1
FEATURES
DBV, DCK, OR DRL PACKAGE
(TOP VIEW)
1
2
3
6
5
4
VCCA
GND
A
VCCB
OE
B
YZP PACKAGE
(BOTTOM VIEW)
GND
A B
VCCA
OE
VCCB
2
3
6
4
1
5
B1
C1
A1 A2
C2
B2
DESCRIPTION/ORDERING INFORMATION
TXS0101
www.ti.com
............................................................................................................................................. SCES638B – OCTOBER 2007 – REVISED JANUARY 2009
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATORFOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
2
•No Direction-Control Signal Needed •ESD Protection Exceeds JESD 22•Maximum Data Rates – A Port– 24 Mbps (Push Pull) – 2500-V Human-Body Model (A114-B)– 2 Mbps (Open Drain) – 200-V Machine Model (A115-A)•Available in the Texas Instruments NanoFree™ – 1500-V Charged-Device Model (C101)Package
– B Port•1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on
– 8-kV Human-Body Model (A114-B)B port (V
CCA
≤V
CCB
)
– 200-V Machine Model (A115-A)•V
CC
Isolation Feature – If Either V
CC
Input Is at
– 1500-V Charged-Device Model (C101)GND, Both Ports Are in the High-ImpedanceState
•No Power-Supply Sequencing Required –Either V
CCA
or V
CCB
Can be Ramped First•I
off
Supports Partial-Power-Down ModeOperation
•Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II
This one-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed totrack V
CCA
. V
CCA
accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track V
CCB
. V
CCAmust be less than or equal to V
CCB
. V
CCB
accepts any supply voltage from 2.3 V to 5.5 V. This allows forlow-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through apulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
Data
GNDGNDGND
Data A B
VCCA VCCB
OE
1.8 V
System
Controller
3.3 V
System
3.3 V1.8 V
TXS0101
SCES638B – OCTOBER 2007 – REVISED JANUARY 2009 .............................................................................................................................................
www.ti.com
ORDERING INFORMATION
ORDERABLE TOP-SIDET
A
PACKAGE
(1) (2)
PART NUMBER MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 TXS0101YZPR _ _ _2G_0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 TXS0101DBVRSOT (SOT-23) – DBV NFF_Reel of 250 TXS0101DBVT– 40 ° C to 85 ° C
Reel of 3000 TXS0101DCKRSOT (SC-70) – DCK 2G_Reel of 250 TXS0101DCKTReel of 3000 TXS0101DRLRSOT (SOT-563) – DRL 2G_Reel of 250 TXS0101DRLT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
PIN DESCRIPTION
NO. NAME FUNCTION
1 V
CCA
A-port supply voltage. 1.65 V ≤V
CCA
≤3.6 V and V
CCA
≤V
CCB
2 GND Ground3 A Input/output A. Referenced to V
CCA
.4 B Input/output B. Referenced to V
CCB
.5 OE Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to V
CCA
.6 V
CCB
B-port supply voltage. 2.3 V ≤V
CCB
≤5.5 V
TYPICAL OPERATING CIRCUIT
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Product Folder Link(s): TXS0101
ABSOLUTE MAXIMUM RATINGS
(1)
THERMAL IMPEDANCE RATINGS
TXS0101
www.ti.com
............................................................................................................................................. SCES638B – OCTOBER 2007 – REVISED JANUARY 2009
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CCA
Supply voltage range – 0.5 4.6 VV
CCB
Supply voltage range – 0.5 6.5 VA port – 0.5 4.6V
I
Input voltage range
(2)
VB port, OE – 0.5 6.5A port – 0.5 4.6Voltage range applied to any outputV
O
Vin the high-impedance or power-off state
(2)
B port – 0.5 6.5A port – 0.5 V
CCA
+ 0.5V
O
Voltage range applied to any output in the high or low state
(2) (3)
VB port – 0.5 V
CCB
+ 0.5I
IK
Input clamp current V
I
< 0 – 50 mAI
OK
Output clamp current V
O
< 0 – 50 mAI
O
Continuous output current ± 50 mAContinuous current through V
CCA
, V
CCB
, or GND ± 100 mAT
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CCA
and V
CCB
are provided in the recommended operating conditions table.
UNIT
DBV package 165DCK package 259θ
JA
Package thermal impedance
(1)
° C/WDRL package 142YZP package 123
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright © 2007 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TXS0101
RECOMMENDED OPERATING CONDITIONS
(1) (2)
ELECTRICAL CHARACTERISTICS
(1) (2) (3)
TXS0101
SCES638B – OCTOBER 2007 – REVISED JANUARY 2009 .............................................................................................................................................
www.ti.com
V
CCA
V
CCB
MIN MAX UNIT
V
CCA
1.65 3.6Supply voltage
(3)
VV
CCB
2.3 5.51.65 V to 1.95 V V
CCI
– 0.2 V
CCIA-port I/Os 2.3 V to 5.5 V2.3 V to 3.6 V V
CCI
– 0.4 V
CCIV
IH
High-level input voltage VB-port I/Os V
CCI
– 0.4 V
CCI1.65 V to 3.6 V 2.3 V to 5.5 VOE input V
CCA
× 0.65 5.5A-port I/Os 0 0.15V
IL
Low-level input voltage B-port I/Os 1.65 V to 3.6 V 2.3 V to 5.5 V 0 0.15 VOE input 0 V
CCA
× 0.35A-port I/Os,
10push-pull drivingInput transition rise or fallΔt/ Δv B-port I/Os, 1.65 V to 3.6 V 2.3 V to 5.5 V ns/Vrate 10push-pull drivingControl Input 10T
A
Operating free-air temperature – 40 85 ° C
(1) V
CCI
is the supply associated with the input port.(2) V
CCO
is the supply associated with the output port.(3) V
CCA
must be less than or equal to V
CCB
, and V
CCA
must not exceed 3.6 V.
over recommended operating free-air temperature range (unless otherwise noted)
T
A
= 25 ° C – 40 ° C to 85 ° CTESTPARAMETER V
CCA
V
CCB
UNITCONDITIONS
MIN TYP MAX MIN MAX
I
OH
= – 20 µA,V
OHA
1.65 V to 3.6 V 2.3 V to 5.5 V V
CCA
× 0.67 VV
IB
≥V
CCB
– 0.4 VI
OL
= 1 mA,V
OLA
1.65 V to 3.6 V 2.3 V to 5.5 V 0.4 VV
IB
≤0.15 VI
OH
= – 20 µA,V
OHB
1.65 V to 3.6 V 2.3 V to 5.5 V V
CCB
× 0.67 VV
IA
≥V
CCA
– 0.2 VI
OL
= 1 mA,V
OLB
1.65 V to 3.6 V 2.3 V to 5.5 V 0.4 VV
IA
≤0.15 VI
I
OE 1.65 V to 3.6 V 1.65 V to 5.5 V ± 1 ± 2 µAA port 0 V 0 to 5.5 V ± 1 ± 2 µAI
off
B port 0 to 3.6 V 0 V ± 1 ± 2 µAI
OZ
A or B port 1.65 V to 3.6 V 2.3 V to 5.5 V ± 1 ± 2 µA1.65 V to V
CCB
2.3 V to 5.5 V 2.4V
I
= V
O
= open,I
CCA
3.6 V 0 V 2.2 µAI
O
= 0
0 V 5.5 V -11.65 V to V
CCB
2.3 V to 5.5 V 12V
I
= V
O
= open,I
CCB
3.6 V 0 V -1 µAI
O
= 0
0 V 5.5 V 1V
I
= V
CCI
,I
CCA
+ I
CCB
1.65 V to V
CCB
2.3 V to 5.5 V 14.4 µAI
O
= 0C
I
OE 3.3 V 3.3 V 2.5 3.5 pFA port 5 6C
io
3.3 V 3.3 V pFB port 6 7.5
(1) V
CCI
is the V
CC
associated with the input port.(2) V
CCO
is the V
CC
associated with the output port.(3) V
CCA
must be less than or equal to V
CCB
, and V
CCA
must not exceed 3.6 V.
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Product Folder Link(s): TXS0101
TIMING REQUIREMENTS
TIMING REQUIREMENTS
TIMING REQUIREMENTS
TXS0101
www.ti.com
............................................................................................................................................. SCES638B – OCTOBER 2007 – REVISED JANUARY 2009
over recommended operating free-air temperature range, V
CCA
= 1.8 V ± 0.15 V (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V± 0.2 V ± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX MIN MAX
Push-pull driving 21 22 24Data rate MbpsOpen-drain driving 2 2 2Push-pull driving 47 45 41t
w
Pulse duration Data inputs nsOpen-drain driving 500 500 500
over recommended operating free-air temperature range, V
CCA
= 2.5 V ± 0.2 V (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 V± 0.2 V ± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX MIN MAX
Push-pull driving 20 22 24Data rate MbpsOpen-drain driving 2 2 1Push-pull driving 50 45 41t
w
Pulse duration Data inputs nsOpen-drain driving 500 500 500
over recommended operating free-air temperature range, V
CCA
= 3.3 V ± 0.3 V (unless otherwise noted)
V
CCB
= 3.3 V V
CCB
= 5 V± 0.3 V ± 0.5 V
UNITMIN MAX MIN MAX
Push-pull driving 23 24Data rate MbpsOpen-drain driving 2 2Push-pull driving 43 41t
w
Pulse duration Data inputs nsOpen-drain driving 500 500
Copyright © 2007 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TXS0101
SWITCHING CHARACTERISTICS
TXS0101
SCES638B – OCTOBER 2007 – REVISED JANUARY 2009 .............................................................................................................................................
www.ti.com
over recommended operating free-air temperature range, V
CCA
= 1.8 V ± 0.15 V (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO TEST
± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
MIN MAX MIN MAX MIN MAX
Push-pull driving 5.3 5.4 6.8t
PHL
Open-drain driving 2.3 8.8 2.4 9.6 2.6 10A B nsPush-pull driving 6.8 7.1 7.5t
PLH
Open-drain driving 45 260 36 208 27 198Push-pull driving 4.4 4.5 4.7t
PHL
Open-drain driving 1.9 5.3 1.1 4.4 1.2 4B A nsPush-pull driving 5.3 4.5 0.5t
PLH
Open-drain driving 45 175 36 140 27 102t
en
OE A or B 200 200 200 nst
dis
OE A or B 50 40 35 nsPush-pull driving 3.2 9.5 2.3 9.3 2 7.6t
rA
A-port rise time nsOpen-drain driving 38 165 30 132 22 95Push-pull driving 1.1 10.8 1 9.1 1 7.6t
rB
B-port rise time nsOpen-drain driving 34 145 23 106 10 76Push-pull driving 1.9 5.9 1.9 6 1.4 13.3t
fA
A-port fall time
Open-drain driving 4.4 6.9 4.3 6.4 4.2 6.1
nsPush-pull driving 2.2 13.8 2.2 16.2 2.6 16.2t
fB
B-port fall time
Open-drain driving 6.9 13.8 7.5 16.2 7 16.2Push-pull driving 21 22 24Max data rate MbpsOpen-drain driving 2 2 2
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Product Folder Link(s): TXS0101
SWITCHING CHARACTERISTICS
TXS0101
www.ti.com
............................................................................................................................................. SCES638B – OCTOBER 2007 – REVISED JANUARY 2009
over recommended operating free-air temperature range, V
CCA
= 2.5 V ± 0.2 V (unless otherwise noted)
V
CCB
= 2.5 V V
CCB
= 3.3 V V
CCB
= 5 VFROM TO TEST
± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
MIN MAX MIN MAX MIN MAX
Push-pull driving 3.2 3.7 3.8t
PHL
Open-drain driving 1.7 6.3 2 6 2.1 5.8A B nsPush-pull driving 3.5 4.1 4.4t
PLH
Open-drain driving 43 250 36 206 27 190Push-pull driving 3 3.6 4.3t
PHL
Open-drain driving 1.8 4.7 1.6 4.2 1.2 4B A nsPush-pull driving 2.5 1.6 1t
PLH
Open-drain driving 44 170 37 140 27 103t
en
OE A or B 200 200 200 nst
dis
OE A or B 50 40 35 nsPush-pull driving 2.8 7.4 2.1 6.6 0.9 5.6t
rA
A-port rise time nsOpen-drain driving 34 149 28 121 24 89Push-pull driving 1.3 8.3 0.9 7.2 0.4 6.1t
rB
B-port rise time nsOpen-drain driving 35 151 24 112 12 81Push-pull driving 1.9 5.7 1.4 5.5 0.8 5.3t
fA
A-port fall time nsOpen-drain driving 4.4 6.9 4.3 6.2 4.2 5.8Push-pull driving 2.2 7.8 2.4 6.7 2.6 6.6t
fB
B-port fall time nsOpen-drain driving 5.1 8.8 5.4 9.4 5.4 10.4Push-pull driving 20 22 24Max data rate MbpsOpen-drain driving 2 2 2
Copyright © 2007 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TXS0101
SWITCHING CHARACTERISTICS
PRINCIPLES OF OPERATION
Applications
Architecture
TXS0101
SCES638B – OCTOBER 2007 – REVISED JANUARY 2009 .............................................................................................................................................
www.ti.com
over recommended operating free-air temperature range, V
CCA
= 3.3 V ± 0.3 V (unless otherwise noted)
V
CCB
= 3.3 V V
CCB
= 5 VFROM TO TEST
± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT) CONDITIONS
MIN MAX MIN MAX
Push-pull driving 2.4 3.1t
PHL
Open-drain driving 1.3 4.2 1.4 4.6A B nsPush-pull driving 4.2 4.4t
PLH
Open-drain driving 36 204 28 165Push-pull driving 2.5 3.3t
PHL
Open-drain driving 1 124 1 97B A nsPush-pull driving 2.5 2.6t
PLH
Open-drain driving 3 139 3 105t
en
OE A or B 200 200 nst
dis
OE A or B 40 35 nsPush-pull driving 2.3 5.6 1.9 4.8t
rA
A-port rise time nsOpen-drain driving 25 116 19 85Push-pull driving 1.6 6.4 0.6 7.4t
rB
B-port rise time nsOpen-drain driving 26 116 14 72Push-pull driving 1.4 5.4 1 5t
fA
A-port fall time nsOpen-drain driving 4.3 6.1 4.2 5.7Push-pull driving 2.3 7.4 2.4 7.6t
fB
B-port fall time nsOpen-drain driving 5 7.6 4.8 8.3Push-pull driving 23 24Max data rate MbpsOpen-drain driving 2 2
The TXS0101 can be used in level-translation applications for interfacing devices or systems operating atdifferent interface voltages with one another. The TXS0101 is ideal for use in applications where an open-draindriver is connected to the data I/Os. The TXB0101 can also be used in applications where a push-pull driver isconnected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications.
The TXS0101 architecture (see Figure 1 ) does not require a direction-control signal to control the direction ofdata flow from A to B or from B to A.
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VCCB
B
VCCA VCCB
GateBias
One-
shot
One-
shot
10k 10k
T1 T2
A
Input Driver Requirements
Power Up
Enable and Disable
Pullup or Pulldown Resistors on I/O Lines
TXS0101
www.ti.com
............................................................................................................................................. SCES638B – OCTOBER 2007 – REVISED JANUARY 2009
Figure 1. Architecture of a TXS01xx Cell
Each A-port I/O has an internal 10-k Ωpullup resistor to V
CCA
, and each B-port I/O has an internal 10-k Ωpullupresistor to V
CCB
. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shotturns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition.
The fall time (t
fA
, t
fB
) of a signal depends on the output impedance of the external device driving the data I/Os ofthe TXS0101. Similarly, the t
PHL
and max data rates also depend on the output impedance of the external driver.The values for t
fA
, t
fB
, t
PHL
, and maximum data rates in the data sheet assume that the output impedance of theexternal driver is less than 50 Ω.
During operation, ensure that V
CCA
≤V
CCB
at all times. During power-up sequencing, V
CCA
≥V
CCB
does notdamage the device, so any power supply can be ramped up first.
The TXS0101 has an OE input that is used to disable the device by setting OE low, which places all I/Os in theHi-Z state. The disable time (t
dis
) indicates the delay between the time when OE goes low and when the outputsactually get disabled (Hi-Z). The enable time (t
en
) indicates the amount of time the user must allow for theone-shot circuitry to become operational after OE is taken high.
Each A-port I/O has an internal 10-k Ωpullup resistor to V
CCA
, and each B-port I/O has an internal 10-k Ωpullupresistor to V
CCB
. If a smaller value of pullup resistor is required, an external resistor must be added from the I/Oto V
CCA
or V
CCB
(in parallel with the internal 10-k Ωresistors).
Copyright © 2007 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Link(s): TXS0101
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
S1
2 × VCCO
Open
50 kW
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
VCCA/2VCCA/2
VCCI
0 V
VCCO/2VOH
VOL
0 V
0.1 y VCCO
VCCO/2
0.9 y VCCO VCCO/2 0 V
VCCI
0 V
VCCI/2 VCCI/2
tw
Input
VCCA
VCCO
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
Input
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
TEST S1
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
50 kW
1 MW
15 pF
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
VCCO
VCCI
DUT
IN OUT
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
VCCO
VCCI
DUT
IN OUT
VCCI/2 VCCI/2
0.9 y VCCO
VCCO/2
tr
0.1 y VCCO tf
TXS0101
SCES638B – OCTOBER 2007 – REVISED JANUARY 2009 .............................................................................................................................................
www.ti.com
Figure 2. Load Circuit and Voltage Waveforms
10 Submit Documentation Feedback Copyright © 2007 – 2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0101
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TXS0101DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DCKT ACTIVE SC70 DCK 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DRLR ACTIVE SOT DRL 6 4000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101DRLRG4 ACTIVE SOT DRL 6 4000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TXS0101YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jan-2012
Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TXS0101DBVR SOT-23 DBV 6 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
TXS0101DBVT SOT-23 DBV 6 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
TXS0101DCKR SC70 DCK 6 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TXS0101DCKT SC70 DCK 6 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TXS0101DRLR SOT DRL 6 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TXS0101YZPR DSBGA YZP 6 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TXS0101DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0
TXS0101DBVT SOT-23 DBV 6 250 202.0 201.0 28.0
TXS0101DCKR SC70 DCK 6 3000 203.0 203.0 35.0
TXS0101DCKT SC70 DCK 6 250 203.0 203.0 35.0
TXS0101DRLR SOT DRL 6 4000 202.0 201.0 28.0
TXS0101YZPR DSBGA YZP 6 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2012
Pack Materials-Page 2
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