5962-8860002GA - ANALOG DEVICES

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

Make changes to A-1 package dimensions. Make change to footnote 5/

description as specified under table I. Make changes to terminal connections

pin and description as specified under figure 1. Add footnote 2/ under

paragraph 6.4. Changes in accordance with N.O.R. 5962-R274-92.

92-10-02 M. A. FRYE

B Drawing updated to reflect current requirements. - ro 01-12-06 R. MONNIN

C Make correction to VIN under the conditions title as specified in TABLE I. - ro 04-07-01 R. MONNIN

D Update paragraphs to current MIL-PRF-38535 requirements. -rrp 10-12-14 C. SAFFLE

E Add radiation assurance requirements, case outline H, and Appendix A for

microcircuit die. - ro 15-08-05 C. SAFFLE

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

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OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14

PMIC N/A PREPARED BY

GARY ZAHN

DLA LAND AND MARITIME

COLUMBUS, OHIO 4321 8-3990

http://www.landandmaritime.dla.mil

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

RAY MONNIN

APPROVED BY

MICHAEL A. FRYE

MICROCIRCUIT, LINEAR, PRECISION, 10 VOLT,

VOLTAGE REFERENCE, MONOLITHIC SILICON

DRAWING APPROVAL DATE

88-03-27

AMSC N/A

REVISION LEVEL

E SIZE

A CAGE CODE

67268

5962-88600

SHEET 1 OF 18

DSCC FORM 2233

APR 97 5962-E438-15

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1. SCOPE

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M)

and space application (devic e class V). A choice of case outlines and lead finishes are available and are reflected in th e Part or

Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.

1.2 PIN. The PIN is as shown in the following examples.

For device class M and Q:

5962 - 88600 01 G A

Federal

stock class

designator

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

\ /

Drawing number

For device class V:

5962 R 88600 01 V X A

Federal

stock class

designator

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Device

class

designator

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

\ / (see 1.2.3)

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are

marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a n on-RHA device.

1.2.2 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic

number Circuit function VOUT (V) VOUT / T (ppm/C)

01 LT1021BM-10 10 V voltage reference



0.05 V 5.0

02 LT1021CM-10 10 V voltag e reference 0.005 V 20.0

03 LT1021DM-10 10 V voltag e reference



0.05 V 20.0

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance l evel as listed

below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q

designators will not be included in the PIN and will not be marked on the device.

Device class Device requirements docum entation

M Vendor self-certification to the requireme nts for MIL-STD-883 compliant, non-

JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A

Q or V Certification and qualification to MIL-PRF-38535

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1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

G MACY1-X8 8 Can

H GDFP1-F10 10 Flat pack

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF - 38535,

appendix A for device class M.

1.3 Absolute maximum ratings. 1/

Input voltage ............................................................................................................. 40 V dc

Input-output voltage differential ................................................................................. 35 V dc

Output to ground voltage ........................................................................................... 16 V dc 2/

Trim pin to ground voltage:

Positive .................................................................................................................. Equal to VOUT

Negative ................................................................................................................ -20 V dc

Output short-circuit duration:

at V

IN = 35 V ......................................................................................................... 10 seconds

at V

IN  20 V .......................................................................................................... Indefinite

Power dissipation (PD) :

Case G .................................................................................................................. 500 mW

Case H .................................................................................................................. 500 mW

Junction temperature (TJ) ......................................................................................... +175C

Storage temperature range ....................................................................................... -65C to +150C

Lead temperature (soldering, 10 seconds) ................................................................ +300C

Thermal resistance, junction-to-case (JC) ............................................................... See MIL-STD-1835

Thermal resistance, junction-to-ambient (JA) :

Case G ................................................................................................................... +150C/W

Case H ................................................................................................................... +170C/W

1.4 Recommended operating conditions.

Ambient operating temperature range (TA) ............................................................... -55C to +125C

1.5 Radiation features.

Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ............................... 100 krads(Si) 3/

Maximum total dose available (dose rate = 10 mrads(Si)/s) ...................................... 100 krads(Si) 3/

_____

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

2/ Shunt mode current limit.

3/ T he manufacturer supplying device types 01, 02 and 03 has performed high dose rate irra diation test in accordance with

MIL-STD-883 method 1019 condition A, and low dose rate irradiation test condition D. The device types 01, 02 and 03

radiation end point limits for the noted par ameters are guaranteed only for the conditions as specified in MIL-STD-883,

method 1019, condition A to a maximum tot al dose of 100 krads(Si), and condition D to a maximum total dose of

100 krads(Si).

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2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and h andbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-385 35 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents ar e available online at http://quicksearch.dla.mil or from the Standardization Document Order

Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicabl e laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specif ied herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in acc ordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.

3.2 Design, construction, and physica l dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herei n for device class M.

3.2.1 Case outlines. The case outlines shall be in accorda nce with 1.2.4 herein.

3.2.2 Terminal connections. The terminal conn ections shall be as specified on figure 1.

3.2.3 Radiation exposure circ uit. T he radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless other wise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requir ements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

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3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the devic e. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF - 38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as requ ired in MIL-PRF-38535, appendi x A.

3.6 Certificate of compliance. For device cla sses Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of

supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of

MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appen dix A and herein.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38 535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of

product (see 6.2 herein) inv olving devices acquired to this drawing is required for any change that affects this drawing.

3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent,

and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore

documentation shall be mad e available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 59 (see MIL-PRF-38535, appendix A).

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TABLE I. Electrical performance characteristi cs.

Test Symbol Conditions 1/ 2/

-55C  TA +125C

VIN = 15 V, IOUT = 0 mA

Group A

subgroups

Device

type

Limits Unit

unless otherwise specified Min Max

Output voltage 3/ VOUT T

A = +25C 1 01,03 9.95 10.05 V

D 9.95 10.05

L 9.942 10.06

R 9.938 10.06

02 9.995 10.005

D 9.992 10.008

L 9.987 10.013

R 9.985 10.015

Output voltage 4/

temperature

coefficient

VOUT/

T TA = +125C, -55C 2,3 01 5.0 ppm /

C

D,L 1 5

R 1 7

2,3 02,03 20

D, L 1 20

R 1 22

Line regulation 5/ VRLN 11.5 V  VIN  14.5 V 1 All 4.0 ppm /

2,3 6.0 V

D 1 4.0

L 4.5

R 5.0

14.5 V  VIN  40 V 1 2.0

2,3 4.0

D,L,R 1 2

Load regulation 5/ VRLD1 0 mA  IOUT  10 mA 1 All 25 ppm /

(sourcing current) 2,3 40 mA

D,L,R 1 25

Load regulation 5/ 6/ VRLD2 1.7 mA  ISHUNT  10 mA 1 All 100 ppm /

(shunt mode) 2,3 150 mA

D,L,R 1 100

Supply current ICC 1 All 1.7 mA

(series mode) 2,3 2.0

D,L,R 1 1.7

See footnotes at end of table.

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TABLE I. Electrical performance characteristics – Continued.

Test Symbol Conditions 1/ 2/

-55C  TA +125C

VIN = 15 V, IOUT = 0 mA

Group A

subgroups

Device

type

Limits Unit

unless otherwise specified Min Max

Minimum current IMIN V

IN = open 1 All 1.5 mA

(shunt mode) 2,3 1.7

D,L,R 1 1.5

Output voltage 7/

noise NO 10 Hz  fO  1.0 kHz,

TA = +25C

4 All 6.0

V rms

Long term stability 8/

of output voltage VOUT/

t

t = 1,000 hours,

TA = +25C

4 All 60 ppm

1/ RHA devices supplied to this drawing have been characterized through all levels D, L, and R of irradiatio n.

However, this device is tested at RHA level L and R level. Pre and Post irradiation va lues are identical unless otherwise

specified in Table I. When performing post irradiation electrical measurements for any RHA level, TA = +25C.

2/ T he manufacturer supplying device types 01, 02 and 03 has performed high dose rate irra diation test in accordance with

MIL-STD-883 method 1019 condition A, and low dose rate irradiation test condition D. The device types 01, 02 and 03

radiation end point limits for the noted par ameters are guaranteed only for the conditions as specified in MIL-STD-883,

method 1019, condition A to a maximum tot al dose of 100 krads(Si), and condition D to a maximum total dose of

100 krads(Si).

3/ Output voltage is measured immediately after turn-on. Changes due to chip warm-up are typ ically less than

0.005 percent.

4/ Temperature coefficient is measured by dividing the change in output voltage over the temperature range by the change

in temperature. Separate test s are done for hot and cold: -55C to +25C, and +25C to +125C.

Incremental slope is also measured at +25C.

5/ Line and load regulation are measured o n a pulse basis. Output changes due to die temperature change must be taken

into account separately. Package thermal resistance is 150C/W for case G and 170C/W for case H.

6/ Shunt mode regulation is measured with input open. W ith the input connected, shunt mode current can be reduced

to 0 mA. Load regulation will remain the same.

7/ The RMS noise is measured with a 2-pole high pass filter at 10 Hz and a 2-pole low pass filter at 1 kHz. The resulting

output is full wave rectified and then integrated for a fixed period, making the fina l reading an average as opposed to rms.

Correction factors are used to convert from average to RMS and to correct for the non-ideal bandpass of the filters.

8/ Guaranteed, if not tested, to the limits specified in table I herein.

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Device types 01, 02, 03 02

Case outlines G H

Terminal

number Terminal symbol

1 No connection 1/ No connection 1/

2 Input voltage Input voltage

3 No connection 1/ No connection 1/

4 Ground Ground

5 Trim No connection

6 Output voltage No connection

7 No connection 1/ Trim

8 No connection 1/ Output voltage

9 --- No connection 1/

10 --- No connection 1/

1/ T hese pins are connected internally. Do not connect extern al circuitry to these pins.

FIGURE 1. Terminal connections.

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4. VERIFICATION

4.1 Sampling and inspection. For device classes Q and V, sampling and inspecti on procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in

accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screen ing shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualific ation and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer u nd er document revision

level control and shall be ma de available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicabl e, in accordanc e with the intent specified in

method 1015.

(2) TA = +125C, minimum.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified i n the

device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained unde r

document revision level contro l of the device manufacturer's Technology Review Board (TRB) in accorda nce with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicabl e, in accordanc e with the intent specified in

method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for devi ce classes Q and V shall be in

accordance with MIL-PRF-38535. Inspectio ns to be performed shall be those specified in MIL-PRF-38535 and herein for groups

A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device

class M shall be in accordanc e with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for

device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E insp ections

(see 4.4.1 through 4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table IIA herein.

b. Subgroups 5, 6, 7, 8, 9, 10, and 11 in table I, method 5 005 of MIL-STD-883 shall be omitted.

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TABLE IIA. Electrical test requirements.

Test requirements Subgroups

(in accordance with

MIL-STD-883,

method 5005, table I)

Subgroups

(in accordance with

MIL-PRF-38535, table III)

Device

class M Device

class Q Device

class V

Interim electrical

parameters (see 4.2) --- --- ---

Final electrical

parameters (see 4.2) 1, 2, 3, 4 1/ 1, 2, 3, 4 1/ 1, 2, 3, 4 1/ 2/

Group A test

requirements (see 4.4) 1, 2, 3, 4 1, 2, 3, 4 1, 2, 3, 4

Group C end-point electrical

parameters (see 4.4) 1 1, 2, 3 1, 2, 3 2/

Group D end-point electrical

parameters (see 4.4) 1 1, 2, 3 1, 2, 3

Group E end-point electrical

parameters (see 4.4) --- --- 1

1/ PDA applies to subgroup 1.

2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits

shall be completed with reference to the zero hour electrical parameters (see table I).

TABLE IIB. Burn-in and operating life test delta parameters. TA = +25C. 1/

Parameters Symbol Device Endpoint limit Delta limits Units

type Min Max Min Max

Output voltage VOUT 01, 03 9.95 10.05 -0.003 0.003 V

02 9.995 10.005 -0.003 0.003

1/ Deltas are performed at room temperature.

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4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.2.1 Additional criteria for device class M . Steady-state life test conditions, method 1 005 of MIL-STD-883:

a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under docum ent revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of

MIL-STD-883.

b. TA = +125C, minimum.

c. Test duration: 1,000 hours, except as permitted b y method 1005 of MIL-STD-883.

4.4.2.1 Additional criteria for device classes Q and V. T he steady-state life test duration, test condition and test temperature,

or approved alternativ es shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-385 35. The

test circuit shall be maintained under docum ent revision level control by the device manufa c turer' s TRB in accordance with

MIL-PRF-38535 and shall be made available to the acquiri ng or preparing activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of

MIL-STD-883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured

(see 3.5 herein).

a. End-point electrical parameters shall be as specified in table IIA herein.

b. For device classes Q and V, the devices or test vehicle shall be subjected to radiati on hardness assured tests as

specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to

radiation hardness assured tests as specified in MIL-PRF - 38535, appendi x A for the RHA level being tested. All device

classes must meet the postirradiation end-point electrical parameter limits as defined in table I at

A = +25C 5C, after exposure, to the subgroups specifie d in table IIA herein.

4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordanc e wit h MIL-STD-883

method 1019 conditions A to a maximum tot al dose of 100 krads(Si), and condition D to a maximum total dose of 100 krads (Si)

for device types 01, 02 and 03.

4.4.4.1.1 Accelerated annealing test. Accelerated annealing tests shall be performed on all devices requiring a RHA le vel

greater than 5 krads(Si). The post-annea l end-point electrical parameter limits shall be as specified in table I herein and shall b e

the pre-irradiation end-point electrical parameter limit at +25C 5C. Testing shall be performed at initial qualification and after

any process or design changes which may affect the RHA response of the device.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes

Q and V or MIL-PRF-38535, appendix A for device class M.

6. NOTES

6.1 Intended use. Microcircuits conforming t o this drawing are intended for use for Government microcircuit applications

(original equipment), desig n applications, and logistics purposes.

6.1.1 Replaceability. Microcircuits covered by this dra wing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished usin g DD Form 1692, Engineering Cha nge Proposal.

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6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires

configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and

this list will be used for coordinatio n and distribution of changes to the drawings. Users of drawings covering microelectronic

devices (FSC 5962) should c ontact DLA Land and Maritime-VA, telephone (614) 692-8108.

6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus , Ohio 43218-3990,

or telephone (614) 692-0540.

6.5 Abbreviations, symbols, and defin itions. The abbreviations, symbols, and definitions used herein ar e defined in

MIL-PRF-38535 and MIL-HDBK-133 1.

6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in

MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein)

to DLA Land and Maritime-VA and have agreed to this drawing.

6.6.2 Approved sources of supply for dev ice class M. Approved sources of supply for class M are listed in MIL-HDBK-103.

The vendors listed in MIL-HDBK-103 h ave agreed to this drawing and a certificate of compliance (se e 3.6 herein) has been

submitted to and accepted by DLA Land and Maritime-VA.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-88600

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

E SHEET 13

DSCC FORM 2234

APR 97

APPENDIX A

APPENDIX A FORMS A PART OF SMD 5962-88600

A.1 SCOPE

A.1.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified

Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF - 38535 and the manufacturers

approved QM plan for use in monolithic microcircuits, multi-chip modules (MCMs), hybrids, electronic modules, or devices using

chip and wire designs in accordance with MIL-PRF-38534 ar e specifi ed herein. Two product assurance classes consisting of

military high reliability (device class Q) and space application (device class V) are reflected in the Part or Identificatio n Number

(PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

A.1.2 PIN. The PIN is as shown in the following example:

5962 R 88600 02 V 9 A

Federal

stock class

designator

RHA

designator

(see A.1.2.1)

Device

type

(see A.1.2.2)

Device

class

designator

Die

code

Die

details

(see A.1.2.4)

\ / (see A.1.2.3)

Drawing number

A.1.2.1 RHA designator. Device classes Q and V RHA identified die meet the MIL-PRF-38535 specified RHA levels. A dash

(-) indicates a non-RHA die.

A.1.2.2 Device type(s). The device type(s) identif y the circuit function as fol lows:

Device type Generic number Circuit function VOUT (V)

02 RH1021C-10 DICE 10 V voltage reference



0.005 V

A.1.2.3 Device class designator.

Device class Device requirements docum entation

Q or V Certification and qualification to the die requirements of MIL-PRF-38535

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-88600

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

E SHEET 14

DSCC FORM 2234

APR 97

APPENDIX A

APPENDIX A FORMS A PART OF SMD 5962-88600

A.1.2.4 Die details. The die details designati on is a unique letter which designates the di e's physical dimensions, bo nding

pad location(s) and related el ectrical function(s), interface materials, and other assembly related i nformation, for each product

and variant supplied to this appendix.

A.1.2.4.1 Die physical dimensions.

Die type Figure number

02 A-1

A.1.2.4.2 Die bonding pad locations and electrical functions.

Die type Figure number

02 A-1

A.1.2.4.3 Interface materials.

Die type Figure number

02 A-1

A.1.2.4.4 Assembly related information.

Die type Figure number

02 A-1

A.1.2.4.5 Special handling of dice. Radiation hardened dice require special handl ing as compared to standard integrated

circuit dice. Radiation harde ned dice are susceptible to surface damage due to the absence of silicon nitride passiv ation that is

present on most standard dice. Silicon nitride protects the dice surface from scratches by its har d and dense properties.

The passivation on radiation hardened dice is silicon di oxide which is much “softer” than silicon nitride. During the visual and

preparation for shipment, elect rostatic discharge (ESD) safe tweezers are u s ed and only the edge of the die are touche d.

It is recommended that dice handling be performed with extreme care so as to protect the die surface from scratches. If the

need arises to move the die in or out of the chip shipment tray (waffle pack), use an ESD safe plastic tipped bent metal vacuum

probe, preferably .020 inch outside d iameter x .010 inch inside diameter ( f or use with tiny parts). The wand should be

compatible with continuous air vacuums. The tip material should be static dissipative Delrin (or equivalent) plastic.

During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top of the dice.

A.1.3 Absolute maximum ratings. See para graph 1.3 herein for details.

A.1.4 Recommended operating conditions. See paragraph 1.4 herein for details.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-88600

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

E SHEET 15

DSCC FORM 2234

APR 97

APPENDIX A

APPENDIX A FORMS A PART OF SMD 5962-88600

A.2 APPLICABLE DOCUMENTS.

A.2.1 Government specification, standards, and handbooks. The following specification, standards, and han dbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in

the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARD

MIL-STD-883 - Test Method Standard Microcircuits.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents ar e available online at http://quicksearch.dla.mil or from the Standardization Document Order

Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

A.2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the

text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regul ations unless a

specific exemption has been obtained.

A.3 REQUIREMENTS

A.3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specif ied herein or as modified in the device manufacturer’s Quality Man agement (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein.

A.3.2 Design, construction and physic al dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein and the manufacturer’s QM plan for device classes Q and V.

A.3.2.1 Die physical dimensions. The die physical dimensions shall be as specified in A.1.2.4.1 and on figure A-1.

A.3.2.2 Die bonding pad locations a nd electrical functions. The die bonding pad locations and electrical functions shall be as

specified in A.1.2.4.2 and on figure A-1.

A.3.2.3 Interface materials. The interface materials for the die shall be as specified in A.1.2.4.3 and on figure A-1.

A.3.2.4 Assembly related information. The assembly related information shall be as specified i n A.1.2.4.4 and o n figure A-1.

A.3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined in paragraph 3.2.3 herein.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-88600

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

E SHEET 16

DSCC FORM 2234

APR 97

APPENDIX A

APPENDIX A FORMS A PART OF SMD 5962-88600

A.3.3 Electrical performance characteristics and post-irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and p ost-irradiation parameter limits are as specifie d in table I of the body of this

document.

A.3.4 Electrical test requirements. The wafer probe test requirements sh all include functional and para m etric testing

sufficient to make the packaged die capa ble of meeting the electrical performance requirements in table I.

A.3.5 Marking. As a minimum, each unique lot of die, lo aded in single or multiple stack of carriers, for shipment to a

customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed

in A.1.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.

A.3.6 Certification of compliance. For device classes Q and V, a certificate of compli ance shall be required from a

QML-38535 listed manufacturer in ord er to supply to the requirements of this drawing (see A.6.4 herein). The certificate of

compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this appendix shall

affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the

requirements herein.

A.3.7 Certificate of conformance. A certificate of conformance as required for devic e classes Q and V in MIL-PRF-38535

shall be provided with each lot of microcircuit die delivered to this drawing.

A.4 VERIFICATION

A.4.1 Sampling and inspection. For device classes Q and V, die samplin g and inspection procedures shall be in accordance

with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM

plan shall not affect the form, fit, or function as described he rein.

A.4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the

manufacturer’s QM plan. As a minimum, it shall consist of:

a. Wafer lot acceptance for clas s V product using the criteria defined in MIL-STD-883, method 5007.

b. 100% wafer probe (see paragraph A.3.4 herein).

c. 100% internal visual inspection to the applica ble class Q or V criteria defined in MIL-STD-883, method 2010 or the

alternate procedures allowed in MIL-STD-883, method 5004.

A.4.3 Conformance inspection.

A.4.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see

A.3.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrica l testing of

packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified in paragraphs 4.4.4,

4.4.4.1, 4.4.4.1.1 herein.

A.5 DIE CARRIER

A.5.1 Die carrier requirements. The requirements for the die carrier shall be in accordance with the manufacturer ’s QM plan

or as specified in the purchas e order by the acquiring activity. The die carrier shal l provide adequate physical, mechanical and

electrostatic protection.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-88600

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

E SHEET 17

DSCC FORM 2234

APR 97

APPENDIX A

APPENDIX A FORMS A PART OF SMD 5962-88600

A.6 NOTES

A.6.1 Intended use. Microcircuit die conforming to this drawing are inten de d for use in microcircuits built in accordance with

MIL-PRF-38535 or MIL-PRF-38534 for gov ernment microcircuit applications (original equipment), design applications, and

logistics purposes.

A.6.2 Comments. Comments on this appendix should be d irected to DLA Land and Maritime -VA, Columbus, Ohio,

43218-3990 or telephone (614)-692-0540.

A.6.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-133 1.

A.6.4 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed within MIL-HDBK-103 and QML-38535 have submitted a certificate of compliance (see A.3.6 herein) to

DLA Land and Maritime -VA and have agreed to this drawing.

STANDARD

MICROCIRCUIT DRAWING

SIZE

5962-88600

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

REVISION LEVEL

SHEET

DSCC FORM 2234

APR 97

APPENDIX A

APPENDIX A FORMS A PART OF SMD 5962-88600

Die bonding pad locations and electrical functions.

Die ph ysical dimensions.

Die size: 94 m ils x 5 5 mils

Die thickness: 12 mils

Interface materials.

T op metallization: AL

Backside metallization: Gold

Glassivation.

T ype: SiO

T hickness: Minimum of 4 kÅ

Substrate: Si

Assembly related information.

Substrate potential: Ground

Special assembly instructions: None

FIGURE A-1. Die bonding pad locations and electrical functions.

Ground

Trim

Output voltage

Input voltage

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 15-08-05

Approved sources of suppl y for SMD 5962-88600 are listed below for immediate acq uisition information only and

shall be added to MIL-HDBK-103 an d QML-38535 during the ne xt revision. MIL-HDBK-103 and QML-38535 will be

revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a

certificate of compliance has been submitted to and accepted by DLA Land and Maritim e-VA. This information

bulletin is superseded by the ne xt dated revision of MIL-HDBK-103 and QML-38535. DL A Land and Maritime

maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

Reference

military specification

5962-8860001GA 64155 LT1021BMH-10/883B MIL-M-38510/12409BGA

5962-8860002GA 64155 LT1021CMH-10/883B

5962-8860003GA 64155 LT1021DMH-10/883B

5962R8860001VGA 64155 RH1021BMH-10

5962R8860002VGA 64155 RH1021CMH-10

5962R8860002VHA 64155 RH1021CMW-10

5962R8860003VGA 64155 RH1021DMH-10

5962R8860002V9A 64155 RH1021C-10 DICE

1/ T he lead finish shown for each PIN representing a hermetic package is the most readily

available from the manufacturer listed for that part. If the desired lead finish is not listed

contact the vendor to determine its availability.

2/ Caution. Do n ot use this number for item acquisition. Items acquired to this number may not

satisfy the performance requirements of this drawing.

Vendor CAGE Vendor name

number and address

64155 Linear Technology Corporation

1630 McCarthy Boulevard

Milpitas, CA 95035-7417

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoeve r for any inaccuracies in the

information bulletin.