
PAGE . 1September 03.2010-REV.00
2N7002KFN3
MECHANICAL DATA
• Case: DFN 3L Package
• Terminals : Solderable per MIL-STD-750,Method 2026
• Marking : AU
60V N-Channel Enhancement Mode MOSFET - ESD Protected
Maximum RATINGS and Thermal Characteristics (TA=25OC unless otherwise noted )
Note: 1. Maximum DC current limited by the package
2. Surface mounted on FR4 board, t < 5 sec
PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE
PARAMETER Symbol Limit Units
Drain-Source Voltage V
DS
60 V
Gate-Source Voltage V
GS
+20 V
Continuous Drain Current I
D
115 mA
Pulsed Drain Current
1)
I
DM
800 mA
Maximum Power Dissipation T
A
=25
O
C
T
A
=75
O
CP
D
200
150 mW
Operating Junction and Storage Temperature
Range T
J
,T
STG
-55 to + 150
O
C
Junction-to Ambient Thermal Resistance(PCB mounted)
2
R
θJA
883
O
C/W
FEATURES
• RDS(ON), VGS@10V,IDS@500mA=3Ω
• RDS(ON), VGS@4.5V,IDS@200mA=4Ω
• Advanced Trench Process Technology
• High Density Cell Design For Ultra Low On-Resistance
• Very Low Leakage Current In Off Condition
• Specially Designed for Battery Operated Systems, Solid-State Relays
Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc.
• ESD Protected 2KV HBM
• Lead free in comply with EU RoHS 2002/95/EC directives.
• Green molding compound as per IEC61249 Std. . (Halogen Free)
0.014(0.36)
0.022(0.55)
0.017(0.45)
0.042(1.05)
0.037(0.95)
0.026(0.65)
0.022(0.55)
0.013(0.32)
0.009(0.22)
0.002(0.05)MAX.
0.022(0.55)
0.017(0.45)
0.008(0.20)
0.004(0.10)
0.013(0.32)
0.009(0.22)
0.008(0.20)
0.004(0.10)
Unit inch(mm):
DFN 3L
0.014(0.36)