1
Data sheet acquired from Harris Semiconductor
SCHS242
Features
Buffered Inputs
Typical Propagation Delay
- 6.4ns at VCC = 5V, TA = 25oC, CL = 50pF
Exceeds 2kV ESD Protection MIL-STD-883, Method
3015
SCR-Latchup-Resistant CMOS Process and Circuit
Design
Speed of Bipolar FAST™/AS/S with Significantly
Reduced Power Consumption
Balanced Propagation Delays
AC Types Feature 1.5V to 5.5V Operation and
Balanced Noise Immunity at 30% of the Supply
±24mA Output Drive Current
- Fanout to 15 FAST™ ICs
- Drives 50 Transmission Lines
Description
The CD74AC175 and CD74ACT175 are quad D flip-flops
with reset that utilize the Harris Advanced CMOS Logic tech-
nology. Information at the D input is transferred to the Q and
Q outputs on the positive-going edge of the clock pulse. All
four flip-flops are controlled by a common clock (CP) and a
common reset (MR). Resetting is accomplished by a LOW
logic level independent of the clock.
Pinout
CD74AC175, CD74ACT175
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART
NUMBER TEMP.
RANGE (oC) PACKAGE PKG.
NO.
CD74AC175E -55 to 125 16 Ld PDIP E16.3
CD74ACT175E -55 to 125 16 Ld PDIP E16.3
CD74AC175M -55 to 125 16 Ld SOIC M16.15
CD74ACT175M -55 to 125 16 Ld SOIC M16.15
NOTES:
13. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
14. Wafer and die for this part number is available which meets all elec-
trical specifications. Please contact your local sales office or Harris
customer service for ordering information.
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
MR
Q0
Q0
D0
D1
Q1
GND
Q1
VCC
Q3
D3
D2
Q2
Q2
CP
Q3
September 1998
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a Trademark of Fairchild Semiconductor.
Copyright © Harris Corporation 1998
CD74AC175,
CD74ACT175
Quad D Flip-Flop with Reset
File Number 1964.1
[ /Title
(CD74
AC175
,
CD74
ACT17
5
)
/
Sub-
j
ect
(Quad
D Flip-
Flop
with
Reset)
/
Autho
r ()
/
Key-
words
(Har-
ris
Semi-
con-
ductor,
Advan
ced
CMOS
,Harris
Semi-
con-
ductor,
Advan
ced
TTL)
/
Cre-
ator ()
/
DOCI
NFO
2
Functional Diagram
TRUTH TABLE (EACH FLIP-FLOP)
INPUTS OUTPUTS
RESET
(MR) CLOCK
CP DATA
Dn Qn Qn
LXXLH
HHHL
HLLH
HLXQ0Q0
H = High Level (Steady State)
L = Low Level (Steady State)
X = Irrelevant
= Transition from Low to High level
Q0, Q0 = Level before the Indicated Steady-State Input conditions
were established.
CP
D
R
2Q0
9
4
D0
CP Q
Q3Q0
MR 1
CP
D
R
7Q1
5
D1 Q
Q6Q1
CP
D
R
10Q2
12
D2 Q
Q11Q2
CP
D
R
15Q3
13
D3 Q
Q14Q3
GND = 8
VCC = 16
CD74AC175, CD74ACT175
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC (Note 4)
AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V
ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Slew Rate, dt/dv
AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max)
AC Types, 3.6V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max)
ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)
Thermal Resistance (Typical, Note 5) θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
15. For up to 4 outputs per device, add ±25mA for each additional output.
16. Unless otherwise specified, all voltages are referenced to ground.
17. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC-40oC TO
85oC-55oC TO
125oC
UNITSVI(V) IO(mA) MIN MAX MIN MAX MIN MAX
AC TYPES
High Level Input Voltage VIH - - 1.5 1.2 - 1.2 - 1.2 - V
3 2.1 - 2.1 - 2.1 - V
5.5 3.85 - 3.85 - 3.85 - V
Low Level Input Voltage VIL - - 1.5 - 0.3 - 0.3 - 0.3 V
3 - 0.9 - 0.9 - 0.9 V
5.5 - 1.65 - 1.65 - 1.65 V
High Level Output Voltage VOH VIH or VIL -0.05 1.5 1.4 - 1.4 - 1.4 - V
-0.05 3 2.9 - 2.9 - 2.9 - V
-0.05 4.5 4.4 - 4.4 - 4.4 - V
-4 3 2.58 - 2.48 - 2.4 - V
-24 4.5 3.94 - 3.8 - 3.7 - V
-75
(Note 6, 7) 5.5 - - 3.85 - - - V
-50
(Note 6, 7) 5.5----3.85 - V
CD74AC175, CD74ACT175
4
Low Level Output Voltage VOL VIH or VIL 0.05 1.5 - 0.1 - 0.1 - 0.1 V
0.05 3 - 0.1 - 0.1 - 0.1 V
0.05 4.5 - 0.1 - 0.1 - 0.1 V
12 3 - 0.36 - 0.44 - 0.5 V
24 4.5 - 0.36 - 0.44 - 0.5 V
75
(Note 6, 7) 5.5 - - - 1.65 - - V
50
(Note 6, 7) 5.5-----1.65 V
Input Leakage Current IIVCC or
GND - 5.5 - ±0.1 - ±1-±1µA
Quiescent Supply Current
MSI ICC VCC or
GND 0 5.5 - 8 - 80 - 160 µA
ACT TYPES
High Level Input Voltage VIH - - 4.5 to
5.5 2-2-2-V
Low Level Input Voltage VIL - - 4.5 to
5.5 - 0.8 - 0.8 - 0.8 V
High Level Output Voltage VOH VIH or VIL -0.05 4.5 4.4 - 4.4 - 4.4 - V
-24 4.5 3.94 - 3.8 - 3.7 - V
-75
(Note 6, 7) 5.5 - - 3.85 - - - V
-50
(Note 6, 7) 5.5----3.85 - V
Low Level Output Voltage VOL VIH or VIL 0.05 4.5 - 0.1 - 0.1 - 0.1 V
24 4.5 - 0.36 - 0.44 - 0.5 V
75
(Note 6, 7) 5.5 - - - 1.65 - - V
50
(Note 6, 7) 5.5-----1.65 V
Input Leakage Current IIVCC or
GND - 5.5 - ±0.1 - ±1-±1µA
Quiescent Supply Current
MSI ICC VCC or
GND 0 5.5 - 8 - 80 - 160 µA
AdditionalSupplyCurrentper
Input Pin TTL Inputs High
1 Unit Load
ICC VCC
-2.1 - 4.5 to
5.5 - 2.4 - 2.8 - 3 mA
NOTES:
18. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize
power dissipation.
19. Test verifies a minimum 50 transmission-line-drive capability at 85oC, 75 at 125oC.
ACT Input Load Table
INPUT UNIT LOAD
Dn 0.58
MR 0.67
CP 0.92
NOTE: Unit load is ICC limit specified in DC Electrical Specifications
Table , e.g., 2.4mA max at 25oC.
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC-40oC TO
85oC-55oC TO
125oC
UNITSVI(V) IO(mA) MIN MAX MIN MAX MIN MAX
CD74AC175, CD74ACT175
5
Prerequisite For Switching Function
PARAMETER SYMBOL VCC (V)
-40oC TO 85oC -55oC TO 125oC
UNITSMIN MAX MIN MAX
AC TYPES
Data to CP Set-Up Time tSU 1.5 2 - 2 - ns
3.3
(Note 8) 2-2-ns
5
(Note 9) 2-2-ns
Hold Time tH1.5 2 - 2 - ns
3.3 2 - 2 - ns
52-2-ns
Removal Time, MR to CP tREM 1.5 1 - 1 - ns
3.3 1 - 1 - ns
51-1-ns
MR Pulse Width tW1.5 44 - 50 - ns
3.3 4.9 - 5.6 - ns
5 3.5 - 4 - ns
CP Pulse Width tW1.5 55 - 63 - ns
3.3 6.1 - 7 - ns
5 4.4 - 5 - ns
CP Frequency fMAX 1.5 9 - 8 - MHz
3.3 81 - 71 - MHz
5 114 - 100 - MHz
ACT TYPES
Data to CP Set-Up Time tSU 5
(Note 9) 2-2-ns
Hold Time tH52-2-ns
Removal Time, MR to CP tREM 51-1-ns
MR Pulse Width tW5 3.5 - 4 - ns
Clock Pulse Width tW5 4.4 - 5 - ns
CP Frequency fMAX 5 114 - 114 - MHz
NOTES:
20. 3.3V Min is at 3V.
21. 5V Min is at 4.5V.
Switching Specifications Input tr, tf = 3ns, CL= 50pF (Worst Case)
PARAMETER SYMBOL VCC (V)
-40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN TYP MAX
AC TYPES
Propagation Delay, CP to Q, Qt
PLH, tPHL 1.5 - - 139 - - 153 ns
3.3
(Note 11) 4.4 - 15.5 4.3 - 17.1 ns
5
(Note 12) 3.2 - 11.1 3.1 - 12.2 ns
CD74AC175, CD74ACT175
6
Propagation Delay, MR to Q, Qt
PLH, tPHL 1.5 - - 139 - - 153 ns
3.3 4.4 - 15.5 4.3 - 17.1 ns
5 3.2 - 11.1 3.1 - 12.2 ns
Input Capacitance CI- - -10- -10pF
Power Dissipation Capacitance CPD
(Note 13) - - 55 - - 55 - pF
ACT TYPES
Propagation Delay, CP to Qn tPLH, tPHL 5
(Note 12) 3 - 10.5 2.9 - 11.5 ns
Propagation Delay, MR to Qn tPLH, tPHL 5 3.3 - 11.8 3.3 - 13 ns
Input Capacitance CI- - -10- -10pF
Power Dissipation Capacitance CPD
(Note 13) - - 55 - - 55 - pF
NOTES:
22. Limits tested 100%.
23. 3.3V Min is at 3.6V, Max is at 3V.
24. 5V Min is at 5.5V, Max is at 4.5V.
25. CPD is used to determine the dynamic power consumption per flip-flop.
PD=C
PD VCC2fi+Σ(CL+V
CC2f
o
)+V
CC ICC where fi= input frequency, fo= output frequency, CL= output load capacitance, VCC =
supply voltage.
FIGURE 5. PROPAGATION DELAYS FIGURE 6. RESET OR SET PREREQUISITE AND
PROPAGATION DELAYS
FIGURE 7. FIGURE 8. PROPAGATION DELAY TIMES
Switching Specifications Input tr, tf = 3ns, CL= 50pF (Worst Case) (Continued)
PARAMETER SYMBOL VCC (V)
-40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN TYP MAX
INPUT LEVEL CP
GND VStW
tPHL tPLH
VSVS
VS
VS
INPUT LEVEL
GND
INPUT CP
MR
VS
tWtREM
tPHL
Q
VS
VS
VS
Q
INPUT LEVEL
GND
D
CP
VS
tSU(L) tH(L) tH(H)
tSU(H)
VSVSVS
VS
VS
INPUT LEVEL
GND
DUT
OUTPUT
RL (NOTE)
OUTPUT
LOAD
500
CL
50pF
NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ.
CD74AC CD74ACT
Input Level VCC 3V
Input Switching Voltage, VS0.5 VCC 1.5V
Output Switching Voltage, VS0.5 VCC 0.5 VCC
CD74AC175, CD74ACT175
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customers applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated