250 V to 600 V, 1.5 A to 2.5 A
High Voltage 3-phase Motor Driver ICs
SLA/SMA6820MH Series Data Sh eet
SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. 1
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Description
SLA/SMA6820MH series are high voltage 3-phase
motor driver ICs in which transistors, pre-driver ICs
(MICs), and bootstrap circuits (diodes and resistors) are
highly integrated .
You can select from the fully-molded type or the
heatsink-type ZIP24 package according to your
mounting c ondition.
SLA/SMA6820MH series are optimal for the
inverting control of small to middle power motors.
Features
●Built-in Bootstrap Diodes with Current Limmiting
Resistors (22 Ω)
●CMOS-compatible Input (3.3 or 5 V)
●Fault Signal Output (FO pin)
●7.5 V Regurator O utpu t
●Bare lead frame: Pb-free (RoHS compliant)
●Protections
Unde rvoltage Lockout for Power Supply
High-side (UVLO_VB) : Auto-restart
Low-side (UVLO_V CC): A uto-restart
Thermal Detectio n (TD): Fault Signal Output
Typical Application
VREG
VCC1
VB1
VB3
W2
U
VCC2
COM2
LIN1
LIN2
LIN3
FO
COM1
HIN1
HIN2
HIN3
W1
V
VBB2
LS2
17
VB2
R
S
VCC
Controller
C
BOOT1
C
BOOT3
C
BOOT2
M
C
DC
C
SB
V
DC
MIC
23
22
21
20
19
18
16
9
8
7
6
5
4
12
13
11
1
24
15
14
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
Fault
GND
2
LS1
C
FO
5V
R
FO
VD 3
VBB1
10
Packages
ZIP24
Full y Molded Type Heatsink Type
(SMA682xMH) (SLA6826MH)
LF No. 2451 LF No. 2175
LF No. 2452 LF No. 2171
Not to scale
Selection Guide
●Packages
Package
Part Number
Full y Molded Type
SMA682xMH
Heatsink Type SLA6826MH
●Output Charact aristic
VDSS
IO
Part Number
250 V 2.0 A SLA6826MH
SMA6821MH
500 V
1.5 A
SMA6822MH
2.5 A
SMA6823MH
600 V
1.5 A
SMA6824MH
Applications
●Washing Machine Fan Motor and Pump Motor
●Air Conditioner Fan Motor
●Air Cleaner Fan Motor
●Fan Motor for Electric Stand Fan
SLA/SMA6820MH Series
SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. 2
Dec. 12, 2016 http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
Contents
Description ------------------------------------------------------------------------------------------------------ 1
Contents --------------------------------------------------------------------------------------------------------- 2
1. Absolute Maximum Ratings ----------------------------------------------------------------------------- 3
2. Reco mmended Operating Conditions ----------------------------------------------------------------- 4
3. Electrical Characteristics -------------------------------------------------------------------------------- 4
3.1. Characteristics of Control Parts ------------------------------------------------------------------ 4
3.2. Bootstrap Diode Characteristics ----------------------------------------------------------------- 5
3.3. Thermal Resistance Characteristics ------------------------------------------------------------- 5
3.4. Transistor Characteristics ------------------------------------------------------------------------- 6
3.4.1. SLA6826MH ----------------------------------------------------------------------------------- 6
3.4.2. SMA6821MH ----------------------------------------------------------------------------------- 7
3.4.3. SMA6822MH ----------------------------------------------------------------------------------- 7
3.4.4. SMA6823MH ----------------------------------------------------------------------------------- 8
3.4.5. SMA6824MH ----------------------------------------------------------------------------------- 8
4. Truth Ta ble ------------------------------------------------------------------------------------------------- 9
5. Block Diagram ------------------------------------------------------------------------------------------- 10
6. Pin Configuration Definit ions ------------------------------------------------------------------------- 11
7. Typical Applic ation ------------------------------------------------------------------------------------- 12
8. Timing Chart in Protection Operation -------------------------------------------------------------- 13
9. Physical Dimensions ------------------------------------------------------------------------------------ 15
9.1. ZIP24 (Fully Molded Type) --------------------------------------------------------------------- 15
9.2. ZIP24 (Heatsink Type) --------------------------------------------------------------------------- 16
10. Marking Diagrams -------------------------------------------------------------------------------------- 17
10.1. ZIP24 (Full Molded Type) ----------------------------------------------------------------------- 17
10.2. ZIP24 (Heatsink Type) --------------------------------------------------------------------------- 17
Important Notes ---------------------------------------------------------------------------------------------- 18
SLA/SMA6820MH Series
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1. Absolute Maximum Ratings
Current polarities are defined as follows: a current flow going into the IC (sinking) is positive current (+); and a
curr ent flo w coming out of the I C (sourcing) is negat ive cur rent (−).
Unless specifically noted, TA = 25°C, COM1 = COM2 that is called COM.
Characteristic Symbol Conditions Rating Unit Remarks
MOSFET Breakdown Voltage VDSS ID = 100 μA
VINx = 0 V
250
V
SLA6826MH
SMA6821MH
500
SMA6822MH
SMA6823MH
600 SMA6824MH
Logic Supply Voltage VCC
VCC1–COM
VCC2–COM
20 V
Bootstrap Supply Voltage VBS
VB1–U
VB2–V
VB3–W1
20 V
Output Current (D C) IO TC = 25 °C
1.5
A
SMA6822MH
SMA6824MH
2.0
SLA6826MH
SMA6821MH
2.5 SMA6823MH
Output Current (Pulse) IOP TC = 25 °C,
PW ≤ 100 μs,
Duty = 1%
2.25
A
SMA6822MH
SMA6824MH
3.0
SLA6826MH
SMA6821MH
3.75 SMA6823MH
Regulator Outp ut Cur rent IREG 35 mA
Input Volt age VIN
HIN1–COM
HIN2–COM
HIN3–COM
LIN1–COM
LIN2–COM
LIN3–COM
−0.5 to 7 V
Power Dissipation PD TC = 25 °C 28 W SMA682xMH
32 SLA6826MH
Operating Case Temperature TC(OP) −30 to 100 °C
Junct ion Temperature Tj 150 °C
Storage Temperature Tstg −40 to 150 °C
SLA/SMA6820MH Series
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2. Recommended Operating Conditions
Unless specifically noted, TA = 25°C, COM1 = COM2 that is called COM.
Characteristic Symbol Conditions Min. Typ. Max. Unit Remarks
Main Suppl y Voltage VDC VBB–LS1
VBB–LS2
— 150 200 V
— 300 400 V
— 300 450 V SMA6824MH
Logic Supply Voltage VCC
VCC1–COM
VCC2–COM
13.5 — 16.5 V
Dead Time of Input Signal tDEAD TJ = −25 to 150 °C 1.5 — — Μs
Minimum Input Pulse Width tIN_MIN(ON) TJ = −25 to 150 °C 0.5 — — μs
tIN_MIN(OFF) TJ = −25 to 150 °C 0.5 — — μs
3. Electrical Characteristics
Current polarities are defined as follows: a current flow going into the IC (sinking) is positive current (+); and a
curr ent flo w coming out of the I C (sourcing) is negat ive cur rent (−).
Unless specifically noted, VCC = 15 V, TA = 25°C, COM1 = COM2 that is called COM.
3.1. Characteristics of Control Parts
Characteristic Symbol Conditions Min. Typ. Max. Unit Remarks
Logic Sup p l y Cur re nt ICC IREG = 0 A — 4 6 mA
Input Volt age
VIH — 2.0 2.5 V
All transistors
on state.
VIL 1.0 1.5 — V
All transistors
off stat e.
VHYS — 0.5 — V
Input Current IIH INx = 5 V — 50 100 μA
IIL INx = 0 V — — 2 μA
Unde rvoltage Lockout for
Power Supply (High side)
V
UVHL
VB1–U
VB2–V
VB3–W1
9.0 10.0 11.0 V
VUVHH 9.5 10.5 11.5 V
VUV_HYS — 0.5 — V
Unde rvoltage Lockout for
Power Supply (Low side)
VUVLL VCC1–COM
VCC2–COM
10.0 11.0 12.0 V
VUVLH 10.5 11.5 12.5 V
VUV_HYS — 0.5 — V
FO Pin Outp ut Vo ltage VFOL 0 — 1.0 V
VFOH 4.0 — 5.5 V
Thermal Detec tion Threshold
Temperature
TDH IREG = 0 mA,
No hea tsink
135 150 165 °C
TDL 105 120 135 °C
TD_HYS — 30 — °C
Regulator Output Voltage VREG IREG = 0 to 35 mA 6.75 7.5 8.25 V
SLA/SMA6820MH Series
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3.2. Bootstrap Diode Characteristics
Characteristic Symbol Conditions Min. Typ. Max. Unit Remarks
Bootstrap Diode Forward
Voltage
VFB IFB = 0.15 A — 1.1 1.3 V
Bootstrap Diode Leakage
Current ILBD
VR = 250 V — — 10
μA
SLA6826MH
SMA6821MH
VR = 500 V — — 10
SMA6822MH
SMA6823MH
VR = 600 V — — 10 SMA6824MH
Bootstrap Diode Series
Resistor
RB 17.6 22.0 26.4 Ω
3.3. Thermal Resistance Characteristics
Characteristic Symbol Conditions Min. Typ. Max. Unit Remarks
Junction-to-Case
Thermal Resistance RJ-C All transisto rs
operation
— — 4.46 °C/W SMA682xMH
— — 3.8 SLA6826MH
Junction-to-Ambient
Thermal Resistance
RJ-A
All transistors
operation
— — 31.25 °C/W SMA682xMH
SLA/SMA6820MH Series
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3.4. Transistor Characteristics
Figure 3-1 shows t h e definition of switching characteristics.
IN
10%
90%
t
d(on)
t
r
t
on
I
D
t
rr
V
DS
10%
90%
t
d(off)
t
f
t
off
Figure 3-1. Switching Characteristics Definitions
3.4.1. SLA6826MH
Characteristic Symbol Conditions Min. Typ. Max. Unit
Drain-to-Source Leaka ge Current IDSS VDS = 250 V, VIN = 0 V — — 100 µA
Drain-to-Source Saturation
Voltage
RDS(ON) ID = 1.0 A, VIN = 5 V — 1.25 1.5 Ω
Source-to-Drain Diode Forward
Voltage
VSD ISD = 1.0 A, VIN = 0 V — 1.1 1.5 V
High-side Switching
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 150 V, ID = 2.0 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 65 — ns
Turn-on Delay Time td(on) — 430 — ns
Rise Time tr — 55 — ns
Turn-off Delay Time td(off) — 355 — ns
Fall Time tf — 20 — ns
Low-side Swit c hi ng
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 150 V, ID = 2.0 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 65 — ns
Turn-on Delay Time td(on) — 505 — ns
Rise Time tr — 60 — ns
Turn-off Delay Time td(off) — 495 — ns
Fall Time tf — 20 — ns
SLA/SMA6820MH Series
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3.4.2. SMA6821MH
Characteristic Symbol Conditions Min. Typ. Max. Unit
Drain-to-Source Leaka ge Current IDSS VDS = 250 V, VIN = 0 V — — 100 µA
Drain-to-Source Saturation
Voltage
RDS(ON) ID = 1.0 A, VIN = 5 V — 1.25 1.5 Ω
Source-to-Drain Diode Forward
Voltage
VSD ISD = 1.0 A, VIN = 0 V — 1.1 1.5 V
High-side Switching
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 150 V, ID = 2.0 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 65 — ns
Turn-on Delay Time td(on) — 430 — ns
Rise Time tr — 55 — ns
Turn-off Delay Time td(off) — 355 — ns
Fall Time tf — 20 — ns
Low-side Swit c hing
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 150 V, ID = 2.0 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 65 — ns
Turn-on Delay Time td(on) — 505 — ns
Rise Time tr — 60 — ns
Turn-off Delay Time td(off) — 495 — ns
Fall Time tf — 20 — ns
3.4.3. SMA6822MH
Characteristic Symbol Conditions Min. Typ. Max. Unit
Drain-to-Source Leaka ge Current IDSS VDS = 500 V, VIN = 0 V — — 100 µA
Drain-to-Source Saturation
Voltage
RDS(ON) ID = 0.75 A, VIN = 5 V — 3.2 4.0 Ω
Source-to-Drain Diode Forward
Voltage
VSD ISD = 0.75 A, VIN = 0 V — 1.1 1.5 V
High-side Switching
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 300 V, ID = 1.5 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 120 — ns
Turn-on Delay Time td(on) — 485 — ns
Rise Time tr — 85 — ns
Turn-off Delay Time td(off) — 420 — ns
Fall Time tf — 30 — ns
Low-side Swit c hing
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 300 V, ID = 1.5 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 130 — ns
Turn-on Delay Time td(on) — 620 — ns
Rise Time tr — 100 — ns
Turn-off Delay Time td(off) — 585 — ns
Fall Time tf — 25 — ns
SLA/SMA6820MH Series
SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. 8
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3.4.4. SMA6823MH
Characteristic Symbol Conditions Min. Typ. Max. Unit
Drain-to-Source Leaka ge Current IDSS VDS = 500 V, VIN = 0 V — — 100 µA
Drain-to-Source Saturation
Voltage
RDS(ON) ID = 1.25 A, VIN = 5 V — 2.0 2.4 Ω
Source-to-Drain Diode Forward
Voltage
VSD ISD = 1.25 A, VIN = 0 V — 1.1 1.5 V
High-side Switching
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 300 V, ID = 2.5 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 170 — ns
Turn-on Delay Time td(on) — 700 — ns
Rise Time tr — 165 — ns
Turn-off Delay Time td(off) — 580 — ns
Fall Time tf — 40 — ns
Low-side Swit c hing
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 300 V, ID = 2.5 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 170 — ns
Turn-on Delay Time td(on) — 800 — ns
Rise Time tr — 180 — ns
Turn-off Delay Time td(off) — 690 — ns
Fall Time tf — 35 — ns
3.4.5. SMA6824MH
Characteristic Symbol Conditions Min. Typ. Max. Unit
Drain-to-Source Leaka ge Current IDSS VDS = 600 V, VIN = 0 V — — 100 µA
Drain-to-Source Saturation
Voltage
RDS(ON) ID = 0.75 A, VIN = 5 V — 2.9 3.5 Ω
Source-to-Drain Diode Forward
Voltage
VSD ISD = 0.75 A, VIN = 0 V — 1.0 1.5 V
High-side Switching
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 300 V, ID = 1.5 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 155 — ns
Turn-on Delay Time td(on) — 685 — ns
Rise Time tr — 115 — ns
Turn-off Delay Time td(off) — 555 — ns
Fall Time tf — 55 — ns
Low-side Swit c hing
Source-to-Drain Diode Reverse
Recovery Time
trr
VDC = 300 V, ID = 1.5 A,
VIN = 0 ~ 5 V, TJ = 25 °C,
inductive load
— 155 — ns
Turn-on Delay Time td(on) — 740 — ns
Rise Time tr — 130 — ns
Turn-off Delay Time td(off) — 670 — ns
Fall Time tf — 35 — ns
SLA/SMA6820MH Series
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4. Truth Table
Table 4-1 is a truth table that provid e s the logic level definitions of operation modes.
In the case where HINx and LINx signals in each phase are high at the same time, both the high-side and low-side
transistors are set on (simultaneous on-state). You must set the input signals so that the simultaneous on-state is not
occuerd.
After recovering from a UVLO_VCC condition, the high-side and low-side transistor s res ume s witching acco rd ing to
the input l ogic l evels of the next HINx and LINx sig na l s (le vel-triggered).
After rec overing from a UVLO_VB condition, the hi gh-side transistors re s ume switching at the next rising edge o f an
HIN signal (ed ge-triggered).
Table 4-1. Truth Table for Operation Modes
Mode HINx LINx High-side Transistors Low-side Transistors
Normal Operation
L
L
OFF
OFF
H
L
ON
OFF
L
H
OFF
ON
H
H
ON
ON
High-side Undervoltage Lockout
for Power Supply (UVLO_VB)
L
L
OFF
OFF
H
L
OFF
OFF
L
H
OFF
ON
H
H
OFF
ON
Low-side Und ervo lt age Loc ko ut
for Power Supply (UVLO_VCC)
L
L
OFF
OFF
H L OFF OFF
L
H
OFF
OFF
H
H
OFF
OFF
Thermal Detec tion (TD)
L
L
OFF
OFF
H
L
ON
OFF
L
H
OFF
ON
H
H
ON
ON
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5. Block Diagram
Low-side
Driver
UVLOUVLOUVLO
UVLO
Input
Logic
Inpu t Logic
1 2 4
11
17
18
19
20
23
3
22
21
VD
VB1VB2VB3
VBB2
W2
V
U
LS1
FO
COM2
LIN3
LIN2
LIN1
VCC2
COM1
HIN3
HIN2
HIN1High-side
Level Shift Dr iver
Thermal
Detection
15 LS2
W1
Bootstrap
Diode R
B
7
8
9
6
13
24
12
14
5VCC1
10 VBB1
UVLO
7.5 V
Regulator
16
VREG
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6. Pin Configuration Definitions
SMA682xMH SLA6826MH
Pin Number Pin Name Functions
1 VB1 U-phas e high-side floating supply voltage input
2 VB2 V-phas e high-side floating supply voltage input
3 VD Anode of bootstrap diodes
4 VB3 W-phase hig h -side float ing sup ply vo ltage inp ut
5 VCC1 High side logic supply voltage input
6 COM1 High side logic ground
7 HIN3 Logic input for W-phase high-side gate driver
8 HIN2 Logic input for V-phase hig h -side gate driver
9 HIN1 Logic input for U-phase hig h-side gate driver
10 VBB1 Positive DC bus supply voltage (be connected toVBB2 by PCB trace)
11 VBB2 Positive DC bus supply voltage (be connected toVBB2 by PCB trace)
12 W1 W-p hase output (be connected toW 2 by PCB trace)
13 V V-phase output
14 W2 W-p hase output (be connected toW 1 by PCB trace)
15 LS2 U and V-phase power MOSFET Source (be connected toLS1 by PCB trace)
16 VREG Regulator output
17 LS1 W-phase power MOSFET Source (be connected toLS2 by PCB trace)
18 LIN3 Logic input for W-phase low-side gate driver
19 LIN2 Logic input for V-phase low-side gate driver
20 LIN1 Logic input for U-phase low-side gate driver
21 COM2 Low side logic ground
22 FO Fault signal output for thermal detection and UVLO, active high
23 VCC2 Lo w side lo gic supply voltage i nput
24 U U-phase output
1
24
1
24
Bra nd ing Are a
Bra nd ing Are a
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7. Typical Application
Capacitors should be place near the IC. If the circuit noise is large, connect the noise reduction ceramic capacitor to
the electrolytic capacitor in parallel.
Pull down resistance (about 100 kΩ) is built-in the H INx p in and the LINx p in. I f the unstable sig nal or noisy s igna l
may be input, connect the resisto r in ext er nal to the HI Nx pin and the LINx pin.
VREG
VCC1
VB1
VB3
W2
U
VCC2
COM2
LIN1
LIN2
LIN3
FO
COM1
HIN1
HIN2
HIN3
W1
V
VBB2
LS2
17
VB2
RS
VCC
Controller
CBOOT1
CBOOT3
CBOOT2
M
CDC
CSB
VDC
MIC
23
22
21
20
19
18
16
9
8
7
6
5
4
12
13
11
1
24
15
14
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
Fault
GND
2
LS1
CFO
5V
RFO
VD 3
VBB1
10
Figure 7-1. Typical Applicat ion
SLA/SMA6820MH Series
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8. Timing Chart in Protection Operation
HIN
VB-HS
HO
UVHH UVHL
UVLO
release
Figure 8-1. High-side Und e rvo l tage Lo ckout for Power Supply (UVLO_VB)
LIN
VCC
LO
UVHH
FO
UVHL
UVLO
release
Figure 8-2. Low-side Und e r vo lt age Loc ko ut for Power Supply (UVLO_VCC)
SLA/SMA6820MH Series
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LIN
FO
Tmic
T
DL
LO
T
DH
When the FO pin is “L”, a internal transistor
that is open collector is on state.
Figure 8-3. T hermal Detection (TD)
SLA/SMA6820MH Series
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9. Physical Dimensions
9.1. ZIP24 (Fully Molded Type)
● LF No. 2451
● LF No. 2452
31±0.2
31.3±0.2
4±0.2
ゲートバリ
1
2
3
410
115
6
7
8
9
12
13
14
15
16
17
18
19
20
21
22
23
24
（根元寸法）
（根元寸法）
10.2±0.2
1.2±0.1
0.5 +0.15
-0.05
2.2 ±0.7 2.2±0.7
（先端寸法） （先端寸法）
（先端寸法）
0.7 +0.15
-0.05
0.6 3
※１
(4.4)
23xP1.27±0.1=(29.21)
+0.15
-0.05
0～0.55
0～0.55　
※２
※２
23xP1.27±0.6=29.21±0.7
（先端寸法）
※３
※４
+0.5
-0.3
0. 6
+ 0. 15
- 0. 05
0. 5 ±0.1 5
4. 5 ±0.5
4±0.2
1. 2 ±0.1
9. 5
+0.7
-0.5
31 .3 ±0.2
10 .2 ±0.2
31 ±0.2
２３×Ｐ１．２７±０．５＝２９．２１±０．６
（樹脂バリを含む）
（先端寸法）
（根元寸法）
（先端寸法）
Ｒ－ｅｎｄ
ゲートバリ
　
1
24
NOTES:
● Dimensions in millimeters
● Bare lead frame: Pb-free (RoHS compliant)
● Maximum “Gate burr” height: 3 mm
NOTES:
● Dimensions in millimeters
● Bare lead frame: Pb-free (RoHS compliant)
● Maximum “Gate burr” height: 3 mm
Gate burr
(Ends of pins)
(Ends of pins)
(End of pin)
(End of pin)
(Roots of pins)
(Ends of pins)
Gate burr
(Ends of pins)
SLA/SMA6820MH Series
SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. 16
Dec. 12, 2016 http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
9.2. ZIP24 (Heatsink Type)
● LF No. 2175
● LF No. 2171
NOTES:
● Dimensions in millimeters
● Bare lead frame: Pb-free (RoHS compliant)
● The recommended screw torque: 58.8~78.4N∙cm (6.0 ~ 8.0 kgf∙cm)
NOTES:
● Dimensions in millimeters
● Bare lead frame: Pb-free (RoHS compliant)
● The recommended screw torque: 58.8~78.4N∙cm (6.0 ~ 8.0 kgf∙cm)
Gate burr
(Ends of pins)
(Ends of pins)
(Ends of pins)
(Ends of pins)
(Ends of pins)
(End of pin)
Gate burr including
Gate burr including
SLA/SMA6820MH Series
SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. 17
Dec. 12, 2016 http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
10. Marking Diagrams
10.1. ZIP24 (Full Molded Type)
The marking diagrams of ZIP24 package is either in follows:
Part Number
S M A 6 8 2 x M H
JAPAN YMDDX L ot Number :
Y is the last d igit of the year o f manuf acture (0 to 9)
M is the month of the yea r (1 to 9, O, N, or D)
DD is the day of the month (01 to 31)
X is the control numb e r
124
Part Number
S M A 6 8 2 x M H
YMDDXXXX L ot Number :
Y is the last d igit of the year o f manuf acture (0 to 9)
M is the month of the yea r (1 to 9, O, N, or D)
DD is the day of the month (01 to 31)
XXXX is the c ontrol number
124
10.2. ZIP24 (Heatsink Type)
Part Number
S L A 6 8 x x M Z
Y M D D X L ot Number :
Y is the last d igit of the year o f man ufacture (0 to 9)
M is the month of the yea r (1 to 9, O, N, or D)
DD is the day of the month (01 to 31)
X is the control numb e r
JAPAN
124
SLA/SMA6820MH Series
SLA/SMA6820MH-DSE Rev.2.0 SANKEN ELECTRIC CO., LTD. 18
Dec. 12, 2016 http://www.sanken-ele.co.jp/en
© SANKEN ELECTRIC CO., LTD. 2013
Important Notes
●All data, illustrations, graphs, table s and any other information included in this document as to Sanken’s products listed herein (the
“Sanken Products”) are current as of the date this document is issued. All contents in this document are subject to any change
without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative
that the contents set forth in this document reflect the latest revisions befor e use.
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appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products,
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your name and seal, on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the
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●Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the
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and follow the procedures required by such applicable laws and regulations.
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●Although S anken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is
error free and Sanken assu mes no liabil ity whatso ever for an y and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the content s included herein.
●Please refer to th e relev an t specification documents in relation to particular precautions when using the Sanken Products, and refer
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DSGN-CEZ-16002