Application Specification Dual In-Line Package (DIP) 114-1056 Programming Switches (7000 and 7100 Series) NOTE 04 MAY 06 Rev B All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2 . Figures and illustrations are for identification only and are not drawn to scale. _ 1. INTRODUCTION This specification covers the requirements for application of DIP Programming Switches (7000 and 7100 Series). The 7000 Series switches are designed for a life of 7000 cycles per pole. The 7100 Series switches are recommended for programming applications where the number of cycles is limited to 2000 per pole. Switches are manually rocker actuated and are designed for wave soldering on printed circuit (pc) boards or insertion into DIP Sockets with in-row centerline spacing of 7.62 mm (.300 in.). The 7000 series switches are black, and are available in 2 through 12 positions, while the 7100 series switches are blue, and are available in 2 through 12 positions. Both series are available with a premium seal, an economy seal, or unsealed in the raised rocker (standard profile) or flush rocker profile (low profile). In addition, the 7000 series switches are available with a side rocker profile (side actuated). Both series are individual single-pole, single-throw (SPST). The 7000 series raised rocker profile switches may have ganged rockers for single-pole, double-throw (SPDT) and double-pole, double-throw (DPDT) make-before-break circuits. The unsealed switches are designed for socket applications and the sealed switches are designed for soldering directly to the pc board. The sealants prevent flux and other contaminants from entering the switch during soldering and cleaning. The raised rocker and side rocker profiles come unsealed or with an optional economy or premium masking top seal. The flush rocker profile comes unsealed or with an optional economy tape top seal or premium masking top seal. The multi-pole switches come unsealed only. All switches come standard with a bottom seal. Switches are designed for use in logic level switching applications. When corresponding with Tyco Electronics Personnel, use the terminology provided on this specification to help facilitate your inquiry for information. Basic terms and features of this product line are provided in Figure 1. Raised Rocker Standard Profile Switch Position Number Flush Rocker White Dot Identifies Pin 1 Side Rocker Switch Housing White Dot Identifies Pin 1 Low-Profile Switch E 2006 Tyco Electronics Corporation, Harrisburg, PA All International Rights Reserved Tyco is a trademark. Solder Tail Figure 1 TOOLING ASSISTANCE CENTER 1-800-722-1111 This controlled document is subject to change. PRODUCT INFORMATION 1-800-522-6752 For latest revision and Regional Customer Service, *Trademark Other products, logos, and company names used are the property of their respective owners. visit our website at www.tycoelectronics.com 1 of 7 LOC B DIP Programming Switches (7000 and 7100 Series) 114-1056 2. REFERENCE MATERIAL 2.1. Revision Summary S Updated document to corporate requirements S General update to document S Deleted premium seal information 2.2. Customer Assistance Reference Base Product Part Number 435802 and Product Code 4546 identify the DIP Programming Switches (7000 and 7100 series). Use of these numbers will identify the product line and expedite your inquiries through a service network established to help you obtain product and tooling information. Such information can be obtained through a local Tyco Electronics Representative or, after purchase, by calling the Tooling Assistance Center or the Product Information Center number at the bottom of page 1. 2.3. Drawings Customer drawings for specific products are available from the service network. The information contained in the customer drawings takes priority if there is a conflict with this specification or with any other technical documentation supplied by Tyco Electronics. Contact the Product Information Center number at the bottom of page 1 if such a conflict is encountered. 2.4. Specifications Product Specifications 108-7519 (7000 series), and 108-7532 (7100 series) provide performance requirements for DIP Programming Switches. Qualification Test Report 501-135 (7000 series), and 501-128 (7100 series) provides an independent corporate test report to show the switch conforms to the above mentioned Product Specifications. 2.5. Instructional Material Instruction Sheet 408-7779 provides installation information and procedures on DIP Programming Switches (7000 and 7100 Series). 2.6. Manuals Manual 402-40 can be used as a guide to soldering. This manual provides information on various flux types and characteristics with the commercial designation and flux removal procedures. A checklist is included in the manual as a guide for information on soldering problems. 3. REQUIREMENTS 3.1. Safety Do not stack product shipping containers so high that the containers buckle or deform. 3.2. Limitations The switches are designed to operate within a temperature range of -55_ to 105_C [-67_ to 221_F]. 3.3. Storage A. Ultraviolet Light Prolonged exposure to ultraviolet light may deteriorate the chemical composition of components used in the switches. B. Shelf Life The switches should remain in the shipping containers until ready for use to prevent damage. These products should be used on a first in, first out basis to avoid storage contamination. C. Chemical Exposure Do not store switches near any chemicals listed below, as they may cause stress corrosion cracking in the components. Alkalies Amines 2 of 7 Ammonia Carbonates Citrates Nitrites Phosphates Citrates Sulfur Nitrites Sulfur Compounds Tartrates Rev B DIP Programming Switches (7000 and 7100 Series) NOTE 114-1056 Where the above environmental conditions exist, phosphor-bronze contacts are recommended if available. 3.4. Printed Circuit (PC) Board Requirements A. Material and Thickness The pc board material must be glass epoxy (FR-4 or G-10). The pc board thickness shall be 2.36 mm [.093 in.]. NOTE Contact the Product Information Center at the number listed at the bottom of page 1 for suitability of other board materials and thicknesses. B. Tolerance Maximum allowable bow of the pc board must be 0.08 mm [.003 in.] over each 25.4 mm [1.000 in.] of length. C. PC Board Layout The solder tail contact holes in the pc board must be precisely located to ensure proper placement and optimum performance of the switch. The pc board layout dimensions and tolerances shown in Figure 2 must be observed when preparing pc boards for the various switches. The layout shows the top (component) side of the board. 2.54 + 0.13 0.89 + 0.13 [.100 + .005] [.035 + .005] Typ Dia Typ 7.62 + 0.13 [.300 + .005] Figure 2 3.5. PC Board Solder Tail Holes The holes in the pc board for the solder tails must be drilled and plated through to specific dimensions. See Figure 3. Board Thickness 2.36 [.093] (Nominal) EEEE II I EEEE II I EEEE II I EEEE II I EEEE II Tin/Lead Thickness (As Required) Dia of Finished Hole After Plating 0.89 +0.13 [.035 +.005] Pad Diameter I EEE I EEE I I EEE I I EEE I I EEE I I EEE (As Required) Copper Thickness (As Required) Drilled Hole Diameter (Maximum Hardness of Copper to (As Required) be 150 Knoop) Figure 3 Rev B 3 of 7 DIP Programming Switches (7000 and 7100 Series) 114-1056 3.6. Mounting Requirements Determine whether the switch will be soldered directly to the pc board (a sealed switch will be required), or whether the switch is to be installed in a socket (an unsealed switch can be used). A. DIP Socket Installation 1. Secure DIP socket to pc board according to instructions packaged with socket. 2. Start one row of contact leads into one row of contact cavities in socket, then rotate switch until it is parallel with socket. 3. Gripping ends of switch push switch into socket until it is bottomed. 4. Determine which of the circuits are to be closed, then depress the applicable rockers to the ON position. 5. If installing a protective dust cover, check to be sure there are no obstructions on the switch rockers or in the protective cover, then slide the cover over the top of the housing. B. PC Board Installation 1. Make a layout on pc board according to dimensions shown in Figure 2. 2. Hold switch at a slight angle and start one row of contact leads into pc board holes. Do NOT over-insert. Switch should be rotated until second row of contact leads are aligned with opposite row of contact holes. 3. Make certain all contact leads have started entry into holes. Grip sides of switch and push switch into pc board until it is bottomed. 4. To hold switch in place during wave soldering, the four outside leads may be clinched inward at 45_. See Figure 4. Clinched Solder Tail (Inward Only) 0.76 [.030] Max Figure 4 3.7. Soldering A. Flux Selection Solder tails must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will depend on the type of pc board and other components mounted on the board. Additionally, the flux must be compatible with the wave solder line, manufacturing, health, and safety requirements. Call the PRODUCT INFORMATION number at the bottom of page 1 for consideration of other types of flux. Flux types that are compatible with these switches are provided in Figure 5. 4 of 7 Rev B DIP Programming Switches (7000 and 7100 Series) 114-1056 CLEANING FLUX PROCESS STEPS ORGANIC RA (Active) ROSIN RMA (Mildly Active) ROSIN 1 Heat Heat Extra pre-clean 2 Solder Solder Heat 3 Wash in tap water or saponifierD Wash with saponifierD Solder 4 Rinse in tap or de-ionized water Rinse in tap or de-ionized water Wash in saponifierD 5 Dry in ambient air or radiant heater Dry in ambient or radiant heater Rinse in tap or de-ionized water 6 --- --- Dry in ambient air or radiant heater DReduces residue to soap Figure 5 B. Solder ing Process Refer to Paragraph 2.5 for instructional material that is available for establishing soldering guidelines. The switches can be soldered using wave soldering or equivalent soldering techniques. It is recommended using SN60 or SN62 solder for these switches. The maximum solder profile temperature should be 245 +10C [473 +10F]. These switches are not recommended for reflow process. C. Cleaning After soldering, removal of fluxes, residues, and activators is necessary. Automatic in-line cleaning is recommended for the sealed switch. Installation in a socket is recommended for the unsealed switch. Consult with the supplier of the solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other contaminants. It is recommended cleaning with the pc board on its edge. If using an aqueous cleaner, standard equipment such as a soak-tank or an automatic in-line machine should be used. The following is a list of common cleaning solvents that will not affect the switches for the time and temperature specified. See Figure 6. NOTE Vapor cleaning (with the pc board on edge) is preferred over submersion in a liquid cleaner. Unsealed switches should not be submerged due to contaminants in the cleaning bath. CAUTION Do NOT ultrasonically clean switches sealed with tape or masking material. CLEANER NAME TYPE TIME TEMPERATURE (Minutes) (Maximum) ALPHA 2110 Aqueous 1 100_C [212_F] BIOACT EC-7 Solvent 5 100_C [212_F] Butyl CARBITOL Solvent 1 Ambient Room Isopropyl Alcohol Solvent 5 100_C [212_F] KESTER 5778 Aqueous 5 100_C [212_F] KESTER 5779 Aqueous 5 100_C [212_F] LONCOTERGE 520 Aqueous 5 100_C [212_F] LONCOTERGE 530 Aqueous 5 100_C [212_F] Terpene Solvent Solvent 5 100_C [212_F] Figure 6 DANGER Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer. Refer to the manufacturer's Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners. Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental effects. Both are carcinogenic (cancer-causing). Rev B 5 of 7 DIP Programming Switches (7000 and 7100 Series) NOTE 114-1056 If you have a particular solvent that is not listed, contact PRODUCT INFORMATION at the number at the bottom of page 1. D. Drying When drying cleaned unsealed assemblies and pc boards, make certain that the housing temperature does not exceed 130_C [270_F]. Excessive temperatures may cause housing degradation. When processing the economy sealant, make certain that the sealant temperature does not exceed 100_C [212_F] for 1 minute. This is a hot melt sealant and will reflow. 3.8. Checking Installed Switches The solder tail must be through its intended hole in the pc board. Solder fillet must be evenly formed around each solder tail. The housing of the switch must be seated on the pc board not exceeding the dimension given in Figure 4. 3.9. Removal and Repair Damaged or defective switches must NOT be used and should be replaced. The switches must be removed from the pc board by standard de-soldering methods. CAUTION When removing or replacing switches, care must be taken not to damage other pc board components during the de-soldering process. 4. QUALIFICATIONS DIP Programming Switches are not required to be agency approved. 5. TOOLING No tooling is required for manual placement of these switches; however, a pc board support that provides relief for protruding components must be used to prevent deformation of contact tails. The pc board support must be custom made. See Figure 7. PC Board Support (Customer Supplied) Holes (Ref) Channel (Ref) Figure 7 6 of 7 Rev B DIP Programming Switches (7000 and 7100 Series) 114-1056 6. VISUAL AID Figure 8 shows a typical application of DIP Programming Switches. This illustration should be used by production personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be inspected using the information in the preceding pages of this specification and in the instructional material shipped with the product or tooling. SOLDERED SWITCH REMOVABLE SWITCH SWITCH BOTTOMED ON SOCKET NO CRACKS IN SOLDER SWITCH VISUALLY BOTTOMED ON PC SWITCH HOUSINGS BOARD MUST NOT BE DAMAGED IN ANY WAY FIGURE 8. VISUAL AID Rev B 7 of 7