DAN222/D - ON Semiconductor

Motorola Small–Signal Transistors, FETs and Diodes Device Data

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This Common Cathode Silicon Epitaxial Planar Dual Diode is designed for use in

ultra high speed switching applications. This device is housed in the SOT–416/SC–90

package which is designed for low power surface mount applications, where board

space is at a premium.

•Fast trr

•Low CD

•Available in 8 mm Tape and Reel

MAXIMUM RATINGS (TA = 25°C)

Rating Symbol Value Unit

Reverse Voltage VR80 Vdc

Peak Reverse Voltage VRM 80 Vdc

Forward Current IF100 mAdc

Peak Forward Current IFM 300 mAdc

Peak Forward Surge Current

IFSM(1)

2.0 Adc

DEVICE MARKING

DAN222 = N9

THERMAL CHARACTERISTICS

Rating Symbol Max Unit

Power Dissipation PD150 mW

Junction Temperature TJ150 °C

Storage Temperature Tstg –55 ~ +150 °C

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Characteristic Symbol Condition Min Max Unit

Reverse V oltage Leakage Current IRVR = 70 V — 0.1 µAdc

Forward Voltage VFIF = 100 mA — 1.2 Vdc

Reverse Breakdown Voltage VRIR = 100 µA 80 — Vdc

Diode Capacitance CDVR = 6.0 V, f = 1.0 MHz — 3.5 pF

Reverse Recovery Time trr(2) IF = 5.0 mA, VR = 6.0 V, RL = 100 Ω, Irr = 0.1 IR— 4.0 ns

1. t = 1 µS

2. trr Test Circuit on following page.

Thermal Clad is a trademark of the Bergquist Company

Order this document

by DAN222/D

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SEMICONDUCTOR TECHNICAL DATA



SOT–416/SC–90 PACKAGE

COMMON CATHODE

DUAL SWITCHING DIODE

SURFACE MOUNT

CASE 463–01, STYLE 4

SOT–416/SC–90

CATHODE

ANODE

 Motorola, Inc. 1996

REV 1

DAN222

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

TYPICAL ELECTRICAL CHARACTERISTICS

100

0.2 0.4 VF, FORWARD VOLTAGE (VOLTS)

0.6 0.8 1.0 1.2

1.0

0.1

0VR, REVERSE VOLTAGE (VOL TS)

1.0

0.1

0.01

0.001 10 20 30 40 50

IF, FORWARD CURRENT (mA)

Figure 1. Forward Voltage Figure 2. Reverse Current

Figure 3. Diode Capacitance

TA = 150

TA = 125

TA = 85

TA = 55

TA = 25

IR, REVERSE CURRENT (

TA = 85

TA = –40

TA = 25

1.0

0.9

0.8

0.7

0.6 2468

, REVERSE VOLTAGE (VOLTS)

CD, DIODE CAPACITANCE (pF)

ARL

trtp

10%

90%

tp = 2 µs

tr = 0.35 ns

IFtrr t

Irr = 0.1 IR

IF = 5.0 mA

VR = 6 V

RL = 100 Ω

RECOVERY TIME EQUIVALENT TEST CIRCUIT INPUT PULSE OUTPUT PULSE

DAN222

Motorola Small–Signal Transistors, FETs and Diodes Device Data

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

ÉÉÉ

1.4

0.5 min. (3x)

TYPICAL

0.5

SOLDERING PATTERN

Unit: mm

SOT–416/SC–90 POWER DISSIPATION

The power dissipation of the SOT–416/SC–90 is a function

of the pad size. This can vary from the minimum pad size for

soldering to the pad size given for maximum power

dissipation. Power dissipation for a surface mount device is

determined by TJ(max), the maximum rated junction tempera-

ture of the die, RθJA, the thermal resistance from the device

junction to ambient; and the operating temperature, TA.

Using the values provided on the data sheet, PD can be

calculated as follows.

PD = TJ(max) – TA

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature T A of 25°C, one can

calculate the power dissipation of the device which in this

case is 125 milliwatts.

PD = 150°C – 25°C

833°C/W = 150 milliwatts

The 833°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve a

power dissipation of 150 milliwatts. Another alternative would

be to use a ceramic substrate or an aluminum core board

such as Thermal Clad. Using a board material such as

Thermal Clad, a higher power dissipation can be achieved

using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference should be a maximum of 10°C.

•The soldering temperature and time should not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied during

cooling

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

DAN222

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the surface mounted package

should be the same as the pad size on the printed circuit

board, i.e., a 1:1 registration.

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator

must set temperatures for several heating zones, and a

figure for belt speed. Taken together, these control settings

make up a heating “profile” for that particular circuit board.

On machines controlled by a computer, the computer

remembers these profiles from one operating session to the

next. Figure 4 shows a typical heating profile for use when

soldering a surface mount device to a printed circuit board.

This profile will vary among soldering systems but it is a good

starting point. Factors that can affect the profile include the

type of soldering system in use, density and types of

components on the board, type of solder used, and the type

of board or substrate material being used. This profile shows

temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface

of a test board at or near a central solder joint. The two

profiles are based on a high density and a low density board.

The Vitronics SMD310 convection/infrared reflow soldering

system was used to generate this profile. The type of solder

used was 62/36/2 Tin Lead Silver with a melting point

between 177–189°C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1

“RAMP”

STEP 2

VENT

“SOAK”

STEP 3

HEATING

ZONES 2 & 5

“RAMP”

STEP 4

HEATING

ZONES 3 & 6

“SOAK”

STEP 5

HEATING

ZONES 4 & 7

“SPIKE”

STEP 6

VENT STEP 7

COOLING

200

150

100

TIME (3 TO 7 MINUTES T OTAL) TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205

TO 219

PEAK AT

SOLDER JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

100

150

C160

140

Figure 4. Typical Solder Heating Profile

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES 170

DAN222

Motorola Small–Signal Transistors, FETs and Diodes Device Data

PACKAGE DIMENSIONS

CASE 463–01

ISSUE A

SOT–416/SC–90

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A0.70 0.80 0.028 0.031

B1.40 1.80 0.055 0.071

C0.60 0.90 0.024 0.035

D0.15 0.30 0.006 0.012

G1.00 BSC 0.039 BSC

H––– 0.10 ––– 0.004

J0.10 0.25 0.004 0.010

K1.45 1.75 0.057 0.069

L0.10 0.20 0.004 0.008

S0.50 BSC 0.020 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

0.20 (0.008) B

–A–

–B–

3 PL

0.20 (0.008) A

STYLE 3:

PIN 1. ANODE

2. ANODE

3. CATHODE

DAN222

6 Motorola Small–Signal Transistors, FETs and Diodes Device Data

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DAN222/D

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