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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
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FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
www.onsemi.com
©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5
September 2018
FOD050L, FOD053L
3.3 V and 5 V High Speed Transistor Optocouplers
Features
■Low Power Consumption
■High Speed
■Available in Single-channel 8-pin SOIC (FOD050L)
or Dual-channel 8-pin SOIC (FOD053L)
■Superior CMR – CMH = 50kV/µs (typical) and
CML = 35kV/µs (typical)
■Guaranteed performance over temperature:
0°C to 70°C
■Safety and Regulatory Approvals:
– UL1577, 2,500 VACRMS for 1 Minute
– DIN-EN/IEC60747-5-5, 565 V Peak Working
Insulation Voltage
Applications
■Line Receivers
■Pulse Transformer Replacement
■High-speed Logic Ground Isolation: LVTTL/LVCMOS
■Wide Bandwidth Analog Coupling
Description
The FOD050L and FOD053L optocouplers consist of
an AlGaAs LED optically coupled to a high speed photo-
detector transistor. These devices are specified for oper-
ation at 3.3 V and 5 V supply voltages.
A separate connection for the bias of the photodiode
improves the speed by several orders of magnitude over
conventional phototransistor optocouplers by reducing
the base-collector capacitance of the input transistor.
An internal noise shield provides superior common
mode rejection of CMH = 50 kV/µs (typical) and
CML = 35 kV/µs (typical).
Schematics Package Outline
LED
On
Off
Truth Table
VO
LOW
HIGH
1
2
3
4 5
6
7
8
+
_
VF1
VCC
V01
V02
GND
VF2
_
+
FOD053L
1
2
3
4 5
6
7
8
+
_
VF
VCC
VB
VO
GNDN/C
N/C
FOD050L
Figure 1. Schematics
Figure 2. Package Outline
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 2
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Safety and Insulation Ratings
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit
data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Note:
1. Safety limit values – maximum values allowed in the event of a failure.
Parameter Characteristics
Installation Classifications per DIN VDE
0110/1.89 Table 1, For Rated Mains Voltage
< 150 VRMS I–IV
< 300 VRMS I–III
Climatic Classification 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Comparative Tracking Index 175
Symbol Parameter Value Unit
VPR
Input-to-Output Test Voltage, Method A, VIORM x 1.6 = VPR,
Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC 904 Vpeak
Input-to-Output Test Voltage, Method B, VIORM x 1.875 = VPR,
100% Production Test with tm = 1 s, Partial Discharge < 5 pC 1060 Vpeak
VIORM Maximum Working Insulation Voltage 565 Vpeak
VIOTM Highest Allowable Over-Voltage 4000 Vpeak
External Creepage ≥4mm
External Clearance ≥4mm
DTI Distance Through Insulation (Insulation Thickness) ≥0.4 mm
TSCase Temperature(1) 150 °C
IS,INPUT Input Current(1) 200 mA
PS,OUTPUT Output Power(1) 300 mW
RIO Insulation Resistance at TS, VIO = 500 V(1) > 109Ω
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 3
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TA = 25°C unless otherwise specified.
Symbol Parameter Value Unit
TSTG Storage Temperature -40 to +125 °C
TOPR Operating Temperature -40 to +85 °C
TJJunction Temperature -40 to +125 °C
TSOL Lead Solder Temperature 260 for 10 seconds °C
EMITTER
IF (avg) DC/Average Forward Input Current Each Channel 25 mA
IF (pk) Peak Forward Input Current
(50% duty cycle, 1 ms P.W.) Each Channel 50 mA
IF (trans) Peak Transient Input Current
(≤1 µs P.W., 300 pps) Each Channel 1.0 A
VRReverse Input Voltage Each Channel 5 V
PD
Input Power Dissipation
(No derating required up to 85°C) Each Channel 45 mW
DETECTOR
IO (avg) Average Output Current Each Channel 8 mA
IO (pk) Peak Output Current Each Channel 16 mA
VEBR Emitter-Base Reverse Voltage FOD050L only 5 V
VCC Supply Voltage -0.5 to 7 V
VOOutput Voltage -0.5 to 7 V
IBBase Current FOD050L only 5 mA
PD
Output Power Dissipation
(No derating required up to 85°C) Each Channel 100 mW
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 4
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Electrical Characteristics
TA = 0 to 70°C unless otherwise specified.
Individual Component Characteristics
Transfer Characteristics
Note:
2. Current Transfer Ratio is defined as a ratio of output collector current, IO, to the forward LED input current, IF, times
100%.
Symbol Parameter Test Conditions Device Min. Typ. Max. Unit
EMITTER
VFInput Forward Voltage IF = 16 mA, TA = 25°C All 1.45 1.7 V
IF = 16 mA 1.8
BVR
Input Reverse
Breakdown Voltage IR = 10 µA All 5.0 V
DETECTOR
IOH
Logic High Output
Current
IF = 0 mA, VO = VCC =
3.3 V & 5 V, TA = 25°C All 0.001 1 µA
ICCL
Logic Low Supply
Current
IF = 16 mA, VO = Open,
VCC = 3.3 V & 5 V FOD050L 200
µA
IF1 = IF2 = 16 mA, VO =
Open, VCC = 3.3 V & 5 V FOD053L 400
ICCH
Logic High Supply
Current
IF = 0 mA, VO = Open, VCC
= 3.3 V & 5 V, TA = 25°C FOD050L 0.3
µA
IF = 0 mA, VO = Open,
VCC = 3.3 V & 5 V
FOD053L 10
Symbol Parameter Test Conditions Device Min. Typ. Max. Unit
COUPLED
CTR Current Transfer Ratio(2) IF = 16 mA, VO = 0.4 V,
VCC = 3.3 V & 5 V, TA = 25°
C
All 15 50 %
VOL
Logic Low Output
Voltage Output Voltage
IF = 16 mA, IO = 3 mA, VCC
= 3.3 V & 5 V, TA = 25°C All 0.3 V
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 5
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Electrical Characteristics (Continued)
TA = 0 to 70°C unless otherwise specified.
Switching Characteristics (VCC = 3.3 V & 5 V)
Isolation Characteristics
Notes:
3. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and 5.6 kΩ pull-up resistor.
4. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor.
5. Common mode transient immunity in logic high level is the maximum tolerable (positive) dVcm / dt on the leading
edge of the common mode pulse signal VCM, to assure that the output will remain in a logic high state
(i.e., VO > 2.0 V). Common mode transient immunity in logic low level is the maximum tolerable (negative)
dVcm / dt on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a
logic low state (i.e., VO < 0.8 V).
6. Device is considered a two terminal device: pins 1, 2, 3 and 4 are shorted together and pins 5, 6, 7 and 8 are
shorted together.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
TPHL
Propagation Delay
Time to Logic LOW
RL = 1.9 kΩ, IF = 16 mA(3)
(Figure 11)
25°C 1.0 µs
2.0
TPLH Propagation Delay
Time to Logic HIGH
RL = 1.9 kΩ, IF = 16 mA(3)
(Figure 11)
25°C 1.0 µs
2.0
|CMH|
Common Mode
Transient Immunity
at Logic HIGH
IF = 0 mA, VCM = 1,000 VP-P, RL = 4.1 kΩ,
TA = 25°C(4)(5) (Figure 12) 5,000 50,000 V/µs
IF = 0 mA, VCM = 1,000 VP-P, TA = 25°C,
RL = 1.9 kΩ(3)(5) (Figure 12) 5,000 50,000 V/µs
|CML|
Common Mode
Transient Immunity
at Logic LOW
IF = 16mA, VCM = 1,000VP-P, RL = 4.1 kΩ,
TA = 25°C(4)(5) (Figure 12) 5,000 35,000 V/µs
IF = 16 mA, VCM = 1,000 VP-P, RL = 1.9 kΩ(3)(5)
(Figure 12) 5,000 35,000 V/µs
Symbol Characteristics Test Conditions Min. Typ. Max. Unit
II-O
Input-Output Insulation
Leakage Current
Relative humidity = 45%, TA = 25°C,
t = 5 s, VI-O = 3000 VDC(6) 1.0 µA
VISO
Withstand Insulation Test
Voltage f = 60Hz, TA = 25°C, t = 60 s(6) 2500 VRMS
RI-O Resistance (Input to Output) VI-O = 500 VDC(6) 1011 1012 Ω
CI-O Capacitance (Input to Output) f = 1 MHz(6) 0.2 pF
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 6
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Typical Performance Curves
Figure 7. Logic High Output Current
vs. Ambient Temperature
TA – AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
IOH – LOGIC HIGH OUTPUT CURRENT (nA)
0.01
0.1
1
10
Figure 5. Current Transfer Ratio
vs. Ambient Temperature
TA – AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
CURRENT TRANSFER RATIO (Normalized)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Figure 6. Output Current vs. Output Voltage
VO – OUTPUT VOLTAGE (V)
0246810121416
IO – OUTPUT CURRENT (mA)
0
2
4
6
8
10
12
Figure 4. Current Transfer Ratio
vs. Forward Current
IF – FORWARD CURRENT (mA)
0 5 10 15 20 25
CURRENT TRANSFER RATIO (Normalized)
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
VO = 0.4 V
VCC = 3.3 V & 5 V
TA = 25°C
TA = 0°C
TA = -40°C
TA = 70°C
TA = 85°C
Normalized to
IF = 16 mA, TA = 25°C
Figure 3. LED Forward Current
vs. Forward Voltage
VF – FORWARD VOLTAGE (V)
0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
IF – FORWARD CURRENT (mA)
0.001
0.01
0.1
1
10
100
TA = 85°C
TA = 70°C
TA = 25°C
TA = 0°C
TA = -40°C
Normalized to TA=25°C
IF= 16 mA
VO=0.4 V
VCC = 3.3 V & 5 V
10 mA
20 mA
IF= 25 mA
15 mA
5 mA
TA=25°C
VCC = 3.3 V & 5 V
V
O
= V
CC
= 3.3 V & 5 V
I
F
=0
Figure 8. Supply Current
vs. Input Forward Current
IF – INPUT FORWARD CURRENT (mA)
ICC (PER CHANNEL) – SUPPLY CURRENT (μA)
0
0246810121416
20
40
60
80
100
120
TA=25°C
VCC = 3.3 V & 5 V
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 7
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Typical Performance Curves (Continued)
Figure 9. Propagation Delay
vs. Ambient Temperature
TA – AMBIENT TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
tP – PROPAGATION DELAY (μs)
tP – PROPAGATION DELAY (μs)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Figure 10. Propagation Delay vs.
Load Resistance
R
L
– LOAD RESISTANCE (kΩ)
110
0.1
1
10
235
VCC = 3.3 V & 5 V
IF= 16 mA
tPLH,R
L=4.1k
Ω
tPLH,R
L=1.9kΩ
tPHL,R
,R
L=1.9kΩ&4.1kΩ
VCC = 3.3 V &5 V
TA=25°C
tPLH,I
F= 16 mA
tPLH,I
F= 10 mA
tPHL,I
F= 16 mA
tPHL,I
F= 10 mA
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 8
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Test Circuits
Pulse Gen
CM
V
V
FF
B
A
+-
+3.3 V
O
V
-
I
F
3
4
+
F
V
-
2
1
Shield
Noise
6
O
5
GND
7
8
V
B
V
CC
V
L
R
PLH
OL
V
V
O
0
3.3 V
50%50%
F
I
T
PHL
T
Switch at A : I = 0 mA
F
Switch at A : I = 16 mA
F
t
r
V
O
O
V
OL
V
3.3 V
0 V 10% 10 %
90%
CM
V 1000 V
4 5
Noise
1
2
3
Shield
8
7
6
+3.3 V
O
V
V
CC
V
01
V
02
GND
V
F1
-
+
F2
V
-
F
I+
10% DUTY CYCLE
I/f < 100μS
F
I
MONITOR
L
R
C = 1.5 pF
L
Pulse
Generator
tr = 5ns
Z = 50
O
Ω
GND
+
4 5
1
3
2
-
F2
V
V
F1
-
Shield
Noise
+3.3 V
CC
8
V
L
V
6
02
V
7
R
01
V
O
V
CM
A
B
Pulse Gen
F
I
+-
+
3
I Monitor
F
4
I/f < 100μs
10% D.C.
tr = 5ns
Generator
Pulse
Z = 50
O
+
V
F
I
Ω
F
-
2
1
Shield
Noise
V
O
O
6
5
GND
7
8
V
B
V
L
R
CC
V+3.3 V
0.1 μF
L
C = 1.5 pF
0.1 μF
Test Circuit for FOD050L Test Circuit for FOD053L
Test Circuit for FOD050L Test Circuit for FOD053L
f
t
0.1 μF
0.1 μF
FF
V
m
R
m
R
90%
Figure 12. Common Mode Immunity Test Circuit
Figure 11. Switching Time Test Circuit
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 9
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Reflow Profile
Figure 13. Reflow Profile
Profile Freature Pb-Free Assembly Profile
Temperature Minimum (Tsmin) 150°C
Temperature Maximum (Tsmax) 200°C
Time (tS) from (Tsmin to Tsmax) 60–120 seconds
Ramp-up Rate (tL to tP) 3°C/second maximum
Liquidous Temperature (TL) 217°C
Time (tL) Maintained Above (TL) 60–150 seconds
Peak Body Package Temperature 260°C +0°C / –5°C
Time (tP) within 5°C of 260°C 30 seconds
Ramp-down Rate (TP to TL) 6°C/second maximum
Time 25°C to Peak Temperature 8 minutes maximum
Time (seconds)
Temperature (°C)
Time 25°C to Peak
260
240
220
200
180
160
140
120
100
80
60
40
20
0
TL
ts
tL
tP
TP
Tsm a x
Tsm i n
120
Preheat Area
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
240 360
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©2003 Semiconductor Components Industries, LLC
FOD050L, FOD053L Rev. 5 10
FOD050L, FOD053L — 3.3 V and 5 V High Speed Transistor Optocouplers
Ordering Information
Note:
7. The product orderable part number system listed in this table also applies to the FOD053L product.
Marking Information
Figure 14. Top Mark
Table 1. Top Mark Definitions
Part Number Package Packing Method
FOD050L Small Outline 8-Pin Tube (100 Units)
FOD050LR2 Small Outline 8-Pin Tape and Reel (1000 Units)
FOD050LV Small Outline 8-Pin, DIN EN/IEC60747-5-5 Option Tube (100 Units)
FOD050LR2V Small Outline 8-Pin, DIN EN/IEC60747-5-5 Option Tape and Reel (1000 Units)
1ON Semiconductor Logo
2 Device Number
3 DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)
4 One-Digit Year Code, e.g., “5”
5 Digit Work Week, Ranging from “01” to “53”
6 Assembly Package Code
1
2
6
43 5
50L
SYYXV
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1
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