HIGH CURRENT INDUCTOR
MODEL NO. : SSC-06803 SERIES
FEATURES:
＊ LOW PROFILE, HIGH POWER, LOW LOSS, LOW DCR WITH LARGE CURRENT DESIGN.
＊ CLOSED MAGNETIC CIRCUIT CONSTRUCTION FOR HIGH DENSITY BOARD ASSEMBLY .
＊ COMPACT SIZE WITH HIGH PERFORMANCE DUST CORE AND
COPPER RIBBON WIRE STRUCTURE.
＊ CUSTOM DESIGNS AVAILABLE.
APPLICATION :
＊ NOTEBOOK COMPUTERS ＊ VGA CARD. ＊ INDUCTOR FOR GENERAL PURPOSE AVAILBLE.
＊ DC/DC CONVERTER IN POWER REGULATION SYSTEM.
ELECTRICAL SPECIFICATION: INDUCTANCE VS DC BIAS:
L1 L2
PART NO
INDUCTANCE
L0(μH) ±20%
@0ADC
INDUCTANCE
(μH)Typ CURRENT
(DCA) INDUCTANCE
(μH)Typ CURRENT
(DCA)
DCR
MAX
(mΩ)
SSC-06803-R10 0.10 0.9 22.0 -- -- 1.5
SSC-06803-R20 0.20 0.18 17.0 -- -- 2.5
SSC-06803-R25 0.25 0.23 16.0 -- -- 2.5
SSC-06803-R47 0.47 0.4 12.5 -- -- 4.5
SSC-06803-R68 0.78 Typ. 0.68±20% 10.5 0.6 15.5 7.5
SSC-06803-1R0 1.15 Typ. 1.0 ±20% 8.5 0.9 11 11.0
NOTE:
1. TEST FREQUENCY: 100 KHZ,1VRMS.
2. L1 THAT WILL CAUSE AN APPROXIMATE ΔT OF 45 ℃
3. L2 THAT WILL CAUSE AN L0 TO DROP APPROXIMATELY 30%.
PHYSICAL DIMENSION : (UNIT:mm)
TOLERANCE : ±0.3 RECOMMENDED LAND PATTERNS
PACKING
Tape and Reel Orientation
NOTE : Top view shown with cover tape removed.
TAPE WIDTH REEL WIDTH COMPONENT PITCH UNITS PER REEL
16mm 22.4mm 12mm 1500
TAPE SPECIFICATIONS:
Carrier Tape Type : Conductive.
Cover Tape Type : Antistatic.
Cover Tape Adhesion to Carrier : 20 - 100 grams.
REEL SPECIFICATIONS:
Antistatic.
Diameter (flange) : 13” (330.2mm)
STANDARDS : All embossed carrier tape packaging will be accomplished in compliance with latest revision of EIA-481
“Taping of surface Mount Components for Automatic Placement”.
ENVIRONMENTAL PERFORMANCE
ITEM TEST CONDITION
1
Thermal Shock One cycle shall consist of :
(1) 30 minutes at temperature –30℃.
(2) 15 seconds maximum at room ambient.
(3) 30 minutes at temperature +125℃.
(4) 15 seconds maximum at room ambient.
Subject samples to 10 cycles. Test per applicable specification after a 4 hours stabilization at room ambient.
2 Vibration Inductance deviation within ±3.0% after vibration for 1 hour.
In each of three orientations at sweep vibration (10∼50∼10Hz) with 1.5mm P-P amplitude.
3 Solderability Solder pot at 230℃±5℃, with kester 1544 solder flux. Dip parts into solder pot containing 63/37 molten alloy for
5 second ±1 second. Wetting must occur on a minimum of 90% of the terminations.
4 Operating
Temperature -30℃ ∼ +105℃ ( coil contain heat)
5 Humidity Inductance deviation within±5.0%
After 96 hour in 90∼95% relative humidity at 40±2℃and 1 hour drying under normal condition.
6 Mechanical Shock Inductance deviation within±5.0% after drop down with 981m/s2 (100G)shock.
Attitude upon a rubber block method shock testing machine, for 1 time, in each of three orientations.
USER DIRECTION OF FEED
SSC-06803
-XXX
TMP XXXX SSC-06803
-XXX
TMP XXXX SSC-06803
-XXX
TMP XXXX
SSC-06803
-XXX
TMP XXXX
