tm
©2009 Fairchild Semiconductor Corporation 1www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
June 2009
FPF1015/6/7/8
IntelliMAXTM 1V Rated Advanced Load Management Products
Features
0.8 to 1.8V Input Voltage Range
Typical RDS(ON) = 34mΩ @ VON - VIN = 2.0V
Output Discharge Function
Internal Pull down at ON Pin
Accurate Slew Rate Controlled Turn-on time
Low < 1µA Quiescent Current
ESD Protected, above 8000V HBM, 2000V CDM
RoHS Compliant
Free from Halogenated Compounds and Antimony Oxides
Applications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Notebook Computers
General Description
The FPF1015/6/7/8 series is an IntelliMAX advanced slew rate
loadswitch offering a very low operating voltage. These devices
consist of a 34mΩ N-channel MOSFET that supports an input
voltage up to 2.0V. These slew rate devices control the switch
turn-on and prevent excessive in-rush current from the supply
rails. The input voltage range operates from 0.8V to 1.8V to
fulfill today's lowest Ultraportable Device's supply requirements.
Switch control is via a logic input (ON) capable of interfacing
directly with low voltage control signals.
The FPF1016 and FPF1018 have an On-Chip pull down
allowing for quick and controlled output discharge when switch
is turned off. The FPF1015/6/7/8 series is available in a
space-saving 2X2 MLP-6L package.
Typical Application Circuit
Ordering Information
Part Switch Turn-on Time Output Discharge ON Pin Activity Package
FPF1015 34mΩ, NMOS 43us NA Active HI MLP 2x2
FPF1016 34mΩ, NMOS 43us 60ΩActive HI MLP 2x2
FPF1017 34mΩ, NMOS 165us NA Active HI MLP 2x2
FPF1018 34mΩ, NMOS 165us 60ΩActive HI MLP 2x2
OFF ON ON
VIN
GND
FPF1015/6/7/8
VOUT
TO LOAD
-
CIN
COUT
BOTTOM
PIN 1
TOP
2www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Functional Block Diagram
Pin Configuration
Pin Description
Absolute Maximum Ratings
Recommended Operating Range
Pin Name Function
1 ON ON/OFF Control Input, 2nd Supply
2, 3 VIN Supply Input: Input to the power switch
4, 5 VOUT Switch Output.
6 GND Ground
Parameter Min Max Unit
VIN, VOUT to GND -0.3 2 V
VON to GND -0.3 4.2 V
Maximum Continuous Switch Current 1.5 A
Power Dissipation @ TA = 25°C (Note 1) 1.2 W
Operating Temperature Range -40 85 °C
Storage Temperature -65 150 °C
Thermal Resistance, Junction to Ambient 86 °C/W
Electrostatic Discharge Protection HBM 8000 V
CDM 2000 V
Parameter Min Max Unit
VIN 0.8 1.8 V
Ambient Operating Temperature, TA-40 85 °C
VIN
ON
VOUT
GND
Output Discharge
(Optional for FPF1016/18)
CONTROL
LOGIC
ESD protection
Turn-on Slew Rate
Controlled Driver
FPF1015/6/7/8
VOUT
VOUT
ON
MicroFET 2x2 6L BOTTOM VIEW
1
2
3
6
5
4
VIN
VIN
GND
Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board
3www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Electrical Characteristics
VIN = 0.8 to 1.8V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 1.8V and TA = 25°C.
Parameter Symbol Conditions Min Typ Max Unit
Basic Operation
Operating Voltage VIN 0.8 1.8 V
ON input Voltage VON(MIN) VIN = 0.8V 1.8 2.8 4.0 V
VON(MAX) VIN = 1.8V(Note2) 2.8 3.8 4.0 V
Operating Current ICC VIN = 1V, VON = 3.3V, VOUT = Open 1 µA
Quiescent Current IQVIN = 1V, VON = VOUT = Open 2 µA
Off Switch Current ISWOFF VIN = 1.8V, VON = GND, VOUT = GND 2 µA
On-Resistance RON
VIN = 1V, VON = 3V, ILOAD = 1A, TA = 25°C 34 45 mΩ
VIN = 1V, VON = 2.3V, ILOAD = 1A, TA = 25°C 41 55
Output Pull Down Resistance RPD
VIN = 1V, VON = 0V, TA = 25°C, ILOAD = 1mA,
FPF1016, FPF1018 60 120 Ω
ON Input Logic Low Voltage VIL
VIN = 0.8V, RLOAD = 1KΩ0.3 V
VIN = 1.8V, RLOAD = 1KΩ0.8
ON Input Leakage VON = VIN or GND -1 1 µA
Dynamic (VIN = 1.0V, VON = 3.0V, TA = 25°C)
VOUT Rise Time TR
FPF1015, FPF1016, RL = 500Ω, CL = 0.1µF 28
µs
FPF1017, FPF1018, RL = 500Ω, CL = 0.1µF 114
FPF1015, FPF1016, RL = 3.3Ω, CL = 10µF 38
FPF1017, FPF1018, RL = 3.3Ω, CL = 10µF 155
Turn ON TON
FPF1015, FPF1016, RL = 500Ω, CL = 0.1µF 43
µs
FPF1017, FPF1018, RL = 500Ω, CL = 0.1µF 165
FPF1015, FPF1016, RL = 3.3Ω, CL = 10µF 58
FPF1017, FPF1018, RL = 3.3Ω, CL = 10µF 228
VOUT Fall Time TF
FPF1015, FPF1017, RL = 500Ω, CL = 0.1µF 105
µs
FPF1016, FPF1018,
RPD = 60Ω, RL = 500Ω, CL = 0.1µF 15
FPF1015, FPF1017, RL = 3.3Ω, CL = 10µF 80
FPF1016, FPF1018
RPD = 60Ω, RL = 3.3Ω, CL = 10µF 74
Turn Off TOFF
FPF1015, FPF1017, RL = 500Ω, CL = 0.1µF 150
µs
FPF1016, FPF1018
RPD = 60Ω, RL = 500Ω, CL = 0.1µF 53
FPF1015, FPF1017, RL = 3.3Ω, CL = 10µF 102
FPF1016, FPF1018
RPD = 60Ω, RL = 3.3Ω, CL = 10µF 96
Note 2: VON(MAX) is limited by the absolute rating.
4www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Typical Characteristics
0
0.002
0.004
0.006
0.008
0.01
0.012
0.014
0.016
0.018
0.02
0.8 1 1.2 1.4 1.6 1.
8
Supply Voltage (V)
Supply Current (uA)
V
ON
= 0V
V
ON
=3.3V
0
2
4
6
8
10
12
-50 -25 0 25 50 75 100 12
5
T
J
, Junction Temperature
o
C
IQ (uA)
V
ON
= 0V
V
OUT
= Open V
IN
= 1.8V
V
IN
= 1.0V
V
IN
= 0.8V
0
1
2
3
4
5
6
7
8
9
10
-50 -25 0 25 50 75 100 12
5
T
J
, Junction Temperature
o
C
ISWOFF ( uA)
V
IN
= 1.8V
V
ON
= 0V
V
OUT
= 0V
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
-50-250 25507510012
5
T
J
, Junction Temperature (
o
C)
I
CC
(uA)
V
ON
= 3.3V
V
OUT
= Open V
IN
= 1.8V
V
IN
= 1.0V
V
IN
= 0.8V
20
25
30
35
40
45
-50 -25 0 25 50 75 100 12
5
T
J
, Junction Temperature (
o
C)
On Resistance (mOhms)
V
IN
= 1 V
V
ON
= 3 V
I
OUT
= 1 A
20
25
30
35
40
45
50
55
60
1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.
7
V
ON
- V
IN
(V)
On Resistance (mOhms)
V
ON
= 3V
I
OUT
= 1A
Figure 1. Supply Current vs.VIN Figure 2. Quiescent Current vs. Temperature
Figure 3. Operating Current vs. Temperature Figure 4. Off Switch Current vs. Temperature
Figure 5. RON vs. Temperature Figure 6. RON vs. VON - VIN
5www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Typical Characteristics
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.
8
Supply Voltage (V)
On Threshold Voltage (V)
0
0.3
0.6
0.9
1.2
1.5
-50 -25 0 25 50 75 100 12
5
T
J
, Junction Temperature (
o
C)
On Threshold Voltage, VIL (V)
V
IN
= 1.8V
V
IN
= 1.0V
V
IN
= 0.8V
0
50
100
150
200
-40 -15 10 35 60 8
5
T
J
, Junction temperature (
o
C)
Rise/Fall Time (us)
FPF1016 / 18 T
FALL
FPF1017 / 18 T
RISE
FPF1015 / 16 T
RISE
V
IN
= 1V
V
ON
= 3V
R
L
= 3.3 Ohm
C
L
= 10uF
0
50
100
150
200
250
300
-40 -15 10 35 60 8
5
T
J
, Junction Temperature (
o
C)
Turn ON/OFF Time (us)
FPF1016 / 18 T
OFF
V
IN
= 1V
V
ON
= 3V
R
L
= 3.3 Oh
m
C
L
= 10uF
FPF1015 / 16 T
ON
FPF1017 / 18 T
ON
VIN = 1V
VON = 2.6V
CIN = 10uF
CL = 4.7uF
RL = 1Ω
VON
2V/DIV
IOUT
500mA/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
CL= 10uF
RL = 3.3Ω
VON
2V/DIV
IOUT
500mA/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
Figure 7. VIL vs. VIN Figure 8. VIL vs. Temperature
Figure 9. TRISE/TFALL vs. Temperature Figure 10. TON/TOFF vs. Temperature
Figure 11. FPF1015 / 16 Turn ON response Figure 12. FPF1015 / 16 Turn ON response
100us/DIV 100us/DIV
6www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Typical Characteristics
VON
2V/DIV
IOUT
500mA/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
CL = 47uF
RL = 1Ω
VON
2V/DIV
IOUT
500mA/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
CL = 10uF
RL = 3.3Ω
VON
2V/DIV
IOUT
500mA/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
CL = 47uF
RL = 1Ω
VON
2V/DIV
IOUT
500mA/DIV
IVIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
CL= 10uF
RL = 3.3Ω
VON
2V/DIV
IOUT
500mA/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
CL = 4.7uF
RL = 1Ω
VON
2V/DIV
IOUT
500mA/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
CL = 10uF
RL = 3.3Ω
Figure 13. FPF1017 / 18 Turn On response Figure 14. FPF1017 / 18 Turn On response
Figure 15. FPF1015 / 17 Turn OFF response Figure 16. FPF105 / 17 Turn OFF response
Figure 17. FPF1016 / 18 Turn OFF response Figure 18. FPF1016 / 18 Turn OFF response
100us/DIV 100us/DIV
100us/DIV 100us/DIV
100us/DIV 100us/DIV
7www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Typical Characteristics
VON
2V/DIV
VIN
500mV/DIV
VOUT
500mV/DIV
VIN = 1V
VON = 2.6V
CIN = 10uF
RL = 499Ω
Figure 19. FPF1016 / 18 Output Pull Down response
20us/DIV
8www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Description of Operation
The FPF1015/6/7/8 are low RDS(ON) N-Channel load switches
with controlled turn-on. The core of each device is a 34mΩ
(VIN = 1V, VON = 3V) N-Channel MOSFET and is customized for
a low input operating range of 0.8 to 1.8V. The ON pin controls
the state of the switch.
The FPF1016 and FPF1018 contain a 60Ω(typ) on-chip resistor
which is connected internally from VOUT to GND for quick output
discharge when the switch is turned off.
On/Off Control
The ON pin is active high and it controls the state of the switch.
Applying a continuous high signal will hold the switch in the ON
state. In order to minimize the switch on resistance, the ON pin
voltage should exceed the input voltage by 2V. This device is
compatible with a GPIO (General Purpose Input/Output) port,
where the logic voltage level can be configured to 4V ≥ VON ≥
VIN+2V and power consumed is less than 1µA in steady state.
Timing Diagram
where:
tdON = Delay On Time
tR=V
OUT Rise Time
tON = Turn On Time
tdOFF = Delay Off Time
tF=V
OUT Fall Time
tOFF = Turn Off Time
VON
VOUT
10%
10% 10%
90%
90%
90%
td
ON
t
R
t
ON
td
OFF
t
F
t
OFF
Application Information
Typical Application
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on, a capacitor must be
placed between VIN and GND. For minimized voltage drop,
especially when the operating voltage approaches 1V and a fast
slew rate part (FPF1015 and FPF1016) is selected, a 10µF
ceramic capacitor should be placed close to the VIN pins. Higher
values of CIN can be used to further reduce the voltage drop
during higher current modes of operation.
Output Capacitor
A 0.1µF capacitor, CL, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductance
from forcing VOUT below GND when the switch turns-off. If the
application has a capacitive load, the FPF1016 and FPF1018
can be used to discharged that load through an on-chip output
discharge path.
Board Layout
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces or large copper planes for all pins
(VIN, VOUT
, ON and GND) will help minimize the parasitic
electrical effects along with minimizing the case to ambient
thermal impedance.
OFF ON ON
VIN
GND
FPF1015/6/7/8
VOUT
VIN = 0.8-1.8V CIN RLCL
9www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Improving Thermal Performance
An improper layout could result in higher junction temperature.
This concern applies when the current is at its continuous
maximum value and is then switched into a large capacitive
load that introduces a large transient current. Since the
FPF1015/6/7/8 does not have thermal shutdown capability, a
proper layout is essential to improving power dissipation of the
switch in transient events and prevents the switch from
exceeding the maximum absolute power dissipation of 1.2W.
The following techniques have been identified to improve the
thermal performance of this family of devices. These techniques
are listed in order of the significance of their impact.
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
2. Embedding two exposed through-hole vias into the DAP
(pin7) provides a path for heat to transfer to the back GND
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
Figure 19: Two through hole open vias embedded in DAP
3. The VIN, VOUT and GND pins will dissipate most of the heat
generated during a high load current condition. The layout
suggested in Figure 20 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The ON pin trace may be laid-out diagonally from
the device to maximize the area available to the ground pad.
Placing the input and output capacitors as close to the device as
possible also contributes to heat dissipation, particularly during
high load currents.
Figure 20: Proper layout of output, input and ground copper
area
Demo Board Layout
FPF1015/6/7/8 Demo board has the components and circuitry
to demonstrate FPF1015/6/7/8 load switches functions.
Thermal performance of the board is improved using a few
techniques recommended in the layout recommendations
section of datasheet.
Figure 21. FPF1015/6/7/8 Demo board TOP, SST, ASTOP
and DRL layers
15 M il
14 M il
10 www.fairchildsemi.com
FPF1015/6/7/8 Rev. D
FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products
Dimensional Outline and Pad Layout
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
AccuPower™
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSW ITCH™*
™*
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FETBench™
FlashWriter®*
FPS™
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
MotionM ax™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
PDP SPM™
Power-SPM™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
Sync-Lock™ ®*
The Power Franchise®
TinyBoost™
TinyBuck™
TinyCalc™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHI LD SEM ICONDUCTOR RESERVES THE RIG HT TO MAKE CHANGES WI THOUT FURTHER NOTICE TO ANY PRODUCTS HEREI N TO IM PROVE
RELIABI LITY , FUNCTION, O R DESIGN. FAI RCHILD DOES NOT ASSUME ANY L IABIL ITY ARI SING OUT OF THE APPL ICATION O R USE OF ANY PRODUCT OR
CIRCUI T DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LI CENSE UNDER ITS PATENT RIGHTS, NOR THE RI GHTS OF OTHERS. THESE
SPECIFI CATIONS DO NO T EXPAND THE TERMS OF FAIRCHI LD’S WORLDWIDE TERM S AND CONDITI ONS, SPECIFI CALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHI LD’S PRODUCTS ARE NOT AUTHORIZED F OR USE AS CRITI CAL COM PONENTS IN LI FE SUPPORT DEVICES OR SY STEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAI RCHI LD SEM ICONDUCTOR CORPORATIO N.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical im plant i nto the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all w arranties and will appropriately address any warranty issues th at may arise. Fair child will n ot provide
any w arranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Preliminary First Production
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only. Rev. I41
