Ampro by ADLINK™ Extreme Rugged™
http://www.adlinktech.com/ampro/
Express-IBR
Choose Ampro by ADLINK™ Express-IBR for…
A modular and power efcient solution for extreme rugged
and mobile environments.
Description
The Ampro by ADLINK™ Express-IBR is a COM Express®
Type 6 module with quad/dual-core 3rd Generation Intel®
Core™ i7 Processor. The Express-IBR is designed Extreme
Rugged to support the extremes of shock, vibration,
humidity, and temperature.
Specifications
Core System
CPU
3rd Generation Intel
®
Core™ i7/i3, 22nm process, BGA type
Intel® Core™ i7-3615QE 2.3GHz (up to 3.3GHz Turbo), 6MB
L3 cache, 45W, quad core
Intel® Core™ i7-3612QE 2.1GHz (up to 3.1GHz Turbo), 6MB
L3 cache, 35W, quad core
Intel® Core™ i7-3555LE 2.5GHz (up to 3.2GHz Turbo), 4MB
L3 cache, 25W, dual core
Intel® Core™ i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB
L3 cache, 17W, dual core
Intel® Core™ i3-3217UE 1.6GHz, 3MB
L3 cache, 17W, dual core
Memory Dual channel ECC 1600 MHz DDR3 memory up to 16 GB in
dual SODIMM sockets
BIOS AMI EFI with CMOS backup in 16 Mb SPI ash
Hardware Monitor Supply voltages and CPU temperature
Debug Interface XDP SFF-26 extension for ICE debug
Watchdog Timer Programmable timer range to generate RESET
Expansion Busses PCI Express x16 (Gen3) bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
7 PCI Express x1: Lanes 0/1/2/3/4/5/6
LPC bus, SMBus (system), I2C (user)
Technologies PAVP 3.0, Intel® AMT 8.0, Intel® VT, Intel® AES-NI, Intel® HT,
Intel® HD Graphics with Dynamic Frequency, Intel® Turbo
Boost , Dynamic Turbo, Intel
®
AVX 1.0, Intel
®
Quick Sync Video
Video
Integrated in Processor Intel
®
HD Graphics 4000 at 650-1300 MHz
Integrated Video DirectX 11.0, OpenGL 3.1, and OCL 1.1
Media Processing Decode (HW JPEG & MJPEG decode), encode (full HW MPEG2
encode), transcode
Intel
®
Clear Video HD Technology + enhanced media processing
VGA Interface Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA hot plug
LVDS Interface Dual channel 18/24-bit LVDS
Digital Display Interface Three DDI ports supporting HDMI / DVI / DisplayPort or SDVO
Audio
Chipset Integrated on Mobile Intel® QM77 Express chipset
Audio Codec Implemented on carrier board
LAN
Chipset Intel® Gigabit LAN PHY WG82579LM
Speed 10/100/1000 Mbps Ethernet
Multi I/O
Chipset Integrated on Mobile Intel® QM77 Express chipset
USB Supports up to eight ports USB 2.0, 4 USB 3.0
SATA Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID
0,1,5,10
Super I/O
Connected to LPC bus on carrier if needed (BIOS supports
W83627DHG)
TPM
Chipset Atmel AT97SC3204
Type TPM 1.2
Power Specications
Input Power AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Power States Supports S0, S1, S3, S4, S5
Power Consumption 12W typical (i7-36xxQE)
8W typical (i7-3555LE/i7-3517UE/i3-3217UE)
S3: 0.85W
S5: 0.55W
Smart Battery Support Yes (BIOS supports LTC4100 and LTC1760)
Mechanical and Environmental
Size COM Express Basic, 125 mm x 95 mm
Board Thickness 0.093” (2.3mm)
Operating Temp. Standard
-20°C to 70°C
Operating Temp. Extended
-40°C to 85°C
Storage Temp. -55°C to 85°C
Humidity 90% at 60°C non-condensing
Shock 50G peak-to-peak, 11ms duration, MIL-STD-202G Method
213B
Vibration Operating: 11.96 Grms, 50-20,000 Hz, each axis,
MIL-STD-202G Method 214A
Compatibility PICMG COM Express COM.0 R2.1 Type 6
Certications CE, FCC, HALT
Operating Systems
Standard Support Windows 7
Linux
Extended Support (BSP) WES 2009/7, WEC 7
Linux, VxWorks 6.9, QNX 6.5
AIDI Library
Extreme Rugged™ COM Express® Type 6 Computer-on-Module
with 3rd Generation Intel® Core™ i7 Processor
Features
Quad/dual core 3rd Generation Intel® Core™
Processor
Mobile Intel® QM77 Express Chipset
Up to 16GB ECC 1600MHz DDR3 memory in two
SODIMM sockets
Three Digital Display Interfaces (DDI) for
DisplayPort /HDMI/DVI/SDVO
Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for
graphics (or general purpose x8/4/1)
Two SATA 6 Gb/s, two SATA 3 Gb/s, Gigabit
Ethernet, eight USB 2.0, 4 USB 3.0
COM Express® COM.0 R2.1 Type 6 Pinout
Extended Temperature: -40°C to +85°C
50% Thicker PCB for high vibration environments
Functional Diagram
Ordering Information
Modules
Model Number Description/Configuration
Express-IBR-i7-R-3615QE
Extreme Rugged COM Express Type 6 module with Intel
®
Core™ i7-3615QE 2.3GHz 45W Quad Core CPU, two
DDR3 ECC SODIMMs supported
Express-IBR- i7-R-3612QE
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i7-3612QE 2.1GHz 35W Quad Core CPU ,
two DDR3 ECC SODIMMs supported
Express-IBR-i7-R-3555LE
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i7-3555LE 2.5GHz 25W Dual Core CPU,
two DDR3 ECC SODIMMs supported
Express-IBR-i7-R-3517UE
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i7-3517UE 1.7GHz 17W Dual Core CPU,
two DDR3 ECC SODIMMs supported
Express-IBR-i3-R-3217UE
Extreme Rugged COM Express Type 6 module with
Intel
®
Core™ i3-3217UE 1.6GHz 17W Dual Core CPU,
two DDR3 ECC SODIMMs supported
Express-IBR-L
Starterkit with 2x2GB DDR3 ECC SODIMM, non-ETT,
Cables, BSP/driver in USB stick and manuals
Accessories
Model Number Description/Configuration
Heat Spreaders (for use with customer supplied thermal solution)
HTS-IBR-BTF Heat spreader for Express-IBR with through-hole standoffs
for top-mounting
HTS-IBR-B Heat spreader for Express-IBR with threaded standoffs for
bottom-mounting
Passive Heatsinks (for use with 17 and 25W CPUs)
THSH-IBR-BTL Heatsink for Express-IBR with through-hole standoffs for
top-mounting
Active Heatsinks (recommended for 35 and 45W CPUs)
THSF-IBR-BTL-CU Heatsink with FAN for Express-IBR with through-hole
standoffs for top-mounting
PCH
Mobile Intel® QM77
Express Chipset
Processor
3rd Gen
Intel® Core™
i7 Processor
Quad & Dual Core
GbE LAN
82579
GPIO
PCA9535
BC
6x PCIe x1
(port 0~5)
SMBus
Dual channel 18/24-bit LVDS
4x GP0
8x USB 2.0 (channel 0/7)
SODIMM 2
1600 MHz
1~8 GB ECC DDR3
SPI 0
BIOS
PCIe x1
(port 7)
HDA Audio
LPC bus
FDI
SODIMM 1
1600 MHz
1~8 GB ECC DDR3
PCI Express x16 (Gen2)
2 x8 or 1x8 + 2x4
SPI
DDI 1
DP / HDMI / DVI / SDVO
DDI 2
DP / HDMI / DVI
DDI 3
DP / HDMI / DVI / eDP
PCIe x1
(port 6)
4x USB 3.0
4x GPI Monitor
ADT7490
DMI
VGA
TPM
AT97SC3204
SPI 1
Debug
header
XDP
SFF26
LVDS DDC I2C
I2C
WDT
2x SATA 6 Gb/s + 2x SATA 3 Gb/s
