100V, 20A Low RDS(ON)
N ch Trench Power MOSFET
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 1
Aug. 28 2013
Features
VDS ------------------------------------------------------ 100 V
ID ---------------------------------------------------------- 20 A
RDS(ON) --------------- 33 mΩ typ.(VGS = 10 V, ID = 10 A)
Built-in Gate protect diode
100 % UIL tested
RoHS Compliant
Applications
Low Voltage DC Motor driver
Solenoid driver
Package
TO220 TO220F
EKG1020 FKG1020
Not to scale
Equivalent circuit
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C
Characteristic
Symbol
Test conditions
Rating
Unit
EKG1020
FKG1020
Drain to Source Voltage
VDSS
100
V
Gate to Source Voltage
VGSS
± 20
V
Continuous Drain Current
ID(DC)
20
A
Pulsed Drain Current
ID(PULSE)
PW ≤ 100 µs
Duty cycle ≤1 %
60
A
Continuous Diode Forward Current
ISD(DC)
20
A
Diode Pulse Current
ISD(PULSE)
PW ≤ 100 µs
Duty cycle ≤ 1 %
60
A
Single Pulse Avalanche Energy
EAS
VDD = 20 V, L = 200 µH,
ILP = 20 A, unclamped,
Rg = 50 Ω, See Figure 1
50
mJ
Maximum avalanche current
IAS
20
A
Maximum Power Dissipation
PD
TC = 25 °C
55
40
W
Thermal Resistance
θj-C
2.27
3.13
°C/W
θj-A
62.5
°C/W
Operating Junction Temperature
Tj
150
°C
Storage Temperature
Tstg
− 55 to 150
°C
(1) (2) (3)
G D S
(1) (2) (3)
G D S
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 2
Aug. 28 2013
Electrical Characteristics
Unless otherwise specified, TA = 25 °C
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Drain to Source Breakdown
Voltage
V(BR)DSS
ID = 1 mA, VGS = 0 V
100
−
−
V
Drain to Source Breakdown
Voltage Temp. Coefficient
ΔV(BR)DSS
ID = 1 mA, VGS = 0 V
−
80
−
mV/°C
Drain to Source Leakage Current
IDSS
VDS = 100 V, VGS = 0 V
−
−
100
µA
Gate to Source Leakage Current
IGSS
VGS = ± 20 V
−
−
±10
µA
Gate Threshold Voltage
VTH
VDS = 10 V, ID = 1 mA
1.5
2.0
2.5
V
Gate Threshold Voltage Temp.
Coefficient
ΔVTH
VDS = 10 V, ID = 1 mA
−
− 6
−
mV/°C
Static Drain to Source
On-Resistance
RDS(ON)
ID = 10 A, VGS = 10 V
−
33
52
mΩ
ID = 10 A, VGS = 4.5 V
−
36
59
Forward Transfer Admittance
|yfs|
VDS = 10 V, ID = 10 A
9.0
−
−
S
Input Capacitance
Ciss
VDS = 10 V
VGS = 0 V
F = 1 MHz
−
2200
−
pF
Output Capacitance
Coss
−
210
−
Reverse Transfer Capacitance
Crss
−
110
−
Total Gate Charge
Qg
VDD = 50 V
ID = 10 A, VGS = 10 V
RL = 5 Ω
−
45
−
nC
Gate to Source Charge
Qgs
−
4
−
Gate to Drain Charge
Qgd
−
9
−
Turn-On Delay Time
td(on)
VDD = 50 V
ID = 10 A
RL = 5 Ω, Rg = 10 Ω
VGS = 10 V , See Figure 3
−
15
−
ns
Rise Time
tr
−
20
−
Turn-Off Delay Time
td(off)
−
180
−
Fall Time
tf
−
90
−
Source-Drain Diode Forward
Voltage
VSD
ISD = 20 A, VGS = 0 V
−
0.9
1.2
V
Source-Drain Diode Reverse
Recovery Time
trr
ISD = 20 A
di/dt = 100 A/µs
See Figure 2
−
50
−
ns
ISD = 20 A
di/dt = 100 A/µs
TC = 150 °C
See Figure 2
−
60
−
ns
Source-Drain Diode Recovery
Charge
Qrr
ISD = 20 A
di/dt = 100 A/µs
See Figure 2
−
90
−
nC
ISD = 20 A
di/dt = 100 A/µs
TC = 150 °C
See Figure 2
−
120
−
nC
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 3
Aug. 28 2013
Test Circuits and Waveforms
VDD
IL
VDS
RG
VGS
0 V
ILp
IL
V(BR)DSS
VDD
VDS
(a) Test Circuit (b) Waveform
Figure 1 Unclamped Inductive
VGS
0 V
ISD
RG
L
D.U.T.
VDD
0 V
ISD
trr
di/dt IRM × 90 %
IRM
(a) Test Circuit (b) Waveform
Figure 2 Diode Reverse Recovery Time
ID
VDS
VDD
RG
RL
VGS
0 V
P.W. = 10 μs
Duty cycle ≤ 1 %
td(on) tr
ton
td(off) tf
toff
90%
10%
90%
10%
VGS
VDS
(a) Test Circuit (b) Waveform
Figure 3 Switching Time
DD(BR)DSS
(BR)DSS
2
LPAS VV
V
IL
2
1
E
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 4
Aug. 28 2013
Performance Curves
0
20
40
60
0 1 2 3
ID (A)
VDS (V)
ID-VDS characteristics (typical)
10V
3.5V
VGS =3V
4V
4.5V
Tc=25℃
0
10
20
30
40
50
60
0 1 2 3 4 5
ID (A)
VGS (V)
ID-VGS characteristics (typical)
VDS=10V
25℃
75℃
Tc = 125℃
0.0
0.5
1.0
1.5
0 5 10 15 20
VDS (V)
VGS (V)
VDS-VGS characteristics (typical)
ID=20A
ID=5A
Tc=25℃
ID=10A
0
20
40
60
80
010 20 30 40 50 60
RDS(ON) (mΩ)
ID (A)
RDS(ON)-ID characteristics (typical)
VGS=10V
VGS=4.5V
Tc=25℃
0
20
40
60
80
050 100 150
RDS(ON) (mΩ)
Tc (℃)
RDS(ON)-Tc characteristics (typical)
VGS=10V
VGS=4.5V
ID=10A
0
20
40
60
0.0 0.5 1.0 1.5
ISD (A)
VSD (V)
ISD-VSDcharacteristics (typical)
Tc=25℃
75℃
125℃
0
50
100
150
200
250
010 20 30 40 50 60
RDS(ON) Maximum (mΩ)
ID (A)
RDS(ON)-ID characteristics (maximum)
VGS=10V
Tc=150℃
0
10
20
30
40
50
60
010 20 30 40 50
VDS (V)
Qg (nC)
Dynamic Input Output Characteristics (typical)
VGS (V)
0
2
4
6
8
10
12
Tc=25℃
VDD≒50V
ID=10A
10
100
1000
10000
010 20 30 40 50
Capacitance (pF)
VDS (V)
Ciss
Coss
Crss
Capacitance-VDS caracteristics (typical)
Tc=25℃
VGS＝0V
f=1MHz
1
10
100
1000
110 100
SWtime (ns)
ID (A)
SW time - ID Characteristics (typical)
td(on)
tr
tf
td(off)
Tc=25℃
VDD≒50V
RG=10Ω
VGS=10V
RLoad
1
10
100
1000
110 100
SWtime (ns)
RG (Ω)
SW time - RG Characteristics (typical)
td(on)
tr
tf
td(off)
Tc=25℃
VDD≒50V
ID=10A
VGS=10V
R Load
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 5
Aug. 28 2013
0.1
1
10
100
0.1 1 10 100
ID (A)
VDS (V)
Safe Operating Area
Tc=25℃
SinglePulse
0
10
20
30
40
50
60
70
80
90
100
25 50 75 100 125 150
EAS (Normalized) (%)
Tch(start) (℃）
EAS-Tc(start) Characteristics
EKG1020
FKG1020
0
10
20
30
40
50
050 100 150
PD (W)
Ta (℃)
PD-Ta Characteristics
Withoutheatsink
0
10
20
30
40
50
60
050 100 150
PD (W)
Ta (℃)
PD-Ta Characteristics
Withoutheatsink
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 6
Aug. 28 2013
Package Outline
NOTES:
1) Dimension is in millimeters.
2) Pin treatment Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
Part Number
YMW BAA
EKG1020
Lot Number
Y is the Last digit of the year (0 to 9)
M is the Month (1 to 9, O, N or D)
W is the Week (1st to 5th week of every month)
B expresses Pb free pins
A is the suffix No.
1.52±0.10
0.08±0.10
TO220
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 7
Aug. 28 2013
Package Outline
NOTES:
1) Dimension is in millimeters.
2) Pin treatment Pb-free. Device composition compliant with the RoHS directive
Marking Diagram
Part Number
YMW BAA
FKG1020
Lot Number
Y is the Last digit of the year (0 to 9)
M is the Month (1 to 9, O, N or D)
W is the Week (1st to 5th week of every month)
B expresses Pb free pins
A is the suffix No.
TO220F
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 8
Aug. 28 2013
OPERATING PRECAUTIONS
In the case that you use Sanken products or design your products by using Sanken products, the reliability largely
depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation
range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to
assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric
current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused
due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum
values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power
devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
Because reliability can be affected adversely by improper storage environments and handling methods, please
observe the following cautions.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
Avoid locations where dust or harmful gases are present and avoid direct sunlight.
Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are
within the ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more
silicone grease than required is applied, it may produce excess stress.
Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect.
Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the
products to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the
product life, are indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has
an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque.
For mounting the products, the mounting surface flatness should be 0.05mm or less.
Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to
the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the
hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That
may stress the products and may cause failures.
Recommended screw torque:
Package
Recommended Screw Torque
TO-220 , TO-220F
0.490 to 0.686 N・m (5 to 7 kgf・cm)
TO-3P , TO-3PF
0.686 to 0.882 N・m (7 to 9 kgf・cm)
SLA
0.588 to 0.784 N・m (6 to 8 kgf・cm)
For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal
stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can
be applied and the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten
with the specified torque. When using a power driver, torque control is mandatory.
Please pay special attention about the slack of the press mold. In case that the hole diameter of the heatsink is less
than 4 mm, it may cause the resin crack at tightening.
EKG1020 / FKG1020
EKG1020/ FKG1020 Rev.1.0 SANKEN ELECTRIC CO.,LTD. 9
Aug. 28 2013
Soldering
When soldering the products, please be sure to minimize the working time, within the following limits:
• 260 ± 5 °C 10 ± 1 s (Flow, 2 times)
• 380 ± 10 °C 3.5 ± 0.5 s (Soldering iron, 1 time)
Soldering should be at a distance of at least 1.5 mm from the body of the products.
Electrostatic Discharge
When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ
of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
Workbenches where the products are handled should be grounded and be provided with conductive table and floor
mats.
When using measuring equipment such as a curve tracer, the equipment should be grounded.
When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent
leak voltages generated by them from being applied to the products.
The products should always be stored and transported in Sanken shipping containers or conductive containers, or
be wrapped in aluminum foil.
IMPORTANT NOTES
The contents in this document are subject to changes, for improvement and other purposes, without notice. Make
sure that this is the latest revision of the document before use.
Application and operation examples described in this document are quoted for the sole purpose of reference for the
use of the products herein and Sanken can assume no responsibility for any infringement of industrial property
rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.
Unless otherwise agreed in writing by Sanken, Sanken makes no warranties of any kind, whether express or
implied, as to the products, including product merchantability, and fitness for a particular purpose and special
environment, and the information, including its accuracy, usefulness, and reliability, included in this document.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at
their own risk, preventative measures including safety design of the equipment or systems against any possible
injury, death, fires or damages to the society due to device failure or malfunction.
Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation
equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various
safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment
or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products
herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that
may result from all such uses in advance and proceed therewith at your own responsibility.
Anti radioactive ray design is not considered for the products listed herein.
Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of
Sanken’s distribution network.
The contents in this document must not be transcribed or copied without Sanken’s written consent.