BMD-300-Series-DS 1.11 Page 1 of 36
Rigado, Inc.
3950 Fairview Industrial Dr.
Salem, Oregon 97302
866-6-RIGADO
modules@rigado.com
www.rigado.com/modules
BMD-300 Series Module for Bluetooth 5 LE
The BMD-300 Series from Rigado is a line of powerful, highly flexible, ultra-low power
Bluetooth Smart modules based on the nRF52832 SoC from Nordic Semiconductor. With
an ARM® Cortex™ M4F CPU, embedded 2.4GHz transceiver, and integrated antenna, they
provide a complete RF solution with no additional RF design, allowing faster time to
market. Providing full use of the nRF52832’s capabilities and peripherals, the BMD-300
Series can power the most demanding applications, all while simplifying designs and
reducing BOM costs. With an internal DC-DC converter and intelligent power control, the
BMD-300 Series provide class-leading power efficiency, enabling ultra-low power sensitive
applications. Regulatory pre-approvals reduce the burden to enter the market, and the
included BMD Software Suite provides access to great features like a secure BLE & UART
bootloader, iOS & Android Bluetooth libraries, and more. Available in three variants:
internal antenna (BMD-300), U.FL connector (BMD-301), and ultra-miniature (BMD-350).
1. Features
• Based on the Nordic nRF52832 SoC
• Bluetooth 5 2M LE + Advertisement Extensions
• Complete RF solution with integrated antenna
(BMD-300 & BMD-350) or U.FL connector (BMD-
301)
• Integrated DC-DC converter
• No external components required
• ARM® Cortex™-M4F 32-bit processor
• Serial Wire Debug (SWD)
• Nordic SoftDevice ready
• Over-the-Air (OTA) firmware updates
• 512kB embedded flash memory
• 64kB RAM
• 32 General Purpose I/O Pins
• 12-bit/200KSPS ADC
• -40C to +85C Temperature Range
• BMD Software Suite included
• FCC: 2AA9B04 (BMD-300/BMD-301) 2AA9B05
(BMD-350)
• Three SPI Master/Slave (8 Mbps)
• Low power comparator
• Temperature sensor
• Random Number Generator
• Two 2-wire Master/Slave (I2C compatible)
• I2S audio interface
• UART (w/ CTS/RTS and DMA)
• 20 channel CPU independent Programmable
Peripheral Interconnect (PPI)
• Quadrature Demodulator (QDEC)
• 128-bit AES HW encryption
• 5 x 32bit, 3 x 24bit Real Timer Counters (RTC)
• NFC-A tag interface for OOB pairing
• BMD-300/301 Dimensions: 14 x 9.8 x 1.9mm
• BMD-350 Dimensions: 8.7 x 6.4 x 1.5mm
• IC: 12208A-04 (BMD-300/BMD-301) 12208A-05
(BMD-350)
• Japan: 210-106799 (BMD-300) 210-107153 (BMD-301)
210-108944 (BMD-350)
2. Applications
• App-cessories
• Beacons – iBeacon™, AltBeacon, Eddystone, etc.
• Low-Power Sensors
• Lighting Products
• Fitness devices
• Wearables
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 2 of 36
3. Ordering Information
Email modules@rigado.com for quotes and ordering or visit www.rigado.com/BMD-300
Part Number
Description
BMD-300-A-R
BMD-300 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-301-A-R
BMD-301 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-350-A-R
BMD-350 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-300-EVAL
BMD-300 Evaluation Kit with Segger J-Link programmer
BMD-301-EVAL
BMD-301 Evaluation Kit with Segger J-Link programmer w/antennas
BMD-350-EVAL
BMD-350 Evaluation Kit with Segger J-Link programmer
Table 1 – Ordering Part Numbers
4. Block Diagram
BMD-300 Series Modules
32 MHz
Crystal
nRF52832
512kB
Flash
DC-DC
Inductor
Decoupling
Capacitors
Bulk
Capacitors
2.4GHz Radio
Multi-protocol
TWI
Master x2
SPI
Master x3
SPI Slave
X3
DC/DC Buck
Regulator
Core LDO
64
kB RAM
Low Power
Comparator
8-ch 12-bit
ADC
UART Quadrature
Decoder
SWD Debug &
Programming Temperature
Sensor
Clock
Management
Watchdog
Timer
Random Number
Gen
Timer x5
Accel Address
Resolver
AES CCM Mode
Encryption
AES ECB
Real Time
Counter x3
GPIO Task
Event Blocks
Programmable
Peripheral
Interconnect
ARM Cortex-M4F
@ 64MHz Matching
Network
Antenna
/ U.FL
GPIO x32
(Analog x8)
I2S
TWI Slave
x2 PWM PDM
General
Purpose
Comparator
NFC Tag
Balun
Figure 1 – Block Diagram
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 3 of 36
Table of Contents
1. FEATURES........................................................................................................................................................................ 1
2. APPLICATIONS ................................................................................................................................................................. 1
3. ORDERING INFORMATION ............................................................................................................................................... 2
4. BLOCK DIAGRAM ............................................................................................................................................................. 2
5. QUICK SPECIFICATIONS .................................................................................................................................................... 5
6. PIN DESCRIPTIONS ........................................................................................................................................................... 6
6.1 BMD-300 / BMD-301 ........................................................................................................................................................................6
6.2 BMD-350 ..........................................................................................................................................................................................7
6.3 RIGDFU PIN FUNCTIONS ........................................................................................................................................................................9
6.4 BMDWARE PIN FUNCTIONS ....................................................................................................................................................................9
7. ELECTRICAL SPECIFICATIONS .......................................................................................................................................... 10
7.1 ABSOLUTE MAXIMUM RATINGS..............................................................................................................................................................10
7.2 OPERATING CONDITIONS.......................................................................................................................................................................10
7.3 GENERAL PURPOSE I/O ........................................................................................................................................................................10
7.4 MODULE RESET .................................................................................................................................................................................11
7.5 DEBUG & PROGRAMMING ....................................................................................................................................................................11
7.6 CLOCKS .............................................................................................................................................................................................11
8. FIRMWARE .................................................................................................................................................................... 14
8.1 FACTORY IMAGE ..................................................................................................................................................................................14
8.1.1 Firmware Version ‘AA’ .................................................................................................................................................................14
8.1.2 Firmware Version ‘AB’ .................................................................................................................................................................14
8.1.3 Firmware Version ‘AC’ .................................................................................................................................................................14
8.1.4 Firmware Version ‘AD’ .................................................................................................................................................................14
8.1.5 Firmware Version ‘AE’..................................................................................................................................................................15
8.1.6 Module Programming and Read-Back Protection .......................................................................................................................15
8.2 SOFTDEVICES .....................................................................................................................................................................................16
8.2.1 S132..............................................................................................................................................................................................16
8.2.2 S212..............................................................................................................................................................................................16
8.2.3 S332..............................................................................................................................................................................................17
8.3 MAC ADDRESS INFO ...........................................................................................................................................................................17
9. MECHANICAL DATA ....................................................................................................................................................... 18
9.1 MECHANICAL DIMENSIONS ....................................................................................................................................................................18
9.1.1 BMD-300 Dimensions ..................................................................................................................................................................18
9.1.2 BMD-301 Dimensions ..................................................................................................................................................................18
9.1.3 BMD-350 Dimensions ..................................................................................................................................................................19
9.2 RECOMMENDED PCB LAND PADS ...........................................................................................................................................................19
9.2.1 BMD-300/301 ..............................................................................................................................................................................19
9.2.2 BMD-350 ......................................................................................................................................................................................20
10. MODULE MARKING........................................................................................................................................................ 20
10.1 BMD-300 MODULE MARKING .............................................................................................................................................................20
10.2 BMD-301 MODULE MARKING .............................................................................................................................................................21
10.3 BMD-350 MODULE MARKING .............................................................................................................................................................21
11. RF DESIGN NOTES .......................................................................................................................................................... 22
11.1 RECOMMENDED RF LAYOUT & GROUND PLANE ........................................................................................................................................22
11.1.1 BMD-300 ......................................................................................................................................................................................22
11.1.2 BMD-301 ......................................................................................................................................................................................22
11.1.3 BMD-350 ......................................................................................................................................................................................22
11.2 MECHANICAL ENCLOSURE .....................................................................................................................................................................23
11.3 ANTENNA PATTERNS ............................................................................................................................................................................24
11.3.1 BMD-300 ......................................................................................................................................................................................24
11.3.2 BMD-350 ......................................................................................................................................................................................26
12. EVALUATION BOARDS .................................................................................................................................................... 27
13. CUSTOM DEVELOPMENT ................................................................................................................................................ 27
14. BLUETOOTH QUALIFICATION .......................................................................................................................................... 28
15. REGULATORY STATEMENTS ............................................................................................................................................ 28
15.1 FCC STATEMENT: ................................................................................................................................................................................28
15.2 FCC IMPORTANT NOTES .......................................................................................................................................................................28
15.3 IC STATEMENT: ...................................................................................................................................................................................30
15.4 IC IMPORTANT NOTES ..........................................................................................................................................................................30
15.5 CE REGULATORY .................................................................................................................................................................................31
15.6 JAPAN (MIC) .....................................................................................................................................................................................31
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 4 of 36
15.7 AUSTRALIA / NEW ZEALAND ..................................................................................................................................................................32
15.8 APPROVED EXTERNAL ANTENNAS............................................................................................................................................................32
15.9 BMD-350 MODULE LABELING ..............................................................................................................................................................32
16. SOLDER REFLOW TEMPERATURE-TIME PROFILE .............................................................................................................. 33
16.1 MOISTURE SENSITIVITY LEVEL ................................................................................................................................................................33
17. PACKAGING AND LABELING ............................................................................................................................................ 33
17.1 CARRIER TAPE DIMENSIONS ...................................................................................................................................................................33
17.1.1 BMD-300 & BMD-301 ..................................................................................................................................................................33
17.1.2 BMD-350 ......................................................................................................................................................................................34
17.2 REEL PACKAGING.................................................................................................................................................................................34
17.3 PACKAGING LABEL ...............................................................................................................................................................................35
18. CAUTIONS ..................................................................................................................................................................... 35
19. LIFE SUPPORT POLICY .................................................................................................................................................... 35
20. DOCUMENT HISTORY ..................................................................................................................................................... 36
21. RELATED DOCUMENTS ................................................................................................................................................... 36
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 5 of 36
5. Quick Specifications
Bluetooth
Version
5.0 Concurrent Central & Peripheral (S132), 2M LE + Advertisement Extensions
Security
AES-128
LE connections
Concurrent central, observer, peripheral, and broadcaster roles with up to twenty
concurrent connections along with one Observer and one Broadcaster (S132)
Radio
Frequency
2.360GHz to 2.500GHz
Modulations
GFSK at 1 Mbps, 2 Mbps data rates
Transmit power
+4 dBm
Receiver sensitivity
BMD-300/301: -96 dBm (BLE mode) BMD-350: -94 dBm (BLE mode)
Antenna
BMD-300: Integrated BMD-301: U.FL Connector BMD-350: Ceramic Chip
Current Consumption
7.5 mA, 5.3 mA
16.6 mA, 11.6 mA
5.4 mA
11.7 mA
7.4 mA, 6.7 mA
3.7 mA, 3.3 mA
0.3 µA, 1.2 µA
30 nA / 4KB block
Dimensions
BMD-300
BMD-301
Length
Width
Height
14.0 mm ± 0.3mm
9.8 mm ± 0.3mm
1.9 mm ± 0.1mm
BMD-350
Length
Width
Height
8.7 mm ± 0.2mm
6.4 mm ± 0.2mm
1.5 mm ± 0.1mm
Hardware
Interfaces
SPI Master/Slave x 3
UART
Two-Wire Master/Slave (I2C) x 2
GPIO x 32
I2S
PWM
PDM
Power supply
1.7V to 3.6V
Temperature Range
-40C to +85°C
Certifications
FCC
FCC part 15 modular certification
BMD-300/BMD-301 FCC ID: 2AA9B04
BMD-350 FCC ID: 2AA9B05
IC
Industry Canada RSS-210 modular certification
BMD-300/BMD-301 IC: 12208A-04
BMD-350 IC: 12208A-05
CE
EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
Japan (MIC)
Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan
BMD-300: 210-106799 BMD-301: 210-107153 BMD-350: 210-108944
Australia / New Zealand
AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices
Bluetooth
BMD-300/301 BT4.2 RF-PHY Component (Tested) – DID: D030629; QDID: 81876
BMD-300/301 BT5 RF-PHY Component (Tested) – DID: D037298; QDID: 101625
BMD-350 BT4.2 RF-PHY Component (Tested) – DID: D036284; QDID: 98865
BMD-350 BT5 RF-PHY Component (Tested) – DID: D037181; QDID: 101018
Export
BMD-300
BMD-301
BMD-350
ECCN: 5A992.C, Exception 742.15(b)(1)
HTS: 8473.30.1180
Table 2 – Quick Specifications
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 6 of 36
6. Pin Descriptions
6.1 BMD-300 / BMD-301
Figure 2 – BMD-300/301 Pin out (Top View)
Pin description
Pin
Name
Direction
Description
6
P0.25
In/Out
GPIO2
7
P0.26
In/Out
GPIO2
8
P0.27
In/Out
GPIO2
9
P0.28
In/Out
GPIO/AIN42
10
P0.29
In/Out
GPIO/AIN52
11
P0.30
In/Out
GPIO/AIN62
12
P0.31
In/Out
GPIO/AIN72
13
P0.00
In/Out
GPIO/XTAL1 (32.768kHz)
14
P0.01
In/Out
GPIO/XTAL2 (32.768kHz)
15
P0.02
In/Out
GPIO/AIN0
19
P0.03
In/Out
GPIO/AIN1
20
P0.04
In/Out
GPIO/AIN2
21
P0.05
In/Out
GPIO/AIN3
22
P0.06
In/Out
GPIO
23
P0.07
In/Out
GPIO
24
P0.08
In/Out
GPIO
25
P0.09
In/Out
GPIO/NFC1
26
P0.10
In/Out
GPIO/NFC2
27
P0.11
In/Out
GPIO
28
P0.12
In/Out
GPIO
31
P0.13
In/Out
GPIO
32
P0.14
In/Out
GPIO/TRACEDATA[3]
33
P0.15
In/Out
GPIO/TRACEDATA[2]
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 7 of 36
Pin
Name
Direction
Description
34
P0.16
In/Out
GPIO/TRACEDATA[1]
35
P0.17
In/Out
GPIO
36
P0.18
In/Out
GPIO/TRACEDATA[0]/SWO
37
P0.19
In/Out
GPIO
38
P0.20
In/Out
GPIO/TRACECLK
39
P0.21
In/Out
GPIO/RESET
40
P0.22
In/Out
GPIO2
41
P0.23
In/Out
GPIO2
42
P0.24
In/Out
GPIO2
43
SWCLK
In
SWD Clock
44
SWDIO
In/Out
SWD IO
17
VCC
Power
+1.7V to +3.6V1
1, 2, 3, 4, 5, 16, 18, 29,
30, 45, 46, 47
GND
Power
Electrical Ground
Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional
bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw.
Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance
parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these
pins. Nordic recommends using only low frequency, low-drive functions when possible.
Table 3 – BMD-300/301 Pin Descriptions
6.2 BMD-350
Figure 3 – BMD-350 Pin out (Top View)
Pin description
Pin
Name
Direction
Description
4
SWCLK
In
SWD Clock
5
SWDIO
In/Out
SWD IO
6
P0.20
In/Out
GPIO/TRACECLK
7
P0.21
In/Out
GPIO/RESET
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 8 of 36
Pin
Name
Direction
Description
8
P0.18
In/Out
GPIO/TRACEDATA[0]/SWO
9
P0.16
In/Out
GPIO/TRACEDATA[1]
10
P0.17
In/Out
GPIO
11
P0.15
In/Out
GPIO/TRACEDATA[2]
12
P0.13
In/Out
GPIO
13
P0.12
In/Out
GPIO
14
P0.14
In/Out
GPIO/TRACEDATA[3]
16
P0.09
In/Out
GPIO/NFC1
17
P0.10
In/Out
GPIO/NFC2
18
P0.11
In/Out
GPIO
19
P0.06
In/Out
GPIO
20
P0.08
In/Out
GPIO
21
P0.05
In/Out
GPIO/AIN3
22
P0.07
In/Out
GPIO
23
P0.01
In/Out
GPIO/XTAL2 (32.768kHz)
24
P0.00
In/Out
GPIO/XTAL1 (32.768kHz)
27
P0.04
In/Out
GPIO/AIN2
28
P0.02
In/Out
GPIO/AIN0
29
P0.30
In/Out
GPIO/AIN62
30
P0.31
In/Out
GPIO/AIN72
31
P0.29
In/Out
GPIO/AIN52
32
P0.27
In/Out
GPIO2
33
P0.25
In/Out
GPIO2
34
P0.26
In/Out
GPIO2
35
P0.23
In/Out
GPIO2
36
P0.24
In/Out
GPIO2
41
P0.22
In/Out
GPIO2
42
P0.19
In/Out
GPIO
44
P0.03
In/Out
GPIO/AIN1
45
P0.28
In/Out
GPIO/AIN42
25
VCC
Power
+1.7V to +3.6V1
1, 2, 3, 15, 26, 37, 38, 39,
40, 43, 46, 47
GND
Power
Electrical Ground
Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional
bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw.
Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance
parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these
pins. Nordic recommends using only low frequency, low-drive functions when possible.
Table 4 – BMD-350 Pin Descriptions
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 9 of 36
6.3 RigDFU Pin Functions
NOTICE: Rigado now provides source code through our GitHub repositories for RigDFU, BMDware, Rigablue
developer tools and mobile apps for customers to customize and extend on their own. We recommend that
projects for the BMD-300, BMD-301 and BMD-350 target Nordic's tools for any new development. This will allow
access to the very latest tools from Nordic and provide an ongoing path as new features are released. Please refer
to this article.
Rigado RigDFU is programmed on the BMD-300 Series at the factory. Two GPIO pins are configured as UART pins
for transferring new firmware images to the BMD-300. Pins are configured only when bootloader is running, and
are fully available to the application firmware. RigDFU can be removed from the BMD-300 by performing a full-
chip erase.
BMD-300/1
Pin
BMD-350
Pin
Name
Direction
RigDFU Functions
22
19
P0.06
Out
UART TX for bootloader
Hi-Z until bootloader activation message received on UART RX.
24
20
P0.08
In
UART RX for bootloader
Internal 13kΩ pull-down enabled
Table 5 – RigDFU Functions
6.4 BMDware Pin Functions
NOTICE: Rigado now provides source code through our GitHub repositories for RigDFU, BMDware, Rigablue
developer tools and mobile apps for customers to customize and extend on their own. We recommend that
projects for the BMD-300, BMD-301 and BMD-350 target Nordic's tools for any new development. This will allow
access to the very latest tools from Nordic and provide an ongoing path as new features are released. Please refer
to this article.
Rigado BMDware is programmed on the BMD-300 Series at the factory. BMDware provides UART-to-BLE Bridge,
beaconing, and Direct Test Mode (DTM) functionality. The pins in Table 6 below describe the pin functionality in
BMDware. DTM Mode, Beacon-Only Mode, and AT Command Mode pin states are checked at BMDware start-up
to configure BMDware as required by the user, and are then set to Hi-Z to conserve power. For further details on
BMDware operation, please see the BMDware Datasheet that can be found at www.rigado.com. BMDware can be
overwritten by RigDFU with custom application firmware, or removed along with RigDFU by a full chip erase.
BMD-300/1
Pin
BMD-350
Pin
Name
Direction
BMDware Functions
21
21
P0.05
Out
Bridge UART RTS
Disabled in Beacon-Only & DTM modes, N/C if not used.
22
19
P0.06
Out
Bridge UART TX
Disabled in Beacon-Only & DTM modes, N/C if not used.
23
22
P0.07
In
Bridge UART CTS
Disabled in Beacon-Only & DTM modes, N/C if not used.
24
20
P0.08
In
Bridge UART RX
Disabled in Beacon-Only & DTM modes, N/C if not
used.
27
18
P0.11
Out
DTM UART TX
Only enabled in DTM mode; N/C if not used.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 10 of 36
BMD-300/1
Pin
BMD-350
Pin
Name
Direction
BMDware Functions
28
13
P0.12
In
DTM UART RX / DTM Mode
Only enabled in DTM mode; N/C if not used.
On BMDware Start-up:
High = Enter DTM mode; Low = Enter Normal Operation
Internal 13kΩ pull-down during BMDware start-up, then Hi-Z
31
12
P0.13
In
Beacon Only Mode
On BMDware Start-up:
High = Bridge UART enabled; Low = Bridge UART
disabled
Internal 13kΩ pull-up during BMDware start-up, then Hi-Z
32
14
P0.14
In
UART AT Command Mode
On BMDware Start-up:
High = Full pass-through mode; Low = AT command
mode
Internal 13kΩ pull-up during BMDware start-up, then Hi-Z
Table 6 – BMDware Functions at Start-up
7. Electrical Specifications
7.1 Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
VCC_MAX
Voltage on supply pin
-0.3
3.9
V
VIO_MAX
Voltage on GPIO pins (VCC > 3.6V)
-0.3
3.9
V
VIO_MAX
Voltage on GPIO pins (VCC ≤ 3.6V)
-0.3
VCC + 0.3V
V
TS
Storage Temperature Range
-40
125
°C
Table 7 – Absolute Maximum Ratings
7.2 Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Operating supply voltage
1.7
3.0
3.6
V
TR_VCC
Supply rise time (0V to 1.7V)
-
-
60
ms
TA
Operating Ambient Temperature Range
-40
25
85
°C
Table 8 – Operating Conditions
7.3 General Purpose I/O
The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO pins through
one port. Each GPIO can be accessed individually with the following user configurable features:
• Input/output direction
• Output drive strength
• Internal pull-up and pull-down resistors
• Wake-up from high or low level triggers on all pins
• Trigger interrupt on all pins
• All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced
through the PPI at the same time is limited by the number of GPIOTE channels
• All pins can be individually configured to carry serial interface or quadrature demodulator signals
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 11 of 36
Symbol
Parameter
Min.
Typ.
Max.
Unit
VIH
Input High Voltage
0.7 x VCC
-
VCC
V
VIL
Input Low Voltage
VSS
-
0.3 x VCC
V
VOH
Output High Voltage
VCC − 0.4
-
VCC
V
VOL
Output Low Voltage
VSS
-
VSS + 0.4
V
RPU
Pull-up Resistance
11
13
16
kΩ
RPD
Pull-down Resistance
11
13
16
kΩ
Table 9 – GPIO
7.4 Module RESET
GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the UICR registers
PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as
RESET
, the internal pull-up is automatically enabled. Rigado and Nordic example applications and development
kits program P0.21 as RESET
.
7.5 Debug & Programming
The BMD-300 Series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful
mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace
capture of code execution flow are part of this support.
The BMD-300 also supports ETM and ITM trace. Trace data from the ETM and the ITM is sent to an external
debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports serial trace via the
Serial Wire Output (SWO) trace protocol.
7.6 Clocks
The BMD-300 Series requires two clocks, a high frequency clock and a low frequency clock.
The high frequency clock is provided on-module by a high-accuracy 32-MHz crystal as required by the
nRF52832 for radio operation.
The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast clock; or
externally by a 32.768 kHz crystal. An external crystal provides the lowest power consumption and greatest
accuracy. Using the internal RC oscillator with calibration provides acceptable performance for BLE
applications at a reduced cost and slight increase in power consumption. Note: the ANT protocol requires the
use of an external crystal.
32.768 kHz Crystal (LFXO)
Symbol
Parameter
Typ.
Max.
Unit
FNOM_LFXO
Crystal frequency
32.768
-
kHz
FTOL_LFXO_BLE
Frequency tolerance, BLE applications
-
±250
ppm
CL_LFXO
Load Capacitance
-
12.5
pF
C0_LFXO
Shunt Capacitance
-
2
pF
RS_LFXO
Equivalent series resistance
-
100
kΩ
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 12 of 36
Cpin
Input Capacitance on XL1 & XL2 pads
4
-
pF
Table 10 – 32.768 kHz Crystal
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 13 of 36
32.768 kHz Oscillator Comparison
Symbol
Parameter
Min.
Typ.
Max.
Unit
ILFXO
Current for 32.768kHz Crystal Oscillator
-
0.25
-
µA
ILFRC
Current for 32.768kHz RC Oscillator
-
0.6
1
µA
ILFSYNT
Current for 32.768kHz Synthesized Oscillator
-
100
-
µA
fTOL_LFXO_BLE
Frequency Tolerance, 32.768kHz Crystal Oscillator
(BLE Stack)1
-
-
±250
ppm
fTOL_LFXO_ANT
Frequency Tolerance, 32.768kHz Crystal Oscillator
(ANT Stack)1
-
-
±50
ppm
f TOL_LFRC
Frequency Tolerance, 32.768kHz RC Oscillator
-
-
±2
%
fTOL_CAL_LFRC
Frequency tolerance, 32.768kHz RC after calibration
-
-
±250
ppm
fTOL_LFSYNT
Frequency Tolerance, 32.768kHz Synthesized
Oscillator
-
-
±48
ppm
Note 1: fTOL_LFXO_BLE and fTOL_LFXO_ANT are the max allowed for BLE and ANT applications. Actual tolerance depends
on the crystal used.
Table 11 – 32.768 kHz Oscillator
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 14 of 36
8. Firmware
NOTICE: Rigado now provides source code through our GitHub repositories for RigDFU, BMDware, Rigablue
developer tools and mobile apps for customers to customize and extend on their own. We recommend that
projects for the BMD-300, BMD-301 and BMD-350 target Nordic's tools for any new development. This will
allow access to the very latest tools from Nordic and provide an ongoing path as new features are released.
Please refer to this article.
8.1 Factory Image
All modules are shipped with factory programmed firmware. The factory
programmed firmware version is indicated on the label.
8.1.1 Firmware Version ‘AA’
Factory firmware version ‘AA’ contains the Rigado RigDFU OTA and Serial bootloader v3.2.0 (42), Nordic S132
SoftDevice v2.0.0, and Rigado BMDware v3.1.0 (50). Modules can be programmed with customer code via BLE
and UART interfaces using the bootloader and Rigado provided tools, or with a full-chip erase via the SWD
interface. Examples apps for iOS and Android are provided that utilize the Rigablue Library for easy OTA
updates. Visit the BMD Software Suite page at www.rigado.com for more information.
Note: A full chip erase will clear the Rigado assigned MAC address from memory; see section 8.3 “MAC
Address Info” on how to retain it.
8.1.2 Firmware Version ‘AB’
Factory firmware version ‘AB’ contains the Rigado RigDFU OTA and Serial bootloader v3.2.1 (43), Nordic S132
SoftDevice v2.0.0, and Rigado BMDware v3.1.1 (51). Modules can be programmed with customer code via BLE
and UART interfaces using the bootloader and Rigado provided tools, or with a full-chip erase via the SWD
interface. Examples apps for iOS and Android are provided that utilize the Rigablue Library for easy OTA
updates. Visit the BMD Software Suite page at www.rigado.com for more information.
Note: A full chip erase will clear the Rigado assigned MAC address from memory; see section 8.3 “MAC
Address Info” on how to retain it.
8.1.3 Firmware Version ‘AC’
Factory firmware version ‘AC’ contains the Rigado RigDFU OTA and Serial bootloader v3.2.2 (44), Nordic S132
SoftDevice v2.0.0, and Rigado BMDware v3.1.1 (51). Modules can be programmed with customer code via BLE
and UART interfaces using the bootloader and Rigado provided tools, or with a full-chip erase via the SWD
interface. Examples apps for iOS and Android are provided that utilize the Rigablue Library for easy OTA
updates. Visit the BMD Software Suite page at www.rigado.com for more information.
Note: A full chip erase will clear the Rigado assigned MAC address from memory; see section 8.3 “MAC
Address Info” on how to retain it. Note: Readback protection is not enabled by default.
8.1.4 Firmware Version ‘AD’
Factory firmware version ‘AD’ contains the Rigado RigDFU OTA and Serial bootloader v3.3.1 (46), Nordic S132
SoftDevice v3.1.0, and Rigado BMDware v3.2.1 (60). Modules can be programmed with customer code via BLE
and UART interfaces using the bootloader and Rigado provided tools, or with a full-chip erase via the SWD
interface. Examples apps for iOS and Android are provided that utilize the Rigablue Library for easy OTA
updates. Visit the BMD Software Suite page at www.rigado.com for more information.
Note: A full chip erase will clear the Rigado assigned MAC address from memory; see section 8.3 “MAC
Address Info” on how to retain it. Note: Readback protection is not enabled by default.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 15 of 36
8.1.5 Firmware Version ‘AE’
Factory firmware version ‘AD’ contains the Rigado RigDFU OTA and Serial bootloader v3.4.0 (47), Nordic S132
SoftDevice v3.1.0, and Rigado BMDware v3.2.1 (60). Modules can be programmed with customer code via BLE
and UART interfaces using the bootloader and Rigado provided tools, or with a full-chip erase via the SWD
interface. Examples apps for iOS and Android are provided that utilize the Rigablue Library for easy OTA
updates. Visit the BMD Software Suite page at www.rigado.com for more information.
Note: A full chip erase will clear the Rigado assigned MAC address from memory; see section 8.3 “MAC
Address Info” on how to retain it. Note: Readback protection is not enabled by default. ‘AE’ marked units
should not be loaded with previous factory firmware due to Nordic nRF52832 Errata #108.
8.1.6 Module Programming and Read-Back Protection
RigDFU allows for UART and OTA updates to RigDFU, the SoftDevice and application firmware. Read-back
protection of the BMD-300 Series modules is enabled which prevents unauthorized access to the firmware
and optional encryption keys through the SWD debug port.
If the SWD port is required, for example when developing custom firmware, the nRF52 must be erased and
recovered. Note: Without this step, the module will not be recognized by most programmers. This is
accomplished with the Rigado BMD-300 Eraser and Recovery Utility at www.rigado.com, or with nrfjprog,
which is provided with the Nordic Semiconductor command line utilities:
nrfjprog -f NRF52 ––recover
A full chip erase is performed, so all components will need to be re-loaded (RigDFU Bootloader, SoftDevice
and application Firmware). The rigado/bootloader-tools repository on GitHub contains the utilities to load
these items. Procedures are described in the RigDFU Datasheet at www.rigado.com for programming,
firmware preparation, and update procedures.
The BMD-300 Series modules may also be restored to the factory firmware versions noted above with the
utilities available at the rigado/programming repository on GitHub.
Access to the Rigado BMD Software Suite may be requested on the Rigado Website.
8.1.6.1 With Factory Firmware ‘AC’ and later
Modules with factory firmware code ‘AC’ and later no longer ship with read-back protection enabled from the
factory. Rigado RigDFU bootloader v3.2.2 and later enable read-back protection when an encryption key is
loaded onto the module. This allows the modules to be recognized more easily by programmers, and allows
the factory MAC address to be read directly through the SWD interface.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 16 of 36
8.2 SoftDevices
Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled, pre-linked
binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable from the Nordic
website. The BMD-300 with the nRF52832 SoC supports the S132 (BLE Central & Peripheral), S212 (ANT) and
S312 (ANT and BLE) SoftDevices.
8.2.1 S132
The S132 SoftDevice is a Bluetooth® low energy (BLE) Central and Peripheral protocol stack solution
supporting up to twenty connections with an additional Observer and a Broadcaster role all running
concurrently. The S132 SoftDevice integrates a BLE Controller and Host, and provides a full and flexible API for
building Bluetooth Smart nRF52 System on Chip (SoC) solutions.
Key Features
• Bluetooth 5.0 compliant low energy single-mode
protocol stack suitable for Bluetooth Smart products
o Concurrent central, observer, peripheral, and
broadcaster roles with up to twenty concurrent
connections along with one Observer and one
Broadcaster
o Configurable number of connections and connection
properties
o Configurable attribute table size
o Custom UUID support
o Link layer supporting LE 1M PHY and LE 2M PHY
o LL Privacy
o LE Data Packet Length Extension
o ATT and SM protocols
o L2CAP with LE Credit-based Flow Control
o LE Secure Connections pairing model
o GATT and GAP APIs
o GATT Client and Server
o Configurable ATT MTU
• Complementary nRF5 SDK including Bluetooth profiles
and example applications
• Master Boot Record for over-the-air device firmware
update
o SoftDevice, application, and bootloader can be
updated separately
• Memory isolation between the application and the
protocol stack for robustness and security
• Thread-safe supervisor-call based API
• Asynchronous, event-driven behavior
• No RTOS dependency
o Any RTOS can be used
• No link-time dependencies
o Standard ARM® Cortex®-M4 project configuration
for application development
• Support for concurrent and non-concurrent
multiprotocol operation
o Concurrent with the Bluetooth stack using Radio
Timeslot API
o Alternate protocol stack in application space
• Support for control of external Power Amplifiers and
Low Noise Amplifiers
8.2.2 S212
The S212 SoftDevice is an ANT™ protocol stack solution that provides a full and flexible Application
Programming Interface (API) for building ANT System on Chip (SoC) solutions for the nRF52832 chip. The S212
SoftDevice simplifies combining the ANT protocol stack and an application on the same CPU.
Key Features
Advanced ANT stack
• Simple to complex network topologies:
o Peer-to-peer, Star, Tree, Star-to-star and
more
• Up to 15 logical channels, each with configurable:
o Channel type, ID and period
o RF frequency
o Networks
• Broadcast, Acknowledged, and Burst Data modes
• Device search, pairing and proximity support
• Enhanced ANT features:
o Advanced Burst Transfer mode (up to 60
kbps)
o Up to 15 channels encryption (AES-128)
support
o Additional networks – up to 8
o Event Filtering and Selective Data Updates
o Asynchronous Transmission
o Fast Channel Initiation
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 17 of 36
SoftDevice features
• Built-in NVM access and radio coexistence
management
• Master Boot Record for over-the air device firmware
update
• Memory isolation between application and protocol
stack for robustness and security
• Thread-safe supervisor-call based API
• Asynchronous, event-driven behavior
• No RTOS dependency
o Any RTOS can be used
o No link-time dependencies
o Standard ARM® Cortex™ -M4F project
configuration for application development
• Support for concurrent and non-concurrent
multiprotocol operation
• Concurrent multiprotocol timeslot API
• Alternate protocol stack running in application space
8.2.3 S332
The S332 SoftDevice is a combined ANT and Bluetooth low energy (BLE) protocol stack solution. It supports all
four Bluetooth low energy roles (central, peripheral, observer, broadcaster) and ANT.
The S332 SoftDevice provides a full and flexible Application Programming Interface (API) for building
concurrent ANT and BLE System on Chip (SoC) solutions. It simplifies combining an ANT and BLE protocol stack
and an application on the same CPU, therefore eliminating the need for an added device to support
concurrent multiprotocol.
8.3 MAC Address Info
The BMD-300 Series modules comes preprogrammed with a unique MAC address from the factory. The MAC
address is also printed on a 2D barcode on the top of the module.
Figure 4 – BMD-300/301 MAC Address on Label
Figure 5 – BMD-350 MAC Address on Label
The 6-byte BLE Radio MAC address is stored in the nRF52832 UICR at NRF_UICR_BASE+0x80 LSB first. Please
read the MAC Address Provisioning application note if you are not using the built-in bootloader to avoid
erasing/overwriting the MAC address during programming. Important: The BMD-300 comes with full memory
protection enabled, not allowing the UICR to be read via the SWD interface. If performing a full-erase, the
MAC can then only be recovered from the 2D barcode and human-readable text. Note: Modules with factory
firmware code ‘AC’ and later no longer enable read-back protection from the factory, allowing the MAC
address to be read with an SWD programmer.
UICR Register:
NRF_UICR + 0x80 (0x10001080): MAC_Addr [0] (0xZZ)
NRF_UICR + 0x81 (0x10001081): MAC_Addr [1] (0xYY)
NRF_UICR + 0x82 (0x10001082): MAC_Addr [2] (0xXX)
NRF_UICR + 0x83 (0x10001083): MAC_Addr [3] (0x93)
NRF_UICR + 0x84 (0x10001084): MAC_Addr [4] (0x54)
NRF_UICR + 0x85 (0x10001085): MAC_Addr [5] (0x94)
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 18 of 36
9. Mechanical Data
9.1 Mechanical Dimensions
9.1.1 BMD-300 Dimensions
Figure 6 – BMD-300 Module Dimensions
(All dimensions are in mm)
9.1.2 BMD-301 Dimensions
Figure 7 – BMD-301 Module Dimensions
(All dimensions are in mm)
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 19 of 36
9.1.3 BMD-350 Dimensions
Figure 8 – BMD-350 Module Dimensions
(All dimensions are in mm)
9.2 Recommended PCB Land Pads
9.2.1 BMD-300/301
The BMD-300 and BMD-301 have identical PCB layout footprints. Note: RF keep-out not required
when using the BMD-301.
Figure 9 – BMD-300/301 Dimensions (Top View)
(All dimensions are in mm)
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 20 of 36
9.2.2 BMD-350
Figure 10 – BMD-350 Dimensions (Top View)
(All dimensions are in mm)
10. Module Marking
10.1 BMD-300 Module Marking
Figure 11 – BMD-300 Module Marking – Rev A
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 21 of 36
10.2 BMD-301 Module Marking
Figure 12 – BMD-301 Module Marking – Rev A
10.3 BMD-350 Module Marking
Figure 13 – BMD-350 Module Marking – Rev A
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 22 of 36
11. RF Design Notes
11.1 Recommended RF Layout & Ground Plane
11.1.1 BMD-300
For the BMD-300, the integrated antenna requires a suitable ground plane to radiate effectively.
The area under and extending out from the antenna portion of the module should be kept clear of copper and
other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. Reducing
the ground plane from that shown in Figure 14 will reduce the effective radiated power. For example, a 27mm
x 29mm board (about the size of a coin cell) has approximately 3dB lower output than the BMD-300
Evaluation Board.
Figure 14 – BMD-300 Recommended RF Layout
11.1.2 BMD-301
For the BMD-301, refer to the external antenna datasheet for antenna placement and grounding
recommendations.
11.1.3 BMD-350
For the BMD-350, the integrated chip antenna requires a suitable ground plane to radiate effectively.
The area under and extending out from the antenna portion of the module should be kept clear of copper and
other metal. The module should be placed at the edge of the PCB with the antenna edge facing out.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 23 of 36
Figure 15 – BMD-350 Recommended RF Layout
11.2 Mechanical Enclosure
For the BMD-300 and BMD-350, care should be taken when designing and placing the module into an
enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the
module can negatively impact RF performance.
The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill,
plastic over-molding, or conformal coating can negatively impact RF performance and must be evaluated by
the customer.
For the BMD-301, refer to the external antenna datasheet for placement in or on a mechanical enclosure.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 24 of 36
11.3 Antenna Patterns
11.3.1 BMD-300
Antenna patterns are based on the BMD-300 Evaluation Kit vA with a ground plane size of 82mm x 56mm. X-
Y-Z orientation is shown in Figure 16:
Figure 16 – X-Y-Z Antenna Orientation
11.3.1.1 X-Y Plane
Figure 17 – X-Y Plane Antenna Pattern
X
Y
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 25 of 36
11.3.1.2 Y-Z Plane
Figure 18 – Y-Z Plane Antenna Pattern
11.3.1.3 Z-X Plane
Figure 19 – Z-X Plane Antenna Pattern
Z
X
Y
Z
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 26 of 36
11.3.2 BMD-350
11.3.2.1 X-Y Plane
Figure 20 – X-Y Plane Antenna Pattern
11.3.2.2 Y-Z Plane
Figure 21 – Y-Z Plane Antenna Pattern
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 27 of 36
11.3.2.3 Z-X Plane
Figure 22 – Z-X Plane Antenna Pattern
12. Evaluation Boards
Rigado has developed full featured evaluation boards that provide a complete I/O pin out to headers, on-
board programming and debug, 32.768 kHz crystal, power & virtual COM port over USB, 4 user LEDs, and 4
user buttons. The evaluation boards also provide the option to be powered from a CR2032 coin cell battery,
and have current sense resistors and headers to allow for convenient current measurements. An Arduino Uno
R3 style header is provided for easy prototyping of additional functions. The evaluation boards also support
programming off-board BMD-300 Series modules.
13. Custom Development
Rigado is a full-service design house offering end-to-end product development from concept to
manufacturing. We can provide custom modules and do electrical and mechanical design, end product
manufacturing, firmware and mobile development, and web and cloud integration. Please contact Rigado at
info@rigado.com or 1-866-6-RIGADO for custom engineering options and fees.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 28 of 36
14. Bluetooth Qualification
The BMD-300 Series modules are qualified as a Bluetooth Component (tested) for RF-PHY. This allows
customers to use different SoftDevices that have been qualified by Nordic without the need to complete
additional RF-PHY testing. To achieve Bluetooth End Product qualification, the Rigado RF-PHY QDID can be
combined with Nordic QDIDs for the SoftDevice used when filing on the Bluetooth SIG website. The only
testing required is for the Bluetooth profiles supported by the customer’s product. Products with only custom
profiles do not require any additional testing.
• BMD-300/BMD-301: RF-PHY v4.2 Component(Tested) Declaration ID D030629 / QDID 81876
• BMD-300/BMD-301: RF-PHY v5.0 Component(Tested) Declaration ID D037298 / QDID 101625
• BMD-350: RF-PHY v4.2 Declaration ID D036284 / QDID 98865
• BMD-350: RF-PHY v5.0 Declaration ID D037181/ QDID 101018
15. Regulatory Statements
15.1 FCC Statement:
This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
Operation is subjected to the following two conditions: (1) This device may no cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired
operation. Note: Modification to this product will void the user’s authority to operate this equipment.
Note: Modification to this product will void the users’ authority to operate this equipment.
15.2 FCC Important Notes
(1) FCC Radiation Exposure Statement
This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This
transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
This equipment complies with Part 15 of the FCC Rules. Operation is subject the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired
operation.
The devices must be installed and used in strict accordance with the manufacturer’s instructions as described
in this document.
Caution!
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 29 of 36
The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to
this equipment. Such modification could void the user authority to operate the equipment.
(2) Co-location Warning:
This device and its antenna(s) must not be co-located or operating in conjunction with any other transmitter
antenna.
(3) OEM integration instructions：
This device is intended only for OEM integrators under the following conditions:
The antenna and transmitter must not be co-located with any other transmitter or antenna. The module shall
be only used with the integral antenna(s) that has been originally tested and certified with this module.
As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance requirements
with this module installed (for example, digital device emission, PC peripheral requirements, etc.)
In the event that these conditions cannot be met (for example certain laptop configuration or co-location with
another transmitter), then the FCC authorization for this module in combination with the host equipment is
no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and
circumstance, the OEM integrator will be responsible for re-evaluating the end product (including the
transmitter) and obtaining a separate FCC authorization.
Caution!
The OEM is still responsible for verifying end product compliance with FCC Part 15, subpart B limits for
unintentional radiators through an accredited test facility.
(4) End product labeling：
The final end product must be labeled in a visible area with the following:
• BMD-300: “Contains FCC ID: 2AA9B04”
• BMD-301: “Contains FCC ID: 2AA9B04”
• BMD-350: “Contains FCC ID: 2AA9B05”
• Any similar wording that expresses the same meaning may be used.
The FCC Statement below should also be included on the label. When not possible, the FCC Statement should
be included in the User Manual of the host device.
“This device complies with part 15 of the FCC rules.
Operation is subject to the following two conditions. (1) This device may not cause harmful
interference. (2) This device must accept any interference received, including interference that may
cause undesired operation.”
(5) Information regarding the end user manual：
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end user
manual shall include all required regulatory information/warning as show in this manual (Section 15.2(4)).
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 30 of 36
15.3 IC (ISED) Statement:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.
RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled
environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with
any other antenna or transmitter.
Avertissement d'exposition RF: L'équipement est conforme aux limites d'exposition aux RF établies pour un
incontrôlés environnement. L'antenne (s) utilisée pour ce transmetteur ne doit pas être co-localisés ou
onctionner en conjonction avec toute autre antenne ou transmetteur .
15.4 IC (ISED) Important Notes
1. The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the user manual of the end product.
The user manual which is provided by OEM integrators for end users must include the following information in
a prominent location.
2. To comply with IC RF exposure compliance requirements, the antenna used for this transmitter must not be
co‐located or operating in conjunction with any other antenna or transmitter, except in accordance with IC
multi‐transmitter product procedures.
3. The final system integrator must ensure there is no instruction provided in the user manual or customer
documentation indicating how to install or remove the transmitter module except such device has
implemented two‐ways authentication between module and the host system.
4. The host device shall be properly labelled to identify the module within the host device. The end product
must be labeled in a visible area with the following:
• BMD-300: “Contains IC: 12208A-04“
• BMD-301: “Contains IC: 12208A-04“
• BMD-350: “Contains IC: 12208A-05“
Any similar wording that expresses the same meaning may be used.
The IC Statement below should also be included on the label. When not possible, the IC Statement should be
included in the User Manual of the host device.
“This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions: (1) this device may not cause interference, and (2) this device must
accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique
subi, même si le brouillage est susceptible d'en compromettre le onctionnement.”
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 31 of 36
15.5 CE Regulatory
The BMD-300 Series modules are tested and compliant against the following standards. OEM integrators
should consult with qualified test house to verify all regulatory requirements have been met for their
complete device.
From Radio Equipment Directive 2014/53/EU:
• EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011
• ETSI EN 300 328 V 2.1.1
• ETSI EN 301 489-1 V2.1.1
• ETSI EN 301 489-17 V3.1.1
Declarations of Conformity and supporting test reports are available at www.rigado.com.
15.6 Japan (MIC)
The BMD-300 Series modules have received type certification and is labeled with its own technical conformity
mark and certification number as required to conform to the technical standards regulated by the Ministry of
Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this
module into a final end product does not require additional radio certification provided installation
instructions are followed and no modifications of the module are allowed. Additional testing may be required:
• If the host product is subject to electrical appliance safety (for example, powered from an AC mains),
the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The
integrator should contact their conformance laboratory to determine if this testing is required.
• There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by
VCCI: http://www.vcci.jp/vcci_e/index.html
The label on the end product which contains a BMD-300 Series module must follow the MIC marking
requirements. Labeling requirements for Japan available at the Ministry of Internal Affairs and
Communications (MIC) website: http://www.tele.soumu.go.jp/e/index.htm.
The BMD-300 module is labeled with its assigned technical conformity mark and certification number. The end
product in which this module is being used must have an external label referring to the type certified module
inside:
Contains transmitter module with certificate number:
The BMD-301 module is labeled with its assigned technical conformity mark and certification number. The end
product in which this module is being used must have an external label referring to the type certified module
inside:
Contains transmitter module with certificate number:
The BMD-350 module is assigned a technical conformity mark and certification number. The end product in
which this module is being used must have an external label referring to the type certified module inside:
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 32 of 36
Contains transmitter module with certificate number:
15.7 Australia / New Zealand
The BMD-300 Series modules have been tested to comply with the AS/NZS 4268 :2012+AMDT 1:2013, Radio
equipment and systems – Short range devices – Limits and methods of measurement. The report may be
downloaded from www.rigado.com, and may be used as evidence in obtaining permission to use the RCM.
Information on registration as a Responsible Party, license and labeling requirements may be found at the
following websites:
Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard-2004
New Zealand: http://www.rsm.govt.nz/compliance
The A-Tick and C-Tick marks are being migrated to the Regulatory Compliance Mark (RCM). Only Australian-
based and New Zealand-based companies who are registered may be granted permission to use the RCM. An
Australian-based or New Zealand-based agent or importer may also register as a Responsible Party to use the
RCM on behalf of a company not in Australia or New Zealand.
15.8 Approved External Antennas
The antennas listed below were tested for use with the BMD-301.
#
Manufacturer
Part Number
Max Gain
Type
Size
Approvals
1
Pulse
W1030
2 dBi
1/4 Wave Dipole – Whip
Length: 108.3mm
FCC, IC, MIC
2
Taoglas
FXP73.07.0100A
2.5dBi
1/4 Wave Dipole – Flex
7mm x 47mm x 0.1mm
FCC, IC, MIC
3
Pulse
W1027
3.2 dBi
1/4 Wave Dipole – Whip
Length: 136.8mm
FCC, IC, MIC
4
Kinsun
6670113050-145
2.0 dBi
1/4 Wave Dipole – PCB
12mm x 65mm x 0.46mm
FCC, IC, MIC
5
Kinsun
6610103081
5.0 dBi
1/2 Wave Dipole – Whip
Length: 196.6mm
FCC, IC, MIC
Table 12 - Approved External Antennas
15.9 BMD-350 Module Labeling
Due to the extreme size constraints, the FCC, IC, and MIC have granted an exemption for the BMD-350 module
from requiring the FCC ID, IC number, and Japan Certification number and mark to be physically located on the
module. However, the host product is still required to affix the FCC ID: 2AA9B05, IC: 12208A-05, and Japan
Certificate 210-108944 (as applicable) to the outside of the host product and in the host product user manual.
See Section 5.2 FCC Important Notes, Section 5.4 IC Important Notes, and Section 5.6 Japan (MIC) for host
product and user manual labeling instructions.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 33 of 36
16. Solder Reflow Temperature-Time Profile
Figure 23 – Reflow Profile for Lead Free Solder
16.1 Moisture Sensitivity Level
The BMD-300 Series is rated for MSL 3, 168-hour floor life after opening.
17. Packaging and Labeling
17.1 Carrier Tape Dimensions
17.1.1 BMD-300 & BMD-301
Figure 24 – BMD-300/301 Carrier Tape Dimensions
BMD-300 Series Module Datasheet
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January 24, 2018
BMD-300-Series-DS V1.11 Page 34 of 36
17.1.2 BMD-350
Figure 25 – BMD-350 Carrier Tape Dimensions
17.2 Reel Packaging
Modules come on 330mm reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a
desiccant pack and humidity card and placed in a 340x350x65mm box. On the outside of the bag an
antistatic warning and reel label are adhered.
Figure 26 – Reel Cartons
BMD-300 Series Module Datasheet
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January 24, 2018
BMD-300-Series-DS V1.11 Page 35 of 36
17.3 Packaging Label
Figure 27 – Packaging Label
18. Cautions
1) The guidelines of this document should be followed in order to assure proper performance of the module.
2) This product is for use in office, business, and residential applications, but not medical devices.
3) This module may short-circuit. If a short circuit can result in serious damage or injury then failsafe
precautions should be used. This could be accomplished by redundant systems and protection circuits.
4) Supply voltage to the module should not be higher than the specified inputs or reversed. Additionally, it
should not contain noise, spikes, or AC ripple voltage.
5) Avoid use with other high frequency circuits.
6) Use methods to eliminate static electricity when working with the module as it can damage the
components.
7) Contact with wires, the enclosure, or any other objects should be avoided.
8) Refer to the recommended pattern when designing for this module.
9) If hand soldering is used, be sure to use the precautions outlined in this document.
10) This module should be kept away from heat, both during storage and after installation.
11) Do not drop or physically shock the module.
12) Do not damage the interface surfaces of the module.
13) The module should not be mechanically stressed at any time (storage, handling, installation).
14) Do not store or expose this module to:
• Humid or salty air conditions
• High concentrations of corrosive gasses.
• Long durations of direct sunlight.
• Temperatures lower than -40°C or higher than 125°C.
19. Life Support Policy
This product is not designed to be used in a life support device or system, or in applications where there is potential
for a failure or malfunction to, directly or indirectly, cause significant injury. By using this product in an application
that poses these risks, such as described above, the customer is agreeing to indemnify Rigado for any damages that
result.
BMD-300 Series Module Datasheet
Bluetooth 5 LE
January 24, 2018
BMD-300-Series-DS V1.11 Page 36 of 36
20. Document History
Revision
Date
Changes / Notes
0.8
11/06/2015
Initial preliminary release
0.8.1
11/10/2015
Updated Table 5, Figure 5, Section 7.5. Corrected antenna references
0.8.2
11/11/2015
Updated Figure 1
0.8.3
11/20/2015
Updated current ratings from nRF52832 OPC v0.6.3. Corrected Table 3
0.9
3/17/2016
Added BMD-301, GPIO notes, MSL, updated certifications, updated electrical specifications
0.9.4
3/23/2016
Added BMD-301 antennas
1.0
5/04/2016
Production Release; removed pending for FCC, Japan (MIC), & Bluetooth
1.1
5/20/2016
Removed pending for IC, MIC (BMD-301)
1.2
6/03/2016
Added Factory Firmware Version AB information
1.3
6/06/2016
Updated Module Programming and Read-Back Protection section
1.4
7/07/2016
Added preliminary information for the BMD-350
1.5
7/28/2016
Added RigDFU and BMDware pin numbers, corrected nRF52832 PS link
1.6
8/10/2016
Corrected RESET pin number on BMD-350
1.7
11/10/2016
Updated layout drawings, added more BMD-350 data + certs
1.8
12/2/2016
Added BMD-350 Japan certificate number
1.9
8/10/2017
Add RED for BMD-300, BMD-301, BMD-350; BT DID for BMD-350, Factory Firmware AD
1.10
9/29/2017
Added Bluetooth 5 QDIDs, Factory Firmware AE
1.11
1/24/2018
Added firmware notices in Firmware, RigDFU pin-out and BMDware pin-out sections
21. Related Documents
Rigado Documents:
• BMD-300-Series-EVAL-UG: Evaluation Kit User Guide
• RIGDFU-DS: RigDFU Secure Bootloader Datasheet
• BMDWARE-DS: BMDware Datasheet
Nordic Documents:
Visit infocenter.nordicsemi.com for a comprehensive library of Nordic technical documentation.
• nRF52832 – nRF52832 Product Specification
• S132-SDS – nRF52832 S132 Soft Device Specification
• S212-SDS – nRF52832 S212 Soft Device Specification
• S332-SDS – nRF52832 S332 Soft Device Specification