INTEGRATED CIRCUITS DIVISION
Dual Optocouplers, Unidirectional Input
Single-Transistor Output
www.ixysic.com
DS-LDA201-R06 1
LDA201
Part Number Description
LDA201 8-Pin DIP (50/tube)
LDA201S 8-Pin Surface Mount (50/tube)
LDA201STR 8-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Breakdown Voltage - BVCEO 30 VP
Current Transfer Ratio - CTR (Typ) 300 %
Saturation Voltage - VCE(sat) 0.5 V
Input Control Current - IF1mA
Applications
Features
Description
Ordering Information
Pin Configuration
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Loop Detect
Ringing Detect
Current Sensing
100mA Continuous Load Rating
3750Vrms Input/Output Isolation
Unidirectional Input
Small 8-Pin Package
Flammability Rating UL 94 V-0
DIP Versions - Machine Insertable,
Wave Solderable
LDA201 is a dual optocoupler with unidirectional
inputs and single-transistor outputs. Current transfer
ratios range from 33% to 1000% with a typical value
of 300%.
Approvals
1
2
3
4
8
7
6
5
E
E
C
C
A
K
K
A
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1175739
EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R06
LDA201
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Breakdown Voltage 30 VP
Reverse Input Voltage 5 V
Input Control Current 100 mA
Peak (10ms) 1 A
Power Dissipation
Input 1150 mW
Phototransistor 2150 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33mW / ºC
2 Derate linearly 2mW / ºC
Electrical Characteristics @ 25ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Breakdown Voltage IC = 10ABV
CEO 30 85 - V
Phototransistor Dark Current VCEO = 5V, IF = 0mA ICEO - 10 500 nA
Saturation Voltage IC = 2mA, IF = 1mA VCE(sat) - 0.3 0.5 V
Current Transfer Ratio IF = 1mA, VCE = 0.5V CTR 33 300 1000 %
Output Capacitance 25V, f =1MHz COUT -6-pF
Input Characteristics
Input Control Current IC = 0.33mA, VCE = 0.5V IF--1mA
Input Voltage Drop IF = 5mA VF0.9 1.2 1.4 V
Reverse Input Current VR = 5V IR--10A
Common Characteristics
Capacitance, Input to Output - CIO -3-pF
Characteristic Symbol Test Condition Typ Units
Turn-On Time ton VCC=5V, IF=2mA, RL=1K7s
Turn-Off Time toff 20
Switching Characteristics @ 25ºC
Switching Time Test Circuit
VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=1%
IF
10%
90%
ton toff
VCE
INTEGRATED CIRCUITS DIVISION
LDA201
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R06
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0
10
20
30
40
50
LED Voltage vs. Current (Linear)
LED Forward Voltage (V)
1.0 1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0.1
1
10
100
LED Voltage vs. Current (Log)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
IF=1mA
LED Forward Current (mA)
0 102030405060
Current Transfer Ratio (%)
100
200
300
400
500
600
700
Typical CTR vs. LED Forward Current
(VCE=5V)
-40ºC
85ºC
55ºC
25ºC
Collector Voltage (V)
0123456
Collector Current (mA)
0
20
40
60
80
100
Typical Collector Current vs.
Collector Voltage
IF=50mA
IF=1mA
IF=2mA
IF=5mA
IF=10mA
IF=20mA
Temperature (ºC)
ICE Current (mA)
ICE Current vs. Temperature
(VCE=5V)
-40 -20 0 20 40 60 80 100 120
0
20
40
60
80
100
IF=20mA
IF=2mA
IF=5mA
IF=10mA
IF=15mA
IF=1mA
Load Resistance (:)
100 1k 10k 100k 1M
Turn-On Time (Ps)
0
2
4
6
8
10
12
14
Turn-On Time vs. Load Resistance
(VCC=5V)
IF=1mA
IF=5mA
IF=2mA
Load Resistance (k:)
0 100 200 300 400 500 600
Turn-Off Time (ms)
0
2
4
6
8
10
Turn-Off Time vs. Load Resistance
(VCC=5V)
IF=1mA
IF=5mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Saturation Voltage (V)
0.08
0.10
0.12
0.14
0.16
0.18
0.20
Saturation Voltage vs. Temperature
(IF=2mA, IC=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
87
88
89
90
91
92
93
94
95
96
Blocking Voltage vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
100
200
300
400
500
Collector Leakage Current
vs. Temperature
VCE=10V
VCE=3V
VCE=5V
PERFORMANCE DATA*
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R06
LDA201
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
LDA201 / LDA201S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
LDA201 / LDA201S 250ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
LDA201
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R06
LDA201
LDA201S
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
Mechanical Dimensions
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
6
LDA201
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LDA201-R06
©Copyright 2017, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
2/10/2017
LDA201STR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Mouser Electronics
Authorized Distributor
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LDA201S