TLP7820
1
Photocouplers Optically Isolation Amplifiers
TLP7820
TLP7820
TLP7820
TLP7820
Start of commercial production
2015-09
1.
1.
1.
1. Applications
Applications
Applications
Applications
• Motor phase and rail current sensing
• Power inverter current and voltage sensing
2.
2.
2.
2. General
General
General
General
The TLP7820 of isolation amplifiers is designed for current sensing in electronic motor drives. In a typical
implementation, motor currents flow through an external resistor and the resulting analog voltage drop is sensed
by the TLP7820.
3.
3.
3.
3. Features
Features
Features
Features
(1) Gain accuracy: ±0.5 % (Gain rank B)
(2) Gain drift: 0.00012 V/V/% (typ.)
(3) Nonlinearity (VIN = ±200 mV): 0.02 % (typ.)
(4) Input offset voltage: 0.9 mV (typ.)
(5) VOUT bandwidth (-3 dB): 230 kHz (typ.)
(6) Operating temperature range: -40 to 105
(7) Common-mode transient immunity: 15 kV/µs (min)
(8) Safety standards
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1)
(Note 1)
(Note 1)
(Note 1)
CQC-approved: GB4943.1, GB8898 Japan Factory
Note 1: When a VDE approved type is needed, please designate the Option (D4)
Option (D4)
Option (D4)
Option (D4).
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
2
4.
4.
4.
4. Packaging and Pin Assignment
Packaging and Pin Assignment
Packaging and Pin Assignment
Packaging and Pin Assignment
11-6B1A
4.1.
4.1.
4.1.
4.1. Pin Assignment
Pin Assignment
Pin Assignment
Pin Assignment
Pin No.
1
2
3
4
5
6
7
8
Symbol
VDD1
VIN+
VIN-
GND1
GND2
VOUT-
VOUT+
VDD2
Description
Input side supply voltage
Positive input
Negative input
Input side ground
Output side ground
Negative output
Positive output
Output side supply voltage
5.
5.
5.
5. Internal Circuit (Note)
Internal Circuit (Note)
Internal Circuit (Note)
Internal Circuit (Note)
Note: A 0.1-µF bypass capacitor must be connected between 1 and 4 pins and between 5 and 8 pins.
6.
6.
6.
6. Principle of Operation
Principle of Operation
Principle of Operation
Principle of Operation
6.1.
6.1.
6.1.
6.1. Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Mechanical Parameters
Characteristics
Height
Creepage distances
Clearance
Internal isolation thickness
Size
2.3 (max)
8.0 (min)
8.0 (min)
0.4 (min)
Unit
mm
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
3
7.
7.
7.
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Supply Voltages
Steady-state input voltages
Two-second transient input voltages
Input power dissipation
Input power dissipation derating
Output voltages
Output power dissipation
Output power dissipation derating
Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
(Ta ≥ 110.6 )
(Ta ≥ 113.0 )
(10 s)
(AC, 60 s, R.H. ≤ 60 %)
Symbol
VDD1, VDD2
VIN+, VIN-
VIN+, VIN-
PD
∆PD/∆Ta
VOUT+, VOUT-
PO
∆PO/∆Ta
Topr
Tstg
Tsol
BVS
Note
(Note 1)
(Note 2)
Rating
-0.5 to 6
-0.5 to VDD1 + 0.5
-6 to VDD1 + 0.5
72
-5.0
-0.5 to VDD2 + 0.5
60
-5.0
-40 to 105
-55 to 125
260
5000
Unit
V
V
V
mW
mW/
V
mW
mW/
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note: Ceramic capacitors (0.1 µF) should be connected between 1 and 4 pins and between 5 and 8 pins to stabilize
the operation. Otherwise, this photocoupler may not switch properly. The bypass capacitors should be placed
as close as possible to each pin.
Note 1: ≥ 2 mm below seating plane.
Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
8.
8.
8.
8. Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Characteristics
Input side supply voltage
Output side supply voltage
Analog input voltage
Ambient temperature
Symbol
VDD1
VDD2
VIN+, VIN-
Ta
Note
(Note 1), (Note 2)
Min
4.5
3
-200
-40
Typ.
5
Max
5.5
5.5
200
105
Unit
V
mV
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
Note 1: Full-Scale Differential Voltage Input Range(FSR) = ±300 mV (typ.)
Note 2: When either VIN+ or VIN- or both are equal to or greater than VDD1 - 2 V (e.g., if VDD1 = 5 V, when VIN+ and/or
VIN- are equal to or greater than 5 V - 2 V = 3 V), isolation amplifiers go into one of the test modes. Do not
raise either VIN+ or VIN- above this voltage to keep the device in functional mode.
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
4
9.
9.
9.
9. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
9.1.
9.1.
9.1.
9.1. DC Characteristics (Unless otherwise specified, T
DC Characteristics (Unless otherwise specified, T
DC Characteristics (Unless otherwise specified, T
DC Characteristics (Unless otherwise specified, Ta
a
a
a = -40 to 105
= -40 to 105
= -40 to 105
= -40 to 105
,
,
,
,
V
V
V
VDD1
DD1
DD1
DD1 = 4.5 to 5.5 V, V
= 4.5 to 5.5 V, V
= 4.5 to 5.5 V, V
= 4.5 to 5.5 V, VDD2
DD2
DD2
DD2 = 3 to 5.5 V, V
= 3 to 5.5 V, V
= 3 to 5.5 V, V
= 3 to 5.5 V, VIN+
IN+
IN+
IN+ = -200 to 200 mV, V
= -200 to 200 mV, V
= -200 to 200 mV, V
= -200 to 200 mV, VIN-
IN-
IN-
IN- = 0 V)
= 0 V)
= 0 V)
= 0 V)
Characteristics
Input offset voltage
Input offset voltage drift vs ambient
temperature
Input offset voltage drift vs input side
supply voltage
Gain (Rank B)
Gain (Rank A)
Gain (None)
Gain drift vs ambient temperature
VOUT non-linearity (±200 mV)
VOUT non-linearity (±200 mV) drift vs
ambient temperature
VOUT non-linearity (±100 mV)
High-level output voltage
Low-level output voltage
Input common-mode rejection ratio
Equivalent input resistance
Input bias current
Input side supply current (VDD1)
Output side supply current (VDD2)
VOUT output resistance
Symbol
VOS
|dVOS/dTa|
|dVOS/dVDD1|
G0
G1
G3
|dG/dTa|
NL200
|dNL200/dTa|
NL100
VOH
VOL
CMRRIN
RIN
IIN+
IDD1
IDD2
ROUT
Note
(Note 1)
(Note 1)
(Note 1)
(Note 2)
(Note 2)
Test Condition
Ta = 25
Ta = 25
Ta = 25
Ta = 25
VIN+ = -200 to 200 mV,
Ta = 25
VIN+ = -100 to 100 mV,
Ta = 25
VIN+ = 400 mV, Ta = 25
VIN+ = -400 mV, Ta = 25
VIN+ = 0 V, Ta = 25
VIN+ = 0 V
VIN+ = 0 V
VOUT+ or VOUT-
Min
-0.6
8.16
8.12
7.95
-1
Typ.
0.9
2
120
8.2
8.2
8.2
0.00012
0.02
0.00007
0.015
2.497
0.0009
80
80
-0.055
8.6
6.2
21
Max
2.4
6
8.24
8.28
8.44
0.13
0.06
12
10
Unit
mV
µV/
µV/V
V/V
V/V/
%
%/
%
V
V
dB
kΩ
µA
mA
mA
Ω
Note 1: See section 9.1.1. for gain rank values.
Note 2: The slope of the optimum line is derived by the method of least squares between differential input voltage
(VIN+ - VIN-) and differential output voltage (VOUT+ - VOUT-). Nonlinearity is defined as a fraction of the half of
the peak-to-peak value of differential output voltage deviation divided by the full-scale differential output voltage
(OVR).
9.1.1.
9.1.1.
9.1.1.
9.1.1. Gain Rank (Note) (Unless otherwise specified, T
Gain Rank (Note) (Unless otherwise specified, T
Gain Rank (Note) (Unless otherwise specified, T
Gain Rank (Note) (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Rank
None (±3 %)
Rank A (±1 %)
Rank B (±0.5 %)
Gain Rank Marking
Blank, A, B
A, B
B
(Min)
7.95
8.12
8.16
Gain
(Typ.)
8.2
8.2
8.2
(Max)
8.44
8.28
8.24
Unit
V/V
Note: The gain is defined as the slope of the optimum line derived by the method
of least squares between differential input voltage (VIN+ - VIN-) and
differential output voltage (VOUT+ - VOUT-) in the recommended voltage
range.
Note: Specify both the part number and a rank in this format when ordering.
Example: Rank B: TLP7820(B
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
5
10.
10.
10.
10. AC Characteristics (Note) (Unless otherwise specified, T
AC Characteristics (Note) (Unless otherwise specified, T
AC Characteristics (Note) (Unless otherwise specified, T
AC Characteristics (Note) (Unless otherwise specified, Ta
a
a
a = -40 to 105
= -40 to 105
= -40 to 105
= -40 to 105
,
,
,
,
V
V
V
VDD1
DD1
DD1
DD1 = 4.5 to 5.5 V, V
= 4.5 to 5.5 V, V
= 4.5 to 5.5 V, V
= 4.5 to 5.5 V, VDD2
DD2
DD2
DD2 = 3 to 5.5 V)
= 3 to 5.5 V)
= 3 to 5.5 V)
= 3 to 5.5 V)
Characteristics
VOUT bandwidth (-3 dB)
VIN to VOUT propagation delay time
(10 %-10 %)
VIN to VOUT propagation delay time
(50 %-50 %)
VIN to VOUT propagation delay time
(90 %-90 %)
VOUT rise time
VOUT fall time
Common-mode transient immunity
Symbol
f-3dB
tpD10
tpD50
tpD90
tr
tf
CMTI
Test Condition
VIN+ = 400 mVp-p , sine wave
VIN+ = 0 to 200 mV/µs step
CL = 15 pF
VCM = 1 kV, Ta = 25
Min
140
15
Typ.
230
1.9
2.3
2.8
1.7
1.7
20
Max
2.3
2.6
3.3
Unit
kHz
µs
kV/µs
Note: All typical values are at Ta = 25 .
CL is approximately 15 pF which includes probe and stray wiring capacitance.
11.
11.
11.
11. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, Ta
a
a
a = 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
CS
RS
BVS
Note
(Note 1)
(Note 1)
(Note 1)
Test Condition
VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60 %
AC, 60 s
AC, 1 s in oil
DC, 60 s in oil
Min
1 × 1012
5000
Typ.
1.0
1014
10000
10000
Max
Unit
pF
Ω
Vrms
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
6
12.
12.
12.
12. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 12.1
12.1
12.1
12.1 V
V
V
VOS
OS
OS
OS - V
- V
- V
- VDD1
DD1
DD1
DD1 Fig.
Fig.
Fig.
Fig. 12.2
12.2
12.2
12.2 V
V
V
VOS
OS
OS
OS - V
- V
- V
- VDD2
DD2
DD2
DD2
Fig.
Fig.
Fig.
Fig. 12.3
12.3
12.3
12.3 V
V
V
VOS
OS
OS
OS - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 12.4
12.4
12.4
12.4 G - V
G - V
G - V
G - VDD1
DD1
DD1
DD1
Fig.
Fig.
Fig.
Fig. 12.5
12.5
12.5
12.5 G - V
G - V
G - V
G - VDD2
DD2
DD2
DD2 Fig.
Fig.
Fig.
Fig. 12.6
12.6
12.6
12.6 G - T
G - T
G - T
G - Ta
a
a
a
2017-10-18
Rev.7.0
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TLP7820
7
Fig.
Fig.
Fig.
Fig. 12.7
12.7
12.7
12.7 NL - T
NL - T
NL - T
NL - Ta
a
a
aFig.
Fig.
Fig.
Fig. 12.8
12.8
12.8
12.8 V
V
V
VOUT
OUT
OUT
OUT - V
- V
- V
- VIN+
IN+
IN+
IN+
Fig.
Fig.
Fig.
Fig. 12.9
12.9
12.9
12.9 I
I
I
IIN+
IN+
IN+
IN+ - V
- V
- V
- VIN+
IN+
IN+
IN+ Fig.
Fig.
Fig.
Fig. 12.10
12.10
12.10
12.10 R
R
R
RIN
IN
IN
IN - T
- T
- T
- Ta
a
a
a
Fig.
Fig.
Fig.
Fig. 12.11
12.11
12.11
12.11 G[dB] - f
G[dB] - f
G[dB] - f
G[dB] - f Fig.
Fig.
Fig.
Fig. 12.12
12.12
12.12
12.12 Switching Time - T
Switching Time - T
Switching Time - T
Switching Time - Ta
a
a
a
2017-10-18
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP7820
8
Fig.
Fig.
Fig.
Fig. 12.13
12.13
12.13
12.13 I
I
I
IDD
DD
DD
DD - V
- V
- V
- VIN+
IN+
IN+
IN+
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2017-10-18
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP7820
9
13.
13.
13.
13. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
13.1.
13.1.
13.1.
13.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
• When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2.
13.2.
13.2.
13.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2017-10-18
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP7820
10
14.
14.
14.
14. Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Unit: mm
Unit: mm
Unit: mm
Unit: mm
15.
15.
15.
15. Marking
Marking
Marking
Marking
2017-10-18
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP7820
11
16.
16.
16.
16. EN60747-5-5 Option (D4) Specification
EN60747-5-5 Option (D4) Specification
EN60747-5-5 Option (D4) Specification
EN60747-5-5 Option (D4) Specification
• Part number: TLP7820 (Note 1)
(Note 1)
(Note 1)
(Note 1)
• The following part naming conventions are used for the devices that have been qualified according to
option (D4) of EN60747.
Example: TLP7820(D4ATP4,E(O
D4 : EN60747 option
A : Gain rank
TP4 : Tape type
E : [[G]]/RoHS COMPATIBLE (Note 2)
(Note 2)
(Note 2)
(Note 2)
O : Domestic ID (Country/Region of origin: Japan)
Note 1: Use TOSHIBA standard type number for safety standard application.
e.g., TLP7820(D4ATP4,E(O → TLP7820
Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
Fig.
Fig.
Fig.
Fig. 16.1
16.1
16.1
16.1 EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
EN60747 Insulation Characteristics
2017-10-18
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TLP7820
12
Fig.
Fig.
Fig.
Fig. 16.2
16.2
16.2
16.2 Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Insulation Related Specifications (Note)
Note: This photocoupler is suitable for safe electrical isolation
safe electrical isolation
safe electrical isolation
safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig.
Fig.
Fig.
Fig. 16.3
16.3
16.3
16.3 Marking on Packing for EN60747
Marking on Packing for EN60747
Marking on Packing for EN60747
Marking on Packing for EN60747
Fig.
Fig.
Fig.
Fig. 16.4
16.4
16.4
16.4 Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Marking Example (Note)
Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of
EN60747.
2017-10-18
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP7820
13
Fig.
Fig.
Fig.
Fig. 16.5
16.5
16.5
16.5 Measurement Procedure
Measurement Procedure
Measurement Procedure
Measurement Procedure
2017-10-18
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP7820
14
17.
17.
17.
17. Specifications for Embossed-Tape Packing
Specifications for Embossed-Tape Packing
Specifications for Embossed-Tape Packing
Specifications for Embossed-Tape Packing
17.1.
17.1.
17.1.
17.1. Applicable Package
Applicable Package
Applicable Package
Applicable Package
Package Name
SO8L(LF4)
Product Type
Long creepage mini flat coupler
17.2.
17.2.
17.2.
17.2. Product Naming Conventions
Product Naming Conventions
Product Naming Conventions
Product Naming Conventions
Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification
is as below.
Example) TLP7820(A-TP4,E(O
Part number: TLP7820
Gain rank: A
Tape type: TP4
[[G]]/RoHS COMPATIBLE: E (Note 1)
(Note 1)
(Note 1)
(Note 1)
Domestic ID (Country/Region of origin: Japan): O
Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's
RoHS compatibility.
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the
restriction of the use of certain hazardous substances in electrical and electronic equipment.
17.3.
17.3.
17.3.
17.3. Tape Dimensions Specification
Tape Dimensions Specification
Tape Dimensions Specification
Tape Dimensions Specification
Tape type
TP4
Quantity
(pcs/reel)
1500
17.3.1.
17.3.1.
17.3.1.
17.3.1. Orientation of Device in Relation to Direction of Feed
Orientation of Device in Relation to Direction of Feed
Orientation of Device in Relation to Direction of Feed
Orientation of Device in Relation to Direction of Feed
Device orientation in the carrier cavities as shown in the following figure.
Device Orientation
Device Orientation
Device Orientation
Device Orientation
17.3.2.
17.3.2.
17.3.2.
17.3.2. Empty Cavities
Empty Cavities
Empty Cavities
Empty Cavities
Characteristics
Occurrences of 2 or more
successive empty cavities
Single empty cavity
Criterion
0 device
6 devices (max) per reel
Remarks
Within any given 40-mm section of tape, not including leader
and trailer
Not including leader and trailer
17.3.3.
17.3.3.
17.3.3.
17.3.3. Tape Leader and Trailer
Tape Leader and Trailer
Tape Leader and Trailer
Tape Leader and Trailer
The start end of the tape has 50 or more empty cavities. The hub end of the tape has 50 or more empty cavities
and two empty turns only for a cover tape.
2017-10-18
Rev.7.0
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Toshiba Electronic Devices & Storage Corporation
TLP7820
15
17.3.4.
17.3.4.
17.3.4.
17.3.4. Tape Dimensions
Tape Dimensions
Tape Dimensions
Tape Dimensions
Tape material: Plastic (for protection against static electricity)
Table
Table
Table
Table Tape Dimensions (unit: mm, unless otherwise specified :
Tape Dimensions (unit: mm, unless otherwise specified :
Tape Dimensions (unit: mm, unless otherwise specified :
Tape Dimensions (unit: mm, unless otherwise specified : ±
±
±
±0.1)
0.1)
0.1)
0.1)
Symbol
A
B
D
E
F
G
K0
Dimension
11.55
6.35
7.5
1.75
16.0
4.0
2.4
Remark
Center line of embossed cavity and sprocket hole
Distance between tape edge and sprocket hole center
Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes
Cumulative error +0.1/-0.3 (max) per 10 sprocket holes
Internal space
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
16
17.3.5.
17.3.5.
17.3.5.
17.3.5. Reel Specification
Reel Specification
Reel Specification
Reel Specification
Material: Plastic (for protection against static electricity)
Table
Table
Table
Table Reel Dimensions (unit: mm)
Reel Dimensions (unit: mm)
Reel Dimensions (unit: mm)
Reel Dimensions (unit: mm)
Symbol
A
B
C
E
U
W1
W2
Dimension
φ330 ± 2
φ100 ± 1
φ13 ± 0.5
2.0 ± 0.5
4.0 ± 0.5
17.4 ± 1.0
21.4 ± 1.0
17.4.
17.4.
17.4.
17.4. Packing (Note)
Packing (Note)
Packing (Note)
Packing (Note)
1 reel/carton (unit: mm)
1 reel/carton (unit: mm)
1 reel/carton (unit: mm)
1 reel/carton (unit: mm)
Note: Taping reel diameter: φ330 mm
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
17
17.5.
17.5.
17.5.
17.5. Label Format
Label Format
Label Format
Label Format
(1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc.
(2) Reel: The label provides the part number, the taping name, quantity, lot number, etc.
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
18
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions
Unit: mm
Weight: 0.205 g (typ.)
Package Name(s)
TOSHIBA: 11-6B1A
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP7820
19
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".
Hardware, software and systems described in this document are collectively referred to as "Product".
• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
("UNINTENDED USE").
("UNINTENDED USE").
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
IF YOU USE PRODUCT FOR
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales
representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2017-10-18
Rev.7.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
