Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 6 1Publication Order Number:
MC10H131/D
MC10H131
Dual D Type Master-Slave
Flip-Flop
The MC10H131 is a MECL 10H part which is a functional/pinout
duplication of the standard MECL 10K family part, with 100%
improvement in clock speed and propagation delay and no increase in
power–supply current.
Propagation Delay, 1.0 ns Typical
Power Dissipation, 235 mW Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10K–Compatible
LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
VCC1
Q1
Q1
R1
S1
CE1
D1
VEE
VCC2
Q2
Q2
R2
S2
CE2
D2
CC
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
S1 5
D1 7
CE1 6
R1 4
CC 9
R2 13
CE2 11
D2 10
S2 12
Q1
Q1
Q2
Q2
2
3
14
15
CLOCKED TRUTH TABLE
N.D. = Not Defined
C = CE + CC
A clock H is a clock transition
from a low to a high state.
RS TRUTH TABLE
RSQ
n+1
L
LL
H
L
H
Qn
H
L
N.D.
H
H
CDQ
n+1
L
HX
L
H
Qn
L
HH
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
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Device Package Shipping
ORDERING INFORMATION
MC10H131L CDIP–16 25 Units/Rail
MC10H131P PDIP–16 25 Units/Rail
MC10H131FN PLCC–20 46 Units/Rail
MARKING
DIAGRAMS
1
16
A = Assembly Location
WL = W afer Lot
YY = Year
WW = Work Week
CDIP–16
L SUFFIX
CASE 620
MC10H131L
AWLYYWW
PDIP–16
P SUFFIX
CASE 648
PLCC–20
FN SUFFIX
CASE 775
10H131
AWLYYWW
1
1
16
MC10H131P
AWLYYWW
MC10H131
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2
MAXIMUM RATINGS
Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) –8.0 to 0 Vdc
VIInput Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current– Continuous
– Surge 50
100 mA
TAOperating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range – Plastic
– Ceramic –55 to +150
–55 to +165 °C
°C
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.)
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
IEPower Supply Current 62 56 62 mA
IinH Input Current High
Pins 6, 11
Pin 9
Pins 7, 10
Pins 4, 5, 12, 13
530
660
485
790
310
390
285
465
310
390
285
465
µA
IinL Input Current Low 0.5 0.5 0.3 µA
VOH High Output Voltage –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc
VOL Low Output Voltage –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc
VIH High Input Voltage –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc
VIL Low Input Voltage –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc
AC PARAMETERS
tpd Propagation Delay
Clock, CE
Set, Reset 0.8
0.6 1.6
1.6 0.8
0.7 1.7
1.7 0.8
0.7 1.8
1.8
ns
trRise Time 0.6 2.0 0.6 2.0 0.6 2.2 ns
tfFall T ime 0.6 2.0 0.6 2.0 0.6 2.2 ns
tset Set–up T ime 0.7 0.7 0.7 ns
thold Hold T ime 0.8 0.8 0.8 ns
ftog Toggle Frequency 250 250 250 MHz
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is
maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts.
APPLICATION INFORMATION
The MC10H131 is a dual master–slave type D flip–flop.
Asynchronous Set (S) and Reset (R) override Clock (CC)
and Clock Enable (CE) inputs. Each flip–flop may be
clocked separately by holding the common clock in the new
low state and using the enable inputs for the clocking
function. If the common clock is to be used to clock the
flip–flop, the Clock Enable inputs must be in the low state.
In this case, the enable inputs perform the function of
controlling the common clock.
The output states of the flip–flop change on the positive
transition of the clock. A change in the information present
at the data (D) input will not affect the output information at
any other time due to master slave construction.
MC10H131
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3
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED A T DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
–M–
–N–
–L–
Y BRK
W
V
D
D
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D–D
20 1
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
S
L–M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
–T– SEATING
PLANE
S
L–M
M
0.007 (0.180) N S
T
S
L–M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1 DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 ––– 0.51 –––
K0.025 ––– 0.64 –––
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y––– 0.020 ––– 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––
____
MC10H131
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4
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–A–
–B–
–T–
FE
G
NK
C
SEATING
PLANE
16 PL
D
S
A
M
0.25 (0.010) T
16 PLJS
B
M
0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.750 0.785 19.05 19.93
B0.240 0.295 6.10 7.49
C––– 0.200 ––– 5.08
D0.015 0.020 0.39 0.50
E0.050 BSC 1.27 BSC
F0.055 0.065 1.40 1.65
G0.100 BSC 2.54 BSC
H0.008 0.015 0.21 0.38
K0.125 0.170 3.18 4.31
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.020 0.040 0.51 1.01
____
16 9
18
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
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MC10H131/D
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