HIGH CURRENT INDUCTOR MODEL NO. FEATURES: : SSC-06803 SERIES LOW PROFILE, HIGH POWER, LOW LOSS, LOW DCR WITH LARGE CURRENT DESIGN. CLOSED MAGNETIC CIRCUIT CONSTRUCTION FOR HIGH DENSITY BOARD ASSEMBLY . COMPACT SIZE WITH HIGH PERFORMANCE DUST CORE AND COPPER RIBBON WIRE STRUCTURE. CUSTOM DESIGNS AVAILABLE. APPLICATION : NOTEBOOK COMPUTERS VGA CARD. INDUCTOR FOR GENERAL PURPOSE AVAILBLE. DC/DC CONVERTER IN POWER REGULATION SYSTEM. ELECTRICAL SPECIFICATION: PART NO INDUCTANCE VS DC BIAS: L2 L1 INDUCTANCE L0(H) 20% INDUCTANCE CURRENT INDUCTANCE CURRENT @0ADC (H)Typ (DCA) (H)Typ (DCA) DCR MAX (m) SSC-06803-R10 0.10 0.9 22.0 -- -- 1.5 SSC-06803-R20 0.20 0.18 17.0 -- -- 2.5 SSC-06803-R25 0.25 0.23 16.0 -- -- 2.5 SSC-06803-R47 0.47 0.4 12.5 -- -- 4.5 SSC-06803-R68 0.78 Typ. 0.6820% 10.5 0.6 15.5 7.5 SSC-06803-1R0 1.15 Typ. 1.0 20% 8.5 0.9 11 11.0 NOTE: 1. TEST FREQUENCY: 100 KHZ,1VRMS. 2. L1 THAT WILL CAUSE AN APPROXIMATE T OF 45 3. L2 THAT WILL CAUSE AN L0 TO DROP APPROXIMATELY 30%. PHYSICAL DIMENSION : (UNIT:mm) TOLERANCE : 0.3 RECOMMENDED LAND PATTERNS PACKING Tape and Reel Orientation SSC-06803 SSC-06803 SSC-06803 SSC-06803 -XXX -XXX -XXX -XXX TMP XXXX TMP XXXX TMP XXXX TMP XXXX USER DIRECTION OF FEED NOTE : Top view shown with cover tape removed. TAPE WIDTH REEL 16mm WIDTH COMPONENT 22.4mm PITCH UNITS 12mm PER REEL 1500 TAPE SPECIFICATIONS: Carrier Tape Type : Conductive. Cover Tape Type : Antistatic. Cover Tape Adhesion to Carrier : 20 - 100 grams. REEL SPECIFICATIONS: Antistatic. Diameter (flange) : 13" (330.2mm) STANDARDS : All embossed carrier tape packaging will be accomplished in compliance with latest revision of EIA-481 "Taping of surface Mount Components for Automatic Placement". ENVIRONMENTAL PERFORMANCE ITEM 1 TEST Thermal Shock CONDITION One cycle shall consist of : (1) 30 minutes at temperature -30. (2) 15 seconds maximum at room ambient. (3) 30 minutes at temperature +125. (4) 15 seconds maximum at room ambient. Subject samples to 10 cycles. Test per applicable specification after a 4 hours stabilization at room ambient. 2 Vibration Inductance deviation within 3.0% after vibration for 1 hour. In each of three orientations at sweep vibration (105010Hz) with 1.5mm P-P amplitude. 3 Solderability Solder pot at 2305, with kester 1544 solder flux. 5 second 1 second. 4 Operating Dip parts into solder pot containing 63/37 molten alloy for Wetting must occur on a minimum of 90% of the terminations. -30 +105 ( coil contain heat) Temperature 5 Humidity Inductance deviation within5.0% After 96 hour in 9095% relative humidity at 402and 1 hour drying under normal condition. 6 2 Mechanical Shock Inductance deviation within5.0% after drop down with 981m/s (100G)shock. Attitude upon a rubber block method shock testing machine, for 1 time, in each of three orientations.