Plastic Packages
National Semiconductor offers a wide variety of plastic pack-
ages for through-hole and surface mount applications. Many
of these plastic packages provide cost-effective solutions to
achieving greater board density (surface-mount packages)
and high performance. Plastic packages are extensively
used in commercial applications.
Today National offers molded plastic packages. The primary
materials used in a plastic package are a leadframe, die at-
tach material, bond wire, mold compound and a lead finish.
In order to provide plastic package solutions which do not
sacrifice reliability or functionality, National continues to im-
prove on the materials used, whether focusing on leadframe
composition for increased thermal conductivity or low stress
mold compound used for large die applications or low mois-
ture absorption mold compounds for improved reliability.
National offers through hole DIP configurations in the
molded dual-in-line package (MDIP) style. Other through
hole package styles include the plastic pin grid array (PPGA)
packages and various plastic TOs.
Many plastic surface mount packages are offered by Na-
tional. Various plastic TO packages are formed for surface
mount application (TO-263). Dual-in-line packages such as
the small outline package (SOP), the shrink small outline
package (SSOP), the thin small outline package (TSOP) and
the thin shrink small outline package (TSSOP) are available
in lower lead counts. Applications requiring higher density
and increased lead count use quad packages such as the
plastic leaded chip carrier (PLCC), the plastic quad flatpak
(PQFP) and the thin plastic quad pack package(TQFP).
Recent improvements in the surface mount packages in-
clude exposed pad thin packages for improved thermal and
electrical performance. These packages have the same foot-
print as the standard thin packages. Other improvements in-
clude the introduction of the small body size packages such
as the SOT-23, SOT-223 and the SC-70 package outlines
The following table provides configuration and characteristic
data regarding each of the plastic package offered by Na-
tional.
August 1999
Plastic Packages
© 2000 National Semiconductor Corporation MS011797 www.national.com
Package Configuration Package Characteristics
Plastic Small Outline Transistor
(SOT-23) •Surface Mount Package
•Gull Wing Lead Configuration
•Solder Plate Lead Finish
•Molded Package
Plastic Small Outline Package
(SOP)
Narrow Body
Wide Body
•Surface Mount Package
•Gull Wing Lead Configuration
•Solder Plate Lead Finish
•Molded Package
•EIAJ and JEDEC Package Styles
•Footprint Compatible with Ceramic Small Outline Package
(SOIC)
Plastic Shrink Small Outline Package
(SSOP)
•Surface Mount Package
•Gull Wing Lead Configuration
•Solder Plate Lead Finish
•Molded Package
•EIAJ and JEDEC Package Styles
Plastic Thin Small Outline Package, Type I
(TSOP)
•Surface Mount Package
•Gull Wing Lead Configuration
•Solder Plate Lead Finish
•Molded Package
•EIAJ Package Style
Plastic Packages
www.national.com 2
Package Configuration Package Characteristics
Plastic Thin Shrink Small Outline Package
(TSSOP) •Surface Mount Package
•Gull Wing Lead Configuration
•Solder Plate Lead Finish
•Molded Package
•EIAJ Package Styles
Molded Dual-In-Line Package
(MDIP)
•Through Hole Package
•Solder Plate or Solder Dip Lead Finish
•Molded Package
•Footprint Compatible with Ceramic Sidebrazed Dual-In-Line
Package (SB and Cerdip)
•Can be Thermally Enhanced
•Half Lead Package Option
Plastic Pin Grid Array
(PPGA)
•Through Hole Package
•Solder DIP Lead Finish
•Molded Package
•Footprint Compatible CPGA
Plastic Leaded Chip Carrier
(PLCC) •Surface Mount Package
•J-Bend Lead Configuration
•Solder Plate Lead Finish
•Molded Package
•Footprint Compatible with Ceramic Leadless Chip Carrier
(LCC) and Ceramic Quad J-Bend (CQJB)
•Can be Thermally Enhanced
Plastic Packages
www.national.com3
Package Configuration Package Characteristics
Plastic Quad Flatpak
(PQFP) •Surface Mount Package
•Gull Wing Lead Configuration
•Solder Plate Lead Finish
•Molded Package
•Can be Thermally Enhanced
•High Density Package Application
TO-92 •Through Hole Package
•Solder Plate Lead Finish
•Molded Plastic Package
TO-202
•Through Hole Package or Chassis Mounting
•Solder Plate Lead Finish
•Molded Plastic Package
TO-220 •Through Hole Package or Chassis Mounting
•Solder Plate Lead Finish
•Molded Plastic Package
•Designed with Heat Sink for High Power Applications
TO-226
•Through Hole Package
•Solder Plate Lead Finish
•Molded Plastic Package
TO-237 •Through Hole Package
•Solder Plate Lead Finish
•Molded Plastic Package
Plastic Packages
www.national.com 4
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: support@nsc.com
National Semiconductor
Europe Fax: +49 (0) 1 80-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 1 80-530 85 85
English Tel: +49 (0) 1 80-532 78 32
Français Tel: +49 (0) 1 80-532 93 58
Italiano Tel: +49 (0) 1 80-534 16 80
National Semiconductor
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: sea.support@nsc.com
National Semiconductor
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
www.national.com
Plastic Packages
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
