2015-12-23 Silicon Differential Photodiode Version 1.3 BPX 48 Features: * Especially suitable for applications from 400 nm to 1100 nm * High photosensitivity * DIL plastic package with high packing density * Double diode with extremely high homogeneousness Applications Industrial electronics * * For control and drive circuits * Edge control * Follow-up control * Path and angle scanning Ordering Information Type: Photocurrent Ordering Code IP [A] Ev = 1000 lx, Std. Light A, VR = 5 V, T = 2856 K BPX 48 2015-12-23 24 ( 15) Q62702P0017S001 1 Version 1.3 BPX 48 Maximum Ratings (TA = 25 C) Parameter Symbol Values Unit Operating and storage temperature range Top; Tstg -40 ... 80 C Reverse voltage VR 10 V Total Power dissipation Ptot 50 mW Electrostatic discharge (acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM) VESD 2000 V Characteristics (TA = 25 C, per single diode / fur jede Einzeldiode) Parameter Symbol Values Unit Photocurrent (Ev = 1000 lx, Std. Light A, VR = 5 V, T = 2856 K) (typ (min)) IP Wavelength of max. sensitivity (typ) S max Spectral range of sensitivity (typ) 10% Radiant sensitive area (typ) A Dimensions of radiant sensitive area (typ) LxW Half angle (typ) Dark current (VR = 10 V) (typ (max)) IR Spectral sensitivity of the chip ( = 850 nm) (typ) S typ Max. deviation from average for each single diode (typ) S Quantum yield of the chip ( = 850nm) (typ) Open-circuit voltage (Ev = 1000 lx, Std. Light A) (typ (min)) VO 330 ( 280) mV Short-circuit current (Ev = 1000 lx, Std. Light A) (typ) ISC 24 A Rise and fall time (VR = 5 V, RL = 1 k, = 850 nm) (typ) tr, tf 0.5 s Forward voltage (IF = 100 mA, E = 0) (typ) VF 1.3 V Capacitance (VR = 0 V, f = 1 MHz, E = 0) (typ) C0 25 pF Temperature coefficient of VO (typ) TCV 2015-12-23 2 24 ( 15) A 900 nm (typ) 400 ... 1150 nm 1.54 mm2 0.7 x 2.2 mm x mm 60 10 ( 100) 0.55 5 0.80 -2.6 nA A/W % Electro ns /Photon mV / K Version 1.3 BPX 48 Parameter Symbol Values Unit Temperature coefficient of ISC (Std. Light A) (typ) TCI 0.18 %/K Noise equivalent power (VR = 10 V, = 850 nm) (typ) NEP 0.103 pW / Hz1/2 Detection limit (VR = 10 V, = 950 nm) (typ) D* 1.2e12 cm x Hz1/2 / W Relative Spectral Sensitivity 1) page 7 Srel = f() 2015-12-23 Photocurrent / Open-Circuit Voltage 1) page 7 IP (VR = 5V) / VO = f(EV) 3 Version 1.3 BPX 48 Power Consumption Ptot = f(TA) Dark Current 1) page 7 IR = f(VR), E = 0 Capacitance 1) page 7 C = f(VR), f = 1 MHz, E = 0 Dark Current 1) page 7 IR = f(TA), VR = 10 V, E = 0 2015-12-23 4 Version 1.3 BPX 48 Directional Characteristics 1) page 7 Srel = f() 40 30 20 10 0 OHF01402 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 Package Outline 0.8 (0.031) 0.6 (0.024) 0.5 (0.020) 0.3 (0.012) Diode system 1.10 (0.043) 0.09 (0.004) 2.45 (0.096) 1.85 (0.073) 2.25 (0.089) 0.4 (0.016) 0.3 (0.012) 0.25 (0.010) 0...5 2.54 (0.100) 0.8 (0.031) 3.75 (0.148) 3.0 (0.118) 6.6 (0.260) 6.3 (0.248) 0.6 (0.024) 3.5 (0.138) 7.4 (0.291) 4.05 (0.159) 2.2 (0.087) 1.9 (0.075) 7.8 (0.307) 7.62 (0.300) spacing 0.7 (0.028) 0.5 (0.020) cathode anode 2.54 (0.100) Radiant sensitive area 2.0 (0.079) x 0.67 (0.026) Approx. weight 0.1 g GEOY6638 Dimensions in mm (inch). Package DIL, Epoxy 2015-12-23 5 120 Version 1.3 BPX 48 Approximate Weight: 0.1 g TTW Soldering IEC-61760-1 TTW OHA04645 300 10 s max., max. contact time 5 s per wave C T 250 235 C - 260 C First wave Second wave Continuous line: typical process Dotted line: process limits T < 150 K 200 Cooling Preheating ca. 3.5 K/s typical 150 ca. 2 K/s 130 C 120 C 100 C 100 ca. 5 K/s Typical 50 0 0 20 40 60 80 100 120 140 160 180 200 220 s 240 t Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 2015-12-23 6 Version 1.3 BPX 48 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2015-12-23 7 Version 1.3 BPX 48 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 2015-12-23 8