCHK
Interrupt & PEC
EBC
LXBus Control
External Bus
Control
DSRAM
System Functions
Clock, Reset, Power
Control, StandBy RAM
OCDS
Debug Support
Interrupt Bus
Peripheral Data Bus
Analog and Digital General Purpose IO (GPIO) Ports
MC_N-SERIES_BLOCKDIAGRAM
GPT
5
Timers
CC2
Module
16
Chan.
LXBus
WDT
Multi
CAN
CCU6x
Modules
3+1
Chan.
each
USICx
Modules
2
Chan.
each
PSRAM
Flash Memory
IMB
MAC Unit
MPU
ADC1
Module
8-/10-
Bit
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 29 V1.5, 2013-02
3.1 Memory Subsystem and Organization
The memory space of the XC223xN is configured in the von Neumann architecture. In
this architecture all internal and external resources, including code memory, data
memory, registers and I/O ports, are organized in the same linear address space.
Table 8 XC223xN Memory Map 1)
Address Area Start Loc. End Loc. Area Size2) Notes
IMB register space FF’FF00HFF’FFFFH256 Bytes
Reserved F0’0000HFF’FEFFH< 1 Mbyte Minus IMB registers
Reserved for EPSRAM E8’4000HEF’FFFFH496 Kbytes Mirrors EPSRAM
Emulated PSRAM E8’0000HE8’3FFFHup to
16 Kbytes
With Flash timing
Reserved for PSRAM E0’4000HE7’FFFFH496 Kbytes Mirrors PSRAM
PSRAM E0’0000HE0’3FFFHup to
16 Kbytes
Program SRAM
Reserved for Flash C5’0000HDF’FFFFH1,728 Kbytes
Flash 1 C4’0000HC4’FFFFH64 Kbytes
Flash 0 C0’0000HC3’FFFFH256 Kbytes3) Minus res. seg.
External memory area 40’0000HBF’FFFFH8 Mbytes
External IO area4) 21’0000H3F’FFFFH1,984 Kbytes
Reserved 20’BC00H20’FFFFH17 Kbytes
USIC0–2 alternate regs. 20’B000H20’BBFFH3 Kbytes Accessed via EBC
MultiCAN alternate regs. 20’8000H20’AFFFH12 Kbytes Accessed via EBC
Reserved 20’5800H20’7FFFH10 Kbytes
USIC0–2 registers 20’4000H20’57FFH6 Kbytes Accessed via EBC
Reserved 20’6800H20’7FFFH6 Kbytes
MultiCAN registers 20’0000H20’3FFFH16 Kbytes Accessed via EBC
External memory area 01’0000H1F’FFFFH1984 Kbytes
SFR area 00’FE00H00’FFFFH0.5 Kbytes
Dualport RAM (DPRAM) 00’F600H00’FDFFH2 Kbytes
Reserved for DPRAM 00’F200H00’F5FFH1 Kbytes
ESFR area 00’F000H00’F1FFH0.5 Kbytes
XSFR area 00’E000H00’EFFFH4 Kbytes
Data SRAM (DSRAM) 00’A000H00’DFFFH16 Kbytes
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 30 V1.5, 2013-02
This common memory space consists of 16 Mbytes organized as 256 segments of
64 Kbytes; each segment contains four data pages of 16 Kbytes. The entire memory
space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the
register spaces (ESFR/SFR) additionally are directly bit addressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
access to the program memories such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
access to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected to the high-speed system bus so that they can
exchange data. This is required if operands are read from program memory, code or
data is written to the PSRAM, code is fetched from external memory, or data is read from
or written to external resources. These include peripherals on the LXBus such as USIC
or MultiCAN. The system bus allows concurrent two-way communication for maximum
transfer performance.
Up to 16 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code
or data. The PSRAM is accessed via the PMU and is optimized for code fetches. A
section of the PSRAM with programmable size can be write-protected.
Note: The actual size of the PSRAM depends on the quoted device type.
Reserved for DSRAM 00’8000H00’9FFFH8 Kbytes
External memory area 00’0000H00’7FFFH32 Kbytes
1) Accesses to the shaded areas are reserved. In devices with external bus interface these accesses generate
external bus accesses.
2) The areas marked with “<” are slightly smaller than indicated, see column “Notes”.
3) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
4) Several pipeline optimizations are not active within the external IO area. This is necessary to control external
peripherals properly.
Table 8 XC223xN Memory Map (cont’d)1)
Address Area Start Loc. End Loc. Area Size2) Notes
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 31 V1.5, 2013-02
Up to 16 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user
data. The DSRAM is accessed via a separate interface and is optimized for data access.
Note: The actual size of the DSRAM depends on the quoted device type.
2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined
variables, for the system stack, and for general purpose register banks. A register bank
can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, …, RL7,
RH7) General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
8 Kbytes of on-chip Stand-By SRAM (SBRAM) provide storage for system-relevant
user data that must be preserved while the major part of the device is powered down.
The SBRAM is accessed via a specific interface and is powered in domain M.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word-wide registers which are
used to control and monitor functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XC2000 Family. In order to ensure
upward compatibility they should either not be accessed or written with zeros.
In order to meet the requirements of designs where more memory is required than is
available on chip, up to 12 Mbytes (approximately, see Table 8) of external RAM and/or
ROM can be connected to the microcontroller. The External Bus Interface also provides
access to external peripherals.
The on-chip Flash memory stores code, constant data, and control data. The
320 Kbytes of on-chip Flash memory consist of 1 module of 64 Kbytes (preferably for
data storage) and 1 module of 256 Kbytes. Each module is organized in 4-Kbyte sectors.
The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used
internally to store operation control parameters and protection information.
Note: The actual size of the Flash memory depends on the chosen device type.
Each sector can be separately write protected1), erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A user-defined password
sequence temporarily unlocks protected areas. The Flash modules combine 128-bit
read access with protected and efficient writing algorithms for programming and erasing.
Dynamic error correction provides extremely high read data security for all read access
operations. Access to different Flash modules can be executed in parallel.
For Flash parameters, please see Section 4.6.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for
programming/erasing.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 32 V1.5, 2013-02
Memory Content Protection
The contents of on-chip memories can be protected against soft errors (induced e.g. by
radiation) by activating the parity mechanism or the Error Correction Code (ECC).
The parity mechanism can detect a single-bit error and prevent the software from using
incorrect data or executing incorrect instructions.
The ECC mechanism can detect and automatically correct single-bit errors. This
supports the stable operation of the system.
It is strongly recommended to activate the ECC mechanism wherever possible because
this dramatically increases the robustness of an application against such soft errors.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 33 V1.5, 2013-02
3.2 Central Processing Unit (CPU)
The core of the CPU consists of a 5-stage execution pipeline with a 2-stage instruction-
fetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and
accumulate unit (MAC), a register-file providing three register banks, and dedicated
SFRs. The ALU features a multiply-and-divide unit, a bit-mask generator, and a barrel
shifter.
Figure 5 CPU Block Diagram
DPRAM
CPU
IPIP
RF
R0
R1
GPRs
R14
R15
R0
R1
GPRs
R14
R15
IFU
Injection/
Exception
Handler
ADU
MAC
mca04917_x.vsd
CPUCON1
CPUCON2
CSP IP
Return
Stack
FIFO
Branch
Unit
Prefetch
Unit
VECSEG
TFR
+/-
IDX0
IDX1
QX0
QX1
QR0
QR1
DPP0
DPP1
DPP2
DPP3
SPSEG
SP
STKOV
STKUN
+/-
MRW
MCW
MSW
MAL
+/-
MAH
Multiply
Unit
ALU
Division Unit
Multiply Unit
Bit-Mask-Gen.
Barrel-Shifter
+/-
MDC
PSW
MDH
ZEROS
MDL
ONES
R0
R1
GPRs
R14
R15
CP
WB
Buffer
2-Stage
Prefetch
Pipeline
5-Stage
Pipeline
R0
R1
GPRs
R14
R15
PMU
DMU
DSRAM
EBC
Peripherals
PSRAM
Flash/ROM
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 34 V1.5, 2013-02
With this hardware most XC223xN instructions are executed in a single machine cycle
of 12.5 ns @ 80-MHz CPU clock. For example, shift and rotate instructions are always
processed during one machine cycle, no matter how many bits are shifted. Also,
multiplication and most MAC instructions execute in one cycle. All multiple-cycle
instructions have been optimized so that they can be executed very fast; for example, a
32-/16-bit division is started within 4 cycles while the remaining cycles are executed in
the background. Another pipeline optimization, the branch target prediction, eliminates
the execution time of branch instructions if the prediction was correct.
The CPU has a register context consisting of up to three register banks with 16 word-
wide GPRs each at its disposal. One of these register banks is physically allocated within
the on-chip DPRAM area. A Context Pointer (CP) register determines the base address
of the active register bank accessed by the CPU at any time. The number of these
register bank copies is only restricted by the available internal RAM space. For easy
parameter passing, a register bank may overlap others.
A system stack of up to 32 Kwords is provided for storage of temporary data. The system
stack can be allocated to any location within the address space (preferably in the on-chip
RAM area); it is accessed by the CPU with the stack pointer (SP) register. Two separate
SFRs, STKOV and STKUN, are implicitly compared with the stack pointer value during
each stack access to detect stack overflow or underflow.
The high performance of the CPU hardware implementation can be best utilized by the
programmer with the highly efficient XC223xN instruction set. This includes the following
instruction classes:
• Standard Arithmetic Instructions
• DSP-Oriented Arithmetic Instructions
• Logical Instructions
• Boolean Bit Manipulation Instructions
• Compare and Loop Control Instructions
• Shift and Rotate Instructions
• Prioritize Instruction
• Data Movement Instructions
• System Stack Instructions
• Jump and Call Instructions
• Return Instructions
• System Control Instructions
• Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes
and words. A variety of direct, indirect or immediate addressing modes are provided to
specify the required operands.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 35 V1.5, 2013-02
3.3 Memory Protection Unit (MPU)
The XC223xN’s Memory Protection Unit (MPU) protects user-specified memory areas
from unauthorized read, write, or instruction fetch accesses. The MPU can protect the
whole address space including the peripheral area. This completes established
mechanisms such as the register security mechanism or stack overrun/underrun
detection.
Four Protection Levels support flexible system programming where operating system,
low level drivers, and applications run on separate levels. Each protection level permits
different access restrictions for instructions and/or data.
Every access is checked (if the MPU is enabled) and an access violating the permission
rules will be marked as invalid and leads to a protection trap.
A set of protection registers for each protection level specifies the address ranges and
the access permissions. Applications requiring more than 4 protection levels can
dynamically re-program the protection registers.
3.4 Memory Checker Module (MCHK)
The XC223xN’s Memory Checker Module calculates a checksum (fractional polynomial
division) on a block of data, often called Cyclic Redundancy Code (CRC). It is based on
a 32-bit linear feedback shift register and may, therefore, also be used to generate
pseudo-random numbers.
The Memory Checker Module is a 16-bit parallel input signature compression circuitry
which enables error detection within a block of data stored in memory, registers, or
communicated e.g. via serial communication lines. It reduces the probability of error
masking due to repeated error patterns by calculating the signature of blocks of data.
The polynomial used for operation is configurable, so most of the commonly used
polynomials may be used. Also, the block size for generating a CRC result is
configurable via a local counter. An interrupt may be generated if testing the current data
block reveals an error.
An autonomous CRC compare circuitry is included to enable redundant error detection,
e.g. to enable higher safety integrity levels.
The Memory Checker Module provides enhanced fault detection (beyond parity or ECC)
for data and instructions in volatile and non volatile memories. This is especially
important for the safety and reliability of embedded systems.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 36 V1.5, 2013-02
3.5 Interrupt System
The architecture of the XC223xN supports several mechanisms for fast and flexible
response to service requests; these can be generated from various sources internal or
external to the microcontroller. Any of these interrupt requests can be programmed to be
serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).
Using a standard interrupt service the current program execution is suspended and a
branch to the interrupt vector table is performed. With the PEC just one cycle is ‘stolen’
from the current CPU activity to perform the PEC service. A PEC service implies a single
byte or word data transfer between any two memory locations with an additional
increment of either the PEC source pointer, the destination pointer, or both. An individual
PEC transfer counter is implicitly decremented for each PEC service except when
performing in the continuous transfer mode. When this counter reaches zero, a standard
interrupt is performed to the corresponding source-related vector location. PEC services
are particularly well suited to supporting the transmission or reception of blocks of data.
The XC223xN has eight PEC channels, each with fast interrupt-driven data transfer
capabilities.
With a minimum interrupt response time of 7/111) CPU clocks, the XC223xN can react
quickly to the occurrence of non-deterministic events.
Interrupt Nodes and Source Selection
The interrupt system provides 96 physical nodes with separate control register
containing an interrupt request flag, an interrupt enable flag and an interrupt priority bit
field. Most interrupt sources are assigned to a dedicated node. A particular subset of
interrupt sources shares a set of nodes. The source selection can be programmed using
the interrupt source selection (ISSR) registers.
External Request Unit (ERU)
A dedicated External Request Unit (ERU) is provided to route and preprocess selected
on-chip peripheral and external interrupt requests. The ERU features 4 programmable
input channels with event trigger logic (ETL) a routing matrix and 4 output gating units
(OGU). The ETL features rising edge, falling edge, or both edges event detection. The
OGU combines the detected interrupt events and provides filtering capabilities
depending on a programmable pattern match or miss.
Trap Processing
The XC223xN provides efficient mechanisms to identify and process exceptions or error
conditions that arise during run-time, the so-called ‘Hardware Traps’. A hardware trap
causes an immediate system reaction similar to a standard interrupt service (branching
1) Depending if the jump cache is used or not.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 37 V1.5, 2013-02
to a dedicated vector table location). The occurrence of a hardware trap is also indicated
by a single bit in the trap flag register (TFR). Unless another higher-priority trap service
is in progress, a hardware trap will interrupt any ongoing program execution. In turn,
hardware trap services can normally not be interrupted by standard or PEC interrupts.
Depending on the package option up to 3 External Service Request (ESR) pins are
provided. The ESR unit processes their input values and allows to implement user
controlled trap functions (System Requests SR0 and SR1). In this way reset, wakeup
and power control can be efficiently realized.
Software interrupts are supported by the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number. Alternatively to emulate an interrupt by software a
program can trigger interrupt requests by writing the Interrupt Request (IR) bit of an
interrupt control register.
3.6 On-Chip Debug Support (OCDS)
The On-Chip Debug Support system built into the XC223xN provides a broad range of
debug and emulation features. User software running on the XC223xN can be debugged
within the target system environment.
The OCDS is controlled by an external debugging device via the debug interface. This
either consists of the 2-pin Device Access Port (DAP) or of the JTAG port conforming to
IEEE-1149. The debug interface can be completed with an optional break interface.
The debugger controls the OCDS with a set of dedicated registers accessible via the
debug interface (DAP or JTAG). In addition the OCDS system can be controlled by the
CPU, e.g. by a monitor program. An injection interface allows the execution of OCDS-
generated instructions by the CPU.
Multiple breakpoints can be triggered by on-chip hardware, by software, or by an
external trigger input. Single stepping is supported, as is the injection of arbitrary
instructions and read/write access to the complete internal address space. A breakpoint
trigger can be answered with a CPU halt, a monitor call, a data transfer, or/and the
activation of an external signal.
Tracing of data can be obtained via the debug interface, or via the external bus interface
for increased performance.
Tracing of program execution is supported by the XC2000 Family emulation device. With
this device the DAP can operate on clock rates of up to 20 MHz.
The DAP interface uses two interface signals, the JTAG interface uses four interface
signals, to communicate with external circuitry. The debug interface can be amended
with two optional break lines.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 38 V1.5, 2013-02
3.7 Capture/Compare Unit (CC2)
The CAPCOM unit supports generation and control of timing sequences on up to
16 channels with a maximum resolution of one system clock cycle (eight cycles in
staggered mode). The CAPCOM unit is typically used to handle high-speed I/O tasks
such as pulse and waveform generation, pulse width modulation (PWM), digital to
analog (D/A) conversion, software timing, or time recording with respect to external
events.
Two 16-bit timers with reload registers provide two independent time bases for the
capture/compare register array.
The input clock for the timers is programmable to several prescaled values of the internal
system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.
This provides a wide range of variation for the timer period and resolution and allows
precise adjustments to the application specific requirements. In addition, external count
inputs allow event scheduling for the capture/compare registers relative to external
events.
The capture/compare register array contains 16 dual purpose capture/compare
registers, each of which may be individually allocated to either CAPCOM timer and
programmed for capture or compare function.
All registers have each one port pin associated with it which serves as an input pin for
triggering the capture function, or as an output pin to indicate the occurrence of a
compare event.
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin which is associated with this
register. In addition, a specific interrupt request for this capture/compare register is
generated. Either a positive, a negative, or both a positive and a negative external signal
transition at the pin can be selected as the triggering event.
The contents of all registers which have been selected for one of the five compare modes
are continuously compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the selected compare mode.
Table 9 Compare Modes
Compare Modes Function
Mode 0 Interrupt-only compare mode;
Several compare interrupts per timer period are possible
Mode 1 Pin toggles on each compare match;
Several compare events per timer period are possible
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 39 V1.5, 2013-02
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin associated with this register. In
addition, a specific interrupt request for this capture/compare register is generated.
Either a positive, a negative, or both a positive and a negative external signal transition
at the pin can be selected as the triggering event.
The contents of all registers selected for one of the five compare modes are continuously
compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the compare mode selected.
Mode 2 Interrupt-only compare mode;
Only one compare interrupt per timer period is generated
Mode 3 Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;
Only one compare event per timer period is generated
Double Register
Mode
Two registers operate on one pin;
Pin toggles on each compare match;
Several compare events per timer period are possible
Single Event Mode Generates single edges or pulses;
Can be used with any compare mode
Table 9 Compare Modes (cont’d)
Compare Modes Function
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 40 V1.5, 2013-02
Figure 6 CAPCOM Unit Block Diagram
Sixteen
16-bit
Capture/
Compare
Registers
Mode
Control
(Capture
or
Compare)
T7
Input
Control
T8
Input
Control
MC_CAPCOM2_BLOCKDIAG
CC16IRQ
CC31IRQ
CC17IRQ
T7IRQ
T8IRQ
CC16IO
CC17IO
T7IN
T6OUF
f
CC
T6OUF
f
CC
Reload Reg.
T7REL
Timer T7
Timer T8
Reload Reg.
T8REL
CC31IO
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 41 V1.5, 2013-02
3.8 Capture/Compare Units CCU6x
The XC223xN types feature the CCU60, CCU61 unit(s).
CCU6 is a high-resolution capture and compare unit with application-specific modes. It
provides inputs to start the timers synchronously, an important feature in devices with
several CCU6 modules.
The module provides two independent timers (T12, T13), that can be used for PWM
generation, especially for AC motor control. Additionally, special control modes for block
commutation and multi-phase machines are supported.
Timer 12 Features
• Three capture/compare channels, where each channel can be used either as a
capture or as a compare channel.
• Supports generation of a three-phase PWM (six outputs, individual signals for high-
side and low-side switches)
• 16-bit resolution, maximum count frequency = peripheral clock
• Dead-time control for each channel to avoid short circuits in the power stage
• Concurrent update of the required T12/13 registers
• Center-aligned and edge-aligned PWM can be generated
• Single-shot mode supported
• Many interrupt request sources
• Hysteresis-like control mode
• Automatic start on a HW event (T12HR, for synchronization purposes)
Timer 13 Features
• One independent compare channel with one output
• 16-bit resolution, maximum count frequency = peripheral clock
• Can be synchronized to T12
• Interrupt generation at period match and compare match
• Single-shot mode supported
• Automatic start on a HW event (T13HR, for synchronization purposes)
Additional Features
• Block commutation for brushless DC drives implemented
• Position detection via Hall sensor pattern
• Automatic rotational speed measurement for block commutation
• Integrated error handling
• Fast emergency stop without CPU load via external signal (CTRAP)
• Control modes for multi-channel AC drives
• Output levels can be selected and adapted to the power stage
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 42 V1.5, 2013-02
Figure 7 CCU6 Block Diagram
Timer T12 can work in capture and/or compare mode for its three channels. The modes
can also be combined. Timer T13 can work in compare mode only. The multi-channel
control unit generates output patterns that can be modulated by timer T12 and/or timer
T13. The modulation sources can be selected and combined for signal modulation.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 43 V1.5, 2013-02
3.9 General Purpose Timer (GPT12E) Unit
The GPT12E unit is a very flexible multifunctional timer/counter structure which can be
used for many different timing tasks such as event timing and counting, pulse width and
duty cycle measurements, pulse generation, or pulse multiplication.
The GPT12E unit incorporates five 16-bit timers organized in two separate modules,
GPT1 and GPT2. Each timer in each module may either operate independently in a
number of different modes or be concatenated with another timer of the same module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for
one of four basic modes of operation: Timer, Gated Timer, Counter, and Incremental
Interface Mode. In Timer Mode, the input clock for a timer is derived from the system
clock and divided by a programmable prescaler. Counter Mode allows timer clocking in
reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes each timer has one associated port pin (TxIN) which serves as a gate or clock
input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.
The counting direction (up/down) for each timer can be programmed by software or
altered dynamically by an external signal on a port pin (TxEUD), e.g. to facilitate position
tracking.
In Incremental Interface Mode the GPT1 timers can be directly connected to the
incremental position sensor signals A and B through their respective inputs TxIN and
TxEUD. Direction and counting signals are internally derived from these two input
signals, so that the contents of the respective timer Tx corresponds to the sensor
position. The third position sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer
overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out
monitoring of external hardware components. It may also be used internally to clock
timers T2 and T4 for measuring long time periods with high resolution.
In addition to the basic operating modes, T2 and T4 may be configured as reload or
capture register for timer T3. A timer used as capture or reload register is stopped. The
contents of timer T3 is captured into T2 or T4 in response to a signal at the associated
input pin (TxIN). Timer T3 is reloaded with the contents of T2 or T4, triggered either by
an external signal or a selectable state transition of its toggle latch T3OTL. When both
T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL
with the low and high times of a PWM signal, this signal can be continuously generated
without software intervention.
Note: Signals T2IN, T2EUD, T4EUD, and T6EUD are not connected to pins.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 44 V1.5, 2013-02
Figure 8 Block Diagram of GPT1
MC_GPT_BLOCK 1
Aux. Timer T2
2
n
:1
T2
Mode
Control
Capture
U/D
Basic Clock
f
GPT
T3CON.BPS1
T3OTL T3OUT
Toggle
Latch
T2IN
T2EUD Reload
Core Timer T3
T3
Mode
Control
T3IN
T3EUD U/D
Interrupt
Request
(T3IRQ)
T4
Mode
Control
U/D
Aux. Timer T4
T4EUD
T4IN Reload
Capture
Interrupt
Request
(T4IRQ)
Interrupt
Request
(T2IRQ)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 45 V1.5, 2013-02
With its maximum resolution of 2 system clock cycles, the GPT2 module provides
precise event control and time measurement. It includes two timers (T5, T6) and a
capture/reload register (CAPREL). Both timers can be clocked with an input clock which
is derived from the CPU clock via a programmable prescaler or with external signals. The
counting direction (up/down) for each timer can be programmed by software or altered
dynamically with an external signal on a port pin (TxEUD). Concatenation of the timers
is supported with the output toggle latch (T6OTL) of timer T6, which changes its state on
each timer overflow/underflow.
The state of this latch may be used to clock timer T5, and/or it may be output on pin
T6OUT. The overflows/underflows of timer T6 can also be used to clock the CAPCOM2
timers and to initiate a reload from the CAPREL register.
The CAPREL register can capture the contents of timer T5 based on an external signal
transition on the corresponding port pin (CAPIN); timer T5 may optionally be cleared
after the capture procedure. This allows the XC223xN to measure absolute time
differences or to perform pulse multiplication without software overhead.
The capture trigger (timer T5 to CAPREL) can also be generated upon transitions of
GPT1 timer T3 inputs T3IN and/or T3EUD. This is especially advantageous when T3
operates in Incremental Interface Mode.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 46 V1.5, 2013-02
Figure 9 Block Diagram of GPT2
MC_GPT_BLOCK 2
GPT2 Timer T5
2
n
:1
T5
Mode
Control
GPT2 CAPREL
T3IN/
T3EUD
CAPREL
Mode
Control
T6
Mode
Control
Reload
Clear
U/D
Capture
Clear
U/D
T5IN
CAPIN
Interrupt
Request
(T5IRQ)
Interrupt
Request
(T6IRQ)
Interrupt
Request
(CRIRQ)
Basic Clock
f
GPT
T6CON.BPS2
T6IN
GPT2 Timer T6 T6OTL T6OUT
T6OUF
Toggle
FF
T6EUD
T5EUD
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 47 V1.5, 2013-02
3.10 Real Time Clock
The Real Time Clock (RTC) module of the XC223xN can be clocked with a clock signal
selected from internal sources or external sources (pins).
The RTC basically consists of a chain of divider blocks:
• Selectable 32:1 and 8:1 dividers (on - off)
• The reloadable 16-bit timer T14
• The 32-bit RTC timer block (accessible via registers RTCH and RTCL) consisting of:
– a reloadable 10-bit timer
– a reloadable 6-bit timer
– a reloadable 6-bit timer
– a reloadable 10-bit timer
All timers count up. Each timer can generate an interrupt request. All requests are
combined to a common node request.
Figure 10 RTC Block Diagram
Note: The registers associated with the RTC are only affected by a power reset.
CNT-Register
REL-Register
10 Bits6 Bits6 Bits10 BitsT14
MCB05568B
T14-Register
Interrupt Sub Node RTCINT
MUX
32
PRE
RUN
CNT
INT3
CNT
INT2
CNT
INT1
CNT
INT0
f
CNT
f
RTC
T14REL 10 Bits6 Bits6 Bits10 Bits
:
MUX
8:
REFCLK
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 48 V1.5, 2013-02
The RTC module can be used for different purposes:
• System clock to determine the current time and date
• Cyclic time-based interrupt, to provide a system time tick independent of CPU
frequency and other resources
• 48-bit timer for long-term measurements
• Alarm interrupt at a defined time
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 49 V1.5, 2013-02
3.11 A/D Converters
For analog signal measurement, up to two 10-bit A/D converters (ADC0, ADC1) with
7 + 2 multiplexed input channels and a sample and hold circuit have been integrated on-
chip. 2 inputs can be converted by both A/D converters. Conversions use the successive
approximation method. The sample time (to charge the capacitors) and the conversion
time are programmable so that they can be adjusted to the external circuit. The A/D
converters can also operate in 8-bit conversion mode, further reducing the conversion
time.
Several independent conversion result registers, selectable interrupt requests, and
highly flexible conversion sequences provide a high degree of programmability to meet
the application requirements. Both modules can be synchronized to allow parallel
sampling of two input channels.
For applications that require more analog input channels, external analog multiplexers
can be controlled automatically. For applications that require fewer analog input
channels, the remaining channel inputs can be used as digital input port pins.
The A/D converters of the XC223xN support two types of request sources which can be
triggered by several internal and external events.
• Parallel requests are activated at the same time and then executed in a predefined
sequence.
• Queued requests are executed in a user-defined sequence.
In addition, the conversion of a specific channel can be inserted into a running sequence
without disturbing that sequence. All requests are arbitrated according to the priority
level assigned to them.
Data reduction features reduce the number of required CPU access operations allowing
the precise evaluation of analog inputs (high conversion rate) even at a low CPU speed.
Result data can be reduced by limit checking or accumulation of results.
The Peripheral Event Controller (PEC) can be used to control the A/D converters or to
automatically store conversion results to a table in memory for later evaluation, without
requiring the overhead of entering and exiting interrupt routines for each data transfer.
Each A/D converter contains eight result registers which can be concatenated to build a
result FIFO. Wait-for-read mode can be enabled for each result register to prevent the
loss of conversion data.
In order to decouple analog inputs from digital noise and to avoid input trigger noise,
those pins used for analog input can be disconnected from the digital input stages. This
can be selected for each pin separately with the Port x Digital Input Disable registers.
The Auto-Power-Down feature of the A/D converters minimizes the power consumption
when no conversion is in progress.
Broken wire detection for each channel and a multiplexer test mode provide information
to verify the proper operation of the analog signal sources (e.g. a sensor system).
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 50 V1.5, 2013-02
3.12 Universal Serial Interface Channel Modules (USIC)
The XC223xN features the USIC modules USIC0, USIC1, USIC2. Each module provides
two serial communication channels.
The Universal Serial Interface Channel (USIC) module is based on a generic data shift
and data storage structure which is identical for all supported serial communication
protocols. Each channel supports complete full-duplex operation with a basic data buffer
structure (one transmit buffer and two receive buffer stages). In addition, the data
handling software can use FIFOs.
The protocol part (generation of shift clock/data/control signals) is independent of the
general part and is handled by protocol-specific preprocessors (PPPs).
The USIC’s input/output lines are connected to pins by a pin routing unit. The inputs and
outputs of each USIC channel can be assigned to different interface pins, providing great
flexibility to the application software. All assignments can be made during runtime.
Figure 11 General Structure of a USIC Module
The regular structure of the USIC module brings the following advantages:
• Higher flexibility through configuration with same look-and-feel for data management
• Reduced complexity for low-level drivers serving different protocols
• Wide range of protocols with improved performances (baud rate, buffer handling)
USIC_basic.vsd
Bus Interface
DBU
0
DBU
1
Control 0
Control 1
DSU
0
DSU
1
PPP_A
PPP_B
PPP_C
PPP_D
PPP_A
PPP_B
PPP_C
PPP_D
Pin Routing Shell
Buffer & Shift Structure Protocol Preprocessors PinsBus
fsys Fractional
Dividers
Baud rate
Generators
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 51 V1.5, 2013-02
Target Protocols
Each USIC channel can receive and transmit data frames with a selectable data word
width from 1 to 16 bits in each of the following protocols:
•UART (asynchronous serial channel)
– module capability: maximum baud rate = fSYS / 4
– data frame length programmable from 1 to 63 bits
– MSB or LSB first
•LIN Support (Local Interconnect Network)
– module capability: maximum baud rate = fSYS / 16
– checksum generation under software control
– baud rate detection possible by built-in capture event of baud rate generator
•SSC/SPI (synchronous serial channel with or without data buffer)
– module capability: maximum baud rate = fSYS / 2, limited by loop delay
– number of data bits programmable from 1 to 63, more with explicit stop condition
– MSB or LSB first
– optional control of slave select signals
•IIC (Inter-IC Bus)
– supports baud rates of 100 kbit/s and 400 kbit/s
•IIS (Inter-IC Sound Bus)
– module capability: maximum baud rate = fSYS / 2
Note: Depending on the selected functions (such as digital filters, input synchronization
stages, sample point adjustment, etc.), the maximum achievable baud rate can be
limited. Please note that there may be additional delays, such as internal or
external propagation delays and driver delays (e.g. for collision detection in UART
mode, for IIC, etc.).
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 52 V1.5, 2013-02
3.13 MultiCAN Module
The MultiCAN module contains independently operating CAN nodes with Full-CAN
functionality which are able to exchange Data and Remote Frames using a gateway
function. Transmission and reception of CAN frames is handled in accordance with CAN
specification V2.0 B (active). Each CAN node can receive and transmit standard frames
with 11-bit identifiers as well as extended frames with 29-bit identifiers.
All CAN nodes share a common set of message objects. Each message object can be
individually allocated to one of the CAN nodes. Besides serving as a storage container
for incoming and outgoing frames, message objects can be combined to build gateways
between the CAN nodes or to set up a FIFO buffer.
Note: The number of CAN nodes and message objects depends on the selected device
type.
The message objects are organized in double-chained linked lists, where each CAN
node has its own list of message objects. A CAN node stores frames only into message
objects that are allocated to its own message object list and it transmits only messages
belonging to this message object list. A powerful, command-driven list controller
performs all message object list operations.
Figure 12 Block Diagram of MultiCAN Module
mc_multican_ block.vsd
MultiCAN Module Kernel
Interrupt
Control
f
CAN
Port
Control
CAN Control
Message
Object
Buffer
CAN
Node 0
Linked
List
Control
Clock
Control
Address
Decoder
CAN
Node n
TXDCn
RXDCn
TXDC0
RXDC0
...
...
...
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 53 V1.5, 2013-02
MultiCAN Features
• CAN functionality conforming to CAN specification V2.0 B active for each CAN node
(compliant to ISO 11898)
• Independent CAN nodes
• Set of independent message objects (shared by the CAN nodes)
• Dedicated control registers for each CAN node
• Data transfer rate up to 1 Mbit/s, individually programmable for each node
• Flexible and powerful message transfer control and error handling capabilities
• Full-CAN functionality for message objects:
– Can be assigned to one of the CAN nodes
– Configurable as transmit or receive objects, or as message buffer FIFO
– Handle 11-bit or 29-bit identifiers with programmable acceptance mask for filtering
– Remote Monitoring Mode, and frame counter for monitoring
• Automatic Gateway Mode support
• 16 individually programmable interrupt nodes
• Analyzer mode for CAN bus monitoring
3.14 System Timer
The System Timer consists of a programmable prescaler and two concatenated timers
(10 bits and 6 bits). Both timers can generate interrupt requests. The clock source can
be selected and the timers can also run during power reduction modes.
Therefore, the System Timer enables the software to maintain the current time for
scheduling functions or for the implementation of a clock.
3.15 Watchdog Timer
The Watchdog Timer is one of the fail-safe mechanisms which have been implemented
to prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after an application reset of the chip. It can be
disabled and enabled at any time by executing the instructions DISWDT and ENWDT
respectively. The software has to service the Watchdog Timer before it overflows. If this
is not the case because of a hardware or software failure, the Watchdog Timer
overflows, generating a prewarning interrupt and then a reset request.
The Watchdog Timer is a 16-bit timer clocked with the system clock divided by 16,384
or 256. The Watchdog Timer register is set to a prespecified reload value (stored in
WDTREL) in order to allow further variation of the monitored time interval. Each time it
is serviced by the application software, the Watchdog Timer is reloaded and the
prescaler is cleared.
Time intervals between 3.2 μs and 13.4 s can be monitored (@ 80 MHz).
The default Watchdog Timer interval after power-up is 6.5 ms (@ 10 MHz).
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 54 V1.5, 2013-02
3.16 Clock Generation
The Clock Generation Unit can generate the system clock signal fSYS for the XC223xN
from a number of external or internal clock sources:
• External clock signals with pad voltage or core voltage levels
• External crystal or resonator using the on-chip oscillator
• On-chip clock source for operation without crystal/resonator
• Wake-up clock (ultra-low-power) to further reduce power consumption
The programmable on-chip PLL with multiple prescalers generates a clock signal for
maximum system performance from standard crystals, a clock input signal, or from the
on-chip clock source. See also Section 4.7.2.
The Oscillator Watchdog (OWD) generates an interrupt if the crystal oscillator frequency
falls below a certain limit or stops completely. In this case, the system can be supplied
with an emergency clock to enable operation even after an external clock failure.
All available clock signals can be output on one of two selectable pins.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 55 V1.5, 2013-02
3.17 Parallel Ports
The XC223xN provides up to 40 I/O lines which are organized into 4 input/output ports
and 2 input ports. All port lines are bit-addressable, and all input/output lines can be
individually (bit-wise) configured via port control registers. This configuration selects the
direction (input/output), push/pull or open-drain operation, activation of pull devices, and
edge characteristics (shape) and driver characteristics (output current) of the port
drivers. The I/O ports are true bidirectional ports which are switched to high impedance
state when configured as inputs. During the internal reset, all port pins are configured as
inputs without pull devices active.
All port lines have alternate input or output functions associated with them. These
alternate functions can be programmed to be assigned to various port pins to support the
best utilization for a given application. For this reason, certain functions appear several
times in Table 10.
All port lines that are not used for alternate functions may be used as general purpose
I/O lines.
Table 10 Summary of the XC223xN’s Ports
Port Width I/O Connected Modules
P2 11 I/O CAN, CC2, GPT12E, USIC, DAP/JTAG
P5 7 I Analog Inputs, CCU6, DAP/JTAG, GPT12E, CAN
P6 2 I/O ADC, CAN, GPT12E
P7 1 I/O CAN, GPT12E, SCU, DAP/JTAG, USIC
P10 16 I/O CCU6, USIC, DAP/JTAG, CAN
P15 2 I Analog Inputs, GPT12E
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 56 V1.5, 2013-02
3.18 Power Management
The XC223xN provides the means to control the power it consumes either at a given time
or averaged over a certain duration.
Three mechanisms can be used (and partly in parallel):
•Supply Voltage Management permits the temporary reduction of the supply voltage
of major parts of the logic or even its complete disconnection. This drastically reduces
the power consumed because it eliminates leakage current, particularly at high
temperature.
Several power reduction modes provide the best balance of power reduction and
wake-up time.
•Clock Generation Management controls the frequency of internal and external
clock signals. Clock signals for currently inactive parts of logic are disabled
automatically. The user can drastically reduce the consumed power by reducing the
XC223xN system clock frequency.
External circuits can be controlled using the programmable frequency output
EXTCLK.
•Peripheral Management permits temporary disabling of peripheral modules. Each
peripheral can be disabled and enabled separately. The CPU can be switched off
while the peripherals can continue to operate.
Wake-up from power reduction modes can be triggered either externally with signals
generated by the external system, or internally by the on-chip wake-up timer. This
supports intermittent operation of the XC223xN by generating cyclic wake-up signals.
Full performance is available to quickly react to action requests while the intermittent
sleep phases greatly reduce the average system power consumption.
Note: When selecting the supply voltage and the clock source and generation method,
the required parameters must be carefully written to the respective bit fields, to
avoid unintended intermediate states. Recommended sequences are provided
which ensure the intended operation of power supply system and clock system.
Please refer to the Programmer’s Guide.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 57 V1.5, 2013-02
3.19 Instruction Set Summary
Table 11 lists the instructions of the XC223xN.
The addressing modes that can be used with a specific instruction, the function of the
instructions, parameters for conditional execution of instructions, and the opcodes for
each instruction can be found in the “Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 11 Instruction Set Summary
Mnemonic Description Bytes
ADD(B) Add word (byte) operands 2 / 4
ADDC(B) Add word (byte) operands with Carry 2 / 4
SUB(B) Subtract word (byte) operands 2 / 4
SUBC(B) Subtract word (byte) operands with Carry 2 / 4
MUL(U) (Un)Signed multiply direct GPR by direct GPR
(16- × 16-bit)
2
DIV(U) (Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U) (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B) Complement direct word (byte) GPR 2
NEG(B) Negate direct word (byte) GPR 2
AND(B) Bitwise AND, (word/byte operands) 2 / 4
OR(B) Bitwise OR, (word/byte operands) 2 / 4
XOR(B) Bitwise exclusive OR, (word/byte operands) 2 / 4
BCLR/BSET Clear/Set direct bit 2
BMOV(N) Move (negated) direct bit to direct bit 4
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit 4
BCMP Compare direct bit to direct bit 4
BFLDH/BFLDL Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B) Compare word (byte) operands 2 / 4
CMPD1/2 Compare word data to GPR and decrement GPR by 1/2 2 / 4
CMPI1/2 Compare word data to GPR and increment GPR by 1/2 2 / 4
PRIOR Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
2
SHL/SHR Shift left/right direct word GPR 2
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 58 V1.5, 2013-02
ROL/ROR Rotate left/right direct word GPR 2
ASHR Arithmetic (sign bit) shift right direct word GPR 2
MOV(B) Move word (byte) data 2 / 4
MOVBS/Z Move byte operand to word op. with sign/zero extension 2 / 4
JMPA/I/R Jump absolute/indirect/relative if condition is met 4
JMPS Jump absolute to a code segment 4
JB(C) Jump relative if direct bit is set (and clear bit) 4
JNB(S) Jump relative if direct bit is not set (and set bit) 4
CALLA/I/R Call absolute/indirect/relative subroutine if condition is met 4
CALLS Call absolute subroutine in any code segment 4
PCALL Push direct word register onto system stack and call
absolute subroutine
4
TRAP Call interrupt service routine via immediate trap number 2
PUSH/POP Push/pop direct word register onto/from system stack 2
SCXT Push direct word register onto system stack and update
register with word operand
4
RET(P) Return from intra-segment subroutine
(and pop direct word register from system stack)
2
RETS Return from inter-segment subroutine 2
RETI Return from interrupt service subroutine 2
SBRK Software Break 2
SRST Software Reset 4
IDLE Enter Idle Mode 4
PWRDN Unused instruction1) 4
SRVWDT Service Watchdog Timer 4
DISWDT/ENWDT Disable/Enable Watchdog Timer 4
EINIT End-of-Initialization Register Lock 4
ATOMIC Begin ATOMIC sequence 2
EXTR Begin EXTended Register sequence 2
EXTP(R) Begin EXTended Page (and Register) sequence 2 / 4
EXTS(R) Begin EXTended Segment (and Register) sequence 2 / 4
Table 11 Instruction Set Summary (cont’d)
Mnemonic Description Bytes
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Functional Description
Data Sheet 59 V1.5, 2013-02
NOP Null operation 2
CoMUL/CoMAC Multiply (and accumulate) 4
CoADD/CoSUB Add/Subtract 4
Co(A)SHR (Arithmetic) Shift right 4
CoSHL Shift left 4
CoLOAD/STORE Load accumulator/Store MAC register 4
CoCMP Compare 4
CoMAX/MIN Maximum/Minimum 4
CoABS/CoRND Absolute value/Round accumulator 4
CoMOV Data move 4
CoNEG/NOP Negate accumulator/Null operation 4
1) The Enter Power Down Mode instruction is not used in the XC223xN, due to the enhanced power control
scheme. PWRDN will be correctly decoded, but will trigger no action.
Table 11 Instruction Set Summary (cont’d)
Mnemonic Description Bytes
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 60 V1.5, 2013-02
4 Electrical Parameters
The operating range for the XC223xN is defined by its electrical parameters. For proper
operation the specified limits must be respected when integrating the device in its target
environment.
4.1 General Parameters
These parameters are valid for all subsequent descriptions, unless otherwise noted.
Note: Stresses above the values listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only. Functional operation
of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for an extended time may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Table 12 Absolute Maximum Rating Parameters
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Output current on a pin
when high value is driven
IOH SR -30 −−mA
Output current on a pin
when low value is driven
IOL SR −−30 mA
Overload current IOV SR -10 −10 mA 1)
1) Overload condition occurs if the input voltage VIN is out of the absolute maximum rating range. In this case the
current must be limited to the listed values by design measures.
Absolute sum of overload
currents
Σ|IOV|
SR
−−100 mA 1)
Junction Temperature TJ SR -40 −150 °C
Storage Temperature TST SR -65 −150 °C
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR -0.5 −6.0 V
Voltage on any pin with
respect to ground (Vss)
VIN SR -0.5 −VDDP +
0.5
VVIN≤VDDP(max)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 61 V1.5, 2013-02
4.1.1 Operating Conditions
The following operating conditions must not be exceeded to ensure correct operation of
the XC223xN. All parameters specified in the following sections refer to these operating
conditions, unless otherwise noticed.
Note: Typical parameter values refer to room temperature and nominal supply voltage,
minimum/maximum parameter values also include conditions of
minimum/maximum temperature and minimum/maximum supply voltage.
Additional details are described where applicable.
Table 13 Operating Conditions
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Voltage Regulator Buffer
Capacitance for DMP_M
CEVRM
SR
1.0 −4.7 μF 1)
Voltage Regulator Buffer
Capacitance for DMP_1
CEVR1
SR
0.47 −2.2 μF 2)1)
External Load
Capacitance
CL SR −203) −pF pin out
driver= default
4)
System frequency fSYS SR −−80 MHz 5)
Overload current for
analog inputs6)
IOVA SR -2 −5 mA not subject to
production test
Overload current for digital
inputs6)
IOVD SR -5 −5 mA not subject to
production test
Overload current coupling
factor for analog inputs7)
KOVA
CC
−2.5 x
10-4
1.5 x
10-3
-IOV< 0 mA; not
subject to
production test
−1.0 x
10-6
1.0 x
10-4
-IOV> 0 mA; not
subject to
production test
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 62 V1.5, 2013-02
Overload current coupling
factor for digital I/O pins
KOVD
CC
−1.0 x
10-2
3.0 x
10-2
-IOV< 0 mA; not
subject to
production test
−1.0 x
10-4
5.0 x
10-3
-IOV> 0 mA; not
subject to
production test
Absolute sum of overload
currents
Σ|IOV|
SR
−−50 mA not subject to
production test
Digital core supply voltage
for domain M8)
VDDIM
CC
−1.5 −
Digital core supply voltage
for domain 18)
VDDI1
CC
−1.5 −
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 3.0 −5.5 V
Digital ground voltage VSS SR −0−V
1) To ensure the stability of the voltage regulators the EVRs must be buffered with ceramic capacitors. Separate
buffer capacitors with the recomended values shall be connected as close as possible to each VDDIM and VDDI1
pin to keep the resistance of the board tracks below 2 Ohm. Connect all VDDI1 pins together. The minimum
capacitance value is required for proper operation under all conditions (e.g. temperature). Higher values
slightly increase the startup time.
2) Use one Capacitor for each pin.
3) This is the reference load. For bigger capacitive loads, use the derating factors listed in the pad properties
section.
4) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output
current may lead to increased delays or reduced driving capability (CL).
5) The operating frequency range may be reduced for specific device types. This is indicated in the device
designation (...FxxL). 80 MHz devices are marked ...F80L.
6) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range: VOV > VIHmax (IOV > 0) or VOV < VILmin ((IOV < 0). The absolute sum of input
overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified
limits. Proper operation under overload conditions depends on the application. Overload conditions must not
occur on pin XTAL1 (powered by VDDIM).
Table 13 Operating Conditions (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 63 V1.5, 2013-02
4.2 Voltage Range definitions
The XC223xN timing depends on the supply voltage. If such a dependency exists the
timing values are given for 2 voltage areas commonly used. The voltage areas are
defined in the following tables.
4.2.1 Parameter Interpretation
The parameters listed in the following include both the characteristics of the XC223xN
and its demands on the system. To aid in correctly interpreting the parameters when
evaluating them for a design, they are marked accordingly in the column “Symbol”:
CC (Controller Characteristics):
The logic of the XC223xN provides signals with the specified characteristics.
SR (System Requirement):
The external system must provide signals with the specified characteristics to the
XC223xN.
7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pins leakage current (IOZ). The amount of error current depends on the overload
current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse
compared to the polarity of the overload current that produces it.The total current through a pin is |ITOT| = |IOZ|
+ (|IOV| KOV). The additional error current may distort the input voltage on analog inputs.
8) Value is controlled by on-chip regulator
Table 14 Upper Voltage Range Definition
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 4.5 5 5.5 V
Table 15 Lower Voltage Range Definition
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 3.0 3.3 4.5 V
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 64 V1.5, 2013-02
4.3 DC Parameters
These parameters are static or average values that may be exceeded during switching
transitions (e.g. output current).
The XC223xN can operate within a wide supply voltage range from 3.0 V to 5.5 V.
However, during operation this supply voltage must remain within 10 percent of the
selected nominal supply voltage. It cannot vary across the full operating voltage range.
Because of the supply voltage restriction and because electrical behavior depends on
the supply voltage, the parameters are specified separately for the upper and the lower
voltage range.
During operation, the supply voltages may only change with a maximum speed of
dV/dt < 1 V/ms.
Leakage current is strongly dependent on the operating temperature and the voltage
level at the respective pin. The maximum values in the following tables apply under worst
case conditions, i.e. maximum temperature and an input level equal to the supply
voltage.
The value for the leakage current in an application can be determined by using the
respective leakage derating formula (see tables) with values from that application.
The pads of the XC223xN are designed to operate in various driver modes. The DC
parameter specifications refer to the pad current limits specified in Section 4.7.4.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 65 V1.5, 2013-02
Pullup/Pulldown Device Behavior
Most pins of the XC223xN feature pullup or pulldown devices. For some special pins
these are fixed; for the port pins they can be selected by the application.
The specified current values indicate how to load the respective pin depending on the
intended signal level. Figure 13 shows the current paths.
The shaded resistors shown in the figure may be required to compensate system pull
currents that do not match the given limit values.
Figure 13 Pullup/Pulldown Current Definition
MC_XC2X_PULL
VDDP
VSS
Pullup
Pulldown
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 66 V1.5, 2013-02
4.3.1 DC Parameters for Upper Voltage Area
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 16 is valid under the following conditions: VDDP≤5.5 V; VDDPtyp. 5 V; VDDP≥4.5 V
Table 16 DC Characteristics for Upper Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Pin capacitance (digital
inputs/outputs). To be
doubled for double bond
pins.1)
CIO CC −−10 pF not subject to
production test
Input Hysteresis2) HYS CC 0.11 x
VDDP
−−VRS=0Ohm
Absolute input leakage
current on pins of analog
ports3)
|IOZ1|
CC
−10 200 nA VIN>VSS ;
VIN<VDDP
Absolute input leakage
current for all other pins.
To be doubled for double
bond pins.3)1)4)
|IOZ2|
CC
−0.2 5 μATJ≤110 °C;
VIN>VSS ;
VIN<VDDP
−0.2 15 μATJ≤150 °C;
VIN>VSS ;
VIN<VDDP
Pull Level Force Current5) |IPLF| SR 250 −−μAVIN≥VIHmin(pull
down_enabled);
VIN≤VILmax(pull
up_enabled)
Pull Level Keep Current6) |IPLK|
SR
−−30 μAVIN≥VIHmin(pull
up_enabled);
VIN≤VILmax(pull
down_enabled)
Input high voltage (all
except XTAL1)
VIH SR 0.7 x
VDDP
−VDDP +
0.3
V
Input low voltage
(all except XTAL1)
VIL SR -0.3 −0.3 x
VDDP
V
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 67 V1.5, 2013-02
Output High voltage7) VOH CC VDDP -
1.0
−−VIOH≥IOHmax
VDDP -
0.4
−−VIOH≥IOHnom
8)
Output Low Voltage7) VOL CC −−0.4 V IOL≤IOLnom
8)
−−1.0 V IOL≤IOLmax
1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the
normal value. For a list of affected pins refer to the pin definitions table in chapter 2.
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
4) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device.
6) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level.
7) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Table 16 DC Characteristics for Upper Voltage Range (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 68 V1.5, 2013-02
4.3.2 DC Parameters for Lower Voltage Area
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 17 is valid under the following conditions: VDDP≥3.0 V; VDDPtyp. 3.3 V;
VDDP≤4.5 V
Table 17 DC Characteristics for Lower Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Pin capacitance (digital
inputs/outputs). To be
doubled for double bond
pins.1)
CIO CC −−10 pF not subject to
production test
Input Hysteresis2) HYS CC 0.07 x
VDDP
−−VRS=0Ohm
Absolute input leakage
current on pins of analog
ports3)
|IOZ1|
CC
−10 200 nA VIN>VSS ;
VIN<VDDP
Absolute input leakage
current for all other pins.
To be doubled for double
bond pins.3)1)4)
|IOZ2|
CC
−0.2 2.5 μATJ≤110 °C;
VIN>VSS ;
VIN<VDDP
−0.2 8 μATJ≤150 °C;
VIN>VSS ;
VIN<VDDP
Pull Level Force Current5) |IPLF| SR 150 −−μAVIN≥VIHmin(pull
down) ;
VIN≤VILmax(pull
up)
Pull Level Keep Current6) |IPLK|
SR
−−10 μAVIN≥VIHmin(pull
up) ;
VIN≤VILmax(pull
down)
Input high voltage (all
except XTAL1)
VIH SR 0.7 x
VDDP
−VDDP +
0.3
V
Input low voltage
(all except XTAL1)
VIL SR -0.3 −0.3 x
VDDP
V
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 69 V1.5, 2013-02
Output High voltage7) VOH CC VDDP -
1.0
−−VIOH≥IOHmax
VDDP -
0.4
−−VIOH≥IOHnom
8)
Output Low Voltage7) VOL CC −−0.4 V IOL≤IOLnom
8)
−−1.0 V IOL≤IOLmax
1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the
normal value. For a list of affected pins refer to the pin definitions table in chapter 2.
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
4) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device: VPIN <= VIL for a pullup; VPIN >= VIH for a pulldown.
6) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level: VPIN >= VIH for a pullup; VPIN <= VIL for a pulldown.
7) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Table 17 DC Characteristics for Lower Voltage Range (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 70 V1.5, 2013-02
4.3.3 Power Consumption
The power consumed by the XC223xN depends on several factors such as supply
voltage, operating frequency, active circuits, and operating temperature. The power
consumption specified here consists of two components:
• The switching current IS depends on the device activity
• The leakage current ILK depends on the device temperature
To determine the actual power consumption, always both components, switching current
IS and leakage current ILK must be added:
IDDP = IS + ILK.
Note: The power consumption values are not subject to production test. They are
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
The given power consumption parameters and their values refer to specific operating
conditions:
•Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
•Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1
stopped.
•Standby mode:
Voltage domain DMP_1 switched off completely, power supply control switched off.
DMP_M domain is supplied by ultra low power electronic voltage regulator
(ULPEVR). The alternate regulator EVR_M is switched off.
Note: The maximum values cover the complete specified operating range of all
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for VDDIM and VDDI1 are charged with
the maximum possible current.
For additional information, please refer to Section 5.2, Thermal Considerations.
Note: Operating Conditions apply.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 71 V1.5, 2013-02
Active Mode Power Supply Current
The actual power supply current in active mode not only depends on the system
frequency but also on the configuration of the XC223xN’s subsystem.
Besides the power consumed by the device logic the power supply pins also provide the
current that flows through the pin output drivers.
A small current is consumed because the drivers’ input stages are switched.
The IO power domains can be supplied separately. Power domain A (VDDPA) supplies the
A/D converters and Port 6. Power domain B (VDDPB) supplies the on-chip EVVRs and all
other ports.
Table 18 Switching Power Consumption
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Power supply current
(active) with all peripherals
active and EVVRs on
ISACT
CC
−6 + 0.6
x fSYS
1)
1) fSYS in MHz
8 + 1.0
x fSYS
1)
mA power_mode=
active ;
voltage_range=
both 2)3)4)
2) The pad supply voltage pins (VDDPB) provide the input current for the on-chip EVVRs and the current
consumed by the pin output drivers. A small current is consumed because the drivers input stages are
switched. In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced to 3 + 0.6
x fSYS.
3) Please consider the additional conditions described in section "Active Mode Power Supply Current".
4) The pad supply voltage has only a minor influence on this parameter.
Power supply current in
standby mode
ISSB CC −45 125 μA power_mode=
standby ;
voltage_range=
lower 5)
5) These values are valid if the voltage validation circuits for VDDPB (SWD) and VDDIM (PVC_M) are off. Leaving
SWD and PVC_M active adds another 90 μA.
−70 220 μA power_mode=
standby ;
voltage_range=
upper 5)
Power supply current in
stopover mode, EVVRs on
ISSO CC −0.7 2.0 mA power_mode=
stopover ;
voltage_range=
both 4)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 72 V1.5, 2013-02
During operation domain A draws a maximum current of 1.5 mA for each active A/D
converter module from VDDPA.
In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced
to 3 + 0.6×fSYS mA.
Figure 14 Supply Current in Active Mode as a Function of Frequency
Note: Operating Conditions apply.
MC_XC2XN_IS
fSYS [MHz]
IS [mA]
10
20
40
20 40 80
60
50
60
70
90
100
ISACTtyp
ISACTmax
30
80
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 73 V1.5, 2013-02
Note: A fraction of the leakage current flows through domain DMP_A (pin VDDPA). This
current can be calculated as 7,000
×
e-
α
, with
α
= 5000 / (273 + 1.3
×
TJ).
For TJ = 150°C, this results in a current of 160
μ
A.
Leakage Power Consumption Calculation
The leakage power consumption can be calculated according to the following formulas:
ILK0 = 500,000 × e-α with α = 3000 / (273 + B × TJ)
Parameter B must be replaced by
• 1.0 for typical values
• 1.6 for maximum values
ILK1 = 530,000 ×
e-α with α = 5000 / (273 + B × TJ)
Parameter B must be replaced by
• 1.0 for typical values
• 1.3 for maximum values
Table 19 Leakage Power Consumption
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Leakage supply current
(DMP_1 off)1)
1) The supply current caused by leakage depends mainly on the junction temperature and the supply voltage.
The temperature difference between the junction temperature TJ and the ambient temperature TA must be
taken into account. As this fraction of the supply current does not depend on device activity, it must be added
to other power consumption values.
ILK0 CC −20 35 μATJ=25°C
2)
−115 330 μATJ=85°C
2)
−270 880 μATJ=125°C
2)
−420 1,450 μATJ=150°C
2)
Leakage supply current
(DMP_1 powered)1)
ILK1 CC −0.03 0.04 mA TJ=25°C
2)
2) All inputs (including pins configured as inputs) are set at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP and all outputs
(including pins configured as outputs) are disconnected.
−0.5 1.2 mA TJ=85°C
2)
−1.9 5.5 mA TJ=125°C
2)
−3.9 12.2 mA TJ=150°C
2)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 74 V1.5, 2013-02
Figure 15 Leakage Supply Current as a Function of Temperature
MC_XC2XN_ILK150
TJ [°C]
ILK [mA]
2
6
10
0 50 150
100-50
4
8
12
ILK0max
ILK0typ
ILK1max
ILK1typ
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 75 V1.5, 2013-02
4.4 Analog/Digital Converter Parameters
These parameters describe the conditions for optimum ADC performance.
Note: Operating Conditions apply.
Table 20 ADC Parameters
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Switched capacitance at
an analog input
CAINSW
CC
−−4 pF not subject to
production test
1)
Total capacitance at an
analog input
CAINT
CC
−−10 pF not subject to
production test
1)
Switched capacitance at
the reference input
CAREFSW
CC
−−7 pF not subject to
production test
1)
Total capacitance at the
reference input
CAREFT
CC
−−15 pF not subject to
production test
1)
Differential Non-Linearity
Error
|EADNL|
CC
−0.8 1 LSB
Gain Error |EAGAIN|
CC
−0.4 0.8 LSB
Integral Non-Linearity |EAINL|
CC
−0.8 1.2 LSB
Offset Error |EAOFF|
CC
−0.5 0.8 LSB
Analog clock frequency fADCI SR 0.5 −16.5 MHz voltage_range=
lower
0.5 −20 MHz voltage_range=
upper
Input resistance of the
selected analog channel
RAIN CC −−2kOh
m
not subject to
production test
1)
Input resistance of the
reference input
RAREF
CC
−−2kOh
m
not subject to
production test
1)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 76 V1.5, 2013-02
Broken wire detection
delay against VAGND2)
tBWG CC −−503)
Broken wire detection
delay against VAREF2)
tBWR CC −−504)
Conversion time for 8-bit
result2)
tc8 CC (11+S
TC) x
tADCI +
2 x
tSYS
−−
Conversion time for 10-bit
result2)
tc10 CC (13+S
TC) x
tADCI +
2 x
tSYS
−−
Total Unadjusted Error |TUE|
CC
−12LSB 5)
Wakeup time from analog
powerdown, fast mode
tWAF CC −−4μs
Wakeup time from analog
powerdown, slow mode
tWAS CC −−15 μs
Analog reference ground VAGND
SR
VSS -
0.05
−1.5 V
Analog input voltage
range
VAIN SR VAGND −VAREF V 6)
Analog reference voltage VAREF
SR
VAGND
+ 1.0
−VDDPA
+ 0.05
V
1) These parameter values cover the complete operating range. Under relaxed operating conditions
(temperature, supply voltage) typical values can be used for calculation. At room temperature and nominal
supply voltage the following typical values can be used: CAINTtyp = 12 pF, CAINStyp = 5 pF, RAINtyp = 1.0 kOhm,
CAREFTtyp = 15 pF, CAREFStyp = 10 pF, RAREFtyp = 1.0 kOhm.
2) This parameter includes the sample time (also the additional sample time specified by STC), the time to
determine the digital result and the time to load the result register with the conversion result. Values for the
basic clock tADCI depend on programming.
3) The broken wire detection delay against VAGND is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 500 μs. Result below 10% (66H)
Table 20 ADC Parameters (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 77 V1.5, 2013-02
Figure 16 Equivalent Circuitry for Analog Inputs
4) The broken wire detection delay against VAREF is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 10 μs. This function is influenced by leakage current, in particular at high
temperature. Result above 80% (332H)
5) TUE is tested at VAREF = VDDPA = 5.0 V, VAGND = 0 V. It is verified by design for all other voltages within the
defined voltage range. The specified TUE is valid only if the absolute sum of input overload currents on analog
port pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the
measurement time.
6) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these
cases will be X000H or X3FFH, respectively.
A/D Converter
MCS05570
R
Source
V
AIN
C
Ext
C
AINT
C
AINS
-
R
AIN, On
C
AINS
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 78 V1.5, 2013-02
Sample time and conversion time of the XC223xN’s A/D converters are programmable.
The timing above can be calculated using Table 21.
The limit values for fADCI must not be exceeded when selecting the prescaler value.
Converter Timing Example A:
Converter Timing Example B:
Table 21 A/D Converter Computation Table
GLOBCTR.5-0
(DIVA)
A/D Converter
Analog Clock fADCI
INPCRx.7-0
(STC)
Sample Time1)
tS
1) The selected sample time is doubled if broken wire detection is active (due to the presampling phase).
000000BfSYS 00HtADCI × 2
000001BfSYS / 2 01HtADCI × 3
000010BfSYS / 3 02HtADCI × 4
:fSYS / (DIVA+1) : tADCI × (STC+2)
111110BfSYS / 63 FEHtADCI × 256
111111BfSYS / 64 FFHtADCI × 257
Assumptions: fSYS = 80 MHz (i.e. tSYS = 12.5 ns), DIVA = 03H, STC = 00H
Analog clock fADCI = fSYS / 4 = 20 MHz, i.e. tADCI = 50 ns
Sample time tS= tADCI × 2 = 100 ns
Conversion 10-bit:
tC10 = 13 × tADCI + 2 × tSYS = 13 × 50 ns + 2 × 12.5 ns = 0.675 μs
Conversion 8-bit:
tC8 = 11 × tADCI + 2 × tSYS = 11 × 50 ns + 2 × 12.5 ns = 0.575 μs
Assumptions: fSYS = 40 MHz (i.e. tSYS = 25 ns), DIVA = 02H, STC = 03H
Analog clock fADCI = fSYS / 3 = 13.3 MHz, i.e. tADCI = 75 ns
Sample time tS= tADCI × 5 = 375 ns
Conversion 10-bit:
tC10 = 16 × tADCI + 2 × tSYS = 16 × 75 ns + 2 × 25 ns = 1.25 μs
Conversion 8-bit:
tC8 = 14 × tADCI + 2 × tSYS = 14 × 75 ns + 2 × 25 ns = 1.10 μs
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 79 V1.5, 2013-02
4.5 System Parameters
The following parameters specify several aspects which are important when integrating
the XC223xN into an application system.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 22 Various System Parameters
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Short-term deviation of
internal clock source
frequency1)
ΔfINT CC -1 −1%ΔTJ ≤ 10°C
Internal clock source
frequency
fINT CC 4.8 5.0 5.2 MHz
Wakeup clock source
frequency2)
fWU CC 400 −700 kHz FREQSEL= 00
210 −390 kHz FREQSEL= 01
140 −260 kHz FREQSEL= 10
110 −200 kHz FREQSEL= 11
Startup time from power-
on with code execution
from Flash
tSPO CC 1.5 2.0 2.4 ms fWU= 500 kHz
Startup time from standby
mode with code execution
from Flash
tSSB CC 2.6 3.8 4.1 ms fWU= 140 kHz
1.6 2.1 2.5 ms fWU= 500 kHz
Startup time from stopover
mode with code execution
from PSRAM
tSSO CC 11 /
fWU
3)
−12 /
fWU
3)
μs
Core voltage (PVC)
supervision level
VPVC CC VLV -
0.03
VLV VLV +
0.074)
V 5)
Supply watchdog (SWD)
supervision level
VSWD
CC
VLV -
0.106)
VLV VLV +
0.15
V voltage_range=
lower 5)
VLV -
0.15
VLV VLV +
0.15
V voltage_range=
upper 5)
VLV -
0.30
VLV VLV +
0.30
VVLV = 5.5 V 5)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 80 V1.5, 2013-02
Conditions for tSPO Timing Measurement
The time required for the transition from Power-on to Base mode is called tSPO. It is
measured under the following conditions:
Precondition: The pad supply is valid, i.e. VDDPB is above 3.0V and remains above 3.0V
even though the XC223xN is starting up. No debugger is attached.
Start condition: Power-on reset is removed (PORST = 1).
End condition: External pin toggle caused by first user instruction executed from FLASH
after startup.
Conditions for tSSB Timing Measurement
The time required for the transition from Standby to Base mode is called tSSB. It is
measured under the following conditions:
Precondition: The Standby mode has been entered using the procedure defined in the
Programmer’s Guide.
Start condition: Pin toggle on ESR pin triggering the startup sequence.
End condition: External pin toggle caused by first user instruction executed from FLASH
after startup.
Conditions for tSSO Timing Measurement
The time required for the transition from Stopover to Stopover Waked-Up mode is
called tSSO. It is measured under the following conditions:
Precondition: The Stopover mode has been entered using the procedure defined in the
Programmer’s Guide.
Start condition: Pin toggle on ESR pin triggering the startup sequence.
End condition: External pin toggle caused by first user instruction executed from PSRAM
after startup.
1) The short-term frequency deviation refers to a timeframe of a few hours and is measured relative to the current
frequency at the beginning of the respective timeframe. This parameter is useful to determine a time span for
re-triggering a LIN synchronization.
2) This parameter is tested for the fastest and the slowest selection. The medium selections are not subject to
production test - verified by design/characterization
3) fWU in MHz
4) This value includes a hysteresis of approximately 50 mV for rising voltage.
5) VLV = selected SWD voltage level
6) The limit VLV - 0.10 V is valid for the OK1 level. The limit for the OK2 level is VLV - 0.15 V.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 81 V1.5, 2013-02
Coding of bit fields LEVxV in SWD Configuration Registers
After power-on the supply watch dog is preconfigured to operate in the lower voltage
range.
Coding of bit fields LEVxV in PVC Configuration Registers
The core voltages are controlled internally to the nominal value of 1.5 V; a variation of
±10 % is allowed. These operation conditions limit the possible PVC monitoring values
to the predefined reset values shown in Table 24.
Table 23 Coding of bit fields LEVxV in Register SWDCON0
Code Voltage Level Notes1)
1) The indicated default levels for LEV1V and LEV2V are selected automatically after a power-on reset.
0000B- out of valid operation range
0001B3.0 V LEV1V: reset request
0010B - 0101B3.1 V- 3.4 V step width is 0.1 V
0110B3.6 V
0111B4.0 V
1000B4.2 V
1001B4.5 V LEV2V: no request
1010B - 1110B4.6 V - 5.0 V step width is 0.1 V
1111B5.5 V
Table 24 Coding of bit fields LEVxV in Registers PVCyCONz
Code Voltage Level Notes1)
1) The indicated default levels for LEV1V and LEV2V are selected automatically after a power-on reset.
000B-011B- out of valid operation range
100B1.35 V LEV1V: reset request
101B1.45 V LEV2V: interrupt request2)
2) Due to variations of the tolerance of both the Embedded Voltage Regulators (EVR) and the PVC levels, this
interrupt can be triggered inadvertently, even though the core voltage is within the normal range. It is,
therefore, recommended not to use this warning level.
110B - 111B- out of valid operation range
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 82 V1.5, 2013-02
4.6 Flash Memory Parameters
The XC223xN is delivered with all Flash sectors erased and with no protection installed.
The data retention time of the XC223xN’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 25 Flash Parameters
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Parallel Flash module
program/erase limit
depending on Flash read
activity
NPP SR −−21)
1) The unused Flash module(s) can be erased/programmed while code is executed and/or data is read from only
one Flash module or from PSRAM. The Flash module that delivers code/data can, of course, not be
erased/programmed.
NFL_RD≤1
−−12) NFL_RD>1
Flash erase endurance
for security pages
NSEC SR 10 −−cycles tRET≥20 years
Flash wait states3) NWSFLAS
H SR
1−− fSYS≤8MHz
2−− fSYS≤13 MHz
3−− fSYS≤17 MHz
4−− fSYS>17MHz
Erase time per
sector/page
tER CC −74) 8.0 ms
Programming time per
page
tPR CC −34) 3.5 ms
Data retention time tRET CC 20 −−years NER≤1,000 cycl
es
Drain disturb limit NDD SR 32 −−cycles
Number of erase cycles NER SR −−15.000 cycles tRET≥5years;
Valid for Flash
module 1 (up to
64 kbytes)
−−1.000 cycles tRET≥20 years
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 83 V1.5, 2013-02
Access to the XC223xN Flash modules is controlled by the IMB. Built-in prefetch
mechanisms optimize the performance for sequential access.
Flash access waitstates only affect non-sequential access. Due to prefetch
mechanisms, the performance for sequential access (depending on the software
structure) is only partially influenced by waitstates.
2) Flash module 1 can be erased/programmed while code is executed and/or data is read from Flash module 0.
3) Value of IMB_IMBCTRL.WSFLASH.
4) Programming and erase times depend on the internal Flash clock source. The control state machine needs a
few system clock cycles. This increases the stated durations noticably only at extremely low system clock
frequencies.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 84 V1.5, 2013-02
4.7 AC Parameters
These parameters describe the dynamic behavior of the XC223xN.
4.7.1 Testing Waveforms
These values are used for characterization and production testing (except pin XTAL1).
Figure 17 Input Output Waveforms
Figure 18 Floating Waveforms
MCD05556C
0.3 VDDP
Input Signal
(driven by tester)
Output Signal
(measured)
Hold time
Output delay Output delay
Hold time
Output timings refer to the rising edge of CLKOUT.
Input timings are calculated from the time, when the input signal reaches
VIH or VIL, respectively.
0.2 VDDP
0.8 VDDP
0.7 VDDP
MCA05565
Timing
Reference
Points
V
Load
+ 0.1 V
V
Load
- 0.1 V
V
OH
- 0.1 V
V
OL
+ 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV
change from load voltage occurs, but begins to float when a 100 mV
change from the loaded V
OH
/V
OL
level occurs (I
OH
/ I
OL
= 20 mA).
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 85 V1.5, 2013-02
4.7.2 Definition of Internal Timing
The internal operation of the XC223xN is controlled by the internal system clock fSYS.
Because the system clock signal fSYS can be generated from a number of internal and
external sources using different mechanisms, the duration of the system clock periods
(TCSs) and their variation (as well as the derived external timing) depend on the
mechanism used to generate fSYS. This must be considered when calculating the timing
for the XC223xN.
Figure 19 Generation Mechanisms for the System Clock
Note: The example of PLL operation shown in Figure 19 uses a PLL factor of 1:4; the
example of prescaler operation uses a divider factor of 2:1.
The specification of the external timing (AC Characteristics) depends on the period of the
system clock (TCS).
M C _ XC 2 X_ CL OC KGEN
Phase Locked Loop Operation (1:N)
f
IN
Direct Clock Drive (1:1)
Prescaler Operation (N:1)
f
SYS
f
IN
f
SYS
f
IN
f
SYS
TCS
TCS
TCS
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 86 V1.5, 2013-02
Direct Drive
When direct drive operation is selected (SYSCON0.CLKSEL = 11B), the system clock is
derived directly from the input clock signal CLKIN1:
fSYS = fIN.
The frequency of fSYS is the same as the frequency of fIN. In this case the high and low
times of fSYS are determined by the duty cycle of the input clock fIN.
Selecting Bypass Operation from the XTAL11) input and using a divider factor of 1 results
in a similar configuration.
Prescaler Operation
When prescaler operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY =
1B), the system clock is derived either from the crystal oscillator (input clock signal
XTAL1) or from the internal clock source through the output prescaler K1 (= K1DIV+1):
fSYS = fOSC / K1.
If a divider factor of 1 is selected, the frequency of fSYS equals the frequency of fOSC. In
this case the high and low times of fSYS are determined by the duty cycle of the input
clock fOSC (external or internal).
The lowest system clock frequency results from selecting the maximum value for the
divider factor K1:
fSYS = fOSC / 1024.
4.7.2.1 Phase Locked Loop (PLL)
When PLL operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 0B),
the on-chip phase locked loop is enabled and provides the system clock. The PLL
multiplies the input frequency by the factor F (fSYS = fIN × F).
F is calculated from the input divider P (= PDIV+1), the multiplication factor N (=
NDIV+1), and the output divider K2 (= K2DIV+1):
(F = N / (P × K2)).
The input clock can be derived either from an external source at XTAL1 or from the on-
chip clock source.
The PLL circuit synchronizes the system clock to the input clock. This synchronization is
performed smoothly so that the system clock frequency does not change abruptly.
Adjustment to the input clock continuously changes the frequency of fSYS so that it is
locked to fIN. The slight variation causes a jitter of fSYS which in turn affects the duration
of individual TCSs.
1) Voltages on XTAL1 must comply to the core supply voltage VDDIM.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 87 V1.5, 2013-02
The timing in the AC Characteristics refers to TCSs. Timing must be calculated using the
minimum TCS possible under the given circumstances.
The actual minimum value for TCS depends on the jitter of the PLL. Because the PLL is
constantly adjusting its output frequency to correspond to the input frequency (from
crystal or oscillator), the accumulated jitter is limited. This means that the relative
deviation for periods of more than one TCS is lower than for a single TCS (see formulas
and Figure 20).
This is especially important for bus cycles using waitstates and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
The value of the accumulated PLL jitter depends on the number of consecutive VCO
output cycles within the respective timeframe. The VCO output clock is divided by the
output prescaler K2 to generate the system clock signal fSYS. The number of VCO cycles
is K2 ×T, where T is the number of consecutive fSYS cycles (TCS).
The maximum accumulated jitter (long-term jitter) DTmax is defined by:
DTmax [ns] = ±(220 / (K2 × fSYS) + 4.3)
This maximum value is applicable, if either the number of clock cycles T > (fSYS / 1.2) or
the prescaler value K2 > 17.
In all other cases for a timeframe of T × TCS the accumulated jitter DT is determined by:
DT [ns] = DTmax × [(1 - 0.058 × K2) × (T - 1) / (0.83 × fSYS - 1) + 0.058 × K2]
fSYS in [MHz] in all formulas.
Example, for a period of 3 TCSs @ 33 MHz and K2 = 4:
Dmax = ±(220 / (4 × 33) + 4.3) = 5.97 ns (Not applicable directly in this case!)
D3 = 5.97 × [(1 - 0.058 × 4) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 4]
= 5.97 × [0.768 × 2 / 26.39 + 0.232]
= 1.7 ns
Example, for a period of 3 TCSs @ 33 MHz and K2 = 2:
Dmax = ±(220 / (2 × 33) + 4.3) = 7.63 ns (Not applicable directly in this case!)
D3 = 7.63 × [(1 - 0.058 × 2) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 2]
= 7.63 × [0.884 × 2 / 26.39 + 0.116]
= 1.4 ns
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 88 V1.5, 2013-02
Figure 20 Approximated Accumulated PLL Jitter
Note: The specified PLL jitter values are valid if the capacitive load per pin does not
exceed CL=20pF.
The maximum peak-to-peak noise on the pad supply voltage (measured between
VDDPB pin 64 and VSS pin 1) is limited to a peak-to-peak voltage of VPP = 50 mV.
This can be achieved by appropriate blocking of the supply voltage as close as
possible to the supply pins and using PCB supply and ground planes.
PLL frequency band selection
Different frequency bands can be selected for the VCO so that the operation of the PLL
can be adjusted to a wide range of input and output frequencies:
MC_XC 2X_JITTER
Cycles
T
0
±1
±2
±3
±4
±5
±6
±7
±8
Acc. jitter
D
T
20 40 60 80 100
ns fSYS = 66 MHz
1
fVCO = 132 MHz
fVCO = 66 MHz
±9 fSYS = 33 MHz
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 89 V1.5, 2013-02
4.7.2.2 Wakeup Clock
When wakeup operation is selected (SYSCON0.CLKSEL = 00B), the system clock is
derived from the low-frequency wakeup clock source:
fSYS = fWU.
In this mode, a basic functionality can be maintained without requiring an external clock
source and while minimizing the power consumption.
4.7.2.3 Selecting and Changing the Operating Frequency
When selecting a clock source and the clock generation method, the required
parameters must be carefully written to the respective bit fields, to avoid unintended
intermediate states.
Many applications change the frequency of the system clock (fSYS) during operation in
order to optimize system performance and power consumption. Changing the operating
frequency also changes the switching currents, which influences the power supply.
To ensure proper operation of the on-chip EVRs while they generate the core voltage,
the operating frequency shall only be changed in certain steps. This prevents overshoots
and undershoots of the supply voltage.
To avoid the indicated problems, recommended sequences are provided which ensure
the intended operation of the clock system interacting with the power system.
Please refer to the Programmer’s Guide.
Table 26 System PLL Parameters
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
VCO output frequency fVCO CC 50 −110 MHz VCOSEL= 00b;
VCOmode=
controlled
10 −40 MHz VCOSEL= 00b;
VCOmode=
free running
100 −160 MHz VCOSEL= 01b;
VCOmode=
controlled
20 −80 MHz VCOSEL= 01b;
VCOmode=
free running
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 90 V1.5, 2013-02
4.7.3 External Clock Input Parameters
These parameters specify the external clock generation for the XC223xN. The clock can
be generated in two ways:
• By connecting a crystal or ceramic resonator to pins XTAL1/XTAL2.
• By supplying an external clock signal
– This clock signal can be supplied either to pin XTAL1 (core voltage domain) or to
pin CLKIN1 (IO voltage domain).
If connected to CLKIN1, the input signal must reach the defined input levels VIL and VIH.
If connected to XTAL1, a minimum amplitude VAX1 (peak-to-peak voltage) is sufficient for
the operation of the on-chip oscillator.
Note: The given clock timing parameters (t1
…
t4) are only valid for an external clock
input signal.
Note: Operating Conditions apply.
Table 27 External Clock Input Characteristics
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Oscillator frequency fOSC SR 4 −40 MHz Input= Clock
Signal
4−16 MHz Input= Crystal
or Ceramic
Resonator
XTAL1 input current
absolute value
|IIL| CC −−20 μA
Input clock high time t1 SR 6 −−ns
Input clock low time t2 SR 6 −−ns
Input clock rise time t3 SR −88ns
Input clock fall time t4 SR −88ns
Input voltage amplitude on
XTAL11)
VAX1 SR 0.3 x
VDDIM
−−VfOSC≥4MHz;
fOSC<16MHz
0.4 x
VDDIM
−−VfOSC≥16 MHz;
fOSC<25 MHz
0.5 x
VDDIM
−−VfOSC≥25 MHz;
fOSC≤40 MHz
Input voltage range limits
for signal on XTAL1
VIX1 SR -1.7 +
VDDIM
−1.7 V 2)
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 91 V1.5, 2013-02
Figure 21 External Clock Drive XTAL1
Note: For crystal or ceramic resonator operation, it is strongly recommended to measure
the oscillation allowance (negative resistance) in the final target system (layout) to
determine the optimum parameters for oscillator operation.
The manufacturers of crystals and ceramic resonators offer an oscillator
evaluation service. This evaluation checks the crystal/resonator specification
limits to ensure a reliable oscillator operation.
1) The amplitude voltage VAX1 refers to the offset voltage VOFF. This offset voltage must be stable during the
operation and the resulting voltage peaks must remain within the limits defined by VIX1.
2) Overload conditions must not occur on pin XTAL1.
MC_EXTCLOCK
t
1
t
2
t
OSC
= 1/f
OSC
t
3
t
4
V
OFF
V
AX1
0.1 V
AX1
0.9 V
AX1
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 92 V1.5, 2013-02
4.7.4 Pad Properties
The output pad drivers of the XC223xN can operate in several user-selectable modes.
Strong driver mode allows controlling external components requiring higher currents
such as power bridges or LEDs. Reducing the driving power of an output pad reduces
electromagnetic emissions (EME). In strong driver mode, selecting a slower edge
reduces EME.
The dynamic behavior, i.e. the rise time and fall time, depends on the applied external
capacitance that must be charged and discharged. Timing values are given for a
capacitance of 20 pF, unless otherwise noted.
In general, the performance of a pad driver depends on the available supply voltage
VDDP. Therefore the following tables list the pad parameters for the upper voltage range
and the lower voltage range, respectively.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 28 is valid under the following conditions: VDDP≤5.5 V; VDDPtyp. 5 V; VDDP≥4.5 V
Table 28 Standard Pad Parameters for Upper Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Maximum output driver
current (absolute value)1)
IOmax
CC
−−4.0 mA Driver_Strength
=Medium
−−10 mA Driver_Strength
=Strong
−−0.5 mA Driver_Strength
=Weak
Nominal output driver
current (absolute value)
IOnom
CC
−−1.0 mA Driver_Strength
=Medium
−−2.5 mA Driver_Strength
=Strong
−−0.1 mA Driver_Strength
=Weak
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 93 V1.5, 2013-02
Rise and Fall times (10% -
90%)
tRF CC −−23 +
0.6 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Medium
−−11.6 +
0.22 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Strong;
Driver_Edge=
Medium
−−4.2 +
0.14 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Strong;
Driver_Edge=
Sharp
−−20.6 +
0.22 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Strong;
Driver_Edge=
Slow
−−212 +
1.9 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Weak
1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16
neighboring output pins, the total output current in each direction (ΣIOL and Σ-IOH) must remain below 50 mA.
Table 28 Standard Pad Parameters for Upper Voltage Range (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 94 V1.5, 2013-02
Table 29 Standard Pad Parameters for Lower Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Maximum output driver
current (absolute value)1)
IOmax
CC
−−2.5 mA Driver_Strength
=Medium
−−10 mA Driver_Strength
=Strong
−−0.5 mA Driver_Strength
=Weak
Nominal output driver
current (absolute value)
IOnom
CC
−−1.0 mA Driver_Strength
=Medium
−−2.5 mA Driver_Strength
=Strong
−−0.1 mA Driver_Strength
=Weak
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 95 V1.5, 2013-02
Rise and Fall times (10% -
90%)
tRF CC −−37 +
0.65 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Medium
−−24 +
0.3 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Strong;
Driver_Edge=
Medium
−−6.2 +
0.24 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Strong;
Driver_Edge=
Sharp
−−34 +
0.3 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Strong;
Driver_Edge=
Slow
−−500 +
2.5 x
CL
ns CL≥20 pF;
CL≤100 pF;
Driver_Strength
=Weak
1) An output current above |IOXnom| may be drawn from up to three pins at the same time. For any group of 16
neighboring output pins, the total output current in each direction (ΣIOL and Σ-IOH) must remain below 50 mA.
Table 29 Standard Pad Parameters for Lower Voltage Range (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 96 V1.5, 2013-02
4.7.5 Synchronous Serial Interface Timing
The following parameters are applicable for a USIC channel operated in SSC mode.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 30 is valid under the following conditions: CL=20pF; SSC=master;
voltage_range= upper
Table 31 is valid under the following conditions: CL=20pF; SSC=master;
voltage_range= lower
Table 30 USIC SSC Master Mode Timing for Upper Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Slave select output SELO
active to first SCLKOUT
transmit edge
t1 CC tSYS -
81)
1) tSYS = 1 / fSYS
−−ns
Slave select output SELO
inactive after last
SCLKOUT receive edge
t2 CC tSYS -
61)
−−ns
Data output DOUT valid
time
t3 CC -6 −9ns
Receive data input setup
time to SCLKOUT receive
edge
t4 SR 31 −−ns
Data input DX0 hold time
from SCLKOUT receive
edge
t5 SR -4 −−ns
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 97 V1.5, 2013-02
Table 32 is valid under the following conditions: CL=20pF; SSC= slave ;
voltage_range= upper
Table 31 USIC SSC Master Mode Timing for Lower Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Slave select output SELO
active to first SCLKOUT
transmit edge
t1 CC tSYS -
101)
1) tSYS = 1 / fSYS
−−ns
Slave select output SELO
inactive after last
SCLKOUT receive edge
t2 CC tSYS -
91)
−−ns
Data output DOUT valid
time
t3 CC -7 −11 ns
Receive data input setup
time to SCLKOUT receive
edge
t4 SR 40 −−ns
Data input DX0 hold time
from SCLKOUT receive
edge
t5 SR -5 −−ns
Table 32 USIC SSC Slave Mode Timing for Upper Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Select input DX2 setup to
first clock input DX1
transmit edge1)
t10 SR 7 −−ns
Select input DX2 hold after
last clock input DX1
receive edge1)
t11 SR 7 −−ns
Receive data input setup
time to shift clock receive
edge1)
t12 SR 7 −−ns
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 98 V1.5, 2013-02
Table 33 is valid under the following conditions: CL=20pF; SSC= slave ;
voltage_range= lower
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR 5 −−ns
Data output DOUT valid
time
t14 CC 7 −33 ns
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Table 33 USIC SSC Slave Mode Timing for Lower Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Select input DX2 setup to
first clock input DX1
transmit edge1)
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
t10 SR 7 −−ns
Select input DX2 hold after
last clock input DX1
receive edge1)
t11 SR 7 −−ns
Receive data input setup
time to shift clock receive
edge1)
t12 SR 7 −−ns
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR 5 −−ns
Data output DOUT valid
time
t14 CC 8 −41 ns
Table 32 USIC SSC Slave Mode Timing for Upper Voltage Range (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 99 V1.5, 2013-02
Figure 22 USIC - SSC Master/Slave Mode Timing
Note: This timing diagram shows a standard configuration where the slave select signal
is low-active and the serial clock signal is not shifted and not inverted.
t
2
t
1
USIC_SSC_TMGX.VSD
Clock Output
SCLKOUT
Data Output
DOUT
t
3
t
3
t
5
Data
valid
t
4
Firs t Trans mit
Edge
Data Input
DX0
Select Output
SELOx
Active
Master Mode Timing
Slave Mode Timi ng
t
11
t
10
Clock Input
DX1
Data Output
DOUT
t
14
t
14
Data
valid
Data Input
DX0
Select Input
DX2
Active
t
13
t
12
Transmit Edge: with this clock edge, transmit data is shifted to transmit data output.
Receive Edge: with this clock edge, receive data at receive data input is latched.
Recei ve
Edge
Last Receive
Edge
InactiveInactive
Transmit
Edge
InactiveInactive
First Transmit
Edge
Recei ve
Edge
Transmi t
Edge
Last Receive
Edge
t
5
Data
valid
t
4
Data
valid
t
12
t
13
Drawn for BRGH .SCLKCFG = 00
B
. Also valid for for SCLKCFG = 01
B
with inverted SCLKOUT signal.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 100 V1.5, 2013-02
4.7.6 Debug Interface Timing
The debugger can communicate with the XC223xN either via the 2-pin DAP interface or
via the standard JTAG interface.
Debug via DAP
The following parameters are applicable for communication through the DAP debug
interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 34 is valid under the following conditions: CL= 20 pF; voltage_range= upper
Table 35 is valid under the following conditions: CL= 20 pF; voltage_range= lower
Table 34 DAP Interface Timing for Upper Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
DAP0 clock period1)
1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state.
t11 SR 25 −−ns
DAP0 high time t12 SR 8 −−ns
DAP0 low time1) t13 SR 8 −−ns
DAP0 clock rise time t14 SR −−4ns
DAP0 clock fall time t15 SR −−4ns
DAP1 setup to DAP0
rising edge
t16 SR 6 −−ns
DAP1 hold after DAP0
rising edge
t17 SR 6 −−ns
DAP1 valid per DAP0
clock period2)
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
t19 CC 17 20 −ns
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 101 V1.5, 2013-02
Figure 23 Test Clock Timing (DAP0)
Table 35 DAP Interface Timing for Lower Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
DAP0 clock period1)
1) See the DAP chapter for clock rate restrictions in the Active::IDLE protocol state.
t11 SR 25 −−ns
DAP0 high time t12 SR 8 −−ns
DAP0 low time1) t13 SR 8 −−ns
DAP0 clock rise time t14 SR −−4ns
DAP0 clock fall time t15 SR −−4ns
DAP1 setup to DAP0
rising edge
t16 SR 6 −−ns
DAP1 hold after DAP0
rising edge
t17 SR 6 −−ns
DAP1 valid per DAP0
clock period2)
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
t19 CC 12 17 −ns
MC_DAP0
0.9
V
DDP
0.5
V
DDP
t
11
t
12
t
13
0.1
V
DDP
t
15
t
14
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 102 V1.5, 2013-02
Figure 24 DAP Timing Host to Device
Figure 25 DAP Timing Device to Host
Note: The transmission timing is determined by the receiving debugger by evaluating the
sync-request synchronization pattern telegram.
Debug via JTAG
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 36 is valid under the following conditions: CL= 20 pF; voltage_range= upper
Table 36 JTAG Interface Timing for Upper Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
TCK clock period t1 SR 50 −−ns 1)
TCK high time t2 SR 16 −−ns
t16 t17
DAP0
DAP1
MC_DAP1_RX
DAP1
MC_DAP1_TX
t
11
t
19
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 103 V1.5, 2013-02
Table 37 is valid under the following conditions: CL= 20 pF; voltage_range= lower
TCK low time t3 SR 16 −−ns
TCK clock rise time t4 SR −−8ns
TCK clock fall time t5 SR −−8ns
TDI/TMS setup to TCK
rising edge
t6 SR 6 −−ns
TDI/TMS hold after TCK
rising edge
t7 SR 6 −−ns
TDO valid from TCK falling
edge (propagation delay)2)
t8 CC −25 29 ns
TDO high impedance to
valid output from TCK
falling edge3)2)
t9 CC −25 29 ns
TDO valid output to high
impedance from TCK
falling edge2)
t10 CC −25 29 ns
TDO hold after TCK falling
edge2)
t18 CC 5 −−ns
1) Under typical conditions, the JTAG interface can operate at transfer rates up to 20 MHz.
2) The falling edge on TCK is used to generate the TDO timing.
3) The setup time for TDO is given implicitly by the TCK cycle time.
Table 37 JTAG Interface Timing for Lower Voltage Range
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
TCK clock period t1 SR 50 −−ns
TCK high time t2 SR 16 −−ns
TCK low time t3 SR 16 −−ns
TCK clock rise time t4 SR −−8ns
TCK clock fall time t5 SR −−8ns
TDI/TMS setup to TCK
rising edge
t6 SR 6 −−ns
Table 36 JTAG Interface Timing for Upper Voltage Range (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 104 V1.5, 2013-02
Figure 26 Test Clock Timing (TCK)
TDI/TMS hold after TCK
rising edge
t7 SR 6 −−ns
TDO valid from TCK falling
edge (propagation delay)1)
t8 CC −32 36 ns
TDO high impedance to
valid output from TCK
falling edge2)1)
t9 CC −32 36 ns
TDO valid output to high
impedance from TCK
falling edge1)
t10 CC −32 36 ns
TDO hold after TCK falling
edge1)
t18 CC 5 −−ns
1) The falling edge on TCK is used to generate the TDO timing.
2) The setup time for TDO is given implicitly by the TCK cycle time.
Table 37 JTAG Interface Timing for Lower Voltage Range (cont’d)
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
MC_JTAG_TCK
0.9 V
DDP
0.5 V
DDP
t
1
t
2
t
3
0.1 V
DDP
t
5
t
4
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Electrical Parameters
Data Sheet 105 V1.5, 2013-02
Figure 27 JTAG Timing
t
6
t
7
t
6
t
7
t
9
t
8
t
10
TCK
TMS
TDI
TDO
MC_JTAG
t
18
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Package and Reliability
Data Sheet 106 V1.5, 2013-02
5 Package and Reliability
The XC2000 Family devices use the package type PG-LQFP (Plastic Green - Low
Profile Quad Flat Package). The following specifications must be regarded to ensure
proper integration of the XC223xN in its target environment.
5.1 Packaging
These parameters specify the packaging rather than the silicon.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC223xN is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Table 38 Package Parameters (PG-LQFP-64-6)
Parameter Symbol Limit Values Unit Notes
Min. Max.
Exposed Pad Dimension Ex × Ey – 5.6 × 5.6 mm –
Power Dissipation PDISS –0.8W–
Thermal resistance
Junction-Ambient
RΘJA – 40 K/W No thermal via1)
1) Device mounted on a 4-layer board without thermal vias; exposed pad not soldered.
37 K/W 4-layer, no pad2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
25 K/W 4-layer, pad3)
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Package and Reliability
Data Sheet 107 V1.5, 2013-02
Package Outlines
Figure 28 PG-LQFP-64-6 (Plastic Green Thin Quad Flat Package)
All dimensions in mm.
You can find complete information about Infineon packages, packing and marking in our
Infineon Internet Page “Packages”: http://www.infineon.com/packages
D
12
H
0.2 A-B D4x
A-B0.2 64x
D
B
12
1
64 64
1
Index Marking Index Marking
0.5
7.5
+0.07
0.2 -0.03
PG-LQFP-64-6, -8, -12-PO V13
0.08 MA-B D
C
COPLANARITYSEATING
PLANE
C
0.08
±0.05
0.1
STAND OFF
±0.05
1.4
1.6 MAX.
±0.15
0.6
H
A
-0.06
+0.05
0.15
0˚...7˚
64x
64x
C
10
0.5 x 45˚
1)
10 1)
1) Does not include plastic or metal protrusion of 0.25 max. per side
Bottom View
Exposed Diepad
Ox
Oy
Ex
Ey
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Package and Reliability
Data Sheet 108 V1.5, 2013-02
5.2 Thermal Considerations
When operating the XC223xN in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (PINT + PIOSTAT + PIODYN) × RΘJA
The internal power consumption is defined as
PINT = VDDP × IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
PIOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
The dynamic external power consumption caused by the output drivers (PIODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
• Reduce VDDP, if possible in the system
• Reduce the system frequency
• Reduce the number of output pins
• Reduce the load on active output drivers
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Package and Reliability
Data Sheet 109 V1.5, 2013-02
5.3 Quality Declarations
The operation lifetime of the XC223xN depends on the applied temperature profile in the
application. For a typical example, please refer to Table 40; for other profiles, please
contact your Infineon counterpart to calculate the specific lifetime within your application.
Table 39 Quality Parameters
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Operation lifetime tOP CC −−20 a See Table 40
and Table 41
ESD susceptibility
according to Human Body
Model (HBM)
VHBM
SR
−−2 000 V EIA/JESD22-
A114-B
Moisture sensitivity level MSL CC −−3−JEDEC
J-STD-020C
Table 40 Typical Usage Temperature Profile
Operating Time (Sum = 20 years) Operating Temperat. Notes
1 200 h TJ = 150°C Normal operation
3 600 h TJ = 125°C Normal operation
7 200 h TJ = 110°C Normal operation
12 000 h TJ = 100°C Normal operation
7 × 21 600 h TJ = 0…10°C, …,
60…70°C
Power reduction
Table 41 Long Time Storage Temperature Profile
Operating Time (Sum = 20 years) Operating Temperat. Notes
2 000 h TJ = 150°C Normal operation
16 000 h TJ = 125°C Normal operation
6 000 h TJ = 110°C Normal operation
151 200 h TJ ≤ 150°C No operation
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